AU2001263889A1 - Method for the production of a three-dimensional sensor element - Google Patents

Method for the production of a three-dimensional sensor element

Info

Publication number
AU2001263889A1
AU2001263889A1 AU2001263889A AU6388901A AU2001263889A1 AU 2001263889 A1 AU2001263889 A1 AU 2001263889A1 AU 2001263889 A AU2001263889 A AU 2001263889A AU 6388901 A AU6388901 A AU 6388901A AU 2001263889 A1 AU2001263889 A1 AU 2001263889A1
Authority
AU
Australia
Prior art keywords
production
sensor element
dimensional sensor
dimensional
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001263889A
Inventor
Michael Borchardt
Frank Wendzinski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institut fuer Chemo und Biosensorik Muenster eV ICB
Original Assignee
Institut fuer Chemo und Biosensorik Muenster eV ICB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institut fuer Chemo und Biosensorik Muenster eV ICB filed Critical Institut fuer Chemo und Biosensorik Muenster eV ICB
Publication of AU2001263889A1 publication Critical patent/AU2001263889A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/333—Ion-selective electrodes or membranes
    • G01N27/3335—Ion-selective electrodes or membranes the membrane containing at least one organic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0545—Pattern for applying drops or paste; Applying a pattern made of drops or paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Biochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Molecular Biology (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
AU2001263889A 2000-05-05 2001-05-04 Method for the production of a three-dimensional sensor element Abandoned AU2001263889A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10023015 2000-05-05
DE2000123015 DE10023015A1 (en) 2000-05-05 2000-05-05 Process to produce a three-dimensional sensor element
PCT/EP2001/005032 WO2001086276A1 (en) 2000-05-05 2001-05-04 Method for the production of a three-dimensional sensor element

Publications (1)

Publication Number Publication Date
AU2001263889A1 true AU2001263889A1 (en) 2001-11-20

Family

ID=7641608

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001263889A Abandoned AU2001263889A1 (en) 2000-05-05 2001-05-04 Method for the production of a three-dimensional sensor element

Country Status (3)

Country Link
AU (1) AU2001263889A1 (en)
DE (1) DE10023015A1 (en)
WO (1) WO2001086276A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7262489B2 (en) * 2003-11-12 2007-08-28 Polymatech Co., Ltd. Three-dimensionally formed circuit sheet, component and method for manufacturing the same
EP1557665A1 (en) * 2004-01-21 2005-07-27 CSEM Centre Suisse d'Electronique et de Microtechnique SA Electrode system for an electrochemical sensor
DE102009014902A1 (en) * 2009-03-25 2010-10-07 Siemens Aktiengesellschaft Helicobacter pylori sensor
DE102015012018A1 (en) * 2015-09-21 2017-04-06 Erwin Quarder Systemtechnik Gmbh Electronic assembly and method of making the same
EP3384987A3 (en) * 2017-04-03 2018-10-24 CSEM Centre Suisse d'Electronique et de Microtechnique SA - Recherche et Développement Vessel for performing electrochemical measurements and method for manufacturing such vessel
DE102018001208B3 (en) 2018-02-14 2019-07-11 INPRO Innovationsgesellschaft für fortgeschrittene Produktionssysteme in der Fahrzeugindustrie mbH Process for the preparation of a functionally integrated electrically conductive plastic substrate structure

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5066372A (en) * 1986-05-02 1991-11-19 Ciba Corning Diagnostics Corp. Unitary multiple electrode sensor
AT403528B (en) * 1989-04-04 1998-03-25 Urban Gerald MICRO-MULTI-ELECTRODE STRUCTURE FOR ELECTROCHEMICAL APPLICATIONS AND METHOD FOR THEIR PRODUCTION
DE4115414C2 (en) * 1991-05-10 1995-07-06 Meinhard Prof Dr Knoll Process for the production of miniaturized chemo- and biosensor elements with an ion-selective membrane as well as carriers for these elements
DE69329542T2 (en) * 1992-06-05 2001-02-08 Mitsui Chemicals Inc THREE-DIMENSIONAL CIRCUIT, ELECTRONIC COMPONENT ARRANGEMENT USING THIS CIRCUIT AND MANUFACTURING METHOD FOR THIS CIRCUIT
DE4408352C2 (en) * 1994-03-12 1996-02-08 Meinhard Prof Dr Knoll Miniaturized substance-recognizing flow sensor and method for its production
JP2938754B2 (en) * 1994-04-20 1999-08-25 株式会社ユニシアジェックス Manufacturing method of ceramic heater
TW293232B (en) * 1995-02-23 1996-12-11 Hitachi Ltd
US5659153A (en) * 1995-03-03 1997-08-19 International Business Machines Corporation Thermoformed three dimensional wiring module
DE19712309A1 (en) * 1996-11-16 1998-05-20 Nmi Univ Tuebingen Microelement arrangement, method for contacting cells in a liquid environment and method for producing a microelement arrangement

Also Published As

Publication number Publication date
WO2001086276A1 (en) 2001-11-15
DE10023015A1 (en) 2002-01-24

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