WO2002050556A2 - Hochfrequenz-tastspitze - Google Patents
Hochfrequenz-tastspitze Download PDFInfo
- Publication number
- WO2002050556A2 WO2002050556A2 PCT/DE2001/004619 DE0104619W WO0250556A2 WO 2002050556 A2 WO2002050556 A2 WO 2002050556A2 DE 0104619 W DE0104619 W DE 0104619W WO 0250556 A2 WO0250556 A2 WO 0250556A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- measuring
- frequency probe
- tip
- signal
- probe tip
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Definitions
- the invention relates to a high-frequency probe tip, in particular for printed circuit boards and / or HF cables, according to the preamble of claim 1.
- TDR measurements Time Domain Reflectometry measurements
- a measuring tip for measuring purposes.
- a measuring tip has also been proposed, in which a measuring mandrel of the ground contact is arranged pivotably. By appropriately pivoting the measuring mandrel, different distances between the ground contact and the signal contact can be realized.
- problems arise with regard to impedance matching and undesired reflections limit a frequency range in which such a measuring tip can be used, for example to a maximum of 125 MHz.
- measuring tips are required today that can be used up to the GHz range.
- the invention has for its object to provide an improved high-frequency probe tip of the above type, which is easy to handle exercise and at the same time ensures good functional reliability even at high frequencies in the GHz range.
- the ground conductor arrangement is designed in such a way that the signal conductor can be displaced within the ground conductor arrangement together with the dielectric surrounding it.
- the ground conductor arrangement is box-shaped in the predetermined region, the electrical field between the ground conductor arrangement and the signal conductor in this region practically runs only through a correspondingly flattened region of the dielectric which surrounds the signal conductor.
- the impedance is independent of the position of the signal conductor within the ground conductor arrangement. This effect is reinforced by the fact that the box-shaped ground conductor arrangement has a small and a large diameter in cross section, the small diameter being smaller than the diameter of the dielectric of the signal conductor.
- the ground conductor arrangement is designed as a flattened tube in the predetermined area.
- a standard coaxial connection for the measuring cable is expediently provided at the connection end.
- the ground contact is preferably formed on the measuring tip.
- two signal conductors each with a signal contact, are provided.
- FIG. 1 shows a preferred embodiment of a high-frequency probe tip according to the invention in a perspective view
- FIG. 2 shows the high-frequency probe tip of FIG. 1 in a longitudinal section
- FIG. 3 is a sectional view taken along line A-A of FIG. 2;
- FIG. 4 shows an alternative embodiment of a high-frequency probe tip according to the invention in a perspective view
- Fig. 5 shows the high-frequency probe tip of Fig. 4 in a longitudinal section
- FIG. 6 is a sectional view taken along line B-B of FIG. 5.
- FIGS. 1 and 2 The preferred embodiment of a high-frequency probe tip according to the invention shown in FIGS. 1 and 2 comprises a connection end 10 to which a measuring cable, not shown, can be connected for connection to a measuring device, not shown, and a measuring tip 12, to which a signal contact 14 and a ground contact 16 are trained.
- the contacts 14, 16 form an RF transition, for example to a test object.
- a coaxial conductor 18 with ground conductor arrangement 20 and signal conductor 22 connects the connection end 10 to the measuring tip 12.
- the signal conductor 22 is surrounded by a dielectric 24.
- a handle 26 is formed and a standard coaxial connection 28 is arranged for the measuring cable.
- the mass conductor arrangement 20 is designed as a flattened tube in a predetermined area 30.
- this tube 20 has a large diameter 32 and a small diameter 34 in cross section, the small diameter 34 being somewhat smaller than the regular diameter of the dielectric 24. Therefore, the dielectric 24 becomes in the region 30 something pressed together.
- the transition from the coaxial cable 18 to the tubular ground conductor arrangement 20 takes place.
- the sheath of the coaxial cable 18 is soldered to the open end of the tube 20, while the inner conductor or signal conductor 22 is continued in one piece with dielectric 24.
- the flattening of the tube 20 in the region 30 ensures that the same impedance as in the coaxial cable 18 prevails in this tube 20 despite the same insulator diameter.
- a distance between the ground contact 16 and the signal contact 14 is infinitely adjustable by means of the movable signal conductor 22.
- a slide 38 (FIG. 1, 2) is provided on the tube 20, which carries the flexible signal conductor 22 between thorns 40. In this way, the signal conductor 22 can be pushed back and forth within the tube 20 in the direction of arrow 42.
- the measuring tip 12 has a constant impedance throughout, ie also for all distances, and is therefore particularly suitable for TDR measurements in which the measurement accuracy and resolution are based on a transition with as little reflection as possible depend on the test object.
- the distance between the signal contact 14 and the ground contact 16 can be changed in a simple manner by actuating the slide 38. When the slide 34 is actuated, the flexible inner or signal conductor 22 with its insulation 24 moves in the box-shaped outer conductor 20.
- FIGS. 4 to 6 In the alternative embodiment of a high-frequency probe tip according to the invention shown in FIGS. 4 to 6, functionally identical parts are designated with the same reference numbers as in FIGS. 1 to 3, so that reference is made to the above description of FIGS. 1 to 3 for their explanation.
- this high-frequency probe tip comprises a symmetrical tip with two signal conductors 22 and accordingly two signal contacts 14 on the measuring tip 12.
- Corresponding outer conductors of coaxial cables 44 are soldered to the tubular outer conductor 20 in the transition region 36.
- this high-frequency probe tip thus has a second, equivalent signal contact 14a on the measuring tip 12, which sits on the rigid line 22a shown in the upper figure.
- the second line 22 in the lower figure can be displaced analogously to the asymmetrical measuring tip 12 according to FIGS. 1 to 3.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA002420581A CA2420581A1 (en) | 2000-12-21 | 2001-12-06 | High-frequency probe-tip |
EP01989385A EP1352253A2 (de) | 2000-12-21 | 2001-12-06 | Hochfrequenz-tastspitze |
JP2002551603A JP2004537031A (ja) | 2000-12-21 | 2001-12-06 | 高周波プローブチップ |
US10/450,394 US20040066181A1 (en) | 2000-12-21 | 2001-12-12 | High-frequency probe tip |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20021685U DE20021685U1 (de) | 2000-12-21 | 2000-12-21 | Hochfrequenz-Tastspitze |
DE20021685.6 | 2000-12-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002050556A2 true WO2002050556A2 (de) | 2002-06-27 |
WO2002050556A3 WO2002050556A3 (de) | 2002-12-05 |
Family
ID=7950409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2001/004619 WO2002050556A2 (de) | 2000-12-21 | 2001-12-06 | Hochfrequenz-tastspitze |
Country Status (7)
Country | Link |
---|---|
US (1) | US20040066181A1 (de) |
EP (1) | EP1352253A2 (de) |
JP (1) | JP2004537031A (de) |
CN (1) | CN1466686A (de) |
CA (1) | CA2420581A1 (de) |
DE (1) | DE20021685U1 (de) |
WO (1) | WO2002050556A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
US6965226B2 (en) | 2000-09-05 | 2005-11-15 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US6914423B2 (en) | 2000-09-05 | 2005-07-05 | Cascade Microtech, Inc. | Probe station |
DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech Inc | Wafersonde |
WO2003052435A1 (en) | 2001-08-21 | 2003-06-26 | Cascade Microtech, Inc. | Membrane probing system |
US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
US7492172B2 (en) | 2003-05-23 | 2009-02-17 | Cascade Microtech, Inc. | Chuck for holding a device under test |
US7250626B2 (en) | 2003-10-22 | 2007-07-31 | Cascade Microtech, Inc. | Probe testing structure |
US7262614B1 (en) * | 2005-02-10 | 2007-08-28 | Lecroy Corporation | Planar on edge probing tip with flex |
US7321234B2 (en) | 2003-12-18 | 2008-01-22 | Lecroy Corporation | Resistive test probe tips and applications therefor |
US7187188B2 (en) | 2003-12-24 | 2007-03-06 | Cascade Microtech, Inc. | Chuck with integrated wafer support |
DE202004021093U1 (de) | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
US7420381B2 (en) | 2004-09-13 | 2008-09-02 | Cascade Microtech, Inc. | Double sided probing structures |
US7183779B2 (en) * | 2004-12-28 | 2007-02-27 | Spectrum Technologies, Inc. | Soil probe device and method of making same |
US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
US9404940B1 (en) | 2006-01-06 | 2016-08-02 | Teledyne Lecroy, Inc. | Compensating probing tip optimized adapters for use with specific electrical test probes |
US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
US7804314B2 (en) * | 2008-02-19 | 2010-09-28 | Siemens Industry, Inc. | Adjustable electrical probes for circuit breaker tester |
US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
US8319503B2 (en) | 2008-11-24 | 2012-11-27 | Cascade Microtech, Inc. | Test apparatus for measuring a characteristic of a device under test |
DE202009003966U1 (de) * | 2009-03-20 | 2009-06-04 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messspitzen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908571A (en) * | 1987-05-26 | 1990-03-13 | International Business Machines Corporation | Contact probe assembly with fine positioning means |
US4923407A (en) * | 1989-10-02 | 1990-05-08 | Tektronix, Inc. | Adjustable low inductance probe |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4829242A (en) * | 1987-12-07 | 1989-05-09 | Microelectronics And Computer Technology Corporation | Multigigahertz probe |
US5565788A (en) * | 1994-07-20 | 1996-10-15 | Cascade Microtech, Inc. | Coaxial wafer probe with tip shielding |
US5506515A (en) * | 1994-07-20 | 1996-04-09 | Cascade Microtech, Inc. | High-frequency probe tip assembly |
JP3112873B2 (ja) * | 1997-10-31 | 2000-11-27 | 日本電気株式会社 | 高周波プローブ |
US6366104B2 (en) * | 2000-02-15 | 2002-04-02 | Hughes Electronics Corp. | Microwave probe for surface mount and hybrid assemblies |
-
2000
- 2000-12-21 DE DE20021685U patent/DE20021685U1/de not_active Expired - Lifetime
-
2001
- 2001-12-06 JP JP2002551603A patent/JP2004537031A/ja active Pending
- 2001-12-06 CN CNA018161979A patent/CN1466686A/zh active Pending
- 2001-12-06 CA CA002420581A patent/CA2420581A1/en not_active Abandoned
- 2001-12-06 EP EP01989385A patent/EP1352253A2/de not_active Withdrawn
- 2001-12-06 WO PCT/DE2001/004619 patent/WO2002050556A2/de not_active Application Discontinuation
- 2001-12-12 US US10/450,394 patent/US20040066181A1/en not_active Abandoned
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4908571A (en) * | 1987-05-26 | 1990-03-13 | International Business Machines Corporation | Contact probe assembly with fine positioning means |
US4923407A (en) * | 1989-10-02 | 1990-05-08 | Tektronix, Inc. | Adjustable low inductance probe |
Non-Patent Citations (1)
Title |
---|
ANONYMOUS: "Test Probe With Variable Ground and Constant Impedance Capabilities. August 1975." IBM TECHNICAL DISCLOSURE BULLETIN, Bd. 18, Nr. 3, 1. August 1975 (1975-08-01), Seiten 699-700, XP002201071 New York, US * |
Also Published As
Publication number | Publication date |
---|---|
CA2420581A1 (en) | 2003-02-25 |
US20040066181A1 (en) | 2004-04-08 |
CN1466686A (zh) | 2004-01-07 |
JP2004537031A (ja) | 2004-12-09 |
WO2002050556A3 (de) | 2002-12-05 |
EP1352253A2 (de) | 2003-10-15 |
DE20021685U1 (de) | 2001-03-15 |
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