WO2002053806A3 - Electrochemical coating device and method - Google Patents

Electrochemical coating device and method Download PDF

Info

Publication number
WO2002053806A3
WO2002053806A3 PCT/DE2001/003676 DE0103676W WO02053806A3 WO 2002053806 A3 WO2002053806 A3 WO 2002053806A3 DE 0103676 W DE0103676 W DE 0103676W WO 02053806 A3 WO02053806 A3 WO 02053806A3
Authority
WO
WIPO (PCT)
Prior art keywords
layers
coated
substrate
thin layers
deposited
Prior art date
Application number
PCT/DE2001/003676
Other languages
German (de)
French (fr)
Other versions
WO2002053806A2 (en
Inventor
Alexander Kraft
Karl-Heinz Heckner
Original Assignee
Gesimat Gmbh
Alexander Kraft
Karl-Heinz Heckner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gesimat Gmbh, Alexander Kraft, Karl-Heinz Heckner filed Critical Gesimat Gmbh
Priority to DE10195773T priority Critical patent/DE10195773D2/en
Priority to AU2002223435A priority patent/AU2002223435A1/en
Priority to EP01272605A priority patent/EP1534880B1/en
Priority to DE50112278T priority patent/DE50112278D1/en
Publication of WO2002053806A2 publication Critical patent/WO2002053806A2/en
Publication of WO2002053806A3 publication Critical patent/WO2002053806A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Battery Mounting, Suspending (AREA)
  • Sealing Battery Cases Or Jackets (AREA)

Abstract

The invention relates to a device and method, with which it is possible to electrochemically deposit thin layers with a nearly homogeneous layer thickness on large-surface substrates having relatively high resistances. These thin layers are, for example, metal layers, metal oxide layers or semiconductor layers as well as layers consisting of conductive polymers that, for example, are deposited on transparent electrodes or semiconductor substrates. The counter-electrode for the substrate to be coated is divided into several electrode segments and voltages that differ from one another can be applied between each individual electrode segment and the substrate to be coated. This results in achieving a good homogeneity of the deposited thin layers with respect to thickness and physical properties.
PCT/DE2001/003676 2001-01-04 2001-09-24 Electrochemical coating device and method WO2002053806A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE10195773T DE10195773D2 (en) 2001-01-04 2001-09-24 Device and method for electrochemical coating
AU2002223435A AU2002223435A1 (en) 2001-01-04 2001-09-24 Electrochemical coating device and method
EP01272605A EP1534880B1 (en) 2001-01-04 2001-09-24 Electrochemical coating device and method
DE50112278T DE50112278D1 (en) 2001-01-04 2001-09-24 DEVICE AND METHOD FOR ELECTROCHEMICAL COATING

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10100297A DE10100297A1 (en) 2001-01-04 2001-01-04 Device and method for electrochemical coating
DE10100297.1 2001-01-04

Publications (2)

Publication Number Publication Date
WO2002053806A2 WO2002053806A2 (en) 2002-07-11
WO2002053806A3 true WO2002053806A3 (en) 2005-03-24

Family

ID=7669816

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2001/003676 WO2002053806A2 (en) 2001-01-04 2001-09-24 Electrochemical coating device and method

Country Status (5)

Country Link
EP (1) EP1534880B1 (en)
AT (1) ATE358194T1 (en)
AU (1) AU2002223435A1 (en)
DE (3) DE10100297A1 (en)
WO (1) WO2002053806A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10132408C2 (en) * 2001-07-04 2003-08-21 Fraunhofer Ges Forschung Variable shape electrode
DE10141056C2 (en) 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Method and device for the electrolytic treatment of electrically conductive layers in continuous systems
DE102004056158B3 (en) * 2004-11-17 2006-03-30 Siemens Ag Method for monitoring an electrochemical treatment process and electrode arrangement suitable for this method
JP6993288B2 (en) * 2018-05-07 2022-01-13 株式会社荏原製作所 Plating equipment
DE102018004841B9 (en) 2018-06-13 2020-12-03 Hooshiar Mahdjour Method and device for the automated regulation of the currents in an electroplating bath

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818352A (en) * 1985-06-04 1989-04-04 Central Glass Company, Limited Electrodeposition of functional film on electrode plate relatively high in surface resistivity
JPH04143299A (en) * 1990-10-03 1992-05-18 Fujitsu Ltd Electroplating method
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
WO2001014618A2 (en) * 1999-08-26 2001-03-01 Cvc Products, Inc. Apparatus and method for electroplating a material layer onto a wafer
WO2001094656A2 (en) * 2000-06-05 2001-12-13 Applied Materials, Inc. Plating apparatus with individually controllable anode segments and associated method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207909B2 (en) * 1992-02-07 2001-09-10 ティーディーケイ株式会社 Electroplating method and split type insoluble electrode for electroplating
DE19717489B4 (en) * 1997-04-25 2008-04-10 Sms Demag Ag Arrangement for the electrogalvanic metal coating of a strip

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4818352A (en) * 1985-06-04 1989-04-04 Central Glass Company, Limited Electrodeposition of functional film on electrode plate relatively high in surface resistivity
JPH04143299A (en) * 1990-10-03 1992-05-18 Fujitsu Ltd Electroplating method
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
WO2001014618A2 (en) * 1999-08-26 2001-03-01 Cvc Products, Inc. Apparatus and method for electroplating a material layer onto a wafer
WO2001094656A2 (en) * 2000-06-05 2001-12-13 Applied Materials, Inc. Plating apparatus with individually controllable anode segments and associated method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 199226, Derwent World Patents Index; Class A85, AN 1992-213863, XP002305508 *
PATENT ABSTRACTS OF JAPAN vol. 0164, no. 19 (C - 0981) 3 September 1992 (1992-09-03) *

Also Published As

Publication number Publication date
WO2002053806A2 (en) 2002-07-11
ATE358194T1 (en) 2007-04-15
DE50112278D1 (en) 2007-05-10
EP1534880B1 (en) 2007-03-28
AU2002223435A1 (en) 2002-07-16
DE10195773D2 (en) 2004-01-22
EP1534880A2 (en) 2005-06-01
DE10100297A1 (en) 2002-07-18

Similar Documents

Publication Publication Date Title
EP1857859A3 (en) Polymeric electrochromic devices
RU2402088C1 (en) Manufacturing method of precision chip resistors as per hybrid technology
DE60213242D1 (en) METHOD FOR PRODUCING A TOUCH-SENSITIVE SCREEN
EP1046727A3 (en) Method of film deposition on substrate surface and substrate produced by the method
WO2006131912A3 (en) Microelectrode, applications thereof and method of manufacturing
WO2007005369A3 (en) An electrochromic vision panel having a plurality of connectors
CN113826235A (en) Method for producing a display having a carrier substrate, carrier substrate produced according to said method and cover glass intended for flexible displays
KR102365814B1 (en) Metallization for a thin film component, method for the production thereof, and sputtering target
WO2008027856A3 (en) Multi-phase coatings for inhibiting tin whisker growth and methods of making and using the same
ATE310251T1 (en) OPTICAL COATINGS AND ASSOCIATED METHODS
EP1928014A3 (en) Charge trap layer for a charge trap semiconductor memory device and method of manufacturing the same
WO2002053806A3 (en) Electrochemical coating device and method
US8017941B2 (en) Ceramic MESFET device and manufacturing method thereof
ATE347735T1 (en) DEVICE AND METHOD FOR COATING SUBSTRATES IN A VACUUM
ATE542785T1 (en) METHOD FOR ELECTROPHORETIC COATING
CN104617111A (en) Substrate, manufacturing method thereof and display device
WO2003038158A3 (en) Electroplating device and electroplating system for coating already conductive structures
JP2016197622A (en) Chip resistor and method for manufacturing the same
WO2002025282A8 (en) Method for adhesion of polymers to metal-coated substrates
KR20170113020A (en) Voltage nonlinear resistive element and method for manufacturing the same
WO2004073034A3 (en) Controlled electrochemical deposition of polysaccharides, films and hydrogel and materials formed therefrom
WO2005008743A3 (en) A semiconductor device with metallic electrodes and a method for use in forming such a device
KR101222061B1 (en) Diamond tool and method of fabricating the same
KR101348010B1 (en) Manufacturing method for electrode wire and substrate using the same
US6790478B1 (en) Method for selectively coating ceramic surfaces

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2001272605

Country of ref document: EP

REF Corresponds to

Ref document number: 10195773

Country of ref document: DE

Date of ref document: 20040122

Kind code of ref document: P

WWE Wipo information: entry into national phase

Ref document number: 10195773

Country of ref document: DE

WWP Wipo information: published in national office

Ref document number: 2001272605

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: JP

WWG Wipo information: grant in national office

Ref document number: 2001272605

Country of ref document: EP