WO2002074489A1 - Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces - Google Patents

Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces Download PDF

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Publication number
WO2002074489A1
WO2002074489A1 PCT/EP2002/003120 EP0203120W WO02074489A1 WO 2002074489 A1 WO2002074489 A1 WO 2002074489A1 EP 0203120 W EP0203120 W EP 0203120W WO 02074489 A1 WO02074489 A1 WO 02074489A1
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WO
WIPO (PCT)
Prior art keywords
tool
outlet
inlet
machined
machining
Prior art date
Application number
PCT/EP2002/003120
Other languages
German (de)
French (fr)
Inventor
Oliver FÄHNLE
Original Assignee
Fisba Optik Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fisba Optik Ag filed Critical Fisba Optik Ag
Priority to US10/527,468 priority Critical patent/US20060141911A1/en
Priority to EP02716837A priority patent/EP1409199B1/en
Priority to DE50208850T priority patent/DE50208850D1/en
Publication of WO2002074489A1 publication Critical patent/WO2002074489A1/en
Priority to US11/931,552 priority patent/US20080119113A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/116Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives

Definitions

  • the invention relates to a device for the abrasive processing of surfaces of elements and in particular of optical elements or workpieces.
  • a wide variety of methods and devices are known for the abrasive processing of surfaces, as is required, for example, for the production of optical elements, such as lenses, prisms, plane-parallel plates, etc., but also for molds for casting or pressing optical elements.
  • the surface to be processed is first subjected to a grinding process and, if appropriate, a fine grinding process with contacting tools, such as disc grinders, ball grinders, etc., and then a polishing process with a polishing tool.
  • a grinding process it is also known to subject the surfaces to a turning process on a lathe with a suitable turning tool or to use another machining process. Most machining processes in which a comparatively large amount of material is removed require at least when optical surfaces are produced finally polishing the surface.
  • polishing is carried out over large areas with a polishing plate on spherical surfaces.
  • aspherical surfaces are produced using tools such as ball grinders, which have a more or less punctiform engagement with the surface to be machined and which are guided along a path over the surface to be machined.
  • the surface is ground or polished.
  • aspherical surfaces are often only ground in a web; The polishing then does not take the form of a web, but over a large area.
  • the surface polishing results in a more or less large polishing error, which has to be compensated for by corresponding manufacturing provisions in the preceding machining operations.
  • the invention is based on the object of specifying a device for the abrasive processing of surfaces and in particular for grinding and / or polishing surfaces of optical elements, which is fast
  • Processing of the surfaces is permitted regardless of the shape of the surface being processed.
  • the device for the abrasive processing of surfaces and in particular for grinding and / or polishing optical elements has a tool which has a fluid inlet and a fluid outlet.
  • a supply unit conveys a liquid to the fluid inlet in which abrasive agents are dissolved. This fluid flows through the tool to an outlet through which it exits the tool.
  • this tool is positioned relative to the surface to be machined by a positioning device such that the outlet from which the
  • the surface to be processed is in particular at a short distance from it. It is crucial here that the area of the annular gap formed by the boundary walls of the outlet and by the area to be machined is smaller than the cross-sectional area of the inlet. As a result, the liquid in which abrasive agents are dissolved at a substantially higher pressure than the pressure with which it flows into the inlet, radially through the annular gap to the tool. The surface of the workpiece is machined by the radially flowing liquid. Depending on the type of abrasive agent dissolved in the liquid, the surface is machined in the area of the annular gap and thus in a linear grinding or polishing process. Due to the linear machining, the machining time is reduced by orders of magnitude in comparison to the known methods or devices in which there is an essentially punctiform engagement between the tool and the workpiece.
  • the ratio of the pressure with which the liquid flows into the tool to the pressure with which the liquid exits the annular gap is inversely proportional to the ratio of the cross-sectional area of the inlet to the cross-sectional area of the annular gap formed. This means that the "machining pressure" by positioning the tool relative to the
  • a particular advantage of the invention is that it is possible to work with comparatively low pressures on the inlet side: in particular, the feed unit can convey the liquid at a pressure of less than 20 bar, preferably less than 5 bar, possibly even only at atmospheric pressure.
  • the cross-sectional area of the inlet is at least five times larger than the cross-sectional area of the annular gap formed. It is further preferred if the height of the annular gap formed is less than 3 mm and in particular is approximately 1 mm.
  • the positioning device has a control unit which controls the positioning of the tool in accordance with the surface data of the surface to be produced. It is preferred if the tool is positioned in such a way that the height of the annular gap remains constant during the displacement along the respective tracks.
  • the positioning device can position the tool along any path relative to the workpiece, i. H. move to the surface to be machined.
  • the path can be a meandering path, with either the tool or the workpiece or both being moved.
  • the tool and the element from which a surface is to be machined can be moved simultaneously.
  • the tool is moved along paths that pass through the surface vertex and at the same time the workpiece or the element to be machined is rotated about an axis by a rotating unit, which in particular is the axis of rotation of the surface to be manufactured.
  • the outlet has a circular cross section and the tool has a (circular) cylindrical outer contour at least in the region of the outlet.
  • the fact that the cross-sectional area of the inlet is smaller than that of the outlet means that the surface is machined only in a linear (or circular) manner in the region of the annular gap and not also in the center of the outlet ,
  • the size of the tool is adapted to the shape of the surface to be machined:
  • the outside diameter of the tool can be machined in the area of the outlet for machining flat surfaces
  • the order of magnitude of half the aperture of the optical element is such that very fast processing of the surface is achieved with the greatest possible homogeneity of the processing operation.
  • the outer diameter of the tool is preferably of the order of the smallest radius (smallest main radius of curvature) of the surface; this ensures that the height of the annular gap is practically constant over the entire annular gap formed.
  • the device according to the invention can be used to machine any surfaces of elements or workpieces, which in principle can consist of any materials.
  • the device according to the invention can be used for machining turbine blades made of steel due to the high machining speed.
  • the use of a device according to the invention for grinding and / or polishing optical surfaces is particularly preferred.
  • the respective elements can be used in the case of lenses, prisms, plane-parallel plates etc. - i.e. directly manufactured optical elements - consist of quartz, an optical glass or a plastic material; if molds for the casting and / or pressing etc. of optical elements are to be produced, the elements can also consist of a metal, such as steel, or a ceramic material.
  • the type of removal essentially does not depend on the design of the tool, but on the type of liquid used or the abrasive agent (agent) dissolved in the liquid, one and the same device can be successively used for grinding, possibly fine grinding and finally used to polish an element or workpiece in one and the same setting.
  • the change between the individual types of processing then only requires an exchange or change of the processing fluid used in each case. In any case, however, it is particularly preferred if the device according to the invention is used for processing aspherical surfaces.
  • FIG. 1 shows a device according to the invention when machining a flat surface
  • Fig. 2 shows a device according to the invention when machining a curved and in particular aspherical surface.
  • the tool 1 shows a device according to the invention, of which only the tool 1 is shown, when machining a flat surface 21 of a workpiece 2, which is a plane-parallel plate without restricting generality.
  • the tool 1 has an inlet 11 and an outlet 12, the cross-sectional area of which is larger than that of the inlet 11.
  • a feed unit not shown, conveys a liquid in which abrasive agents, such as abrasives or polishing agents, are dissolved into the inlet 11 of the tool 1
  • the tool 1 is a positioning unit, not shown positioned relative to the workpiece 2 such that an annular gap 3 is formed between the boundary walls 13 of the outlet 12 and the surface 21, the cross-sectional area of which is smaller and preferably substantially smaller than the cross-sectional area of the inlet 11.
  • the pressure at which the liquid emerges from the annular gap 3 is increased by the ratio of the cross-sectional areas of the inlet 11 and the annular gap 3.
  • the pressure effective for the machining of the workpiece surface 21 is thus significantly greater than the delivery pressure.
  • the positioning device moves the tool 1 parallel to the surface of the workpiece 2, while a rotating unit, also not shown, rotates the workpiece 2 about an axis 22, so that the linear engagement along the annular gap 3 is shifted over the workpiece 2 such that the entire Surface 21 machined evenly, for example polished.
  • the diameter of the tool 1 is in the order of the radius of the workpiece 2.
  • Fig. 2 shows an apparatus according to the invention during the machining of a curved and in particular aspherical surface 21 ⁇ of a workpiece 2.
  • the same parts are provided with the same reference numerals, is omitted to be presented again.
  • the diameter of the tool 1 is of the order of the smallest radius of the aspherical surface 21 ⁇ .
  • the positioning unit also not shown, pushes tool 1 along paths that run through the apex of surface 21 * *.
  • the workpiece 2 is rotated about an axis of rotation 22 running through the apex.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention relates to a device for the abrasive machining of surfaces of elements. Said device comprises a tool (1) with an inlet (11) and an outlet (12), a supply unit that supplies a liquid to the inlet (11), said liquid containing dissolved abrasive agents and emerging from the outlet (12) and a positioning device, which guides the tool over the surface to be machined, positioning said tool in such a way that the outlet lies opposite the surface to be machined. According to the invention, the surface area of the annular gap (3) that is formed by the limiting walls (13) of the outlet (12) and the surface (2) to be machined is smaller than the cross-sectional surface of the inlet (11).

Description

Vorrichtung zur abrasiven Bearbeitung von Device for the abrasive processing of
Flächenvon Elementen und insbesondere vonAreas of elements, and in particular of
Optischen Elementen bzw. WerkstückenOptical elements or workpieces
BESCHRE IBUNGDESCRIPTION
Technisches GebietTechnical field
Die Erfindung bezieht sich auf eine Vorrichtung zur abrasiven Bearbeitung von Flächen von Elementen und insbesondere von optischen Elementen bzw. Werkstücken.The invention relates to a device for the abrasive processing of surfaces of elements and in particular of optical elements or workpieces.
Stand der TechnikState of the art
Zur abrasiven Bearbeitung von Flächen, wie sie beispielsweise für die Herstellung von optischen Elementen, wie Linsen, Prismen, planparallelen Platten etc., aber auch von Formen für das Gießen oder das Pressen optischer Elemente erforderlich ist, sind die verschiedensten Verfahren und Vorrichtungen bekannt. Bei vielen der bekannten Verfahren bzw. Vorrichtungen wird die zu bearbeitende Fläche mit kontaktierenden Werkzeugen, wie z.B. Teller-Schleifern, Kugelschleifern etc. zunächst einem Schleifvorgang sowie ggf. einem Feinschleifvorgang und anschließend mit einem Polierwerkzeug einem Poliervorgang unterzogen. An Stelle von SchleifVorgängen ist es auch bekannt, die Flächen auf einer Drehbank mit einem geeigneten Drehmeißel einem Drehvorgang zu unterziehen oder ein anderes spanabhebendes Verfahren anzuwenden. Die meisten Bearbeitungsvorgänge, bei denen vergleichsweise viel Material abgetragen wird, erfordern zumindest dann, wenn optische Flächen hergestellt werden sollen, abschließend ein Polieren der Fläche. Das Polieren erfolgt nach dem Stand der Technik bei sphärischen Flächen großflächig mit einem Polierteller.A wide variety of methods and devices are known for the abrasive processing of surfaces, as is required, for example, for the production of optical elements, such as lenses, prisms, plane-parallel plates, etc., but also for molds for casting or pressing optical elements. In many of the known methods and devices, the surface to be processed is first subjected to a grinding process and, if appropriate, a fine grinding process with contacting tools, such as disc grinders, ball grinders, etc., and then a polishing process with a polishing tool. Instead of grinding processes, it is also known to subject the surfaces to a turning process on a lathe with a suitable turning tool or to use another machining process. Most machining processes in which a comparatively large amount of material is removed require at least when optical surfaces are produced finally polishing the surface. According to the prior art, polishing is carried out over large areas with a polishing plate on spherical surfaces.
Probleme ergeben sich bei den herkömmlichen Verfahren und Vorrichtungen immer dann, wenn asphärische Flächen hergestellt werden sollen. Die Herstellung asphärischer Flächen erfolgt nach dem Stand der Technik mit Werkzeugen wie Kugelschleifern, die einen mehr oder weniger punktförmigen Eingriff mit der zu bearbeitenden Fläche haben und die längs einer Bahn über die zu bearbeitende Fläche geführt werden. Je nach Ausbildung des Werkzeugs wird die Fläche dabei geschliffen oder poliert. Aus Zeit- bzw. Kostengründen werden allerdings asphärische Flächen häufig nur bahnförmig geschliffen; das Polieren erfolgt dann nicht bahnförmig, sondern großflächig. Insbesondere dann, wenn die Asphärizität vergleichsweise groß ist, wie dies beispielsweise bei progressiven Brillengläsern der Fall ist, ergibt sich durch das flä- chige Polieren ein mehr oder weniger großer Polierfehler, der durch entsprechende Fertigungsvorhalte bei den vorangehenden Bearbeitungsvorgängen kompensiert werden muss .Problems arise with the conventional methods and devices whenever aspherical surfaces are to be produced. According to the prior art, aspherical surfaces are produced using tools such as ball grinders, which have a more or less punctiform engagement with the surface to be machined and which are guided along a path over the surface to be machined. Depending on the design of the tool, the surface is ground or polished. For reasons of time and costs, however, aspherical surfaces are often only ground in a web; The polishing then does not take the form of a web, but over a large area. Particularly when the asphericity is comparatively large, as is the case, for example, with progressive spectacle lenses, the surface polishing results in a more or less large polishing error, which has to be compensated for by corresponding manufacturing provisions in the preceding machining operations.
Weiterhin ist es bekannt, Flächen von Werkstücken und insbesondere von optischen Elementen mit Fluidstrahlen zu bearbeiten. Die hierfür vorgeschlagenen Vorrichtungen sind jedoch vergleichsweise aufwendig und erlauben auf Grund der mehr oder weniger punktförmigen Bearbei- tung der Fläche dennoch keine schnelle Herstellung der Flächen. Darstellung der ErfindungIt is also known to process surfaces of workpieces and in particular of optical elements with fluid jets. However, the devices proposed for this purpose are comparatively complex and, owing to the more or less punctiform processing of the surface, nevertheless do not allow the surfaces to be produced quickly. Presentation of the invention
Der Erfindung liegt die Aufgabe zu Grunde, eine Vorrichtung zur abrasiven Bearbeitung von Flächen und insbesondere zum Schleifen und/oder Polieren von Flächen von optischen Elementen anzugeben, die eine schnelleThe invention is based on the object of specifying a device for the abrasive processing of surfaces and in particular for grinding and / or polishing surfaces of optical elements, which is fast
Bearbeitung der Flächen unabhängig von der Form der jeweils bearbeiteten Fläche erlaubt.Processing of the surfaces is permitted regardless of the shape of the surface being processed.
Eine erfindungsgemäße Lösung dieser Aufgabe ist im Pa- tentanspruch 1 angegeben. Weiterbildungen der Erfindung sind Gegenstand der Ansprüche 2 bis 10. In den Ansprüchen 11 bis 14 sind mögliche Verwendungen der erfindungsgemäßen Vorrichtung beansprucht.A solution to this problem according to the invention is specified in patent claim 1. Further developments of the invention are the subject of claims 2 to 10. Claims 11 to 14 claim possible uses of the device according to the invention.
Erfindungsgemäß weist die Vorrichtung zur abrasiven Bearbeitung von Flächen und insbesondere zum Schleifen und/ oder Polieren von optischen Elementen ein Werkzeug auf, das einen Fluid-Einlass und einen Fluid-Auslass hat. Eine Zuführeinheit fördert zu dem Fluid-Einlass eine Flüssigkeit, in der abrasive Mittel gelöst sind. Diese Flüssigkeit strömt durch das Werkzeug zu einem Auslass, durch den sie aus dem Werkzeug austritt. Erfindungsgemäß wird dieses Werkzeug durch eine Positioniereinrichtung derart relativ zu der zu bearbeitenden Fläche positioniert, dass der Auslass, aus dem dieAccording to the invention, the device for the abrasive processing of surfaces and in particular for grinding and / or polishing optical elements has a tool which has a fluid inlet and a fluid outlet. A supply unit conveys a liquid to the fluid inlet in which abrasive agents are dissolved. This fluid flows through the tool to an outlet through which it exits the tool. According to the invention, this tool is positioned relative to the surface to be machined by a positioning device such that the outlet from which the
Flüssigkeit austritt, der zu bearbeitenden Fläche insbesondere mit einem geringen Abstand gegenüber liegt. Dabei ist entscheidend, dass die Fläche des durch die Begrenzungswände des Auslasses und durch die zu bear- beitende Fläche gebildeten Ringspaltes kleiner als die Querschnittsfläche des Einlasses ist. Hierdurch tritt die Flüssigkeit, in der abrasive Mittel gelöst sind, mit einem wesentlich höheren Druck als dem Druck, mit dem sie in den Einlass einströmt, durch den Ringspalt radial zum Werkzeug aus. Durch die radial ausströmende Flüssigkeit erfolgt die Bearbeitung der Fläche des Werkstücks. Je nach der Art der in der Flüssigkeit gelösten abrasiven Mittel wird die Fläche im Bereich des Ringspaltes und damit linienförmig schleifend oder polierend bearbeitet. Durch die linienförmige Bearbeitung wird die Bearbeitungszeit im Vergleich zu den bekannten Verfahren bzw. Vorrichtungen, bei denen ein im wesentlichen punktförmiger Eingriff zwischen Werkzeug und Werkstück besteht, um Größenordnungen verkürzt.Liquid escapes, the surface to be processed is in particular at a short distance from it. It is crucial here that the area of the annular gap formed by the boundary walls of the outlet and by the area to be machined is smaller than the cross-sectional area of the inlet. As a result, the liquid in which abrasive agents are dissolved at a substantially higher pressure than the pressure with which it flows into the inlet, radially through the annular gap to the tool. The surface of the workpiece is machined by the radially flowing liquid. Depending on the type of abrasive agent dissolved in the liquid, the surface is machined in the area of the annular gap and thus in a linear grinding or polishing process. Due to the linear machining, the machining time is reduced by orders of magnitude in comparison to the known methods or devices in which there is an essentially punctiform engagement between the tool and the workpiece.
Das Verhältnis des Drucks, mit dem die Flüssigkeit in das Werkzeug einströmt, zu dem Druck, mit dem die Flüssigkeit aus dem Ringspalt austritt, ist dabei umgekehrt proportional zum Verhältnis der Querschnittsfläche des Einlasses zur Querschnittsfläche des gebildeten Ringspaltes. Dies bedeutet, dass der "Bearbeitungsdruck" durch die Positionierung des Werkzeugs relativ zumThe ratio of the pressure with which the liquid flows into the tool to the pressure with which the liquid exits the annular gap is inversely proportional to the ratio of the cross-sectional area of the inlet to the cross-sectional area of the annular gap formed. This means that the "machining pressure" by positioning the tool relative to the
Werkstück - anders ausgedrückt durch die Einstellung der Höhe des Ringspaltes - eingestellt werden kann, ohne dass der Druck, mit dem die Zuführeinheit die Flüssigkeit fördert, geändert werden müsste.Workpiece - in other words, by adjusting the height of the annular gap - can be adjusted without having to change the pressure with which the feed unit delivers the liquid.
Ein besonderer Vorteil der Erfindung ist dabei, dass einlassseitig mit vergleichsweise niedrigen Drücken gearbeitet werden kann: insbesondere kann die Zuführeinheit die Flüssigkeit mit einem Druck kleiner 20 bar, bevorzugt kleiner 5 bar, ggf. sogar nur mit Atmosphärendruck fördern. Für eine für den Bearbeitungsvorgang und die Bearbeitungsgeschwindigkeit vorteilhafte Druck- erhöhung ist es bevorzugt, wenn die Querschnittsfläche des Einlasses wenigstens um den Faktor fünf größer als die Querschnittsfläche des gebildeten Ringspaltes ist. Dabei ist es weiterhin bevorzugt, wenn die Höhe des ge- bildeten Ringspaltes kleiner als 3 mm ist und insbesondere etwa 1 mm beträgt.A particular advantage of the invention is that it is possible to work with comparatively low pressures on the inlet side: in particular, the feed unit can convey the liquid at a pressure of less than 20 bar, preferably less than 5 bar, possibly even only at atmospheric pressure. For a printing process which is advantageous for the processing operation and the processing speed, increase, it is preferred if the cross-sectional area of the inlet is at least five times larger than the cross-sectional area of the annular gap formed. It is further preferred if the height of the annular gap formed is less than 3 mm and in particular is approximately 1 mm.
In jedem Falle ist es von Vorteil, wenn die Positioniereinrichtung eine Steuereinheit aufweist, die die Positionierung des Werkzeuges entsprechend den Flächendaten der herzustellenden Fläche steuert. Bevorzugt ist es, wenn die Positionierung des Werkzeugen dabei so erfolgt, dass die Höhe des Ringspaltes während der Verschiebung längs der jeweiligen Bahnen konstant bleibt.In any case, it is advantageous if the positioning device has a control unit which controls the positioning of the tool in accordance with the surface data of the surface to be produced. It is preferred if the tool is positioned in such a way that the height of the annular gap remains constant during the displacement along the respective tracks.
Die Positioniereinrichtung kann das Werkzeug prinzipiell längs beliebiger Bahnen relativ zum Werkstück, d. h. zu der zu bearbeitenden Fläche verschieben. Beispielsweise kann die Bahn eine mäanderförmige Bahn sein, wobei entweder das Werkzeug oder das Werkstück oder beide bewegt werden.In principle, the positioning device can position the tool along any path relative to the workpiece, i. H. move to the surface to be machined. For example, the path can be a meandering path, with either the tool or the workpiece or both being moved.
Ferner kann eine gleichzeitige Verschiebung des Werkzeugs und des Elements, von dem eine Fläche bearbeitet werden soll, erfolgen. Im Falle rotationssymmetrischer Flächen oder nur geringfügig von der Rotationssymmetrie abweichender Flächen ist es bevorzugt, wenn das Werkzeug längs Bahnen bewegt wird, die durch den Flächenscheitel verlaufen und gleichzeitig das Werkstück bzw. das zu bearbeitende Element von einer Dreheinheit um eine Achse gedreht wird, die insbesondere die Rotationsachse der herzustellenden Fläche ist. Um eine homogene Bearbeitung der Fläche längs des Ringspaltes zu erreichen, ist es ferner bevorzugt, wenn der Auslass einen kreisförmigen Querschnitt hat, und das Werkzeug zumindest im Bereich des Auslasses eine (kreis) -zylindrische Außenkontur aufweist.Furthermore, the tool and the element from which a surface is to be machined can be moved simultaneously. In the case of rotationally symmetrical surfaces or surfaces that deviate only slightly from the rotational symmetry, it is preferred if the tool is moved along paths that pass through the surface vertex and at the same time the workpiece or the element to be machined is rotated about an axis by a rotating unit, which in particular is the axis of rotation of the surface to be manufactured. In order to achieve homogeneous machining of the surface along the annular gap, it is further preferred if the outlet has a circular cross section and the tool has a (circular) cylindrical outer contour at least in the region of the outlet.
Bei einer weiteren bevorzugten Ausgestaltung der Erfindung wird dadurch, dass die Querschnittsfläche des Ein- lasses kleiner als die des Auslasses ist, erreicht, dass eine Bearbeitung der Fläche nur linienförmig (bzw. kreisringförmig) im Bereich des Ringspaltes und nicht auch im Zentrum des Auslasses erfolgt.In a further preferred embodiment of the invention, the fact that the cross-sectional area of the inlet is smaller than that of the outlet means that the surface is machined only in a linear (or circular) manner in the region of the annular gap and not also in the center of the outlet ,
Weiterhin ist es bevorzugt, wenn die Größe des Werkzeugs der Form der zu bearbeitenden Fläche angepasst ist:It is further preferred if the size of the tool is adapted to the shape of the surface to be machined:
Zur Bearbeitung von planen Flächen kann der Außendurch- messer des Werkzeugs im Bereich des Auslasses in derThe outside diameter of the tool can be machined in the area of the outlet for machining flat surfaces
Größenordnung der halben Apertur des optischen Elements liegen, so dass eine sehr schnelle Bearbeitung der Fläche bei größtmöglicher Homogenität des Bearbeitungsvorganges erreicht wird. Bei der Bearbeitung von gekrümm- ten Flächen liegt bevorzugt der Außendurchmesser des Werkzeugs in der Größenordnung des kleinsten Radius (kleinster Hauptkrümmungsradius) der Fläche; hierdurch wird sichergestellt, dass die Höhe des Ringspaltes über den gesamten gebildeten Ringspalt praktisch konstant ist. Die erfindungsgemäße Vorrichtung kann zum Bearbeiten beliebiger Flächen von Elementen bzw. Werkstücken eingesetzt werden, die aus prinzipiell beliebigen Materialien bestehen können. Beispielsweise kann die erfin- dungsgemäße Vorrichtung aufgrund der hohen Bearbeitungsgeschwindigkeit zur Bearbeitung von Turbinenschaufeln aus Stahl eingesetzt werden.The order of magnitude of half the aperture of the optical element is such that very fast processing of the surface is achieved with the greatest possible homogeneity of the processing operation. When machining curved surfaces, the outer diameter of the tool is preferably of the order of the smallest radius (smallest main radius of curvature) of the surface; this ensures that the height of the annular gap is practically constant over the entire annular gap formed. The device according to the invention can be used to machine any surfaces of elements or workpieces, which in principle can consist of any materials. For example, the device according to the invention can be used for machining turbine blades made of steel due to the high machining speed.
Besonders bevorzugt ist jedoch die Verwendung einer er- findungsgemäßen Vorrichtung zum Schleifen und/oder Polieren optischer Flächen. Die jeweiligen Elemente können dabei im Falle von Linsen, Prismen, planparallelen Platten etc. - d.h. direkt hergestellter optischer Elemente - aus Quarz, einem optischen Glas oder einem Kunststoffmaterial bestehen; sollen Formen für das Gießen und/oder Pressen etc. von optischen Elementen hergestellt werden, können die Elemente auch aus einem Metall, wie Stahl, oder einem keramischen Material bestehen.However, the use of a device according to the invention for grinding and / or polishing optical surfaces is particularly preferred. The respective elements can be used in the case of lenses, prisms, plane-parallel plates etc. - i.e. directly manufactured optical elements - consist of quartz, an optical glass or a plastic material; if molds for the casting and / or pressing etc. of optical elements are to be produced, the elements can also consist of a metal, such as steel, or a ceramic material.
Da die Art des Abtrags im wesentlichen nicht von der Ausbildung des Werkzeugs, sondern von der Art der eingesetzten Flüssigkeit bzw. des (der) in der Flüssigkeit gelösten abrasiven Mittels (Mittel) abhängt, kann ein- und dieselbe Vorrichtung nacheinander zum Schleifen, gegebenenfalls Feinschleifen und abschließend zum Polieren eines Elements bzw. Werkstücks in ein- und derselben Aufspannung eingesetzt werden. Der Wechsel zwischen den einzelnen Bearbeitungsarten bedingt dann le- diglich einen Austausch bzw. Wechsel des jeweils verwendeten Bearbeitungsfluids . In jedem Falle ist es jedoch besonders bevorzugt, wenn die erfindungsgemäße Vorrichtung zur Bearbeitung von asphärischen Flächen eingesetzt wird.Since the type of removal essentially does not depend on the design of the tool, but on the type of liquid used or the abrasive agent (agent) dissolved in the liquid, one and the same device can be successively used for grinding, possibly fine grinding and finally used to polish an element or workpiece in one and the same setting. The change between the individual types of processing then only requires an exchange or change of the processing fluid used in each case. In any case, however, it is particularly preferred if the device according to the invention is used for processing aspherical surfaces.
Kurze Beschreibung der ZeichnungBrief description of the drawing
Die Erfindung wird nachstehend ohne Beschränkung des allgemeinen Erfindungsgedankens anhand von Ausführungsbeispielen unter Bezugnahme auf die Zeichnung exemplarisch beschrieben, auf die im übrigen hinsichtlich der Offenbarung aller im Text nicht näher erläuterten erfindungsgemäßen Einzelheiten ausdrücklich verwiesen wird. Es zeigen:The invention is described below by way of example without limitation of the general inventive concept on the basis of exemplary embodiments with reference to the drawing, to which reference is expressly made with regard to the disclosure of all details according to the invention not explained in more detail in the text. Show it:
Fig. 1 eine erfindungsgemäße Vorrichtung bei der Be- arbeitung einer planen Fläche,1 shows a device according to the invention when machining a flat surface,
Fig. 2 eine erfindungsgemäße Vorrichtung bei der Bearbeitung einer gekrümmten und insbesondere asphärischen Fläche.Fig. 2 shows a device according to the invention when machining a curved and in particular aspherical surface.
Darstellung eines AusführungsbeispielsRepresentation of an embodiment
Fig. 1 zeigt eine erfindungsgemäße Vorrichtung, von der lediglich das Werkzeug 1 dargestellt ist, bei der Bearbeitung einer planen Fläche 21 eines Werkstücks 2, das ohne Beschränkung der Allgemeinheit eine planparallele Platte ist. Das Werkzeug 1 weist einen Einlass 11 und einen Auslass 12 auf, dessen Querschnittsfläche größer ist als die des Einlasses 11. Eine nicht dargestellte Zuführeinheit fördert eine Flüssigkeit, in der abrasive Mittel, wie Schleifmittel oder Poliermittel gelöst sind, in den Einlass 11 des Werkzeugs 1. Das Werkzeug 1 wird von einer nicht dargestellten Positioniereinheit derart relativ zum Werkstück 2 positioniert, dass zwischen den Begrenzungswänden 13 des Auslasses 12 und der Fläche 21 ein Ringspalt 3 gebildet wird, dessen Querschnittsfläche kleiner und bevorzugt wesentlich kleiner als die Querschnittsfläche des Einlasses 11 ist. Hierdurch wird der Druck, mit dem die Flüssigkeit aus dem Ringspalt 3 austritt, um das Verhältnis der Querschnittsflächen des Einlasses 11 und des Ringspaltes 3 erhöht. Der für die Bearbeitung der Werkstück-Ober- fläche 21 wirksame Druck ist damit wesentlich größer als der Förderdruck.1 shows a device according to the invention, of which only the tool 1 is shown, when machining a flat surface 21 of a workpiece 2, which is a plane-parallel plate without restricting generality. The tool 1 has an inlet 11 and an outlet 12, the cross-sectional area of which is larger than that of the inlet 11. A feed unit, not shown, conveys a liquid in which abrasive agents, such as abrasives or polishing agents, are dissolved into the inlet 11 of the tool 1 The tool 1 is a positioning unit, not shown positioned relative to the workpiece 2 such that an annular gap 3 is formed between the boundary walls 13 of the outlet 12 and the surface 21, the cross-sectional area of which is smaller and preferably substantially smaller than the cross-sectional area of the inlet 11. As a result, the pressure at which the liquid emerges from the annular gap 3 is increased by the ratio of the cross-sectional areas of the inlet 11 and the annular gap 3. The pressure effective for the machining of the workpiece surface 21 is thus significantly greater than the delivery pressure.
Die nicht dargestellte Positioniereinrichtung verschiebt das Werkzeug 1 parallel zur Oberfläche des Werkstücks 2, während eine ebenfalls nicht dargestellte Dreheinheit das Werkstück 2 um eine Achse 22 dreht, so dass der linienförmige Eingriff längs des Ringspaltes 3 so über das Werkstück 2 verschoben wird, dass die gesamte Fläche 21 gleichmäßig bearbeitet, beispielsweise poliert wird.The positioning device, not shown, moves the tool 1 parallel to the surface of the workpiece 2, while a rotating unit, also not shown, rotates the workpiece 2 about an axis 22, so that the linear engagement along the annular gap 3 is shifted over the workpiece 2 such that the entire Surface 21 machined evenly, for example polished.
Der Durchmesser des Werkzeugs 1 liegt in der Größenordnung des Radius des Werkstücks 2.The diameter of the tool 1 is in the order of the radius of the workpiece 2.
Fig. 2 zeigt eine erfindungsgemäße Vorrichtung bei der Bearbeitung einer gekrümmten und insbesondere asphärischen Fläche 21 Λ eines Werkstücks 2. Gleiche Teile sind dabei mit den selben Bezugszeichen versehen, so dass auf eine erneute Vorstellung verzichtet wird. Der Durchmesser des Werkzeugs 1 liegt in der Größenordnung des kleinsten Radius der asphärischen Fläche 21 λ. Die ebenfalls nicht dargestellte Positioniereinheit ver- schiebt das Werkzeug 1 längs Bahnen, die durch den Scheitel der Fläche 21** verlaufen. Gleichzeitig wird das Werkstück 2 um eine durch den Scheitel verlaufende Rotationsachse 22 gedreht.Fig. 2 shows an apparatus according to the invention during the machining of a curved and in particular aspherical surface 21 Λ of a workpiece 2. The same parts are provided with the same reference numerals, is omitted to be presented again. The diameter of the tool 1 is of the order of the smallest radius of the aspherical surface 21λ . The positioning unit, also not shown, pushes tool 1 along paths that run through the apex of surface 21 * *. At the same time, the workpiece 2 is rotated about an axis of rotation 22 running through the apex.
Vorstehend ist die Erfindung anhand von Ausführungsbeispielen ohne Beschränkung des allgemeinen Erfindungsgedankens beschrieben worden. The invention has been described above with reference to exemplary embodiments without restricting the general inventive concept.

Claims

PATENTANSPRÜCHE
1. Vorrichtung zur abrasiven Bearbeitung von Flächen von Elementen mit einem Werkzeug, das einen Einlass und einen1. Device for the abrasive machining of surfaces of elements with a tool that has an inlet and a
Auslass aufweist, einer Zuführeinheit, die zu dem Einlass eine Flüssigkeit fördert, in der abrasive Mittel gelöst sind, und die aus dem Auslass austritt, und einer Positioniereinrichtung, die das Werkzeug über die zu bearbeitende Fläche führt ' und dabei derart positioniert, dass der Auslass der zu bearbeitenden Fläche gegenüber liegt, wobei die Fläche des durch die Begrenzungswände des Auslasses und die zu bearbeitende Fläche gebildeten Ringspaltes kleiner als die Querschnittsfläche des Einlasses ist.Has outlet, a feed unit which conveys a liquid to the inlet, in which abrasive agents are dissolved, and which exits from the outlet, and a positioning device which guides the tool over the surface to be machined 'and thereby positioned such that the outlet is opposite to the surface to be machined, the surface of the annular gap formed by the boundary walls of the outlet and the surface to be machined being smaller than the cross-sectional area of the inlet.
2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Querschnittsfläche des Einlasses wenigstens um den Faktor fünf größer als die Querschnittsfläche des gebildeten Ringspaltes ist.2. Device according to claim 1, characterized in that the cross-sectional area of the inlet is at least five times larger than the cross-sectional area of the annular gap formed.
3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Höhe des gebilde- ten Ringspaltes kleiner als 3 mm ist und bevorzugt etwa 1 mm beträgt. 3. Device according to claim 1 or 2, characterized in that the height of the annular gap formed is less than 3 mm and is preferably about 1 mm.
4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass eine Dreheinheit vorgesehen ist, die das zu bearbeitende Element um eine Achse dreht.4. Device according to one of claims 1 to 3, characterized in that a rotating unit is provided which rotates the element to be processed about an axis.
5. Vorrichtung nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Auslass einen kreisförmigen Querschnitt hat, und dass das Werkzeug zumindest im Bereich des Auslas- ses eine zylindrische Außenkontur aufweist.5. Device according to one of claims 1 to 4, characterized in that the outlet has a circular cross section and that the tool has a cylindrical outer contour at least in the region of the outlet.
6. Vorrichtung nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Querschnittsfläche des Einlasses kleiner als die des Auslasses ist.6. Device according to one of claims 1 to 5, characterized in that the cross-sectional area of the inlet is smaller than that of the outlet.
7. Vorrichtung nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Zuführeinheit die Flüssigkeit mit einem Druck kleiner 20 bar, bevor- zugt kleiner 5 bar fördert.7. Device according to one of claims 1 to 6, characterized in that the feed unit conveys the liquid at a pressure of less than 20 bar, preferably less than 5 bar.
8. Vorrichtung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass zur Bearbeitung von planen Flächen der Außendurchmesser des Werkzeugs im Bereich des Auslasses in der Größenordnung der halben Apertur des optischen Elements liegt.8. Device according to one of claims 1 to 7, characterized in that for machining flat surfaces, the outer diameter of the tool in the region of the outlet is in the order of half the aperture of the optical element.
9. Vorrichtung nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass bei der Bearbeitung von gekrümmten Flächen der Außendurchmesser des9. Device according to one of claims 1 to 7, characterized in that when machining curved surfaces, the outer diameter of the
Werkzeugs in der Größenordnung des kleinsten Radius der Fläche liegt. Tool is on the order of the smallest radius of the surface.
10. Vorrichtung nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass die Positioniereinrichtung eine Steuereinheit aufweist, die die Po- sitionierung des Werkzeuges entsprechend den Flächendaten der herzustellenden Fläche steuert.10. Device according to one of claims 1 to 9, characterized in that the positioning device has a control unit which controls the positioning of the tool in accordance with the surface data of the surface to be produced.
11. Verwendung einer Vorrichtung nach einem der Ansprüche 1 bis 10 zum Schleifen optischer Flächen.11. Use of a device according to one of claims 1 to 10 for grinding optical surfaces.
12. Verwendung einer Vorrichtung nach einem der Ansprüche 1 bis 10 zum Polieren optischer Flächen.12. Use of a device according to one of claims 1 to 10 for polishing optical surfaces.
13. Verwendung einer einzigen Vorrichtung nach einem der Ansprüche 1 bis 10 zunächst zum Schleifen und anschließend zum Polieren einer optischen Fläche.13. Use of a single device according to one of claims 1 to 10 first for grinding and then for polishing an optical surface.
14. Verwendung einer Vorrichtung nach einem der Ansprüche 1 bis 10 zur Bearbeitung von asphärischen Flächen. 14. Use of a device according to one of claims 1 to 10 for machining aspherical surfaces.
PCT/EP2002/003120 2001-03-20 2002-03-20 Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces WO2002074489A1 (en)

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US10/527,468 US20060141911A1 (en) 2001-03-20 2002-03-20 Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces
EP02716837A EP1409199B1 (en) 2001-03-20 2002-03-20 Use of a device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces
DE50208850T DE50208850D1 (en) 2001-03-20 2002-03-20 USE OF A DEVICE FOR THE ABRASIVE MACHINING OF SURFACES OF ELEMENTS AND IN PARTICULAR OF OPTICAL ELEMENTS WORKPIECES
US11/931,552 US20080119113A1 (en) 2001-03-20 2007-10-31 Method for machining surfaces

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DE10113599A DE10113599A1 (en) 2001-03-20 2001-03-20 Device for the abrasive processing of surfaces of optical elements

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007343A1 (en) * 2003-07-18 2005-01-27 Universidad Nacional Autonoma De Mexico Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
WO2005063441A1 (en) * 2003-12-23 2005-07-14 C. Hilzinger-Thum Method and device for surface control
CN105234825A (en) * 2015-09-25 2016-01-13 安庆市凯立金刚石科技有限公司 Jet polishing device used for diamond film
DE102015224933A1 (en) 2015-12-11 2017-06-14 Siltronic Ag Monocrystalline semiconductor wafer and method for producing a semiconductor wafer

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1022293C2 (en) * 2002-12-31 2004-07-15 Tno Device and method for manufacturing or processing optical elements and / or optical form elements, as well as such elements.
DE10314625B3 (en) * 2003-04-01 2004-10-14 Optotech Optikmaschinen Gmbh Process for post-processing precision surfaces on random workpieces comprises using a rotating polishing tool for fine grinding an polishing having a polishing element which is longitudinally guided in a guiding chamber of a housing
NL1026526C2 (en) * 2004-06-30 2005-05-31 Tno Optical element forming or working apparatus, has at least one measuring device which operates to measure changes in form of surface being worked when roughness are formed on the surface
DE502004008269D1 (en) * 2004-07-22 2008-11-27 Fisba Optik Ag Apparatus and method for grinding and / or polishing surfaces
DE502004008271D1 (en) * 2004-07-22 2008-11-27 Fisba Optik Ag Method for grinding and / or polishing surfaces
EP1977860B1 (en) * 2007-04-04 2010-12-15 Fisba Optik Ag Device and method for manufacturing optical elements
GB2471119B (en) * 2009-06-17 2013-11-27 Nebb Technology As Rotor or stator blade and method for forming such rotor or stator blade
DE102009033206A1 (en) 2009-07-15 2011-01-27 Brand, Guido Polishing method and polishing apparatus for correcting geometric deviation errors on precision surfaces
CN102284911B (en) * 2011-07-22 2013-01-02 中国科学院长春光学精密机械与物理研究所 Long-range polishing stable-clearance device
CN103128672B (en) * 2013-02-05 2015-02-18 浙江工业大学 Constraint abrasive flow polishing tool head
CN103128671B (en) * 2013-02-05 2015-04-29 浙江工业大学 Restraining abrasive particle flow polishing device of hard and brittle material complex curve part
CN103128673B (en) * 2013-02-05 2015-04-29 浙江工业大学 Restraining abrasive particle flow polishing tool head of hard and brittle materials

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5573446A (en) * 1995-02-16 1996-11-12 Eastman Kodak Company Abrasive air spray shaping of optical surfaces
US5700181A (en) * 1993-09-24 1997-12-23 Eastman Kodak Company Abrasive-liquid polishing and compensating nozzle
WO1999026764A2 (en) * 1997-11-20 1999-06-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Process and device for working a workpiece

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769762A (en) * 1972-03-07 1973-11-06 Altair Scient Inc Method for controlled lapping of optical surfaces to correct deviations from desired contours
US4038786A (en) * 1974-09-27 1977-08-02 Lockheed Aircraft Corporation Sandblasting with pellets of material capable of sublimation
US4956944A (en) * 1987-03-19 1990-09-18 Canon Kabushiki Kaisha Polishing apparatus
DE4440631C2 (en) * 1994-11-14 1998-07-09 Trumpf Gmbh & Co Method and processing machine for beam cutting workpieces using at least two cutting beams
US5531634A (en) * 1995-02-03 1996-07-02 Schott; Paul Method of using an abrasive material for blast cleaning of solid surfaces
DE19747838C2 (en) * 1997-10-19 2001-07-12 Gp Granulate Pneumatic Geraete Method and device for the dry removal of coatings, graffiti or other surface contaminants
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine
US6244927B1 (en) * 1998-08-31 2001-06-12 Ingersoll-Rand Company Multi-functional sensing methods and apparatus therefor
US6280302B1 (en) * 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
JP3990073B2 (en) * 1999-06-17 2007-10-10 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
US6306010B1 (en) * 1999-10-26 2001-10-23 Industrial Gasket, Inc. Method of forming a hole in a glass reflector
US6425804B1 (en) * 2000-03-21 2002-07-30 Hewlett-Packard Company Pressurized delivery system for abrasive particulate material
JP3896265B2 (en) * 2001-09-11 2007-03-22 オリンパス株式会社 Positioning jig and spray polishing apparatus using positioning jig
US6769956B1 (en) * 2002-02-04 2004-08-03 Oberg Industries Apparatus and method for rapid, precise positioning of a grit-blasting nozzle

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5700181A (en) * 1993-09-24 1997-12-23 Eastman Kodak Company Abrasive-liquid polishing and compensating nozzle
US5573446A (en) * 1995-02-16 1996-11-12 Eastman Kodak Company Abrasive air spray shaping of optical surfaces
WO1999026764A2 (en) * 1997-11-20 1999-06-03 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno Process and device for working a workpiece

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005007343A1 (en) * 2003-07-18 2005-01-27 Universidad Nacional Autonoma De Mexico Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
JP2006528081A (en) * 2003-07-18 2006-12-14 ウニベルシダッド ナシオナル アウトノマ デ メキシコ Polishing tool using hydrodynamic radial flux for cutting and polishing optical product surface and semiconductor surface
JP4719675B2 (en) * 2003-07-18 2011-07-06 ウニベルシダッド ナシオナル アウトノマ デ メキシコ Polishing tool using hydrodynamic radial flux for cutting and polishing optical product surface and semiconductor surface
KR101226757B1 (en) 2003-07-18 2013-01-25 유니버시다드 나시오날 오토노마 드 멕시코 Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
WO2005063441A1 (en) * 2003-12-23 2005-07-14 C. Hilzinger-Thum Method and device for surface control
CN105234825A (en) * 2015-09-25 2016-01-13 安庆市凯立金刚石科技有限公司 Jet polishing device used for diamond film
DE102015224933A1 (en) 2015-12-11 2017-06-14 Siltronic Ag Monocrystalline semiconductor wafer and method for producing a semiconductor wafer
WO2017097670A1 (en) 2015-12-11 2017-06-15 Siltronic Ag Monocrystalline semiconductor wafer and method for producing a semiconductor wafer
US11075070B2 (en) 2015-12-11 2021-07-27 Siltronic Ag Monocrystalline semiconductor wafer and method for producing a semiconductor wafer

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DE10113599A1 (en) 2002-10-02
EP1409199A1 (en) 2004-04-21

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