WO2001099206A1 - Dispositif a resistance magnetique, tete a resistance magnetique comprenant ce dispositif et appareil d'enregistrement/reproduction magnetique - Google Patents
Dispositif a resistance magnetique, tete a resistance magnetique comprenant ce dispositif et appareil d'enregistrement/reproduction magnetique Download PDFInfo
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- WO2001099206A1 WO2001099206A1 PCT/JP2001/005334 JP0105334W WO0199206A1 WO 2001099206 A1 WO2001099206 A1 WO 2001099206A1 JP 0105334 W JP0105334 W JP 0105334W WO 0199206 A1 WO0199206 A1 WO 0199206A1
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- 230000005291 magnetic effect Effects 0.000 title claims abstract description 127
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B5/3903—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects using magnetic thin film layers or their effects, the films being part of integrated structures
- G11B5/3906—Details related to the use of magnetic thin film layers or to their effects
- G11B5/3909—Arrangements using a magnetic tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F10/00—Thin magnetic films, e.g. of one-domain structure
- H01F10/32—Spin-exchange-coupled multilayers, e.g. nanostructured superlattices
- H01F10/324—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer
- H01F10/3268—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn
- H01F10/3272—Exchange coupling of magnetic film pairs via a very thin non-magnetic spacer, e.g. by exchange with conduction electrons of the spacer the exchange coupling being asymmetric, e.g. by use of additional pinning, by using antiferromagnetic or ferromagnetic coupling interface, i.e. so-called spin-valve [SV] structure, e.g. NiFe/Cu/NiFe/FeMn by use of anti-parallel coupled [APC] ferromagnetic layers, e.g. artificial ferrimagnets [AFI], artificial [AAF] or synthetic [SAF] anti-ferromagnets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/33—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only
- G11B5/39—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects
- G11B2005/3996—Structure or manufacture of flux-sensitive heads, i.e. for reproduction only; Combination of such heads with means for recording or erasing only using magneto-resistive devices or effects large or giant magnetoresistive effects [GMR], e.g. as generated in spin-valve [SV] devices
Definitions
- Magnetoresistive element Magnetoresistive head and magnetic recording / reproducing device using the same
- the present invention relates to a magnetoresistive element, a magnetoresistive head using the same, and a magnetic recording / reproducing device, for example, a hard disk device.
- a spin-valve MR element In a spin-valve MR element, two ferromagnetic layers are arranged via a nonmagnetic layer, and the magnetization direction of one ferromagnetic layer (pinned layer) is exchanged by a magnetization rotation suppression layer (pinning layer). It is fixed by a bias magnetic field (the ferromagnetic layer and the magnetization rotation suppressing layer are called exchange coupling films). Then, since the magnetization direction of the other ferromagnetic layer (free layer) changes according to the external magnetic field, the relative angle between the magnetization directions of the fixed layer and the free layer changes. This change in relative angle is detected as a change in the electric fan.
- a spin valve type MR element using a Ni—Fe film as a magnetic layer, a Cu film as a nonmagnetic layer, and an Fe—Mn film as a magnetization rotation suppressing layer is known.
- the magnetoresistance ratio (MR ratio) is about 2% (Journal of Magnetism and Magnetic Materials 93, plOl, 1991).
- PtMn and NiMn-based materials are used in hard disk reproduction magnetic heads because those using FeMn as the magnetization rotation suppressing layer have a small MR ratio and also lack corrosion resistance.
- NiO or o from devices using -Fe 2 0 3 oxide such as the magnetization rotation suppressing layer, MR ratio of 15% or more have been obtained.
- TMR Tunneling Magnetoresistance
- the problem with TMR elements is that if the element area is extremely limited with the progress of high-density magnetic recording, the resistance of the element becomes too high. .
- the present invention proposes to use a so-called CPP-GMR (Current Perpendicular to the Plane) element to cope with a further increase in magnetic recording density.
- the CPP-GMR element allows current to flow in the direction perpendicular to the film surface, while the conventional GMR element allows current to flow in the film surface (CIP, Current in Plane).
- the MR element of the present invention includes a first magnetic layer (free layer), a nonmagnetic layer, and a second magnetic layer (fixed layer) laminated on the first magnetic layer via the nonmagnetic layer.
- the resistance of the element does not become too high even if the element area is limited. Therefore, a large output can be obtained even in a narrow magnetic gap.
- main component refers to a component that accounts for 80 atom% or more.
- the metal having a specific resistance in the above range preferably accounts for 95 atom% or more of the nonmagnetic layer.
- the present invention also provides an MR head having the above MR element and a magnetic shield. This magnetic shield is provided to shield an external magnetic field flowing into the MR element from other than the magnetic recording medium. Further, the present invention also provides a magnetic recording / reproducing apparatus having the above MR head and a magnetic recording medium for recording / reproducing information with the MR head.
- FIG. 1 is a cross-sectional view showing one embodiment of the magnetic resistance effect element of the present invention.
- FIG. 2 is a sectional view showing another embodiment of the magnetoresistive element of the present invention.
- FIG. 3 is a diagram showing an example of a change in exchange interaction between magnetic layers as the thickness of the nonmagnetic layer increases.
- FIG. 4 is a perspective view showing one embodiment of the magnetoresistive head of the present invention.
- FIG. 5 is a perspective view showing a conventional magnetoresistive head using an MR element.
- FIG. 6 is a plan view of one embodiment of the magnetic information recording / reproducing apparatus of the present invention.
- FIG. 7 is a cross-sectional view of one embodiment of the magnetic information recording / reproducing apparatus of the present invention.
- FIG. 8 is a cross-sectional view of the device manufactured in Example 1.
- FIG. 9 is a cross-sectional view of the device manufactured in Example 2.
- the MR element includes a lower electrode 5, a magnetization rotation suppressing layer 4, a fixed layer 3, a nonmagnetic layer 2, a free layer 1, and an upper electrode 6, which are sequentially stacked. Having a multilayer film.
- the magnetization of the fixed layer 3 is pinned by the exchange bias magnetic field by the magnetization rotation suppressing layer 4.
- the free layer 1, which is another ferromagnetic material, is magnetically separated from the fixed layer 3 by the nonmagnetic layer 2. For this reason, the magnetization of the free layer rotates more easily than the magnetization of the fixed layer due to an external magnetic field.
- the electrical resistance of the element in the direction perpendicular to the film surface changes with the relative change in the angle of magnetization between the fixed layer 3 and the free layer 1 that changes according to the external magnetic field. This change in electrical resistance can be read as a change in electrical signal when a current is passed between the electrodes 5 and 6.
- the CPP-GMR element is used by passing a current for sensing in the direction perpendicular to the film surface.
- the specific resistance of conventionally used metal materials such as Cu and Ag is less than 2 ⁇ -cm, which is too small as a material for the non-magnetic layer of a device that passes current vertically.
- the material used for the nonmagnetic layer of the element that allows current to flow perpendicular to the film surface preferably has a specific resistance of ⁇ -cm or more.
- the specific resistance of the material for the non-magnetic layer is somewhat low.
- the specific resistances of Co and Fe used as the material for the magnetic layer are about 5.6 and 10. ⁇ 'cm, respectively.
- the material for the non-magnetic layer has a specific resistance of about twice this, that is, Those having are particularly suitable.
- the specific resistance of the metal used for the nonmagnetic layer is described based on the bulk state.
- a metal thin film that is thin enough to be used for a magnetoresistive element usually has a specific resistance that is two to several times that of a metal pulp made of the same material, but this value depends on conditions such as the film thickness. Therefore, in order to clearly identify the appropriate metal material, the resistivity is described here based on the bulk state.
- the thickness of the non-magnetic layer 2 is preferably in a range where the exchange interaction between the free layer 1 and the fixed layer 3 via the non-magnetic layer is weak, and particularly preferably in a range where the exchange interaction is almost zero. Therefore, the thickness of the nonmagnetic layer is preferably at least 1.2 nm, particularly preferably at least 2 nm. On the other hand, in consideration of the electron spin diffusion length, the thickness of the nonmagnetic layer is preferably 20 nm or less, particularly 10 nm or less in order not to lower the MR ratio.
- the exchange interaction between the magnetic layers is attenuated while reciprocating between ferromagnetic (parallel magnetization) and antiferromagnetic (parallel magnetization) as the thickness of the nonmagnetic layer increases.
- the magnetic coupling force (H coupling) between the magnetic layers due to the exchange interaction changes with the ferromagnetic coupling as the thickness (T) of the nonmagnetic layer increases. It gradually attenuates while changing between ferromagnetic coupling.
- the magnetic coupling force (H coupling) between the free layer and the fixed layer is 20% or less of the absolute value of the magnetic coupling force when the antiferromagnetic property is the highest (IH coupling I ⁇ 0.2 XI—pi), and preferably the thickness of the nonmagnetic layer is determined so as to have an absolute value of 10% or less.
- the magnetic coupling force is indicated as positive for ferromagnetic and negative for antiferromagnetic.
- the indirect exchange interaction is more preferably 0 or antiferromagnetic within a range satisfying the above conditions.
- the area of the non-magnetic layer is suitably O.Ol m 2 or less.
- the area of the surface through which the current for sensing (sense current) passes is defined as the area of the nonmagnetic layer.
- the resistance becomes too high.
- the area of the non-magnetic layer is more preferably 0.008 .pi.1 2 or less, particularly good Mashiku is 0.005 m 2 or less.
- the area of the non-magnetic layer is suitably O.OOOl m 2 or more.
- the metal constituting the main component of the nonmagnetic layer may be a simple metal or an alloy.
- the nonmagnetic layer is Be, Bi, Cr, Hf, In, Ir, Mg, Mn, Mo, Nb Os, Pd, Pt, Re, Ru, Rh, Sb, Se, Ta, Th, Ti, Tl, V, It may contain at least one selected from W, Y and Zr. Further, alloys between the metals exemplified herein or between the exemplified metals and other metals may be used.
- a particularly preferred non-magnetic metal material is Cr.
- Cr has a high specific resistance of 12.8 H ⁇ -cm; the Fe / Cr multilayer shows a large magnetoresistance change. Therefore, when the nonmagnetic layer mainly contains Cr, the magnetic layer preferably contains Fe.
- the magnetic layer preferably contains Fe.
- at least one of the free layer and the pinned layer is composed of one or more magnetic layers, More preferably, the magnetic film in contact with the nonmagnetic layer contains Fe as a main component.
- the device shown in FIG. 1 uses a magnetic layer having a two-layer structure.
- a plurality of magnetic layers it is possible to realize a preferable combination with the material of the non-magnetic layer, while taking into consideration other characteristics, for example, the soft magnetism of the magnetic layer.
- the nonmagnetic layer 2 contains Cr as a main component
- the free layer 1 uses an Fe film as the interfacial magnetic layer 102, and the magnetic layer 101 as a film made of a material that is softer than Fe, for example, It is preferable to use a Ni-Fe film or a Ni-Fe-Co film.
- the pinned layer 3 also uses an Fe film as the interfacial magnetic layer 301, and uses Co, Co-Fe, Ni- as the magnetic layer 302 to reinforce the magnetization rotation suppressing effect of the magnetization rotation suppressing layer 4.
- a magnetic film such as a Fe, Ni'Fe-Co film may be used.
- nonmagnetic layers are Ir, Ru and Rh.
- the magnetic layer mainly contains at least one selected from Ir, Hu and Rh
- the magnetic layer preferably contains Fe, Co and Ni or an alloy thereof.
- a non-magnetic layer containing at least one selected from Ir, Ru and is used at least one selected from a free layer and a fixed layer is composed of one or more magnetic films, and More preferably, the magnetic film in contact with the layer contains at least one selected from Fe, Co and Ni as a main component.
- the fixed layer 3 As the fixed layer 3, a pair of ferromagnetic films antiferromagnetically coupled via a nonmagnetic layer, a so-called laminated ferri-type fixed layer may be used. This increases the effect of pinning the magnetization of the fixed layer. In addition, since the magnetization of the fixed layer is partially canceled and the magnetic flux leaking from the fixed layer to the free layer is reduced, the leakage magnetic field can be adjusted.
- the film thickness of each ferromagnetic layer is appropriately 1 to 3 nm.
- Ru, Ir, or the like is appropriate. The thickness of this nonmagnetic layer is preferably 0.3 to 1.2 nm.
- PtMn, NiMn, PdPtMn. CrMn, FeMn Etc. can be used.
- the materials of the electrodes 5 and 6 are not particularly limited, and Cu or the like conventionally used may be used.
- the substrate for forming the respective films glass, MgO, Si, Al 2 0 3 -TiC substrate like surface may be used as smooth.
- Al 2 0 3 -TiC substrate is suitable.
- a magnetic shield or the like is appropriately formed between the substrate and each of the above thin films according to the application.
- an underlayer may be interposed between the substrate and the magnetic rotation suppressing layer for the purpose of improving the characteristics of the magnetization rotation suppressing layer.
- the underlayer Ta, NiFe, NiFeCr alloy, a laminated film thereof, or the like can be used.
- the appropriate thickness of the underlayer is 1 to about 10 nm.
- the multilayer film shown in FIG. 1 may be stacked upside down (in order from the free layer 1 side) instead of being stacked from below in the figure.
- the method for forming each layer is not particularly limited, but a sputtering method is suitable.
- a sputtering method any method such as a DC sputtering method, an RF sputtering method, and an ion beam sputtering method may be used.
- the present invention is also applicable to a device employing a configuration in which a fixed layer is used on both sides of a free layer.
- the interface magnetic layer 102 (301) may be provided on the free layer 1 (fixed layer 3) in contact with the nonmagnetic layer 2.
- FIG. 4 shows an example of an MR head using the above-described magnetoresistive element of the present invention.
- the MR element 100 is sandwiched between an upper magnetic shield (common shield) 13 and a lower magnetic shield 16. These magnetic shields are provided so that an external magnetic field from outside the medium does not affect the element.
- Shi — Suitable magnetic materials are soft magnetic films such as Ni-Fe, Fe-Al-Si and Co-Nb'Zr alloys.
- the magnetic shields 13 and 16 also function as electrodes for passing current to the element.
- An insulating film 18 is arranged between the two electrodes except for the MR element.
- a conductive spacer 20 may be interposed between the MR element and the shield.
- the MR element 100 and the conductive spacer 20 constitute a reproducing gap 17.
- On the common shield 13, a non-magnetic layer 14 and an upper core 12 constituting a recording gap are further laminated in order. These members together with the coil 11 constitute a recording head.
- an insulating film 18 is interposed between the MR element 200 and the magnetic shields 13 and 16 as a shield gap material.
- the insulating film 18 needs to be electrically insulated from the shield member.
- the conductive spacer 20 is not essential. Therefore, if it is necessary to further reduce the reproduction gap 17, the spacer may be thinned or removed.
- the insulating film 18 is required to have a certain thickness or more in order to secure electrical insulation. For this reason, there is a limit to narrowing the reproduction gap 17.
- the MR head of the present invention is advantageous in narrowing the magnetic gap.
- the hard disk drive 110 using the MR head includes a slider 120 for holding the MR head and a head support mechanism for supporting the slider. 130, an actuator 1-14 that tracks the MR head via the head support mechanism, and a disk drive motor 112 that rotates the disk 116.
- the head support mechanism 130 has an arm 122 and a suspension 124.
- the disk drive module 1 1 2 rotates the disk 1 16 at a predetermined speed.
- Actuator 1114 moves the slider 120 holding the MR head in the radial direction of the disk 116 so that the MR head can access the specified data track on the disk 116.
- the actuators 114 are, for example, linear or rotary voice coil motors.
- the slider 120 holding the MR head is, for example, an air bearing slider.
- the slider 120 comes into contact with the surface of the disk 116 when the hard disk device 110 starts and stops.
- the slider 120 is maintained on the surface of the disk 116 by the air bearing formed between the rotating disk 116 and the slider 120. You.
- the MR head held by the slider 120 records and reproduces information on the disk 116.
- a magnetoresistive element having the configuration shown in FIG. 8 was produced.
- Substrate 7 is made of Si, Cu film as lower electrode 5 (also serving as underlayer), Pt-Mn film as magnetization rotation suppressing layer 4, Co-Fe film as fixed magnetic layer 302, interface magnetic layer
- An Fe film was formed as 301, 102, a Cr film as nonmagnetic layer 2, a Ni-Fe film as soft magnetic layer 101, and a Cu film as upper electrode 6.
- Sputtering method after evacuating the vacuum chamber in one to less than l X 10- 8 Torr, having conducted while flowing to the Ar gas is about 0.8RaTorr.
- the magnetic coupling due to the exchange interaction when Cr is used as the nonmagnetic layer is attenuated while oscillating between the ferromagnetic coupling and the antiferromagnetic coupling as illustrated in FIG. It is known.
- the thickness of the Cr film is 2 nm, the magnetic coupling is close to zero.
- the elements A and B were used to construct the MR head shown in Fig. 4, and the characteristics were evaluated.
- Al 2 O 3 as the substrate -..
- Example 2 In the same manner as in Example 1, an MR element having the structure shown in FIG. 9 was produced. However, although the fixed layer 3 is shown as a single layer, a stacked ferrimagnetic fixed layer of CoFeZRuZCoFe was used. Substrate 7 is a glass substrate, lower electrode 5 and upper electrode 6 are Cu films, magnetization rotation suppressing layer 4 is a Ni-Mn alloy film, nonmagnetic layer 2 is Ru film, and free layer 1 is Coo.gFe alloy. Was. No interface magnetic layer was formed. The film configuration of this element is shown below. And elements C:....
- a magnetoresistive head magnetic information recording / reproducing apparatus using this MR element is a device that can support high-density recording.
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- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Hall/Mr Elements (AREA)
- Magnetic Heads (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/312,006 US6982854B2 (en) | 2000-06-22 | 2001-06-21 | Magnetoresistance effect device and magnetoresistance effect head comprising the same, and magnetic recording/reproducing apparatus |
EP01941168A EP1311008A4 (en) | 2000-06-22 | 2001-06-21 | MAGNETIC RESISTANCE DEVICE, MAGNETIC RESISTANCE HEAD COMPRISING THIS DEVICE, AND MAGNETIC RECORDING / REPRODUCING APPARATUS |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-187973 | 2000-06-22 | ||
JP2000187973 | 2000-06-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001099206A1 true WO2001099206A1 (fr) | 2001-12-27 |
Family
ID=18687845
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/005334 WO2001099206A1 (fr) | 2000-06-22 | 2001-06-21 | Dispositif a resistance magnetique, tete a resistance magnetique comprenant ce dispositif et appareil d'enregistrement/reproduction magnetique |
Country Status (5)
Country | Link |
---|---|
US (1) | US6982854B2 (ja) |
EP (1) | EP1311008A4 (ja) |
KR (1) | KR20030011361A (ja) |
CN (1) | CN1437772A (ja) |
WO (1) | WO2001099206A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006511957A (ja) * | 2002-12-18 | 2006-04-06 | フリースケール セミコンダクター インコーポレイテッド | 磁気エレクトロニクス装置の反平行結合膜構造 |
JP2007516604A (ja) * | 2003-05-13 | 2007-06-21 | フリースケール セミコンダクター インコーポレイテッド | 複合磁気フリー層を有する磁気エレクトロニクス情報デバイス |
JP2009289799A (ja) | 2008-05-27 | 2009-12-10 | Yoshihiro Ishikawa | スイッチング素子 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7196882B2 (en) * | 2002-07-23 | 2007-03-27 | Micron Technology, Inc. | Magnetic tunnel junction device and its method of fabrication |
EP1648039A4 (en) * | 2003-07-18 | 2006-09-06 | Fujitsu Ltd | CCP MAGNETO-RESISTANT ELEMENT, METHOD FOR THE PRODUCTION THEREOF, MAGNETIC HEAD AND MAGNETIC STORAGE |
US7233461B2 (en) * | 2004-01-20 | 2007-06-19 | Hitachi Global Storage Technologies Netherlands, B.V. | Stabilization structure for CPP GMR/TV |
US7221545B2 (en) * | 2004-02-18 | 2007-05-22 | Hitachi Global Storage Technologies Netherlands B.V. | High HC reference layer structure for self-pinned GMR heads |
US7190560B2 (en) * | 2004-02-18 | 2007-03-13 | Hitachi Global Storage Technologies Netherlands B.V. | Self-pinned CPP sensor using Fe/Cr/Fe structure |
US7352541B2 (en) * | 2004-04-30 | 2008-04-01 | Hitachi Global Storage Technologies Netherlands B.V. | CPP GMR using Fe based synthetic free layer |
US20060228586A1 (en) * | 2005-04-06 | 2006-10-12 | Seagate Technology Llc | Ferromagnetically coupled magnetic recording media |
US8338005B2 (en) * | 2009-01-13 | 2012-12-25 | Seagate Technology Llc | Recording layer and multilayered soft underlayer |
US8743511B2 (en) * | 2011-08-31 | 2014-06-03 | HGST Netherlands B.V. | CPP-GMR sensor with corrosion resistent spacer layer and higher signal/noise ratio |
CN105823913A (zh) * | 2015-01-09 | 2016-08-03 | 中国科学院上海微系统与信息技术研究所 | 一种用于杜瓦的便携电磁屏蔽桶 |
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US5668688A (en) * | 1996-05-24 | 1997-09-16 | Quantum Peripherals Colorado, Inc. | Current perpendicular-to-the-plane spin valve type magnetoresistive transducer |
JP2000124522A (ja) * | 1998-10-15 | 2000-04-28 | Tdk Corp | 磁気抵抗効果素子および磁界センサ |
JP2000228004A (ja) * | 1998-11-30 | 2000-08-15 | Nec Corp | 磁気抵抗効果素子、再生ヘッド、および記録再生システム |
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JP3022023B2 (ja) * | 1992-04-13 | 2000-03-15 | 株式会社日立製作所 | 磁気記録再生装置 |
US5446613A (en) | 1994-02-28 | 1995-08-29 | Read-Rite Corporation | Magnetic head assembly with MR sensor |
US5841611A (en) * | 1994-05-02 | 1998-11-24 | Matsushita Electric Industrial Co., Ltd. | Magnetoresistance effect device and magnetoresistance effect type head, memory device, and amplifying device using the same |
US5587943A (en) * | 1995-02-13 | 1996-12-24 | Integrated Microtransducer Electronics Corporation | Nonvolatile magnetoresistive memory with fully closed flux operation |
JP3362818B2 (ja) * | 1995-08-11 | 2003-01-07 | 富士通株式会社 | スピンバルブ磁気抵抗効果型トランスジューサ及び磁気記録装置 |
US5657191A (en) | 1995-09-18 | 1997-08-12 | Read-Rite Corporation | Stabilization of giant magnetoresistive transducers |
US6219205B1 (en) * | 1995-10-10 | 2001-04-17 | Read-Rite Corporation | High density giant magnetoresistive transducer with recessed sensor |
JPH09288807A (ja) | 1996-02-22 | 1997-11-04 | Matsushita Electric Ind Co Ltd | 薄膜磁気ヘッド |
GB2312088B (en) * | 1996-03-20 | 2000-09-20 | Univ City | Magnetoresistive device |
US5793279A (en) * | 1996-08-26 | 1998-08-11 | Read-Rite Corporation | Methods and compositions for optimizing interfacial properties of magnetoresistive sensors |
JP2000517484A (ja) * | 1997-07-01 | 2000-12-26 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 磁界センサ |
JP3987226B2 (ja) | 1999-02-05 | 2007-10-03 | 富士通株式会社 | 磁気抵抗効果型デバイス |
US6383574B1 (en) * | 1999-07-23 | 2002-05-07 | Headway Technologies, Inc. | Ion implantation method for fabricating magnetoresistive (MR) sensor element |
JP2001332780A (ja) * | 2000-05-19 | 2001-11-30 | Fujitsu Ltd | 磁気抵抗効果膜、磁気抵抗効果型ヘッド、および情報再生装置 |
-
2001
- 2001-06-21 WO PCT/JP2001/005334 patent/WO2001099206A1/ja not_active Application Discontinuation
- 2001-06-21 US US10/312,006 patent/US6982854B2/en not_active Expired - Fee Related
- 2001-06-21 KR KR1020027017403A patent/KR20030011361A/ko not_active Application Discontinuation
- 2001-06-21 CN CN01811520A patent/CN1437772A/zh active Pending
- 2001-06-21 EP EP01941168A patent/EP1311008A4/en not_active Withdrawn
Patent Citations (3)
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US5668688A (en) * | 1996-05-24 | 1997-09-16 | Quantum Peripherals Colorado, Inc. | Current perpendicular-to-the-plane spin valve type magnetoresistive transducer |
JP2000124522A (ja) * | 1998-10-15 | 2000-04-28 | Tdk Corp | 磁気抵抗効果素子および磁界センサ |
JP2000228004A (ja) * | 1998-11-30 | 2000-08-15 | Nec Corp | 磁気抵抗効果素子、再生ヘッド、および記録再生システム |
Non-Patent Citations (2)
Title |
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J. BASS, W.P. PRATT JR.: "Current-perpendicular (CPP) magnetoresistance in magnetic metallic multilayers", JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, vol. 200, 1999, pages 274 - 289, XP002945040 * |
See also references of EP1311008A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006511957A (ja) * | 2002-12-18 | 2006-04-06 | フリースケール セミコンダクター インコーポレイテッド | 磁気エレクトロニクス装置の反平行結合膜構造 |
JP2007516604A (ja) * | 2003-05-13 | 2007-06-21 | フリースケール セミコンダクター インコーポレイテッド | 複合磁気フリー層を有する磁気エレクトロニクス情報デバイス |
JP2009289799A (ja) | 2008-05-27 | 2009-12-10 | Yoshihiro Ishikawa | スイッチング素子 |
Also Published As
Publication number | Publication date |
---|---|
KR20030011361A (ko) | 2003-02-07 |
US20030161077A1 (en) | 2003-08-28 |
EP1311008A4 (en) | 2006-01-18 |
CN1437772A (zh) | 2003-08-20 |
US6982854B2 (en) | 2006-01-03 |
EP1311008A1 (en) | 2003-05-14 |
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