WO2001086276A1 - Verfahren zur herstellung eines dreidimensionalen sensorelementes - Google Patents
Verfahren zur herstellung eines dreidimensionalen sensorelementes Download PDFInfo
- Publication number
- WO2001086276A1 WO2001086276A1 PCT/EP2001/005032 EP0105032W WO0186276A1 WO 2001086276 A1 WO2001086276 A1 WO 2001086276A1 EP 0105032 W EP0105032 W EP 0105032W WO 0186276 A1 WO0186276 A1 WO 0186276A1
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- WIPO (PCT)
- Prior art keywords
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- dimensional
- substances
- primer
- paste
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
- G01N27/28—Electrolytic cell components
- G01N27/30—Electrodes, e.g. test electrodes; Half-cells
- G01N27/333—Ion-selective electrodes or membranes
- G01N27/3335—Ion-selective electrodes or membranes the membrane containing at least one organic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
Definitions
- the invention relates to a method for producing a three-dimensional sensor element according to the preamble of the main claim.
- Electrochemical sensors which usually have a planar structure and comprise a carrier, for example made of plastic or glass, on which electrodes are deposited, for example electrochemically. Depending on the intended use, additional layers are applied on which biological components are immobilized or which are designed as sensitive membranes.
- the electrochemical sensors according to the prior art have the disadvantage that three-dimensional sensor structures cannot be implemented in many cases because A finely structured metallization on non-planar surfaces according to the prior art is only very complex or is not possible at all. Furthermore, the planar sensors often lack support for sensitive membranes and often biological components can be used
- the invention is therefore based on the object of providing a method for producing a three-dimensional sensor element with which three-dimensional sensor structures for mass production can be produced simply and inexpensively.
- a modelable primer paste for structuring the electrodes is applied to the carrier, the carrier provided with primer paste is then three-dimensionally deformed in accordance with the desired shape and then the primer paste defining the electrode surfaces is selectively metallized and substance-recognizing substances and / or converting substances If at least one molded part cavity is introduced, a simple, inexpensive and mass-production-compatible method for producing three-dimensional sensor arrangements is supplied.
- the shaping, stabilization and contacting of the sensors is possible with only one workpiece, it being possible for a plurality of sensors or additional parts, such as fluidic parts, to be combined, for example in the injection molding process, to form sensor systems and to be joined together in one piece. Due to the cavities and cavities of the three-dimensional biological components and sensitive membranes can be mechanically fixed very well.
- a variety of substance-recognizing and / or converting substances can be used, e.g. Microorganisms, metallic catalysts, antibodies, enzymes, DNA fragments or the like.
- FIG. 4 shows a bottom view and a sectional view of a cup with a plurality of sensor arrangements.
- FIG. 5 is a schematic sectional view of a sensor integrated into a flow measuring cell, and Fig. 6 process flow of the manufacture of a urea sensor.
- FIG. 1 shows various manufacturing steps of an electrochemical sensor arrangement according to a first exemplary embodiment of the invention.
- a means for structuring the electrodes used for the sensor arrangement and electrical feeds to the electrodes which are designed overall as conductor tracks and electrical contact areas, are applied to a carrier 1 for the production of an electrochemical sensor arrangement.
- the electrodes can simultaneously represent sensor elements.
- the carrier 1 has moldable properties and consists, for example, of plastic, preferably a thermoformed film made of polycarbonates, acrylnit ⁇ t-butadiene-styrene copolymers and polyethylene (PC, ABS, PE) is used.
- the means for structuring the electrodes is a primer paste, which specifies the desired electrode shape with feeds.
- the paste contains reducing agents for the chemical reductive deposition of e.g. Copper or nickel.
- the structuring of the later three-dimensional sensor body already begins on the flat substrate or carrier 1.
- the coating method is chosen so that after the later deformation there is a sufficient short-circuit-safe distance between the individual sensor surfaces or electrodes and feeds is available.
- care must be taken to ensure that the surface applied is deformed.
- the later three-dimensional structure must be calculated before application.
- the carrier is coated exactly where the three-dimensional sensor body is later metallized. Suitable coating processes are, for example, spraying or printing, whereby the screen printing process enables a two-dimensional coating with the primer paste that is accurate to the millimeter. A largely automated coating process can be carried out in accordance with modern screen printing technology.
- the arrangement is dried or conditioned, the paste hardening.
- the carrier 1 is deformed three-dimensionally and forms a three-dimensional sensor body or a three-dimensional molded part.
- a hot deformation is carried out, in which the support m heats the flexible state, is deformed under low force and then is cooled below the freezing area with continued deformation force.
- Various heat sources such as infrared flat heaters, heat barriers, hot air and hot water can be used.
- Several processes are conceivable for the deformation process, such as stamping, embossing,
- the shaping of the sensor body or molded part is carried out by thermoforming.
- the primer paste can also be deformed so that no cracks or the like can occur. In principle, care must be taken in the process control that the primer layer remains approximately the same thickness and homogeneity.
- Electrode surfaces and conductor tracks are carried out.
- All electrochemical sensors work with electrically conductive surfaces, whereby the common electrochemical determination methods often use a differential method, i.e. the change in an electrical effect between a working and a reference electrode is determined. This in turn means that the two electrodes must be spatially separated. The spatial separation in turn leads to the isolation of the electrodes.
- the implementation of electrodes that are separate from one another is technically very complex.
- the coating of the electrode space with electrically conductive material is only carried out after the formation of a three-dimensional structure.
- the structuring metallization of hollow bodies e.g. worked with mask technologies, the use of masks requiring a high dimensional accuracy of the three-dimensional basic body. The mechanical reworking of the basic bodies is often also necessary.
- the metallization can be started after the primer paste has been applied and the base body has been deformed.
- Chemical metal deposition is used to make the plastic surface provided with the primer conductive.
- the workpiece can be provided with a relatively thin, current-conducting layer. This in turn can be strengthened electrolytically by depositing further metal.
- electrochemical metal deposition can take place directly on the paste.
- thermoformable primer paste which contains catalytically active substances, was applied to activate the surface.
- the reductive metallization can be described by the following equation:
- Me the dissolved metal ion with the charge z +
- This method basically allows all non-conductors to be metallized after application of the activation layer, ie the primer paste and the thermoforming.
- the layer thickness of the metal is the same at every point that has been wetted by the electrolyte.
- Nickel and copper baths are of greatest importance in chemical reductive metallization.
- the composition of a chemical copper plating bath usually consists of ionic copper, a reducing agent, basic components and complexing agents. Formaldehyde, for example, serves as a reducing agent.
- the main chemical reaction in metal deposition is as follows: Cu 2+ + 4 ⁇ H " + 2HCHO ⁇ Cu ° + 2HCOO " + H 2 + 2H 2 0
- Phosphorus is created as a by-product and is incorporated into the Nikkei layer.
- the optimal coating speed is between 2 and 10 ⁇ m / h.
- further metals can now be deposited electrolytically thereon. The surface to be coated is used for the electrochemical
- the cathodic reaction can be described as follows:
- the coatings are cleaned.
- copper, nickel, chrome, tin, brass, black chrome, etc. are used as metals for electrolytic metal deposition.
- metals such as silver and gold are predominantly used and used platinum.
- An alternative method for structuring electrodes is the so-called partial electroplating, as used e.g. is also used for the production of printed circuits.
- the metallization or the electrode surfaces can be recognized by the hatching for the lines.
- Fig. Ld shows two electrodes 2, 3, which belong to two different types of electrodes.
- the electrodes 2, 3 are e.g. a Platm working electrode and an Ag / AgCl reference electrode.
- an opening or a hole 4 is provided in the center, which enables contact with the measurement solution.
- the sensor arrangement can be provided with a fluid part (not shown), which is, for example, a plastic part provided with one or more channels, which can be injection molded directly onto the deformed carrier 1 or onto the molded part. In this way, the sensor arrangement shown can be integrated into other systems.
- the senor can be integrated into the flow measuring cells, flow projection analysis systems, sensor strips or other combinations.
- injection molding there are other methods for linking the three-dimensional sensors with e.g. a fluidics. These processes can be summarized as "gluing and joining techniques".
- Sensitive substances can be introduced into the molding cavity or biological components can be immobilized, for example enzyme membranes and / or ion-selective membranes are introduced, thereby realizing biosensors.
- the components that determine the nature of the sensor must be introduced into the three-dimensional sensor structure after the thermoforming.
- a modelable, dimensionally stable film was used as the carrier.
- another material can also be used for the carrier, for example a conductive or non-conductive metal.
- the carrier can have various physical properties that are important for the functionality of the sensor.
- the carrier can thus act as an electrical insulator, be electrically conductive, be permeable to certain substances and have certain mechanical, optical or acoustic properties.
- a material that is permeable to gas is, for example, Teflon.
- Carriers designed as dialysis membranes are permeable to substances in solution.
- FIG. 2 shows a method for producing an amperometric enzyme sensor in a three-electrode arrangement.
- 2A shows a planar thermoformable plastic substrate 10 which is coated in FIG. 2B) with a primer paste 11 in accordance with the desired structure of the three electrodes.
- FIG. 2C the entire arrangement is deformed, for example by stamping, in which the heated polymer-coated plastic 10, 11 is pressed between a stamp and a die. It cools under tension in the unheated tool.
- step 2D the molded part 12 is machined, in the exemplary embodiment shown an opening 13 is machined by laser drilling.
- step 2E) the molded part 12 is hermter-sp ⁇ tzt with plastic mass 15 in such a way that a channel 14 connected to the opening 13 m is formed.
- the molded part 12 is metallized with the back-injected plastic compound 15 at the locations at which the primer 11 is located, then it is galvanized with the desired metal and a reference electrode is produced by chlorinating, for example an Ag / AgCl reagent from a silver surface. reference electrode formed.
- step 2G the cavity of the molded part 12 is filled with an injection molded plastic mass 15 with an enzyme gel 16 and the enzyme layer 16 is then covered by a sealing layer 17, for example from a UV or RTV hardening silicone or acrylate adhesive
- the component manufactured in accordance with FIG. 2 represents, for example, a component of a flow measuring cell.
- a sensor with a flow measuring cell is shown by way of example in FIG. 5.
- thermoformable plastic substrate 20 (A)) is coated with a primer paste 21 (B)) and corresponding to C) into one
- Molded part 22 deformed.
- the primer coating 21 extends over substantially the whole art ⁇ fabric substrate 20.
- Fig. 3D is machined the mold part 22 by an opening 23 is formed by both the primer layer 21 as preferably incorporated also through the substrate 20 by laser drilling.
- FIG. 3E the molded part 22 is back-injected with a plastic compound 25 and, in accordance with F), a metallization is carried out at the locations at which the primer is located, and then the metallization is galvanized with the desired metal.
- the cavity is filled with an ion-selective membrane 26.
- filling is carried out with Ag / AgCl, for example, to produce a reference electrode.
- FIG. 4 shows the use of a three-dimensional sensor arrangement for a cup, both the underside and a section and an enlarged representation of the sensor being provided.
- Four sensor arrangements 31 are formed in the underside of a cup 30, each of which is connected to the inside of the cup via an opening 32.
- Such a cup 30 can be used for a single measurement.
- the cup is manufactured using the thermoforming process and is e.g. provided with ion-selective electrodes and reference electrodes.
- the use of such a cup is e.g. conceivable for medical examinations, for example, substances that require urine can be determined very quickly with a sensor-equipped urine beaker.
- sensors for determining the pH value, the electrolytes and the metabolites are integrated in the beaker.
- Another application is, for example, a yogurt cup, in which an integrated sensor arrangement, e.g. a pH sensor can provide information about the maturity or deterioration of the product.
- an integrated sensor arrangement e.g. a pH sensor can provide information about the maturity or deterioration of the product.
- the primer paste was used to produce a selective metal deposition, but it is also conceivable that it is used for the chemical or electrochemical absorption or absorption of polymers.
- the primer paste was used to produce a selective metal deposition, but it is also conceivable that it is used for the chemical or electrochemical absorption or absorption of polymers.
- the structures of the sensor are applied to a polycarbonate film 41 using the screen printing method.
- the primer paste specifies the desired sensor shape with derivation (Fig. 6a).
- the film with applied paste is thermoformed with vacuum.
- a three-dimensional sensor body is obtained.
- the sensor structures are chemically metallized with copper 42 (FIG. 6b) and only at the locations where the primer is located.
- An opening 43 is drilled in the cavity 44 formed.
- the encapsulated film with the metallized sensor structures is completely sealed under pressure and heat for encapsulation with a polyester hot-melt film with a laminating device.
- an ammonium-sensitive PVC membrane 46 (FIG. 6c) and then a gel 47, which contains urease, are introduced through the bore (FIG. 6d).
- ammonium-sensitive electrodes are used as transducers, which are coupled with a biologically active component.
- the measuring principle of the one-way sensor is based on the enzymatic cleavage of the urea by immobilized urease.
- the enzyme catalyzes the hydrolysis of urea to hydrogen carbonate ions and ammonium ions.
- the ammonium ions are determined with the help of the biosensor produced.
- composition of the PVC membrane cocktail for the production of ammonium-sensitive has sobacic acid b ⁇ s-2-ethylhexyl ester, polyvinyl chloride (PVC) and nonactin.
- the components are weighed in a preparation glass and dissolved by swiveling organic solvents. Tetrahydrofuran and cyclohexanone in a ratio of 3: 1 are used as solvents. The cocktail is left to stand at room temperature overnight until the components are completely dissolved.
- the homogeneous viscous membrane cocktail obtained in this way is manually dispensed into the cavity of the sensor blank using a dispenser.
- the cavity is completely filled with cocktail.
- the membrane has hardened after 24 hours.
- the biological component is brought into the cavity in the form of a hydrogel solution.
- the enzyme urease is previously dissolved in a gel material that has not yet polymerized.
- the gel is then dispensed into the cavity and brought to polymerization.
- the enzyme is immobilized in the gel.
- the sensors produced are calibrated using a stock method and then used as Emweg urea sensors.
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electrochemistry (AREA)
- Biochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
- Apparatus Associated With Microorganisms And Enzymes (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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AU2001263889A AU2001263889A1 (en) | 2000-05-05 | 2001-05-04 | Method for the production of a three-dimensional sensor element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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DE10023015.6 | 2000-05-05 | ||
DE2000123015 DE10023015A1 (de) | 2000-05-05 | 2000-05-05 | Verdahren zur Herstellung eines dreidimensionalen Sensorelementes |
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WO2001086276A1 true WO2001086276A1 (de) | 2001-11-15 |
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PCT/EP2001/005032 WO2001086276A1 (de) | 2000-05-05 | 2001-05-04 | Verfahren zur herstellung eines dreidimensionalen sensorelementes |
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AU (1) | AU2001263889A1 (de) |
DE (1) | DE10023015A1 (de) |
WO (1) | WO2001086276A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005071394A1 (fr) * | 2004-01-21 | 2005-08-04 | Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement | Systeme d'electrodes pour capteur electrochimique |
US7262489B2 (en) | 2003-11-12 | 2007-08-28 | Polymatech Co., Ltd. | Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
WO2010108759A1 (de) * | 2009-03-25 | 2010-09-30 | Siemens Aktiengesellschaft | Helicobacter pylori-sensor |
US20180284062A1 (en) * | 2017-04-03 | 2018-10-04 | Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement | Vessel for performing electrochemical measurements and method for manufacturing such vessel |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015012018A1 (de) * | 2015-09-21 | 2017-04-06 | Erwin Quarder Systemtechnik Gmbh | Elektronische Baugruppe sowie Verfahren zur Herstellung derselben |
DE102018001208B3 (de) | 2018-02-14 | 2019-07-11 | INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH | Verfahren zur Herstellung einer funktionsintegrierbaren elektrisch leitenden Kunststoffsubstrat-Struktur |
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JP2938754B2 (ja) * | 1994-04-20 | 1999-08-25 | 株式会社ユニシアジェックス | セラミックスヒータの製造方法 |
DE19712309A1 (de) * | 1996-11-16 | 1998-05-20 | Nmi Univ Tuebingen | Mikroelementenanordnung, Verfahren zum Kontaktieren von in einer flüssigen Umgebung befindlichen Zellen und Verfahren zum Herstellen einer Mikroelementenanordnung |
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- 2000-05-05 DE DE2000123015 patent/DE10023015A1/de not_active Ceased
-
2001
- 2001-05-04 WO PCT/EP2001/005032 patent/WO2001086276A1/de active Application Filing
- 2001-05-04 AU AU2001263889A patent/AU2001263889A1/en not_active Abandoned
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US5066372A (en) * | 1986-05-02 | 1991-11-19 | Ciba Corning Diagnostics Corp. | Unitary multiple electrode sensor |
DD301930A9 (de) * | 1989-04-04 | 1994-07-21 | Gerald Urban | Mikro-Mehrelektrodenanordnung |
WO1992021020A1 (de) * | 1991-05-10 | 1992-11-26 | Meinhard Knoll | Verfahren zur herstellung von miniaturisierten chemo- und biosensorelementen mit ionenselektiver membran sowie von trägern für diese elemente |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US7262489B2 (en) | 2003-11-12 | 2007-08-28 | Polymatech Co., Ltd. | Three-dimensionally formed circuit sheet, component and method for manufacturing the same |
WO2005071394A1 (fr) * | 2004-01-21 | 2005-08-04 | Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement | Systeme d'electrodes pour capteur electrochimique |
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WO2010108759A1 (de) * | 2009-03-25 | 2010-09-30 | Siemens Aktiengesellschaft | Helicobacter pylori-sensor |
US20180284062A1 (en) * | 2017-04-03 | 2018-10-04 | Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement | Vessel for performing electrochemical measurements and method for manufacturing such vessel |
EP3384987A3 (de) * | 2017-04-03 | 2018-10-24 | CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement | Gefäss zur durchführung elektrochemischer messungen und verfahren zur herstellung solch eines gefässes |
Also Published As
Publication number | Publication date |
---|---|
DE10023015A1 (de) | 2002-01-24 |
AU2001263889A1 (en) | 2001-11-20 |
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