US20060141911A1 - Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces - Google Patents

Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces Download PDF

Info

Publication number
US20060141911A1
US20060141911A1 US10/527,468 US52746805A US2006141911A1 US 20060141911 A1 US20060141911 A1 US 20060141911A1 US 52746805 A US52746805 A US 52746805A US 2006141911 A1 US2006141911 A1 US 2006141911A1
Authority
US
United States
Prior art keywords
tool
surface
outlet
surfaces
characterized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/527,468
Inventor
Oliver Fahnle
Original Assignee
Oliver Fahnle
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10113599.8 priority Critical
Priority to DE2001113599 priority patent/DE10113599A1/en
Application filed by Oliver Fahnle filed Critical Oliver Fahnle
Priority to PCT/EP2002/003120 priority patent/WO2002074489A1/en
Publication of US20060141911A1 publication Critical patent/US20060141911A1/en
Application status is Abandoned legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/10Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work
    • B24B31/116Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor involving other means for tumbling of work using plastically deformable grinding compound, moved relatively to the workpiece under the influence of pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24CABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C1/00Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
    • B24C1/08Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives

Abstract

A device for abrasive machining of surfaces of components, comprising a tool (1) having an inlet (11) and an outlet (12); a supply unit for conveying to the inlet (11) a liquid in which abrasive agents are dissolved and which emerges from the outlet (12); and a positioning means which guides the tool across a surface to be machined and simultaneously positions the tool in such manner that the outlet faces the surface to be machined, an area of an annular gap (3) defined by boundary walls (13) of the outlet (12) and the surface (2) to be machined being smaller than a cross-sectional area of the inlet (11).

Description

    TECHNICAL FIELD
  • The invention relates to a device for abrasive machining of surfaces of components, particularly optical components or work pieces.
  • PRIOR ART
  • Various methods and devices are known for abrasively machining surfaces, as is necessary for example for the manufacture of optical components such as lenses, prisms, plane parallel plates etc, but also of molds for casting or molding optical components,. With many of the known methods or devices a surface to be machined is first subjected to a grinding operation, and possibly also to a fine grinding operation using contacting tools such as, for example, disk-wheel grinders, spherical grinders etc., and subsequently to a polishing operation using a polishing tool. Instead of applying grinding operations it is also known to subject the surfaces to turning using a suitable lathe chisel on a lathe, or to apply another machining-down method. Most machining operations in which relatively much material is removed require a final polishing of the surface, at least when optical surfaces are to be produced. The polishing of spherical surfaces is performed in prior art on a large surface using a polishing disk.
  • Problems always arise with conventional methods and devices when a spherical surfaces are to be produced. The manufacture of a spherical surfaces is accomplished according to prior art with tools such as spherical grinders which engage the surface to be machined in a more or less point-wise manner and are guided along a track across the surface to be machined. In this, according to the design of the tool, the surface is either ground or polished. However, for reasons of time and cost, a spherical surfaces are frequently only ground along a track; the polishing is then effected not along a track but on a large surface. Particularly when the asphericity is comparatively large, as is the case for example with progressive spectacle lenses, the surface polishing leads to a more or less large polishing error which must be compensated by means of suitable fabrication corrections during preceding processing operations.
  • Furthermore, it is known to treat surfaces of work pieces and particularly optical components with jets of fluid. However, the devices proposed for this require a relatively large outlay, yet do not permit of any fast manufacture of the surfaces because of the more or less point-shaped working of the surfaces.
  • DECRIPTION OF THE INVENTION
  • The invention is based on the object of providing a device for abrasive machining of surfaces, and particularly for grinding and/or polishing of surfaces of optical components, which permits fast machining of the surface irrespective of the shape of the particular surface being machined.
  • An achievement of the object in accordance with the invention is set out in patent claim 1. Further developments of the invention are the subject matter of claims 2 to 10. Possible uses of the device of the invention are claimed in claims 11 to 14.
  • In accordance with the invention, the device for abrasive machining of surfaces and particularly for grinding and/or polishing optical components comprises a tool having a fluid inlet and a fluid outlet. A supply unit conveys a liquid in which abrasive agents are dissolved to the fluid inlet. This liquid flows through the tool to an outlet from which it emerges from the tool. According to the invention, this tool is positioned by a positioning means in such manner relative to the surface to be machined that the outlet from which the liquid emerges faces the surface to be machined, in particular with a small intervening space. Here it is important that the area of the annular gap defined between the boundary walls of the outlet and the surface to be machined be smaller than the cross-sectional area of the inlet. Because of this, the liquid in which abrasive agents are dissolved emerges from the annular gap along the radial direction of the tool under a pressure which is substantially higher than the pressure under which it flows into the inlet. The machining of the surface of the work piece is performed by the liquid flowing out in the radial direction. The surface in the region of the annular gap is thus machined so as to be linearly ground or polished in accordance with the kind of abrasive agents dissolved in the, liquid. Because of the linear working, the machining time is shortened by some orders of magnitude when compared with that of known methods or devices in which there is a substantially point-shaped engagement between the tool and the work piece.
  • In this, the ratio of the pressure under which the liquid flows into the tool to the pressure under which the liquid emerges from the annular gap is inversely proportional portional to the ratio of the cross-sectional area of the inlet to the cross-sectional area of the formed annular gap. This means that the “processing pressure”can be set by the positioning of the tool relative to the work piece—in other words, by an adjustment of the height of the annular gap—without the pressure under which the supply unit conveys the liquid having to be changed. With this it is a special advantage of the invention that comparatively low pressures may be used on the inlet side: in particular, the supply unit can convey the liquid at a pressure of less than 20 bar, preferably less than 5bar, and possibly even at only atmospheric pressure. In order that a pressure increase which is of advantage for the processing operation and the processing speed may be achieved, it is preferred for the cross-sectional area of the inlet to be greater than the cross-sectional area of the formed annular gap by a factor of at least 5. With this it is furthermore preferred for the height of the formed annular gap to be smaller than 3 mm and, in particular, about 1 mm.
  • In any case, it is of advantage for the positioning means to have a control unit for controlling the positioning of the tool according to the surface data of the surface to be produced. In this, it is preferred for the positioning of the tool to be so effected that the height of the annular gap remains constant during a shift along respective tracks.
  • In principle, the positioning device can shift the tool relative to the work piece, i.e. to the surface to be machined, along any tracks. For example, the track may be a meandering track, with either the tool or the work piece or both being moved.
  • Furthermore, the tool and the component of which a surface is to be machined can be simultaneously shifted. In the case of rotationally symmetrical surfaces, or surfaces deviating only slightly from rotational symmetry, it is preferred for the tool to be moved along tracks which extend through the surface apex, and simultaneously for the work piece or the component being machined to be rotated by a rotary unit around an axis which, in particular, is the rotational axis of the surface to be produced.
  • In order to effect a homogeneous machining of the surface along the annular gap it is furthermore preferred for the outlet to have a circular cross-section, and for the tool to have an outside contour in the shape of a (regular) cylinder at least in the region of the outlet.
  • In a further preferred development of the invention, a machining of the surface occurring only linearly (or circularly) in the region of the annular gap, and not also at the center of the outlet, is achieved by the cross-sectional area of the inlet being smaller than that of the outlet.
  • Furthermore, it is preferred for the size of the tool to be conformed to the shape of the surface to be machined:
  • For a machining of plane surfaces the outer diameter of the tool in the region of the outlet may be of the order of magnitude of one half of the aperture of an optical component, so that a very fast machining of the surface is achieved with the greatest possible homogeneity of the machining operation. For a machining of curved surfaces, the outer diameter of the tool is preferably of the order of magnitude of the smallest radius (smallest principal radius of curvature) of the surface; hereby it is ensured that the height of the annular gap is practically constant along the entire formed annular gap.
  • The device of the invention can be used for machining any surfaces of components or work pieces which in principle may be of any material. For example, because of the high working speed, the device of the invention can be used for machining steel turbine blades.
  • Particularly preferred, however, is the use of a device of the invention for grinding and/or polishing optical surfaces. In the case of lenses, prisms, plane parallel plates etc.—i.e. directly manufactured optical components—the work pieces concerned may be of quartz, optical glass or synthetic material; if molds are to be produced for the casting and/or molding etc. of optical components, the work pieces may also be of a metal such as steel or a ceramic material.
  • Because the kind of abrasion depends substantially not on the design of the tool, but on the kind of liquid or abrasive agent(s) dissolved in the liquid used, one and the same device may be used successively for grinding, possibly fine grinding, and finally for polishing a component or work piece in one and the same mount. A change between the individual kinds of machining then necessitates merely a replacement or exchange of the working fluids used in each case.
  • In every case, however, it is especially preferred for the device of the invention to used for machining a spherical surfaces.
  • BREIF DECRIPTION OF THE DRAWINGS
  • In the following the invention will be described by way of example without limitation of the general inventive concept, with the aid of embodiments with reference to the drawings to which attention is expressly drawn concerning the disclosure of all details of the invention not described more explicitly in the text. Shown by:
  • FIG. 1 is a device according to the invention, used in machining a plane surface; and
  • FIG. 2 is a device according to the invention, used in machining a curved surface, and particularly an a spherical surface.
  • DESCRIPTION OF AN EXAMPLE OF EMBDIMENT
  • FIG. 1 illustrates a device according to the invention, of which only a tool 1 is shown, used in machining a plane surface 21 of a work piece 2 which, without limitation of the generality, is a plane parallel plate. The tool 1 has an inlet 11, and an outlet 12 having a cross-sectional area which is greater than that of the inlet 11. A not shown supply unit conveys a liquid in which abrasive agents such as grinding agents or polishing agents are dissolved into the inlet 11 of the tool 1. The tool 1 is positioned by a not shown positioning unit in such manner relative to the work piece 2 that between the boundary walls 13 of the outlet 12 and the surface 21 an annular gap 3 is formed, the cross-sectional area of which is smaller and preferably substantially smaller than the cross-sectional area of the inlet 11. Hereby the pressure with which the liquid emerges from the annular gap 3 is increase in the ratio of the cross-sectional areas of the inlet 11 and the annular gap 3. The pressure which is effective for the machining of the work piece surface 21 is thus substantially greater than the delivery pressure.
  • The not shown positioning means shifts the tool 1 parallel to the surface of the work piece 2, whilst an also not shown rotary unit rotates the work piece 2 about an axis 22, so that the line-shaped engagement along the annular gap 3 is shifted across the work piece 2 in such manner that the entire surface 21 is uniformly machined, for example polished.
  • The diameter of the tool 1 is of the order of magnitude of the radius of the work piece 2.
      • FIG. 2 shows a device in accordance with the invention during a machining of a curved, in particular a spherical surface 21′of a work piece 2. The same parts are provided with the same reference signs, so that their renewed introduction can be dispensed with. The diameter of the tool 1 is of the order of magnitude of the smallest radius of the a spherical surface 21′. The positioning unit, also not shown, shifts the tool 1 along tracks passing through the apex of the surface 21′. At the same time the work piece 2 is rotated around an axis 22 of rotation passing through the apex.
  • In the foregoing the invention has been described with the aid of examples of embodiment without limitation of the general inventive concept.

Claims (14)

1. Device for abrasive machining of surfaces of components, comprising
a tool having an inlet and an outlet;
a supply unit for conveying to the inlet a liquid in which abrasive agents are dissolved and which emerges from the outlet; and
a positioning means which guides the tool across a surface to be machined, and simultaneously positions said tool in such manner that the outlet faces the surface to be machined, an area of an annular gap defined by boundary walls of the outlet and the surface to be machined being smaller than a cross-sectional area of the inlet.
2. Device according to claim 1,
characterized in that the cross-sectional area of the inlet is greater by a factor of at least 5 than the cross-sectional area of the formed annular gap.
3. Device according to claim 1 or 2,
characterized in that a height of the formed annular gap is smaller than 3mm and preferably is about 1 mm.
4. Device according to any one of claims 1 to 3,
characterized in that a rotary unit is provided for rotating a component to be machined around an axis.
5. Device according to any one of claims 1 to 4,
characterized in that the outlet has a circular cross-section, and that the tool has a cylindrical outer contour at least in the region of the outlet.
6. Device according to any one of claims 1 to 5,
characterized in that the cross-sectional area of the inlet is smaller than that of the outlet.
7. Device according to any one of claims 1 to 6,
characterized in that the supply unit conveys the liquid under a pressure smaller than 20 bar, preferably smaller than 5 bar.
8. Device according to any one of claims 1 to 7,
characterized in that for machining plane surfaces, an outer diameter of the tool in a region of the outlet is of an order of magnitude of one half of an aperture of an optical component.
9. Device according to any one of claims 1 to 7,
characterized in that for machining curved surfaces, an outer diameter of the tool is of an order of magnitude of a smallest radius of the surface.
10. Device according to any one of claims 1 to 9,
characterized in that the positioning means comprises a control unit for controlling a positioning of the tool according to surface data of a surface to be produced.
11. Use of a device of any one of claims 1 to 10 for grinding optical surfaces.
12. Use of a device of any one of claims 1 to 10 for polishing optical surfaces.
13. Use of a single device of any one of claims 1 to 10 for first grinding, and subsequently polishing an optical surface.
14. Use of a device of any one of claims 1 to 10 for machining a spherical surfaces.
US10/527,468 2001-03-20 2002-03-20 Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces Abandoned US20060141911A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10113599.8 2001-03-20
DE2001113599 DE10113599A1 (en) 2001-03-20 2001-03-20 Device for the abrasive processing of surfaces of optical elements
PCT/EP2002/003120 WO2002074489A1 (en) 2001-03-20 2002-03-20 Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/931,552 US20080119113A1 (en) 2001-03-20 2007-10-31 Method for machining surfaces

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US11/931,552 Division US20080119113A1 (en) 2001-03-20 2007-10-31 Method for machining surfaces

Publications (1)

Publication Number Publication Date
US20060141911A1 true US20060141911A1 (en) 2006-06-29

Family

ID=7678280

Family Applications (2)

Application Number Title Priority Date Filing Date
US10/527,468 Abandoned US20060141911A1 (en) 2001-03-20 2002-03-20 Device for the abrasive machining of surfaces of elements and in particular optical elements or workpieces
US11/931,552 Abandoned US20080119113A1 (en) 2001-03-20 2007-10-31 Method for machining surfaces

Family Applications After (1)

Application Number Title Priority Date Filing Date
US11/931,552 Abandoned US20080119113A1 (en) 2001-03-20 2007-10-31 Method for machining surfaces

Country Status (4)

Country Link
US (2) US20060141911A1 (en)
EP (1) EP1409199B1 (en)
DE (2) DE10113599A1 (en)
WO (1) WO2002074489A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080248729A1 (en) * 2007-04-04 2008-10-09 Fisba Optik Ag Method and Apparatus for Manufacturing Optical Elements
CN102284911A (en) * 2011-07-22 2011-12-21 中国科学院长春光学精密机械与物理研究所 A long-gap stabilizer polishing apparatus Cheng
KR101226757B1 (en) * 2003-07-18 2013-01-25 유니버시다드 나시오날 오토노마 드 멕시코 Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
CN103128673A (en) * 2013-02-05 2013-06-05 浙江工业大学 Restraining abrasive particle flow polishing tool head of hard and brittle materials
CN103128671A (en) * 2013-02-05 2013-06-05 浙江工业大学 Restraining abrasive particle flow polishing device of hard and brittle material complex curve part
CN103128672A (en) * 2013-02-05 2013-06-05 浙江工业大学 Constraint abrasive flow polishing tool head

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1022293C2 (en) 2002-12-31 2004-07-15 Tno Device and method for manufacturing or processing optical elements and / or optical form elements, as well as such elements.
DE10314625B3 (en) * 2003-04-01 2004-10-14 Optotech Optikmaschinen Gmbh Process for post-processing precision surfaces on random workpieces comprises using a rotating polishing tool for fine grinding an polishing having a polishing element which is longitudinally guided in a guiding chamber of a housing
WO2005063441A1 (en) * 2003-12-23 2005-07-14 C. Hilzinger-Thum Method and device for surface control
NL1026526C2 (en) * 2004-06-30 2005-05-31 Tno Optical element forming or working apparatus, has at least one measuring device which operates to measure changes in form of surface being worked when roughness are formed on the surface
DE502004008269D1 (en) * 2004-07-22 2008-11-27 Fisba Optik Ag Apparatus and method for grinding and / or polishing surfaces
DE502004008271D1 (en) * 2004-07-22 2008-11-27 Fisba Optik Ag Method for grinding and / or polishing surfaces
GB2471119B (en) * 2009-06-17 2013-11-27 Nebb Technology As Rotor or stator blade and method for forming such rotor or stator blade
DE102009033206A1 (en) 2009-07-15 2011-01-27 Brand, Guido Polishing method and polishing apparatus for correcting geometric deviation errors on precision surfaces
CN105234825A (en) * 2015-09-25 2016-01-13 安庆市凯立金刚石科技有限公司 Jet polishing device used for diamond film
DE102015224933A1 (en) 2015-12-11 2017-06-14 Siltronic Ag Monocrystalline semiconductor wafer and method for producing a semiconductor wafer

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769762A (en) * 1972-03-07 1973-11-06 Altair Scient Inc Method for controlled lapping of optical surfaces to correct deviations from desired contours
US4038786A (en) * 1974-09-27 1977-08-02 Lockheed Aircraft Corporation Sandblasting with pellets of material capable of sublimation
US4956944A (en) * 1987-03-19 1990-09-18 Canon Kabushiki Kaisha Polishing apparatus
US5700181A (en) * 1993-09-24 1997-12-23 Eastman Kodak Company Abrasive-liquid polishing and compensating nozzle
US5759086A (en) * 1994-11-04 1998-06-02 Trumpf Gmbh & Co. Method and machine tool for cutting workpieces
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine
US6244927B1 (en) * 1998-08-31 2001-06-12 Ingersoll-Rand Company Multi-functional sensing methods and apparatus therefor
US6280302B1 (en) * 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
US6425804B1 (en) * 2000-03-21 2002-07-30 Hewlett-Packard Company Pressurized delivery system for abrasive particulate material
US6643882B1 (en) * 1999-06-17 2003-11-11 Ebara Corporation Substrate cleaning apparatus
US6769956B1 (en) * 2002-02-04 2004-08-03 Oberg Industries Apparatus and method for rapid, precise positioning of a grit-blasting nozzle
US7008293B2 (en) * 2001-09-11 2006-03-07 Olympus Optical Co., Ltd. Positioning jig, spray polishing device using positioning jig and spray polishing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5531634A (en) * 1995-02-03 1996-07-02 Schott; Paul Method of using an abrasive material for blast cleaning of solid surfaces
US5573446A (en) * 1995-02-16 1996-11-12 Eastman Kodak Company Abrasive air spray shaping of optical surfaces
DE19747838C2 (en) * 1997-10-19 2001-07-12 Gp Granulate Pneumatic Geraete Method and apparatus for the dry removal of coatings, graffiti or other superficial impurities
NL1007589C1 (en) * 1997-11-20 1999-05-25 Tno Method and device for machining of a workpiece.
US6306010B1 (en) * 1999-10-26 2001-10-23 Industrial Gasket, Inc. Method of forming a hole in a glass reflector

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769762A (en) * 1972-03-07 1973-11-06 Altair Scient Inc Method for controlled lapping of optical surfaces to correct deviations from desired contours
US4038786A (en) * 1974-09-27 1977-08-02 Lockheed Aircraft Corporation Sandblasting with pellets of material capable of sublimation
US4956944A (en) * 1987-03-19 1990-09-18 Canon Kabushiki Kaisha Polishing apparatus
US5700181A (en) * 1993-09-24 1997-12-23 Eastman Kodak Company Abrasive-liquid polishing and compensating nozzle
US5759086A (en) * 1994-11-04 1998-06-02 Trumpf Gmbh & Co. Method and machine tool for cutting workpieces
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine
US6244927B1 (en) * 1998-08-31 2001-06-12 Ingersoll-Rand Company Multi-functional sensing methods and apparatus therefor
US6280302B1 (en) * 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
US6643882B1 (en) * 1999-06-17 2003-11-11 Ebara Corporation Substrate cleaning apparatus
US6425804B1 (en) * 2000-03-21 2002-07-30 Hewlett-Packard Company Pressurized delivery system for abrasive particulate material
US7008293B2 (en) * 2001-09-11 2006-03-07 Olympus Optical Co., Ltd. Positioning jig, spray polishing device using positioning jig and spray polishing method
US6769956B1 (en) * 2002-02-04 2004-08-03 Oberg Industries Apparatus and method for rapid, precise positioning of a grit-blasting nozzle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101226757B1 (en) * 2003-07-18 2013-01-25 유니버시다드 나시오날 오토노마 드 멕시코 Hydrodynamic radial flux tool for polishing and grinding optical and semiconductor surfaces
US20080248729A1 (en) * 2007-04-04 2008-10-09 Fisba Optik Ag Method and Apparatus for Manufacturing Optical Elements
US7987015B2 (en) * 2007-04-04 2011-07-26 Fisba Optik Ag Method and apparatus for manufacturing optical elements
CN102284911A (en) * 2011-07-22 2011-12-21 中国科学院长春光学精密机械与物理研究所 A long-gap stabilizer polishing apparatus Cheng
CN103128673A (en) * 2013-02-05 2013-06-05 浙江工业大学 Restraining abrasive particle flow polishing tool head of hard and brittle materials
CN103128671A (en) * 2013-02-05 2013-06-05 浙江工业大学 Restraining abrasive particle flow polishing device of hard and brittle material complex curve part
CN103128672A (en) * 2013-02-05 2013-06-05 浙江工业大学 Constraint abrasive flow polishing tool head

Also Published As

Publication number Publication date
EP1409199A1 (en) 2004-04-21
DE50208850D1 (en) 2007-01-11
WO2002074489A1 (en) 2002-09-26
DE10113599A1 (en) 2002-10-02
EP1409199B1 (en) 2006-11-29
US20080119113A1 (en) 2008-05-22

Similar Documents

Publication Publication Date Title
Walker et al. The ‘Precessions’ tooling for polishing and figuring flat, spherical and aspheric surfaces
US5569062A (en) Polishing pad conditioning
US3121982A (en) Grinding wheel with adjustable abrasive segments
US6953381B2 (en) System and method for ophthalmic lens manufacture
EP1384553B1 (en) A polishing machine with driving means to move the grinding tool along a precession path and method to use it
US5934973A (en) Semiconductor wafer dicing saw
US5951375A (en) Support for optical lenses and method for polishing lenses
US6110025A (en) Containment ring for substrate carrier apparatus
EP0917931B1 (en) Combined cutting and grinding tool
US5967882A (en) Lapping apparatus and process with two opposed lapping platens
JP3286941B2 (en) Truing method of diamond grinding wheel
US6113468A (en) Wafer planarization carrier having floating pad load ring
CN1073910C (en) Deterministic magnetorhydrological finishing
US6120352A (en) Lapping apparatus and lapping method using abrasive sheets
US6149506A (en) Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6102777A (en) Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6537138B2 (en) Method of grinding an axially asymmetric aspherical mirror
EP1436119B2 (en) Device and method for complete machining of lenses that are optically active on two sides
US6659843B2 (en) Substrate dicing method
US6290584B1 (en) Workpiece carrier with segmented and floating retaining elements
US6506102B2 (en) System for magnetorheological finishing of substrates
Suzuki et al. Precision cutting of aspherical ceramic molds with micro PCD milling tool
JP4184009B2 (en) Method and apparatus for surface machining a workpiece of non-fragile material in the manufacture of optical elements and tool therefor
EP1118429B1 (en) Method and device for simultaneously grinding double surfaces, and method and device for simultaneously lapping double surfaces
US7018272B2 (en) Pressure feed grinding of AMLCD substrate edges

Legal Events

Date Code Title Description
STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION