WO2002043923A1

WO2002043923A1 - Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers

Info

Publication number: WO2002043923A1
Application number: PCT/DE2001/004082
Authority: WO
Inventors: Veit Götze; Rüdiger Hunger
Original assignee: Infineon Technologies Ag
Priority date: 2000-11-29
Filing date: 2001-10-25
Publication date: 2002-06-06
Also published as: KR20040004453A; DE10195157B4; JP2004514300A; DE10195157D2; US20030216112A1

Abstract

A cleaning device for cleaning a polishing pad (12) has a first cleaning system (5) with an abrasive disk (50) and a second cleaning system (2) with a distributor device (20) for discharging a gas-water mixture at high pressure. The polishing pad (12) that is located on the polishing (11) can be caused to rotate, so that the surface sections to be cleaned are subjected first to pre-cleaning with the abrasive disk (50) and then, to a second cleaning with the gas-water mixture of the distributor device (20).

Description

description

Cleaning device for cleaning polishing cloths used for polishing semiconductor wafers

The present invention relates to a cleaning device and a method carried out with the cleaning device for cleaning polishing pads, in particular polishing cloths, which are used for the chemical-mechanical polishing of semiconductor wafers in the course of a manufacturing process.

In the semiconductor industry, the demand for ever smaller structures and increasing yields in semiconductor wafers means that, in addition to process control, the reduction in defect density on the wafers is gaining increasing influence. In the course of a structuring and processing process of a semiconductor surface, it can be provided that certain materials are removed by means of a polishing pad, for example a polishing cloth, by chemical-mechanical polishing or the like. Known devices for this are, for example, the so-called IPEC / estech 472, which is a device specifically for the chemical-mechanical polishing of silicon fields. The polishing process carried out with this device is a single-wafer process in which the product side of the wafer is chemically and mechanically polished. The material abrasion occurring in this polishing process is however deposited in the polishing pad. These / deposits can have a negative effect when polishing subsequent wafers, for example by scratches forming on the surface of these wafers. The problem arises particularly in Cu processes, since contamination of a subsequently polished silicon wafer can lead to failure of components on this silicon wafer.

In order to reduce contamination of subsequent wafers by abrasion of previously polished wafers and to reduce the load on the To limit polishing pads with abrasion, the polishing pad has been replaced very often so far. However, this is generally disadvantageous since the costs and changeover times caused thereby have a considerable influence on the performance of the polishing process.

It has therefore already been proposed to subsequently clean the polishing pads used in the polishing process from the deposited material abrasion and from residues of the slurry used in chemical mechanical polishing. In the German patent application DE 197 37 854 AI, which is hereby included in the disclosure of the present application, a device for cleaning a polishing pad, for example a polishing cloth for polishing wafers, is described. This device is essentially formed by a distributor for delivering a gas-water mixture at a high pressure. The gas-water mixture is atomized and sprayed onto the polishing pad to be cleaned via nozzles which are arranged on the outlet side of the distributor. Furthermore, a blasting nozzle is provided for blasting a directed water jet onto the polishing pad to be cleaned. The directed water jet also exits the blasting nozzle at high pressure. In principle, this cleaning device allows thorough cleaning of the surface of the polishing pad. However, it has been shown that the cleaning process is ineffective, since material particles stuck in the polishing pad in particular can only be removed with a relatively high consumption of the gas-water mixture.

It is therefore an object of the present invention to provide a cleaning device and a corresponding method for cleaning polishing pads, in particular polishing cloths, by means of which a thorough and effective cleaning of the surface of the polishing pads can be made possible. This object is solved by the features of the independent claims. Advantageous embodiments of the cleaning device and the cleaning method are specified in the corresponding subclaims.

The present invention is based on the essential idea that essentially two cleaning systems are used for cleaning the polishing pads, in which a first cleaning system carries out a preliminary or rough cleaning of the surface of the polishing pad, and a second cleaning system carries out a post-cleaning of the surface. The first cleaning system essentially has a rotating grinding wheel, through which the surface of the polishing pad is ground. The second cleaning system, on the other hand, essentially consists of the distributor known per se in the prior art and described in the above-mentioned publication DE 197 37 854 A1 for dispensing a gas-water mixture onto the surface of the polishing pad.

A corresponding cleaning process of the surface of the polishing pad can be carried out in such a way that in a first cleaning step the entire surface of the polishing pad is first ground off and then in a second cleaning step the surface is exposed to the gas / water mixture under high pressure. If necessary, both cleaning steps can be carried out several times in succession in alternation.

In an advantageous embodiment of the cleaning method, however, both cleaning steps are carried out simultaneously, with different sections of the surface either being ground down or the gas / water mixture being applied, and the polishing pad being rotated about a main axis, so that essentially each the section of the surface is subjected to both cleaning steps at least once. The cleaning device is preferably designed for this purpose so that the polishing pad to be cleaned can be positioned such that the surface to be cleaned of the polishing pad faces the grinding wheel and the exit side of the gas / water mixture from the distributor, and grinding wheel and distributor each on holding arms are attached such that they face different sections of the surface of the polishing pad, and the polishing pad is rotatably supported about a main axis. At least one of the holding arms for the grinding wheel and the distributor can be arranged pivotably. A spray nozzle for rinsing off grinding particles detached from the surface of the polishing pad by the grinding wheel can additionally be attached to the holding arm of the grinding wheel.

The cleaning device can additionally have a liquid nozzle through which a further section of the surface of the polishing pad can be acted upon by a liquid, in particular water. As a result, the surface of the polishing pad, in particular a surface section which had just been exposed to the gas / water mixture, can be rinsed out of the liquid nozzle with a directed water jet.

Since the polishing pads used for the chemical-mechanical polishing processes in semiconductor process technology in many cases have a circular shape essentially in the shape of the semiconductor wafer, the cleaning device is preferably designed such that a circular polishing pad for a cleaning process on it preferably rotatably mounted support can be stored. In this case, the grinding wheel, the distributor and optionally the liquid nozzle can then be arranged on different circumferential sections of the circular polishing pad. The arrangement of these links and the rotational movement of the polishing pad are preferably such that the surface sections are subjected to a cleaning treatment by the grinding wheel, are then charged with the gas-water mixture and finally rinsed off by the directed water jet from the liquid nozzle.

Both the grinding wheel and the distributor can be attached to their respective holding arms in such a way that they can be moved along the holding arm.

The distributor for dispensing a gas-water mixture can be designed as it was described in the publication DE 197 37 854 AI already mentioned. The entire content of this document, but in particular the sections relating to the structure of the distributor for the gas-water mixture and the provision of the gas-water mixture in the distributor, are hereby incorporated into the disclosure content of the present application. In particular, a gas supply line and a water supply line are arranged on the inlet side of the distributor. The individual components of the gas-water mixture are fed into the distributor from various sources through the water and gas supply lines. A plurality of nozzles is formed on an outlet side of the distributor, through which the gas-water mixture is discharged or atomized to the outside.

By means of the cleaning device according to the invention and the corresponding cleaning method, abrasion particles located on the polishing pad can thus be removed from the polishing pad in a thorough and effective manner at the same time. At the same time, the risk of contamination of wafers to be subsequently processed due to abrasion of previously polished wafers is greatly reduced. By first performing a pre-cleaning by grinding through the grinding wheel for each surface section to be cleaned and only then performing subsequent cleaning by means of the distributor, the entire cleaning process can be carried out very efficiently and the consumption of the gas-water mixture for the distributor can be reduced , A single exemplary embodiment of the cleaning device according to the invention is explained in more detail below with reference to the drawing figures. Show it:

1 shows an exemplary embodiment of a cleaning device according to the invention in a schematic cross-sectional view;

FIG. 2 shows a top view of the cleaning device according to FIG. 1.

1 schematically shows an exemplary embodiment of a cleaning device according to the invention for cleaning a polishing cloth 12 arranged on a polishing table 11 in a cross section. 2 shows a top view of the cleaning device, the individual cleaning elements being shown in their relative arrangement to one another and to the surface of the polishing cloth 12 to be cleaned.

The cleaning device essentially consists of a first cleaning system 5 for pre-cleaning the surface of the polishing pad 12 and a second cleaning system 2 for carrying out post-cleaning. The first cleaning system 5 has a circular grinding wheel 50 which is set into a rotary movement during the cleaning process. The grinding wheel 50 is fastened on a pivotable holding arm 51 and is displaceable along the holding arm 51 (see FIG. 2). At the beginning of a cleaning process with the first cleaning system 5, the holding arm 51 is pivoted in so that the grinding wheel 50 is positioned above the surface of the polishing pad 12, whereupon the grinding wheel 50 is placed on the polishing pad 12 with a defined pressure. The grinding wheel 50 is a circular wheel, which is provided with a special rough diamond-coated surface and roughenes the surface of the polishing pad 12 due to its rotational movement. In addition, the shark

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cleaned section is passed due to the rotary movement under the radiation surface of the distributor 20, in which the second cleaning step takes place, whereupon the dissolved particles are subsequently rinsed off the surface of the polishing pad 12 by the water jet 30A of the jet nozzle 30.

In an alternative embodiment it can also be provided that the holding arm 25 of the second cleaning system can also be pivoted and is initially in a pivoted-out position. The two cleaning steps can be carried out separately, in which case in a first cleaning step essentially the entire surface of the polishing pad 12 is ground down by the grinding wheel 50 attached to the pivoted-in holding arm 51. After the first cleaning step has been carried out, the holding arm 51 of the first cleaning system can then be pivoted away and the holding arm 25 of the second cleaning system can be pivoted in, after which essentially the entire surface is subjected to a second cleaning step by applying the gas / water mixture from the distributor to the surface 20 is cleaned.

Claims

claims

1. Cleaning device for cleaning a polishing pad (12), in particular a polishing cloth, with a first cleaning system (5), which has a grinding wheel (50), and a second cleaning system (2), which has a distributor (20) for dispensing a gas Has water mixture under high pressure.

2. Cleaning device according to claim 1, characterized ge ez chne t that the polishing pad (12) can be positioned such that the surface to be cleaned of the polishing pad (12) of the grinding wheel (50) and the outlet side (22) of the distributor (20) is facing, and

The grinding wheel (50) and distributor (20) are each fastened to holding arms (51, 25) in such a way that they face different sections of the surface of the polishing pad (12) and the polishing pad (12) is rotatably mounted about a main axis.

3. Cleaning device according to claim 2, characterized in that at least one of the holding arms (25, 51) is pivotable.

4. Cleaning device according to claim 2 or 3, characterized ge zei chne t that on the holding arm (51) of the grinding wheel (50) has a spray nozzle (52) for rinsing through the grinding wheel (50) from the surface of the polishing pad (12) loosened abrasive particles is attached.

5. Cleaning device according to one of claims 2 to 4, characterized in that a liquid nozzle (30) is arranged such that a further section of the surface of the polishing pad (12) can be acted upon by a liquid, in particular water.

6. Cleaning device according to one of the preceding claims, characterized in that

- It is designed for receiving an essentially circular polishing pad (12), and the grinding wheel (50), the distributor (20) and optionally the liquid nozzle (30) are arranged on different peripheral sections of the polishing pad (12).

7. A method for cleaning a polishing pad (12), in particular a polishing cloth, in particular using a device according to one of claims 1 to 6, characterized in that

- The surface of the polishing pad (12) is sanded either simultaneously or alternately and a gas-water mixture is applied under high pressure.

8. The method according to claim 7, since you do not have, d a ß - at the same time, different sections of the surface are either ground off or the gas / water mixture is applied, and

- The polishing pad (12) is rotated about a main axis so that essentially each section of the surface is subjected to both cleaning steps at least once.

9. The method of claim 7, since you rchgeke nn zeic hn et, ß - first the entire surface of the polishing pad (12) ground and then applied with the gas-water mixture is struck, the two cleaning steps optionally being carried out several times in succession in alternation.

10. The method according to any one of claims 7 to 9, characterized in that - the surface of the polishing pad (12), in particular a surface section, which had previously been exposed to the gas-water mixture, with a directed water jet (30A ) is rinsed off.