WO2002076717A2 - Fabrication de dispositifs d'identification autoalimentes - Google Patents

Fabrication de dispositifs d'identification autoalimentes Download PDF

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Publication number
WO2002076717A2
WO2002076717A2 PCT/IL2002/000235 IL0200235W WO02076717A2 WO 2002076717 A2 WO2002076717 A2 WO 2002076717A2 IL 0200235 W IL0200235 W IL 0200235W WO 02076717 A2 WO02076717 A2 WO 02076717A2
Authority
WO
WIPO (PCT)
Prior art keywords
card
laminating
substrate
layer
programming
Prior art date
Application number
PCT/IL2002/000235
Other languages
English (en)
Other versions
WO2002076717A3 (fr
Inventor
Thomas H. Tempelton
Nathan Altman
Original Assignee
Beepcard Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/853,017 external-priority patent/US7280970B2/en
Priority claimed from PCT/IL2001/000758 external-priority patent/WO2002014974A2/fr
Application filed by Beepcard Inc. filed Critical Beepcard Inc.
Priority to EP02718485A priority Critical patent/EP1407418A4/fr
Priority to AU2002249532A priority patent/AU2002249532A1/en
Publication of WO2002076717A2 publication Critical patent/WO2002076717A2/fr
Publication of WO2002076717A3 publication Critical patent/WO2002076717A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
    • G06F21/44—Program or device authentication
    • G06F21/445—Program or device authentication by mutual authentication, e.g. between devices or programs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/04—Payment circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/08—Payment architectures
    • G06Q20/12—Payment architectures specially adapted for electronic shopping systems
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/30—Payment architectures, schemes or protocols characterised by the use of specific devices or networks
    • G06Q20/34—Payment architectures, schemes or protocols characterised by the use of specific devices or networks using cards, e.g. integrated circuit [IC] cards or magnetic cards
    • G06Q20/341—Active cards, i.e. cards including their own processing means, e.g. including an IC or chip
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/38—Payment protocols; Details thereof
    • G06Q20/382—Payment protocols; Details thereof insuring higher security of transaction
    • G06Q20/3823—Payment protocols; Details thereof insuring higher security of transaction combining multiple encryption tools for a transaction
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/38—Payment protocols; Details thereof
    • G06Q20/40—Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check credit lines or negative lists
    • G06Q20/401—Transaction verification
    • G06Q20/4014—Identity check for transactions
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/38—Payment protocols; Details thereof
    • G06Q20/40—Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check credit lines or negative lists
    • G06Q20/401—Transaction verification
    • G06Q20/4014—Identity check for transactions
    • G06Q20/40145—Biometric identity checks
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00—Payment architectures, schemes or protocols
    • G06Q20/38—Payment protocols; Details thereof
    • G06Q20/40—Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check credit lines or negative lists
    • G06Q20/409—Device specific authentication in transaction processing
    • G06Q20/4097—Device specific authentication in transaction processing using mutual authentication between devices and transaction partners
    • G—PHYSICS
    • G07—CHECKING-DEVICES
    • G07F—COIN-FREED OR LIKE APPARATUS
    • G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
    • G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
    • G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
    • G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L63/00—Network architectures or network communication protocols for network security
    • H04L63/08—Network architectures or network communication protocols for network security for authentication of entities
    • H04L63/0853—Network architectures or network communication protocols for network security for authentication of entities using an additional device, e.g. smartcard, SIM or a different communication terminal
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/32—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials
    • H04L9/3271—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols including means for verifying the identity or authority of a user of the system or for message authentication, e.g. authorization, entity authentication, data integrity or data verification, non-repudiation, key authentication or verification of credentials using challenge-response
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/34—Inserts
    • B32B2305/342—Chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F2221/2129—Authenticate client device independently of the user
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L2209/00—Additional information or applications relating to cryptographic mechanisms or cryptographic arrangements for secret or secure communication H04L9/00
    • H04L2209/56—Financial cryptography, e.g. electronic payment or e-cash

Definitions

  • the present invention relates to manufacture methods of identification cards and particularly of self-powered identification cards.
  • assembly of bank-type cards involves the manufacture of a plurality of card bodies in sheets.
  • Each sheet has plurality of card bodies, for example, 7x12 cards (or 84 cards).
  • the exact dimensions of the matrix can vary depending on production equipment of the card body producer or the type of microprocessor card. This is accomplished by machining a cavity into the body of the "dumb” credit cards, after they are fully printed, complete with logos, and signature panels, and implanting the electronics module and contact into that cavity.
  • the card is completed without exposing the sensitive electronics to the violence of the card production process.
  • the electronics module is manufactured separately, and only implanted in finished singulated cards, during the final personalization process.
  • the typical ISO 78 lx card production process also includes handling information, which must be kept highly secure, such as bank or credit card account information. That typical process also provides for the secure handling and shipment of graphical or branding elements that relate to the authenticity of the card as a transaction vehicle (such as bank association logo, watermarking, and bank card graphics), which are designed to foil counterfeiters. But these known techniques are inconvenient for printing, manufacturing, and personalizing electronic bank-type cards with a volume of components greater than can fit into an ISO 7816 standard self-powered identification card module. Those diverse components can include transducers or other wireless IO components, displays, or batteries, solar panels or other power supplies, or even electronics for dynamically reforming the magnetic stripe.
  • German patent No. DE 19645071 discloses a cold thermosetting adhesive (i.e., cool-lamination) method for fabricating cards with electronic components of diverse physical properties, and that method is embodied in "480" systems formerly offered for sale by Machine-Zeigler & Co. of Kunststoff Germany.
  • An aspect of some embodiments of the present invention relates to a method of producing an identification card including embedded electrical elements.
  • the method includes preparing a substrate including one or more electrical elements and laminating the substrate with one or more protective layers, for example PVC and/or plastic layers.
  • the lamination includes a hot lamination process and/or a controlled partially hot lamination process.
  • the lamination includes a cold lamination process.
  • the substrate includes durable electrical elements which are insensitive to hot lamination processes.
  • the electrical elements include a battery and/or a switch.
  • the electrical elements include a processor chip and/or memory unit.
  • the electrical elements include thin/thick film resistors, integrated circuits, ceramic piezoelectric components, sonic/ultrasonic transducers, LCDs and/or LEDs.
  • the substrate includes four, five or even six different electrical elements.
  • the substrate may carry a chip, a battery, two transducers and a switch.
  • the different elements on the substrate may have different thickness.
  • an adhesive layer is placed between the substrate and the plastic layer in order to compensate for height variations.
  • the elements are organized on the substrate in a manner which reduces the chances of damage during lamination, after lamination processing
  • electronic elements are placed towards edges and/or corners of the card, in order to reduce the chances of damage due to bending of the card by its owner.
  • the lamination is performed using standard lamination machines known in the art for lamination of cards which do not include electrical elements during the lamination.
  • the production process may include adding customized graphics and/or holograms, embossing, microprocessor module implantation and/or other personalization techniques.
  • the substrate includes at least one chip which is programmed and/or tested before the lamination.
  • the programming includes inserting data which is not related to a specific person.
  • Personalized information is optionally added to the card only after the lamination is completed. Thus, the addition of the personalized information can be performed in a separate location from the lamination, for example, a highly secure location.
  • a method of manufacturing an identification card comprising providing a substrate carrying a circuit including at least one electronic element and laminating the substrate to at least one isolating layer, using an at least partially hot lamination process, so as to form a card.
  • the at least one electronic element comprises a battery.
  • the at least one electronic element comprises a transducer.
  • the transducer comprises an acoustic transducer.
  • the substrate carries at least four electronic elements.
  • the substrate carries a plurality of electronic elements and at least two of the elements have different thickness.
  • the at least one electronic element comprises a processor chip.
  • the at least one electronic element comprises a memory unit.
  • the method includes programming at least one element of the circuit before laminating the substrate to the at least one layer.
  • programming the at least one element comprises storing one or more of a public ID, a private ID, a counter start point and at least one encryption key on the at least one element.
  • programming the at least one element comprises generating one or more operator generated values, by applying an operator to a set of one or more random initial keys and one or more parameters, and programming the at least one element with the random initial keys and the one or more parameters.
  • the one or more parameters comprise a public TD.
  • the one or more random initial keys include at least one of a private ID and a counter start point.
  • the one or more operator generated values comprise hash codes.
  • the method includes initiating encryption of the random initial keys by the circuit.
  • the method includes transmitting the encrypted random initial keys by the circuit.
  • the method includes testing the transmitted encrypted random initial keys against a stored copy of the one or more operator generated values.
  • testing is performed before the laminating.
  • testing is performed after the laminating.
  • testing the transmitted encrypted random initial keys comprises applying the operator to the encrypted initial keys and to the one or more parameters to obtain an actual value and comparing the actual value to a corresponding stored operator generated value.
  • the method includes repeating the applying of the operator and the comparing for substantially all the stored operator generated values.
  • the method includes testing the electronic element before laminating the substrate to the at least one layer.
  • laminating the substrate to the at least one layer comprises laminating to a plurality of layers.
  • laminating the substrate to the at least one layer comprises laminating to at least one layer including printed graphics.
  • laminating the substrate to the at least one layer comprises laminating to at least one transparent layer.
  • laminating the substrate to the at least one layer comprises laminating to at least one composite layer formed of a plurality of layers.
  • none of the layers included in the laminating includes personal data.
  • the method includes embossing the card after the lamination.
  • the method includes adding a hologram to the card after the lamination.
  • laminating the substrate to the at least one layer comprises laminating in a vacuum.
  • laminating the substrate to the at least one layer comprises laminating using an adhesive layer between the substrate and the isolating layer.
  • one or more of the at least one electronic elements is located near a comer of the substrate.
  • the one or more of the at least one electronic elements located near the comer comprises a battery or a chip.
  • the one or more of the at least one electronic elements located near the comer comprises an element sensitive to bending.
  • the isolating layer comprises a PNC layer, a plastic or a polymeric layer.
  • the laminating comprises causing a change of state of at least one of the layers.
  • the laminating comprises filling air gaps between the substrate and the layers if such air gaps exist.
  • the method includes testing the substrate by applying a mechanical force to a sandwich formed of the substrate and one or more of the at least one isolating layer, before the laminating is performed.
  • the method includes attaching an activating switch to the card and connecting the activating switch to at least one component.
  • the method includes attaching one or more data receiving or transmitting components to the card, and connecting the activating switch to at least one component.
  • the substrate has a thickness of less than 0.45 mm.
  • the card has a thickness of less than 0.84 mm.
  • laminating the substrate to the at least one isolating layer comprises laminating to an isolating layer having an area of at least the area of the substrate.
  • a method of manufacturing an identification card comprising providing a substrate carrying a circuit including at least one electrical element, programming the circuit, and laminating the substrate with at least one isolating layer.
  • the at least one isolating layer has an area of at least the area of the substrate.
  • a method of manufacturing an identification card comprising providing a circuit including at least one electronically programmable device, programming the at least one electronically programmable device; and inserting the programmed device into an identification card.
  • inserting the programmed device into the card comprises laminating a substrate carrying the circuit with one or more plastic layers.
  • the laminating comprises using a cold lamination process.
  • the laminating comprises using an at least partially hot lamination process.
  • programming the device comprises programming with non-personalized data.
  • programming the device comprises programming with unique data which is different from information of other cards in a card batch of the card.
  • a method of preparing an identification card for use comprising generating one or more random initial keys, providing one or more parameters, generating one or more operator generated values, by applying an operator to the one or more random initial keys and the one or more parameters, storing the one or more operator generated values, on a storage medium external to the card; and programming a circuit of the card with the random initial keys and the one or more parameters.
  • the one or more parameters comprise a public ID of the card.
  • the one or more random initial keys include at least one of a private ID and a counter start point.
  • the one or more operator generated values comprise hash codes.
  • the method includes testing the card by comparing the operator generated values to values generated by the circuit. Possibly, the testing is performed before the circuit is embedded in the card with a plastic surrounding from all sides.
  • the one or more random initial keys are deleted from any storage medium not in the card after the storing of the one or more operator generated values and the programming of the circuit.
  • FIGS. 1A-1D are schematic illustrations of identification cards, in accordance with some embodiments of the present invention.
  • Fig. 2 is a schematic illustration of layers of an identification card, in accordance with an embodiment of the present invention
  • Figs. 3A-3C are schematic cross-section illustrations of transducers, in accordance with some embodiments of the present invention
  • Fig. 4 is a block diagram of an identification card manufacture process, in accordance with an embodiment of the present invention.
  • Fig. 5 is a block diagram of an identification card manufacture process, in accordance with an embodiment of the present invention.
  • Fig. 1A is a schematic illustration of a self-powered identification card 10, in accordance with an embodiment of the present invention.
  • Identification card 10 comprises a substrate 17 (e.g., a Printed Circuit Board (PCB)) on which are mounted various electronic elements embedded within card 10.
  • the elements mounted on substrate 17 optionally include a battery 11, a processor chip 12, transducers 14 and/or 15, and/or a switch 16.
  • a display unit (not shown), including for example an LCD and/or one or more LEDs, is also mounted onto substrate 17.
  • Connectors 13 for an extended chip are optionally also provided.
  • switch 16 (optionally an internal switch) enables the electronics in identification card 10 to first transmit data, which is then followed by a short receiving period.
  • the single switch 16 permits multiple modes (as described in U.S. patent application 09/570,399 of the same applicant, the disclosure of which is incorporated herein by reference) where, for example, a single pressing of the switch indicates transmission and a double pressing indicates reception.
  • multiple switches are provided on a single self-powered identification card.
  • switch 16 is a dome switch constructed of stainless steel material, but of course it can be any other type of switch, for" example, a membrane switch.
  • a thin PNC layer optionally also covers the switch.
  • switch 16 is provided on the side opposite the printed PNC layer where the actual magnetic stripe is placed.
  • two transducers 14, 15 are provided, one for transmission (e.g., a speaker for acoustic signals) and the other for reception (e.g., a microphone for acoustic signals). In other embodiments of the invention, only one transducer is used for both transmission and reception.
  • transducers 14 and/or 15 are piezo- ceramic discs positioned on top of a small brass/steel plate, as described hereinbelow with reference to Figs. 3A-3C.
  • the self-powered identification card is thin (0.8 mm is a standard plastic card thickness), so that an internal microphone should also be very thin.
  • the acoustic receiver can be any suitable microphone, such as a regular capsule microphone or an ultrasonic type microphone, which may be specific for a particular frequency or frequency range used. In some cases, special ultra-low power circuitry may be used, to allow for longer operation life of card 10.
  • the acoustic transmitter can preferably generate a strong atmosphere wave. It is noted however, that only a small amount of power is required for short-range transmissions.
  • the reception transducer may be a capacitive microphone with two plates with a small air gap; that is, the distance between the two plates is small compared to conventional capacitive microphones. Any vibration on the plate changes the capacitance, which in turn changes the current to the reception circuitry. With a DC voltage applied across the plates, the resulting changing current signal is filtered, amplified, and then analyzed since the modulation of this signal is directly proportional to the information contained therein.
  • the transmitted transducer is a thin stainless steel/brass plate on a PCB with a piezo-ceramic material on top of it. The distance between the top surface of the piezo-ceramic material and the printed PNC layer is approximately 0.8 microns (micro-meters).
  • battery 11 is a thin-film battery or a thin button cell battery, as it known in the art. Furthermore, the use of Lithium-IO ⁇ thin film or thin button batteries have desirable power characteristics, and Sodium-Ion technology allows for more convenient machining, and is less toxic.
  • Battery 11 is optionally small and operates in a range of between about 0-60 degrees Celsius, so that the battery will not be damaged even if the card is left inside a hot car. Alternatively, battery 11 operates and/or is not damaged in a larger range of temperatures, for example down to -15 degrees Celsius. Optionally, battery 11 has a life span for at least 10,000 card activations (i.e., switch pressings).
  • Chip 12 optionally includes a microprocessor and a memory unit although other chips may be used including specific dedicated hardware chips.
  • Chip 12 optionally includes a digital core (microprocessor and supporting circuits and components, such as memory unit) as well as an analog front end.
  • chip 12 includes a Surface Mount Technology (SMT) component.
  • SMT Surface Mount Technology
  • the electronic components in card 10, including battery 11, switch 16, chip 12 and/or the transducers, are optionally miniaturized and placed on select locations in the card to optimize the use of the limited space available. However, as components get smaller and smaller, the placement of some components (in whole or in part) should not affect the durability and reliability of the self-powered identification card.
  • identification card 10 includes a magnetic strip and/or embossed data, including for example a name, a social security number and/or an expiration date.
  • card 10 includes a bank logo, issuer graphics, a hologram and/or other security graphics and/or a photo of the cardholder.
  • components in card 10 are placed in locations such that bending of the card will not damage or otherwise impair the functionality of the self- powered identification card, hi addition, the electronic components are optionally placed in location which will allow the embossing of the data on card 10 and/or adding the hologram to the card, without causing damage to the electronic components.
  • a region 18 is defined for the placement of embossing, holograms, a magnetic stripe and/or any other card additions which are to be added to card 10, in accordance with some embodiments of the invention, after the electronic components are added to the card.
  • region 18 only electronic components insensitive to pressure and/or heat are placed, such as switch 16 and transducers 14 and 15.
  • region 18 does not include any electronic elements.
  • Fig. IB is a schematic illustration of an identification card 10, in accordance with another embodiment of the present invention.
  • card 10 includes two batteries lib and 15a.
  • a single transducer 19 is shown instead of both of transducers 14 and 15.
  • Chip 12, switch 16 and a protion of first battery 11a are located in a magnetic stripe region 18a.
  • region 18b is the magnetic stripe area, instead of region 18a.
  • transducer 19 and part of second battery lib are placed in region 18 without affecting the magnetic stripe.
  • Fig. 1C shows identification card 10, in accordance with still another embodiment of the present invention, this embodiment, switch 16 is the only component in the magnetic stripe region 18a.
  • the connectors 13 of self-powered identification card 10 are placed below transducer 14.
  • the magnetic stripe region 18a can also be used for embossing purposes.
  • Fig. ID shows identification card 10, in accordance with still another embodiment of the present invention.
  • a PCB substrate 19, smaller than substrate 17, is used to mount chip 12, tranducers 14 and 15 and switch 16.
  • a thin battery lie is positioned near a comer of card 10, optionally adjacent substrate 19. Positioning battery lie near the edges, optionally the comers, of card 10, reduces the chances that the battery will be damadged due to bending of card 10.
  • other elements of card 10, such as chip 12 are located near the edges and/or corners of card 10.
  • the doted Section 60 represents an optional area for hologram adhesive.
  • the attachment of the Hologram over circuit elements such as batteries requires the modification of certain process parameters. Holograms are typically "hot stamped” onto the card body. This involves a heated “ram” that literally melts the plastic of the hologram into and onto the card body in the desired location.
  • the placement of the components in self-powered identification card 10 is an important design criterion.
  • the embossing area which is also typically not the same area as the magnetic stripe region 18, should contain no components as the process of embossing may destroy or damage components, as shown in Fig. ID.
  • both the embossing area 18d and the area applied for the connecting of smart chip module 13 are free from components of self-powered identification card 10. This allows embossing to be accomplished with relative ease, while minimizing the concerns that credit card manufacturers may have on whether the embossing process might harm an electronic component.
  • Fig. 2 is a schematic illustration of the layers of identification card 10, in accordance with an embodiment of the present invention.
  • the electronic elements to be embedded in card 10, for example chip 12, battery 11, transducer 14, and switch 16, are placed on a substrate layer 23.
  • an insulation material (not shown), for example PNC, is used to cover battery 11 and/or other electronic components which require insulation.
  • an epoxy material and/or any other reinforcement material is placed on some or all of the electronic components in order to prevent moisture from forming and/or to prevent damage from physical bending.
  • substrate layer 23 comprises a very thin PCB whose underside (in the direction facing substrate 25) has copper interconnects with special coating.
  • a filler material is used to cover substrate layer 23 along with the embedded electronic components in order to cover gaps and/or to even out the height of layer 23.
  • a printed PNC layer 22 is optionally placed above substrate layer 23.
  • a magnetic stripe is fabricated on PNC layer 22.
  • a printed PNC layer 25 is optionally provided below layer 23.
  • Various images e.g., credit card logo, and bank logo), photos, and other information associated with credit cards are optionally provided on PNC layer 25.
  • the magnetic stripe can be placed on printed PNC layer 25 and the other images and photos can be placed on PVC layer 22.
  • Clear PNC outer layers 21 and 26 are optionally provided on the outer surface of each side of identification card 10.
  • layers 21, 22, 23, 25 aand 26 are combined in a lamination process.
  • a hot lamination process is used.
  • the electronic components of substrate 23 are optionally durable components known in the art which are not sensitive to temparetures and/or pressures required in hot lamination processes. Existing durable components can undergo lamination and embossing at 120 degrees for 10 minutes.
  • a controlled, partially hot, lamination process is used.
  • a cold lamination process is used, such as described in the above mentioned DE 19645071 patent.
  • a shielding layer is placed on relatively sensative components before the larnination to prevent damage due to the lamination process.
  • an "Activation energy” any type of energy that causes materials or adhesives to change state
  • an “Activation energy” other than thermal energy for example as in cold lamination, less insensitive elements may be used.
  • the lamination includes using an adhesive material that serves as both an adhesive and a filler, which is required to protect the electronic layer against normal forces.
  • Fig. 3A shows a cross-section of a circular transducer, such as transducer 14 of Fig. 1A, in accordance with one embodiment of the present invention.
  • a brass/stainless steel plate 34 is optionally provided.
  • a small piezo-ceramic disc or element 33 is optionally placed on top of brass/stainless steel plate 34. In order to provide some room for the vibration and/or movement of piezo-ceramic element 33, needed to generate acoustic signals, some space is provided around the piezo-ceramic element 33.
  • the resonant frequency of the acoustic signals generated by the transducer depends on the selection of the various parameters of the components in the transducer. These parameters include, for example, the thickness of the piezo-ceramic element 33, and the thickness, stiffness, type of material, shape, and diameter of the brass/stainless steel plate 34.
  • printed PNC layer 30 (corresponding to PNC layer 22) is spaced apart from piezo-ceramic element 33. The distance from the top of the piezo-ceramic element 33 to the bottom of the printed PNC layer 30 forms a reverberation chamber 31. Walls 32 defining the sides of chamber 31 are optionally formed of an intermediate adhesive and/or a plastic layer, as is known in the art.
  • the acoustic signal generated by the transducer is generally directed toward PCB 35 (downward direction on Fig. 3A).
  • PCB 35 has a thickness of approximately 100 ⁇ m (microns)
  • brass/stainless steel plate 34 has a thickness of approximately 100-150 ⁇ m
  • piezo-ceramic element 33 has a thickness of approximately 150 ⁇ m
  • chamber 31 has a thickness of approximately 80 ⁇ m.
  • Fig. 3B shows an alternative embodiment of the transducer construction, hi this embodiment, brass/stainless steel plate 34 is not used. Instead, piezo-ceramic element 33 rests on, and uses PCB layer 35, as a substitute plate. In some embodiments of the invention, a portion of printed PNC layer 30 protrudes into chamber 31 so that the distance between the top of the piezo-ceramic element 33 and the bottom of the protruded printed PNC layer 30 remains at about 80 ⁇ m. In a variation of this embodiment, piezo-ceramic element 33 is made thicker and the protruding portion of the printed PVC layer 30 is not used.
  • Figs. 3 A and 3B show transducers, which are fabricated during the fabrication of card 10.
  • Fig. 3C shows a third embodiment of the transducer construction, where the transducer is modular and not fabricated with card 10.
  • chamber 31 is defined by a wall 36 and a cover portion 36a.
  • cover portion 36a and wall 36 are made either of steel or of plastic, hi this configuration, the piezo-ceramic element 33 need not rely on the printed PVC layer 30 to form chamber 31. It is noted that the modular transducer of Fig. 3C is better suited, in some cases, for use in hot lamination processes.
  • Fig. 4 schematically illustrates in block diagram form a manufacturing process of self- powered identification card 10, in accordance with an embodiment of the present invention.
  • the process of Fig. 4 may be divided into three stages which may be performed in different geographical locations and/or at different times. It is noted, however, that the process may be performed in more or fewer stages, and the stage division of Fig. 4 is brought only by way of example.
  • module assembly 41 a module including substrate 17 (Fig. 1A, for example, substrate layer 23 in Fig. 2) and the electronic components thereon, is assembled.
  • card 10 is assembled.
  • Stage 42 includes programming the module assembled during module assembly 41, in an act referred to as Writing Module 422.
  • a hash generation process 423 is performed.
  • the results of the hash generation 423 are optionally stored in a hash database (DB) 46 in addition to their use in programming the module.
  • Stage 42 further comprises manufacturing of the layers of card 10 described in Fig. 2 and the graphics to be imprinted on card 10, such as a bank logo, a hologram and/or a magnetic stripe (421).
  • the assembly includes printing card graphics on PVC layers 22 and 25.
  • the card graphics are printed on PVC layers 22 and/or 25 before they are combined with substrate layer 23.
  • the printing is performed after PVC layers 22 and 25 are combined to substrate layer 23.
  • the combined layers 22, 23 and 25 are inserted to a printing machine twice so as to print on both sides of the card.
  • clear outer layers 21 and 26 are optionally laminated, or otherwise attached, to the other layers so as to form card 10.
  • Clear overlay layers 21 and 26 make the plastic surface of card 10 more durable.
  • clear outer layers 21 and 26 are attached to PVC layers 22 and 25, respectively, before their attachment to substrate layer 23.
  • clear outer layers 21 and 26 are attached to PVC layers 22 and 25, respectively, after the PVC layers are attached to substrate 23.
  • clear outer layers 21 and 26 include a magnetic strip and/or a security fluorescent printing.
  • the magnetic strip and/or the fluorescent printing are added to the card after the card is assembled.
  • an additional chip is added to card 10 using methods known in the art.
  • the card 10 is in its final form as an ISO standard bank-type card, complete with magnetic stripe, signature panel, hologram, graphics, and bank association logo.
  • self-powered identification card 10 emerges from this stage singulated (i.e., separated from the sheet into single cards) with the magnetic stripe and the unprogrammed smart chip, and not yet affiliated with any cardholder account information.
  • the last stage of the manufacturing of self-powered identification card 10 is a Personalization stage 43.
  • the personalization stage 43 the physical card is linked to its owner.
  • Stage 43 includes the same personalization process as with any standard credit card, with or without self-powered identification card functionality.
  • Stage 43 includes embossing, unique graphic printing, magnetic stripe writing, and/or self-powered identification card programming.
  • the magnetic stripe and the optional smart chip are programmed, and associated with an actual card holder account, such as personalized self-powered identification card 45, which is the final product of the self-powered identification card 10 manufacturing process.
  • a picture or a signature of the cardholder can be added, at stage 43, to the graphics of self-powered identification card 10.
  • self-powered identification card 10 is ready for shipment to the cardholder.
  • the self-powered identification card is optionally squeezed (i.e., activated), sending a signal that generates a link table 44, which links the ID of the self- powered identification card manufacturer and the personalized credit card ID of the card holder.
  • Stage 42 is a distinct stage of the manufacturing process than stage 41. Such that stage 42 can be carried out at a facility other than that used (i) to print and laminate printed PVC layers 22 and 25 with clear PVC layers 21 and 26 (PVC Assembly Stage 421); and (ii) module assembly stage 41. Therefore Stage 42 is module that can be collocated either within the same facility used for within the same facility as PVC Assembly Stage 421 or Personalization Stage 43.
  • Proprietors of credit card brands (each an "Issuing Group"), such as bank card associations (e.g. Visa or Mastercard) or stand-alone brands (e.g. American Express, Discover, JCB, Diners), along with bank and credit card issuers (e.g. Nippon Shinpan, Citibank, Chase, First USA, Barklays, HSBC) maintain rigorous quality and security requirements for the facilities used to produce their cards. Those requirements are aimed to protect the cardholder account information used in personalizing the cards, and to protect the graphical and other security elements used to prevent the production of counterfeit cards.
  • bank card associations e.g. Visa or Mastercard
  • stand-alone brands e.g. American Express, Discover, JCB, Diners
  • bank and credit card issuers e.g. Nippon Shinpan, Citibank, Chase, First USA, Barklays, HSBC
  • the PVC layers 21, 22, 25 and 26 contain such controlled elements such as bank and bank association graphics.
  • those PVC layers should be printed within facilities that are certified by those groups for their safety, security and quality.
  • PVC Assembly Stage 421 occurs in printing machine lines that are distinct from the Datacard 9000-type machine lines used in Personalization Stage 43.
  • Card Assembly Stage 42 under the present invention can occur at separate facilities, or within the same facilities as PVC Assembly Stage 421, or Personalization Stage 43. As indicated in Figure 4, Card Assembly Stage 42 shares a facility PVC Assembly Stage 421, thus saving the expense of having a separate facility certified by the Issuing Groups.
  • the pre- personalized cards can be shipped using secure shipping techniques. In that way, a single Card Assembly Stage 42 can serve several personalization facilities.
  • Card Assembly Stage 42, PVC Assembly Stage 421, and Personalization Stage 43 would all be housed within a single facility, certified by at least one Issuing Group.
  • each of Card Assembly Stage 42, PVC Assembly Stage 421, and Personalization Stage 43 would each be housed within separate facilities, each being certified by at least one Issuing Group.
  • Fig. 5 schematically illustrates the manufacttiring process and the testing of self- powered identification card 10 according to an embodiment of the invention.
  • a self-powered identification card module 51 is manufactured, comprising the components and PCB of self-powered identification card 10, as described with reference to Figs. 1A-1D and/or Fig. 4.
  • a Module Writing 422 programs all data required into memory units of self-powered identification card module 51.
  • the memory units are integrated parts of chip 12.
  • the required programmed data that is stored in module 51 includes:
  • Card Public ID an individual ID that each self-powered identification card is assigned during its mmufacturing process.
  • the individual ID is essentially the card's serial number and is unique to that card.
  • the manufacturer's server has data concerning each self-powered identification card public ID.
  • TD - Card Private TD - a random value that is generated per card from a random number generating machine, as an additional card ID. While the manufacturer server knows each self-powered identification card public ID, it does not know or have access to the self-powered identification card private ID. This random value is a secret number, and is used to increase the security level of self-powered identification card.
  • Encryption Keys - one or more random values that are used for the encryption of the Private Card ID and the counter value while they will be transmitted from the self- powered identification card.
  • the encryption that is used by the card, in order to encrypt the Private TD and the counter is Triple Data Encryption Standard (3-DES), but of course, any other encryption method can be used, in order to encrypt the Private ID and the counter.
  • 3-DES Triple Data Encryption Standard
  • any other encryption method can be used, in order to encrypt the Private ID and the counter. It is noted that the above data is brought by way of example and that any other data set may be used, including data sets for transmission of non-encrypted data.
  • Random Generator 52 provides the random values (i.e., secret keys) that represent the
  • Module Writing 422 stores these secret generated keys in the memory units of Module 51.
  • the programming station, Module Writing 422 inserts the actual self-powered identification card specific data into the card (i.e., into module 51) such as, card software, card secret data (i.e., Card Private ID, etc.
  • Hash table is built from N number results of a hash function (i.e., a one-way mathematical function). Hash table is used to allow a server to identify a user and according to its self-powered identification card.
  • a Hash function is a transformation that converts a string of any size to a fixed-size string. The fixed-size string is called Hash value.
  • Hash functions with this property have a variety of general computational uses, but when employed in cryptography, the hash functions are usually chosen to possess additional properties.
  • Hash Generator 423 generates a cryptographic value corresponds to an encryption process such as, a hash function.
  • Hash Generator 423 receives at its input a Card Private ID value, a current counter value and the encryption keys.
  • Hash Generator 423 uses the encryption key(s) to encrypt the Private ID and the current counter, by an encryption function (e.g., T- DES).
  • the encrypted data together with set of predetermined parameter are used to provide the output of Hash Generator 423.
  • the provided output is an addition encrypted value, which is stored as a part of the Hash table in an external Hash Database 46.
  • the initialization data provided by Random Generator 52 and the predetermined set of parameters are now used to generate additional N hash function values for N future squeezes on the self-powered identification card switch, and thereby creating a hash table that is stored in the external hash database. These values that are stored in the hash table are referred to as operator generated values.
  • a hash function is operated using the Card Public ID as the key to identify the cardholder and compare it with its operator generated values. After the hash table was filled with all N values of future squeezes, the values of the private ID and the encryption keys are deleted.
  • the programming module 53 initiates the process of creating the authentication database 46 for specific card (i.e., hash table) only after successful programming of module 53.
  • the programming module 422 sends the card data to an authentication database creator.
  • the authentication database creator builds the authentication database (i.e., hash table) and stores it in the authentication database 46, waiting for the self-powered identification card to be exported from the facility, which will define the actual authentication database which will be retrieved.
  • Station 54 checks the programming of Programmed Module 53, in order to define whether it was programmed properly.
  • the programmed module 53 is tested against its own hash table, which is stored in hash database 46, to check if it transmits the information that is stored in it, or generated by it, correctly.
  • Testing station 54 squeezes the switch (i.e., press a button), which is physically attached to module 51, to generate a signal and transmit it, in order to compare it to its own hash table.
  • the transmitted signal then goes through the same hash function, as used to generate its own hash table, and two bit streams are compared. This is done in order to define whether the programming of module 51 was successful.
  • Testing Station 54 tests Programmed Module 53 before it is assembled. In case the programmed module 53 does not pass the test, there is an option to save the resources of Card Public ID by recycling the Card Public ID from Programmed Module 53, and making its value available for use with another self-powered identification card. All the other data were generated at random, so that there is no need to save or remember them. The programmed module is destroyed and its hash table is not used or is deleted.
  • Card Assembly Process 424 laminates working module 55 with plastic and graphics 421.
  • the card assembly process optionally includes laminating the following card layers:
  • an optional smart chip module is to be added, then it is added following the end of the lamination process.
  • the bonding process of the layers is made in a vacuum (as disclosed for example, in DE 19645071), and optionally also using ragged surfaces that are pressed against each other.
  • an assembled Self-powered identification card 57 is provided in its final form as an ISO standard card, shaped with graphics, and may have an optional magnetic stripe and/or smart module, as described also with reference to Fig. 4.
  • Testing Station 56 tests the assembled Self- powered identification card 57.
  • This test has almost the same functionality as the test that was taken by Testing Station 54, but at this testing 56 the card is already assembled.
  • the assembled self-powered identification card 57 transmits data to Testing Station 56, which checks whether the assembled Self-powered identification card 57 has beeped, and if another beeping is raising the inner counter of Self-powered identification card 57 by a wanted value.
  • the switch on the self-powered identification card needs to be squeezed.
  • a plunger is attached to the card where its operation squeezes on the card's switch.
  • the last stage of the manufacturing process of Self-powered identification card 57 is the Personalization stage 43 that was described with reference to Fig. 4.
  • the card public ID or any other identification information is being recorded on the magnetic stripe and it is being read during personalization stage 43.
  • the read information from the magnetic stripe cause for a link to be created between the cardholder and that specific self-powered identification card.
  • the user normally has to log into the card distributor's website and press the button (i.e., switch) on the assembled self-powered identification card 57.
  • the website then processes the data transmission and affiliates the card ID with the user's account.
  • the self-powered identification card can emit a signal usable over ordinary phone lines or cellular phones and thus, the cardholder's first activation of a card could also result in affiliating the card ID with the cardholder's account.
  • the issuer needs not worry about programming the self- powered identification card, since the affiliation of the self-powered identification card with the user's account occurs at the back-end, after the user has activated the self-powered identification card by pressing the self-powered identification card button.
  • the personalization of the self-powered identification card occurs upon the "first use" of the self-powered identification card in accordance with one embodiment of the present invention.
  • conventional technologies require some form of card-accepting device to be available and operational at the time of card registration or activation in order for personalization to occur.
  • Self-powered identification card button which is a mechanical test, and which tests if the switch is working according to the standard requirement.
  • a plunger is used to execute the test for the switch.
  • the self-powered identification card optionally complies with the credit card set of standards - ISO 7810, 7811-1 to 7811-6, 7813, 7816-1, and 7816-2. Some minor deviations from the standard may be required, for example the location of the external switch and/or the additional functionality provided by the self-powered identification card electronics. In other embodiments, no attempt is made to make the self-powered identification card comply with a specific credit card standard.
  • Card 10 optionally allows for conventional embossing in an area (for example region 18 of Fig. 1) reserved for embossing cardholder information in compliance with ISO 7816.
  • High pressure embossing is optionally also performed in a card signature field of card 10.
  • no electronic elements which are sensitive to embossing are included in these areas.
  • Card 10 is optionally printed with external features of an integrator's choice, such as holograms and/or company logos.
  • the present invention includes many attributes which provide improvement over existing identification card manufacturing procedures.
  • the manufacturer programs the card with appropriate values, i.e., codes and IDs, as required for a predetermined purpose.
  • the cards are produced in sheets, which facilitates significant productivity efficiency over the handling of individual self-powered identification cards.
  • the self-powered identification card should comply with the credit card standards organization's approved payment system. This involves the need for additional components in the cards, and additional programming to comply with the payment standard.
  • the manufacturer of these self-powered identification cards need not comply with this payment system standard. This allows the manufacturer to save on the cost of supplying, assembling, and programming the chips with the payment system standard-complying logic.

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Abstract

L'invention concerne un procédé destiné à la fabrication d'une carte d'identification. Ce procédé consiste à recouvrir un substrat transportant un circuit formé par au moins un élément électronique avec au moins une couche isolante à l'aide d'un procédé de stratification à chaud, partielle ou totale.
PCT/IL2002/000235 2001-03-22 2002-03-21 Fabrication de dispositifs d'identification autoalimentes WO2002076717A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP02718485A EP1407418A4 (fr) 2001-03-22 2002-03-21 Fabrication de dispositifs d'identification autoalimentes
AU2002249532A AU2002249532A1 (en) 2001-03-22 2002-03-21 Manufacture of self-powered identification devices

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US27799601P 2001-03-22 2001-03-22
US27801001P 2001-03-22 2001-03-22
US27806501P 2001-03-22 2001-03-22
US60/278,010 2001-03-22
US60/278,065 2001-03-22
US60/277,996 2001-03-22
US09/853,017 2001-05-10
US09/853,017 US7280970B2 (en) 1999-10-04 2001-05-10 Sonic/ultrasonic authentication device
PCT/IL2001/000758 WO2002014974A2 (fr) 2000-08-14 2001-08-14 Authentification par serveurs multiples
ILPCT/IL01/00758 2001-08-14

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PCT/IL2002/000236 WO2002078199A2 (fr) 2001-03-22 2002-03-21 Procede et systeme d'authentification a distance de dispositifs d'identification

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US9607475B2 (en) 1998-09-16 2017-03-28 Dialware Inc Interactive toys
US9830778B2 (en) 1998-09-16 2017-11-28 Dialware Communications, Llc Interactive toys
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US7607249B2 (en) 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
US7959085B2 (en) 2006-04-10 2011-06-14 Innovatier, Inc. Electronic inlay module used for electronic cards and tags
US8727224B2 (en) 2006-06-20 2014-05-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
CN101794479A (zh) * 2010-04-08 2010-08-04 中国工商银行股份有限公司 一种银行卡制卡系统及换卡系统
CN103370181A (zh) * 2011-01-18 2013-10-23 因诺瓦蒂尔公司 用于在制造电子装置时将电子组合件附接到底部覆盖层的方法
CN103370181B (zh) * 2011-01-18 2017-03-01 因诺瓦蒂尔公司 用于在制造电子装置时将电子组合件附接到底部覆盖层的方法

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WO2002078199A2 (fr) 2002-10-03
WO2002076717A3 (fr) 2004-01-15
EP1381985A4 (fr) 2013-06-26
WO2002078199A3 (fr) 2003-02-27
AU2002249532A1 (en) 2002-10-08
EP1407418A4 (fr) 2010-06-23
EP1381985A2 (fr) 2004-01-21
EP1407418A2 (fr) 2004-04-14

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