WO2002028940A1 - Resine de polyphenol, procede pour sa production, composition de resine epoxy et son utilisation - Google Patents

Resine de polyphenol, procede pour sa production, composition de resine epoxy et son utilisation Download PDF

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Publication number
WO2002028940A1
WO2002028940A1 PCT/JP2001/008693 JP0108693W WO0228940A1 WO 2002028940 A1 WO2002028940 A1 WO 2002028940A1 JP 0108693 W JP0108693 W JP 0108693W WO 0228940 A1 WO0228940 A1 WO 0228940A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
epoxy resin
production
polyphenol
bcmb
Prior art date
Application number
PCT/JP2001/008693
Other languages
English (en)
French (fr)
Inventor
Yasumasa Akatsuka
Toyofumi Asano
Masahiro Imaizumi
Katsuhiko Oshimi
Syouichi Tomida
Original Assignee
Nippon Kayaku Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Kabushiki Kaisha filed Critical Nippon Kayaku Kabushiki Kaisha
Priority to DE2001628118 priority Critical patent/DE60128118T2/de
Priority to US10/148,701 priority patent/US6723801B2/en
Priority to EP20010972665 priority patent/EP1323761B1/en
Priority to TW90124241A priority patent/TWI287553B/zh
Priority to TW94133905A priority patent/TWI287554B/zh
Publication of WO2002028940A1 publication Critical patent/WO2002028940A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
PCT/JP2001/008693 2000-10-05 2001-10-03 Resine de polyphenol, procede pour sa production, composition de resine epoxy et son utilisation WO2002028940A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE2001628118 DE60128118T2 (de) 2000-10-05 2001-10-03 Polyphenolharz, verfahren zu dessen herstellung, epoxyharzzusammensetzung und dessen anwendung
US10/148,701 US6723801B2 (en) 2000-10-05 2001-10-03 Polyphenol resin, process for its production, epoxy resin composition and its use
EP20010972665 EP1323761B1 (en) 2000-10-05 2001-10-03 Polyphenol resin, process for its production, epoxy resin composition and its use
TW90124241A TWI287553B (en) 2000-10-05 2001-10-03 Polyphenol resin and manufacturing process thereof
TW94133905A TWI287554B (en) 2000-10-05 2001-10-03 Sheet made of epoxy resin composition and cured product thereof

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000305854 2000-10-05
JP2000-305854 2000-10-05
JP2000-377920 2000-12-12
JP2000377920 2000-12-12

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US10/148,701 A-371-Of-International US6723801B2 (en) 2000-10-05 2001-10-03 Polyphenol resin, process for its production, epoxy resin composition and its use
US10/787,781 Division US20040166326A1 (en) 2000-10-05 2004-02-26 Polyphenol resin, method for producing the same, epoxy resin composition and use thereof

Publications (1)

Publication Number Publication Date
WO2002028940A1 true WO2002028940A1 (fr) 2002-04-11

Family

ID=26601592

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/008693 WO2002028940A1 (fr) 2000-10-05 2001-10-03 Resine de polyphenol, procede pour sa production, composition de resine epoxy et son utilisation

Country Status (6)

Country Link
US (2) US6723801B2 (ja)
EP (1) EP1323761B1 (ja)
KR (1) KR100750998B1 (ja)
DE (1) DE60128118T2 (ja)
TW (2) TWI287553B (ja)
WO (1) WO2002028940A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005044307A3 (en) * 2003-11-04 2005-08-25 Chiron Corp Methods of therapy for b cell-related cancers

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100750998B1 (ko) * 2000-10-05 2007-08-22 니폰 가야꾸 가부시끼가이샤 폴리페놀수지, 그의 제조방법, 에폭시수지 조성물 및 그의용도
JP4240448B2 (ja) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 樹脂層付銅箔を用いた多層プリント配線板の製造方法
TW200415197A (en) * 2002-10-03 2004-08-16 Nippon Kayaku Kk Epoxy resin composition for optical semiconductor package
US20080200636A1 (en) * 2005-02-25 2008-08-21 Masataka Nakanishi Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof
MY143482A (en) * 2005-11-30 2011-05-31 Nippon Kayaku Kk Phenolic resin, process for production thereof, epoxy resin, and use thereof
WO2008117522A1 (ja) * 2007-03-23 2008-10-02 Sumitomo Bakelite Co., Ltd. 半導体封止用樹脂組成物およびこれを用いる半導体装置
TW200842135A (en) * 2007-04-23 2008-11-01 Chang Chun Plastics Co Ltd Flame retardant resin composition
WO2009126772A1 (en) * 2008-04-10 2009-10-15 Karl Christopher Hansen Simple-to-use optical wireless remote control
KR100995683B1 (ko) 2008-06-30 2010-11-22 주식회사 코오롱 에폭시 수지, 그 제조방법 및 용도
WO2011056455A2 (en) * 2009-11-06 2011-05-12 3M Innovative Properties Company Dielectric material with non-halogenated curing agent
CN101722694A (zh) * 2009-11-17 2010-06-09 丹阳市永和电器科技有限公司 一种高Tg高导热型铝基覆铜箔层压板
MX360156B (es) * 2009-12-21 2018-10-24 Basf Se Estructura compuesta para adoquinado.
WO2013011677A1 (ja) * 2011-07-19 2013-01-24 パナソニック株式会社 樹脂組成物、樹脂ワニス、プリプレグ、金属張積層板、及びプリント配線板
KR102497115B1 (ko) * 2020-11-06 2023-02-07 송원산업 주식회사 노볼락형 페놀 수지 그 제조방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10251362A (ja) * 1997-03-11 1998-09-22 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

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US3042655A (en) * 1960-01-22 1962-07-03 American Viscose Corp Novolak and method of manufacture thereof
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
JP2866747B2 (ja) * 1990-12-21 1999-03-08 三井化学株式会社 フェノール重合体の製造方法
DE69217400T2 (de) * 1991-03-29 1997-06-12 Dainippon Ink & Chemicals Epoxydharzhärter und Epoxidharzzusammensetzung
JP3479812B2 (ja) * 1994-01-25 2003-12-15 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP3122834B2 (ja) * 1994-09-20 2001-01-09 明和化成株式会社 新規フェノールノボラック縮合体
TW350857B (en) * 1994-09-20 1999-01-21 Ube Industries Phenol novolak condensate and the uses thereof
KR100235082B1 (ko) * 1995-04-04 1999-12-15 우찌가사끼 이사오 접착제, 접착 필름 및 접착제-부착 금속박
JPH09143345A (ja) * 1995-11-27 1997-06-03 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物
JP3622937B2 (ja) * 1995-12-28 2005-02-23 住友ベークライト株式会社 半導体封止用樹脂組成物
JP3604866B2 (ja) * 1997-05-13 2004-12-22 明和化成株式会社 フェノ−ルノボラック縮合体の製造方法
JPH11147998A (ja) * 1997-11-19 1999-06-02 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3414340B2 (ja) * 1998-12-15 2003-06-09 日本電気株式会社 難燃性樹脂材料および難燃性樹脂組成物
JP2001055431A (ja) * 1999-08-19 2001-02-27 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3460820B2 (ja) * 1999-12-08 2003-10-27 日本電気株式会社 難燃性エポキシ樹脂組成物
KR100750998B1 (ko) * 2000-10-05 2007-08-22 니폰 가야꾸 가부시끼가이샤 폴리페놀수지, 그의 제조방법, 에폭시수지 조성물 및 그의용도

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10251362A (ja) * 1997-03-11 1998-09-22 Nippon Kayaku Co Ltd ノボラック型樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005044307A3 (en) * 2003-11-04 2005-08-25 Chiron Corp Methods of therapy for b cell-related cancers
EP1844815A1 (en) * 2003-11-04 2007-10-17 Novartis Vaccines and Diagnostics, Inc. Combination therapy comprising anti-CD20 and anti-CD40 antibodies for the treatment of B cell-related cancers
EP2236172A1 (en) * 2003-11-04 2010-10-06 Novartis Vaccines and Diagnostics, Inc. Combination therapy comprising anti-CD20 and anti-CD40 antibodies for the treatment of B cell-related cancers

Also Published As

Publication number Publication date
EP1323761A4 (en) 2005-02-09
EP1323761B1 (en) 2007-04-25
DE60128118T2 (de) 2007-08-30
DE60128118D1 (de) 2007-06-06
KR20020063199A (ko) 2002-08-01
KR100750998B1 (ko) 2007-08-22
US20040166326A1 (en) 2004-08-26
US20030009001A1 (en) 2003-01-09
TWI287554B (en) 2007-10-01
US6723801B2 (en) 2004-04-20
TWI287553B (en) 2007-10-01
EP1323761A1 (en) 2003-07-02

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