TW293232B - - Google Patents

Description

Printed by the Consumer Labor Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7 V. Description of the invention (1) The present invention relates to a printed circuit board having a circuit on the surface of a three-dimensional resin molded body and a method of manufacturing the same. A method for manufacturing a printed circuit board with a circuit on the surface of a three-dimensional resin molded body, for example, Japanese Patent Application Laid-Open No. 6 3-5 0 4 8 2 discloses the use of an amorphous thermoplastic resin composition to form the first insulating shape. A method of forming a second insulating shape on the surface, making an integrated article exposing the first shape on the surface, and then only promoting adhesion to the surface area of the integrated article, and a method of analyzing the surface portion composed of the first shape of the integrated article to analyze the metal, Japanese Unexamined Patent Publication No. 6 4_4 6 9 9 7 discloses the formation of a plastic primary molded product, and after roughening it, a predetermined portion of the primary molded product is formed with a plastic material to form a secondary molded product. Part of the plating process, the method of forming a metal film, etc. However, when the printed circuit board is manufactured by the above method, the wiring pattern is formed on the molded resin by direct plating process. Therefore, the intersection of the two flat consecutive conductor circuits formed by the crossing of the printed circuit board formed by the mold span The curvature of the conductor circuit portion of the two planes becomes smaller. As a result, the printed circuit board is heat-treated when parts are mounted, and the conductor circuit portion of the two planes crossing each other is cracked. In this paper, the plastic materials used in such three-dimensional printed circuit boards require heat resistance or mechanical strength. Plastic materials that satisfy this characteristic are generally resistant to chemicals, and it is often not easy to chemically roughen the surface of the product with prawns. Therefore, N, N >-dimethylformamide and other organic solvents or a mixed solution of chromic acid and sulfuric acid are used for roughening treatment, but it takes a long time to process, and the roughening treatment must be changed when changing the type of plastic The type or temperature of the liquid, the degree of treatment, etc. The paper size adopts the Chinese National Standard (CNS) A4 specification (210X 297 mm) -------- C-¾ clothing ------, Order ------ ^. V (please read the precautions on the back before filling in this page) -4-A7 B7 5. Description of invention (2). Therefore, it is impossible to treat various molding materials with the same processing liquid. In addition, the primary molded body uses a material that can be roughened or plated, and then the parts other than the conductor circuit are subjected to secondary molding using materials that are roughened and difficult to plate, and the whole is immersed in the roughening liquid so that only the plated part Roughening, the conventional method of plating the exposed primary molded body to produce a three-dimensional printed circuit board must use at least two kinds of resins that cannot be plated and special resins containing a catalyst that can be plated, or are easily roughened Resins and resins that are not likely to be roughened, and it is necessary to use the material of the primary molded body that improves the adhesion by roughening. The conventional method is to swell the hard-roughening plastic with an organic solvent and then roughen it, but it shows sufficient The roughening conditions of the adhesive force may cause problems such as roughness of the surface of the resin after roughening and poor surface flatness after plating. An object of the present invention is to provide a printed circuit board that prevents & cracks in a conductor circuit formed by the intersection of the aforementioned flat or curved surfaces on a printed circuit board and a method of manufacturing the same. Printed by the Consumer Labor Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page). The printed circuit board of the present invention is at least one conductor circuit between the adhesive layer and the two or more planes that cross each other A printed circuit board formed on the surface of a continuous plane or a plastic molded body having a curved surface, and a continuous conductor circuit formed between the intersecting planes, the curvature of the surface of the adhesive layer at the intersection is higher than that of the surface of the substrate at the intersection In a printed circuit board having a large curvature, the curvature of the surface of the adhesive layer at the intersection is at least 20 μm. The printed circuit board of the present invention is that at least one conductor circuit is interposed between the adhesive layer on a plane containing two or more planes that cross each other or has a curved paper scale. The China National Standards (CNS) A4 specification (210X297 mm) is applicable ) „A7 B7 29S2S2 V. Description of the invention (3) (Please read the precautions on the back before filling this page) The printed circuit board formed on the surface of the plastic molded body on the surface, and the continuous conductor circuit is formed between the intersecting planes, The elastic modulus of the adhesive layer is lower than that of the substrate, the surface roughness of the adhesive layer is 10 to 5 S, and the surface roughness of the conductor circuit is 2 0 // m R max or less. A printed circuit board is a printed circuit board on which at least one conductor circuit is interposed between an adhesive layer on a plane containing two or more planes crossing each other or a surface of a plastic molded body having a curved surface, and the planes crossing each other form a connection The conductor circuit of the present invention forms a second plastic molded body except for the portion of the surface of the adhesive layer that becomes the conductor circuit. The method of manufacturing the printed circuit board of the present invention is Including, the step of forming a plastic resin molded body having a desired three-dimensional shape, the step of forming an adhesive layer on the surface of the plastic resin molded body, the step of roughening the surface of the adhesive layer, and attaching the plating catalyst to the roughening After the aforementioned steps of the adhesive layer surface

Step V, the step of forming a resist plating other than the conductor circuit portion on the surface of the adhesive layer, the step of forming a conductor circuit by electroless plating, and the step of removing the resist. The manufacturing method of the printed circuit board of the present invention printed by the Central Kestrel Bureau Tool and Consumer Cooperative of the Ministry of Economic Affairs includes the steps of forming a plastic resin molded body having a desired three-dimensional shape, and forming an adhesive layer on the surface of the plastic resin molded body. The step of roughening the surface of the adhesion layer, the step of attaching a plating catalyst to the surface of the adhesion layer after roughening, and the step of forming a plating resist other than the conductor circuit portion of the surface of the adhesion layer, to The step of forming electroless plating on the surface of the adhesion layer to form a gold-thorium layer, the step of forming an etching resist on the surface of the gold-thorium layer that becomes a conductor circuit, the step of forming a conductor circuit by etching the metal-thorium and removing the above The paper scale is applicable to the Chinese National Standard (CNS> A4 size (210X297mm) -6-Printed by the Central Bureau of Economic Development of the Ministry of Economic Affairs, Consumer Labor Cooperatives A7 B7 V. Description of the invention (4) Etching steps "Printed by the invention The method of manufacturing a circuit board includes the steps of forming a plastic resin molded body having a desired three-dimensional shape on the surface of the plastic resin molded body The step of forming an adhesive layer on the surface, the step of roughening the surface of the adhesive layer, the step of attaching a plating catalyst to the surface of the adhesive layer after roughening, forming a plating other than the conductor circuit portion on the surface of the adhesive layer The step of resisting, the step of forming a metal layer on the surface of the adhesion layer by electroless, the step of forming a plating resist other than the conductor circuit part on the surface of the metal layer, the conductor circuit part is formed by electroless plating Steps: a step of solder plating on the surface of the conductor circuit, a step of removing the resist, a step of removing the gold layer other than the conductor circuit part by etching, and a step of removing the solder plating layer. The method of manufacturing a circuit board includes the steps of forming a plastic resin molded body having a desired shape, forming an adhesive layer on the surface of the plastic resin molding, roughening the surface of the adhesive layer, and plating the catalyst The step of attaching to the surface of the adhesive layer after roughening, the step of forming a metal layer on the surface of the adhesive layer by electroless, the gold The step of forming a plating resist other than the conductor circuit part of the surface of the layer, the step of forming the conductor circuit by the electroplating of the conductor circuit part, the step of solder plating on the surface of the conductor circuit, the step of removing the resist, by etching The step of removing the metal layer other than the conductor circuit part and the step of removing the aforementioned solder plating layer. The manufacturing method of the printed circuit board of the present invention includes the step of forming the first plastic resin molded body having the desired three-dimensional shape The size of a plastic paper is in accordance with Chinese National Standard (CNS) A4 (210X297mm) " -------- {Clothing ------ 1T ------ ((read first (Notes on the back and then fill out this page) A7 __B7_ Du Printed A7 __B7_ of the Ministry of Economic Affairs, Central Bureau of Preservation and Consumption, V. Description of the invention (5) The step of forming an adhesive layer on the surface of the molded body of the glue resin to make the aforementioned surface adhered The step of roughening, the step of attaching the plating agent to the surface of the adhesive layer after roughening, the step of forming a plating resist other than the conductor circuit part of the surface of the adhesive layer, covering the adhesion part other than the circuit part The step of forming a second plastic molded body of a desired shape on the surface and the step of forming a conductor circuit by electroless plating on the surface of the adhesive layer of the circuit "The material that can be used for the formed body of the present invention is a thermally insulating thermosetting resin, Thermoplastic resins, such as insulating thermosetting resins containing inorganic glassy or potassium titanate, calcium carbonate, calcium silicate and other inorganic thermal insulation resins, containing glassy or potassium titanate, calcium carbonate, calcium silicate Thermoplastic resins such as inorganic and dimensional. Thermoplastic resins include acetal resins, such as acrylic resins of polymethyl acrylate, ethyl cellulose, cellulose acetate, cellulose propionate, butyl woven cellulose acetate, such as nitrocellulose. Resins; Polyether resins such as polyphenylene ether; Polyamides: polystyrene; copolymers of acrylonitrile and styrene; styrene mixed resins of acrylonitrile-butadiene-styrene copolymer; polycarbonates ; Double-gas trifluoroethylene; polyvinyl acetate, polyvinyl alcohol, polyvinyl butyral, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinylidene fluoride, such as polyvinyl formal Ethylene polymer and copolymer of vinylidene chloride and vinyl formal. Thermoplastics such as polyetherimide, polyiodine, polyacrylate, polyethylene terephthalate, polyether inkstone, polyphenylene sulfide, polyphenylene ether, polyether ether ketone, liquid crystal polymer, etc. can also be used Resin. Thermosetting resins include polymers of allyl phthalate and formaldehyde, polymers of furan and formaldehyde, polymers of melamine and formaldehyde; and allyl phthalate and (please read the precautions on the back before filling this page) ”The standard of the printed paper is in accordance with Chinese National Standards (CNS & A4 specifications (210 X 297 mm) ^^ S2S2 A7 B7 The Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative Printing Policy V. Invention Instructions (B) Formaldehyde polymer and phenol Copolymer of formaldehyde> Copolymer of furan and formaldehyde and phenol formaldehyde • 1 Copolymer of allyl phthalate and formaldehyde and phenol furfural 9 Copolymer of furan and formaldehyde and phenol furfural * Copolymer of allyl acetate phthalate and phenol formaldehyde and copolymer of acrylonitrile butadiene and styrene Copolymer of furan and formaldehyde and copolymer of phenol and formaldehyde and acrylonitrile-butadiene- Copolymers of Styrene »Melamine irfc · * Copolymer of Xing's formaldehyde polymer and phenol formaldehyde copolymer with acrylonitrile-butadiene-styrene copolymer Allyl phthalate and formaldehyde polymer and phenol furfural copolymer and acrylonitrile-butadiene — Copolymer of styrene Copolymer of furan and formaldehyde and phenol furfural Xing Acrylonitrile_ Butadiene — Copolymer of styrene Copolymer of trimeric gas amine and formaldehyde and phenol furfural Xing acrylonitrile — Butadiene-styrene copolymer Copolymer of phthalic acid allyl acetate and formaldehyde and phenol formaldehyde and acrylonitrile-butadiene-styrene copolymer Copolymer of furan and formaldehyde and phenol formaldehyde Copolymer of acrylonitrile-butadiene-styrene Copolymer of melamine and formaldehyde and phenol-formaldehyde Copolymer of acrylonitrile-butadiene-styrene Copolymer of allyl acid ester and formaldehyde polymer and phenol aldehyde and acrylonitrile-butadiene-styrene copolymer 9 Copolymer of furan and formaldehyde polymer and phenol furfural and acrylonitrile-butadiene— Copolymer of styrene Copolymer of melamine and formaldehyde polymer and phenol furfural and acrylonitrile-copolymer of butadiene and styrene f Polyacrylate »Polysiloxane« m Formaldehyde resin epoxy resin 1 Acrylic resin glycerin Phthalate-based resin polyesters 9 Polyimide resins «Polyamide resins, etc. 0 Substances that can be used as an adhesion promoter layer, such as a combination of epoxy resins. This paper scale uses the Chinese National Standard (CNS > A4 Specifications (210X297mm) A7 _ B7 printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the invention (7) With synthetic rubber, cross-linking agent, hardener and filler. Epoxy resins include phenolic epoxy resins and bisphenol A epoxy resins, synthetic rubbers such as acrylonitrile butadiene rubber or carboxyl-containing acrylonitrile butadiene rubber, and hardeners such as diaminoxylene and imidazole And other cross-linking agents include methyl-modified resol type phenol resin. As long as the roughening is easy, a material having sufficient adhesion can use other thermosetting resins or thermoplastic resins, a mixture of thermosetting resins and thermoplastic resins, and the like. In addition, the filler to be mixed includes calcium carbonate, calcium silicate and the like. The material of the adhesion promoting layer mentioned above can be, for example, the following composition. Epoxy resin 20 ~ 50 g / 5 Synthetic rubber 30 ~ 50 g / 9. Crosslinking agent 30 ~ 50 g / Si Hardener 3 ~ 10 parts by weight / Epoxy resin 100 parts by weight Filler 30 ~ 100 g / 9. The ideal solvents include methyl ethyl ketone and solvent. After forming the first shaped body, an adhesion promoting layer is formed on the surface of the primary shaped body using the above-mentioned composition. The adhesion promoting layer system is formed by immersing the primary molded body in the above composition solution or spraying the above composition etc. under the following drying and curing conditions. The size of this paper is universal Chinese National Standard (CNS) A4 specification (210X297mm) (please read the precautions on the back before filling in this page). · ·---10-A7 B7 Printed by Beigong Consumer Cooperatives, Central Bureau of Standards, Ministry of Economic Affairs Preparation 5. Description of the invention (8) Drying temperature 50 ~ 80 ° C Drying time 10 ~ 15 minutes Hardening temperature 1 5 0 ~ 2 0 0 ° C Hardening time 60 ~ 90 minutes These drying temperatures, drying time, hardening temperature and hardening The time is used in combination with a solvent, and the use of resin plasticity can be arbitrarily selected within a range that does not deteriorate or deform the first molded body. The solution (roughening solution) for roughening the adhesion promoting layer formed on the surface of the first molded body includes, for example, a potassium permanganate solution, a mixed solution of chromic acid and sulfuric acid, and a strong emu solution such as sodium hydroxide or potassium hydroxide Wait. For the composition of the roughening liquid, for example, the following (1) potassium permanganate solution potassium permanganate 20 ~ 100 g / pH (adjusted with potassium hydroxide) 11 ~ 14 (2) chromic acid / sulfuric acid mixed solution chromium can be used Acid 20 ~ 300 g / β Sulfuric acid 50 ~ 30 0m 5/5 (3) Sodium hydroxide 60 ~ 600 g / other aqueous solution. The temperature and time of the roughening liquid can be as shown below. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) ~ (please read the precautions on the back before filling this page) " Order 20S2S2 A7 B7 V. Description of the invention (9) Roughening temperature 4 0 to 8 0 ° C Roughening time 5 to 40 minutes Conditions printed by the Ministry of Economic Affairs, Central Bureau of Standards, Pui Sung Consumer Cooperatives, and the material of the adhesive layer and the type of roughening liquid , Concentration to choose. For the plating catalyst attached to the adhesion promoting layer after roughening, a generally electroless copper plating catalyst such as palladium-tin colloid or gold-copper colloid can be used. The channel plating catalyst can be attached by, for example, a well-known method of sequentially immersing in tin chloride and vaporized palladium solution. In addition, a commercially available palladium-tin colloidal catalyst solution or alkaline ionic catalyst solution can be used under ordinary conditions. Crossing a flat surface or curved surface with two or more planes intersecting each other on the molded product, forming a conductor circuit by continuous plating process, etc. Because the curvature of the intersection is small, the conductor circuit formed thereon is easy Cracking occurred. However, according to the present invention, an adhesive layer is formed at least on the intersection of the molded product, so that the curvature of the adhesive layer at the intersection is greater than the curvature of the intersection of the molded product to prevent cracking, and when the curvature is above 20, it can be prevented The aforementioned cracks. In the conventional method, when the resin of the material of the molded body is changed once, the roughening conditions of the resin must be changed. In the present invention, an adhesive layer is provided on the surface of the primary molded body, and then the surface of the primary molded body is directly roughened instead of roughening the adhesive layer. Therefore, it is not necessary to change the roughening conditions even if the resin of the molded body material is changed once, and it can be handled with substantially the same roughening conditions. In the conventional method, it is often necessary to prepare two kinds of resins for the molded body. However, the present invention covers the primary molded body with an adhesive layer, so a variety of resins can be used for the primary molded body. Therefore, the resin used for the molded body is more applicable to the national standard (CNS) A4 specifications at the current paper size than the two resins prepared. (210X297mm) ~ " " -12-(please read the notes on the back first before filling this page)

1. Printed by 1T Ministry of Economic Affairs, Central Bureau of Standardization, Beigong Consumer Cooperative A7_B7_V. Description of Invention (10) The freedom of choice of conventional methods is large. The conventional method of directly treating the resin of the molded body with the roughening liquid roughens the roughened surface of the resin surface into a deep hole. Secondly, when a metal film is formed on the surface of the resin by plating, the gold film will not be buried in the hole and cause voids. This cavity is generated during the plating process, so that the adhesion between the metal film and the resin decreases, and the film strength of the metal film decreases. The printed circuit board of the present invention does not form a hole-like roughened state ((30 ~ 100) S (J IS B 0601)) as in the aforementioned conventional method, but only forms a slightly roughened state on the surface of the adhesive layer (( 1 0 ~ 5) S). When a metal film is formed on such a surface by plating treatment, voids of the conventional method do not occur. As a result, the adhesion of the high adhesive layer to the gold film and film is improved, and the strength of the high film is also improved. The conventional method is to perform plating treatment on the roughened surface of the hole, so the flatness of the surface of the formed metal film is poor. However, the roughened surface of the present invention has only a conventional roughness of 1/10 to 1/20. Hereinafter, embodiments of the present invention will be described in detail. (Embodiment 1) A printed circuit board of the shape and pattern of 圚 1 was produced according to the method of FIG. The method is described in detail below. Polyether is used as the molding material, and plastic molding is produced by injection molding. In this embodiment, the injection molding temperature is 3 6 0 ° C and the mold temperature is 1 5 〇-c. The curvature of the intersection of the molded product formed by the conductor circuit was measured to be 1 2 / zm, and the elastic modulus was 7 GP a. Secondly, dip the solution of the adhesive layer of the composition shown below outside the plastic molded product (please read the precautions on the back before filling out this page). The size of the paper for this edition is applicable to the Chinese National Standard (CNS) 84 specifications ( 21〇χ297 public love) -13-A7 B7 5. Description of the invention (11) The whole part is coated with an adhesive layer of about 10 kernel thickness. Phenolic resin epoxy resin acrylonitrile butadiene rubber alkyl type phenol resin II Amino xylene calcium carbonate solvent 40g / 5 30g / 5 35g / 9. 2 heavy child parts 45g / 32 methyl ethyl ketone, followed by the following drying, curing conditions to form an adhesive layer drying temperature drying time curing temperature curing time 75. . 10 minutes 165〇C 70 minutes (please read the precautions on the back before filling in this page) Printed by Beigong Consumer Cooperative of the Central Bureau of Samples and Economics of the Ministry of Economic Affairs The elastic modulus of this adhesive is 2.5 Pa. Next, this plastic molded body was immersed in the following roughening solution for 5 minutes to perform roughening treatment. Chromic acid / sulfuric acid mixed solution chromic acid sulfuric acid liquid temperature

50g / 9. 25〇m 9. / 9. 45〇C This paper size is applicable to China National Standards (CNS) A4 specification (210X297mm) 14-

Printed by the Ministry of Economic Affairs, Central Bureau of Industry and Economics Beigong Consumer Cooperative «L A7 __B7_____ V. Invention description (l2) After roughening, the curvature of the intersection of the molded product formed by the conductor circuit is measured to be 3 2. Next, the catalyst (palladium salt) is applied to the plastic molded body according to the operation steps in FIG. 3. The parts other than the conductor circuit part on the surface of the plastic molded body were plated with resist, and then immersed in an electroless copper plating solution of the following composition for 14 hours to precipitate copper with a thickness of about 30.

Copper sulfate · 5 hydrate 1 Og / Glycinediamine tetraacetic acid 30g / i? Polyethylene glycol (Mw6000) 0. 8g / 9. 2, 2, 2-bipyridine 3〇mi? / J2 37% formaldehyde 3πιΛ / ί pH (adjusted with sodium hydroxide) 12.5 Liquid temperature 70 ° C Next, remove the plating resist to form a conductor loop on the surface of the plastic molded body. As described above, the thickness of the film formed on the surface of the printed circuit board was 4 m m max. A thermal cycle test (15, -50 ° C, 100 times) was carried out on this substrate. The results showed no abnormality and high reliability. (Embodiment 2) Except for changing the composition of the sticky drawer to the following composition, the rest is the same as that in Embodiment 1. $ Paper scale applies the Chinese national standard (匚 八八 4 Specifications (21〇 < 297mm) (please Read the notes on the back first and then fill out this page) 袈 · Order 20S232 A7 B7 40g / 9. 30g / ί 30g / Si 2 reset 35g / ί Methyl ethyl ketone V. Description of the invention (13) Bisphenol A Type epoxy resin acrylonitrile butadiene rubber alkyl modified phenol resin diaminoxylene calcium carbonate solvent measured the elastic modulus of the adhesive layer formed above is 2. 8GPa. After roughening treatment, the conductor circuit is formed The curvature of the intersection on the molded product is 3 8. The thickness of the film forming the conductor circuit on the surface of the printed circuit board is 4.8 # mRmax. In addition, a thermal cycle test (150 ° C, -50 ° C, 100 times), the result is not abnormal, the reliability is high "(Example 3) In addition to using the spraying method to apply the adhesive layer to the surface of the plastic molded body, and change the composition of the adhesion promotion layer to the following composition , The rest is the same as in Example 1. {Approved clothing ------ * order ------ f (Please read the note on the back first Please fill in this page again.) Ministry of Economic Affairs Central Bureau of Samples and Printing Beigong Consumer Cooperative Printed 20g of phenolic epoxy resin 9. Acrylonitrile butadiene rubber 30g / β alkyl modified phenol resin 30g / 5 diaminoxylene 1. 5 parts by weight of calcium carbonate 30 g / 9. Solvent methyl ethyl ketone This paper scale is applicable to the Chinese National Standard (CNS) A4 specifications (210X297 mm) 16-A7 B7 5. Description of the invention (14) Determination of the above The modulus of elasticity of the adhesive layer is 2.1 GPa. After roughening, the curvature of the cross section on the molded product formed of the conductor circuit is measured to be 2 6 / zm. • Next, observe the electroless copper plating that forms the conductor circuit on the surface of the printed circuit board The thickness of the film is 3.2 emR max. In addition, this substrate was subjected to a thermal cycle test (150 ° C, -50 ° C, 100 times), and the results showed no abnormality and high reliability. (Example 4) Except for use The adhesion layer is applied to the surface of the plastic molded body by spraying, and the composition of the adhesion promotion layer is changed to the following composition, the rest is the same as in Example 2. (Please read the precautions on the back before filling this page) ^^ 1 · ^^^ 1 m ^ ϋ— ^ ϋ · nn ^ i I ·

* 1T Bisphenol A epoxy resin 20g / i2 Acrylonitrile butadiene rubber 30g / 9. Alkyl modified phenol resin 40g / diamino xylene 1.5 parts by weight calcium carbonate 45g / 5 solvent methyl ethyl 3GPa。 Base Ketone Ministry of Economy Central Standards Bureau Beigong Consumer Cooperative printed and measured the elastic modulus of the adhesive layer formed above is 2. 3GPa. After the roughening treatment, the curvature of the cross section on the molded product formed by the conductor circuit was measured to be 2 9. Secondly, the thickness of the electroless copper plating film formed on the surface of the printed circuit board was 3.8 μm R max. In addition, this substrate was subjected to a thermal cycle test (150 it, -50. (:, 100 times). As a result, this paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ 17-The Ministry of Economic Affairs Central Standards Bureau is negative Industrial-Consumer Cooperation Du-printed A7 B7 V. Description of the invention (15) No abnormality occurred, reliability degree β (Example 5) Except for applying the adhesive layer on the surface of the plastic molded body by using static spray method, the rest is the same Example 3. The elastic modulus of the adhesive layer formed above was determined to be 3.1 GPa. After the roughening treatment, the curvature of the cross section on the molded product forming the conductor circuit was measured to be 27 # m. The thickness was observed to be 3.2 am Rmax "The substrate was subjected to a thermal cycle test (150 ° C, 150 ° C, 100 times). The results showed no abnormalities and high reliability. (Example 6) In addition to the use of electrostatic spraying method The coating layer is coated on the surface of the plastic molded body, and the rest is the same as in Example 4. The elastic modulus of the adhesive layer formed above is measured to be 2.9 GPa. After the roughening treatment, the intersection on the molded product forming the conductor circuit is measured The curvature is 2 1 ί / m. Observe that its thickness is 2.5 um Rmax. A thermal cycle test (1 50 ° C, _50 ° C, 100 times) was conducted, and the results showed no abnormalities and high reliability. (Example 7) Except for the use of inorganic fillers containing 50 weight? 6 " "Plating grade" liquid crystal polymer (Ve ctrac. 8 1 0 manufactured by po I yp 1 ast ic company) instead of poly chain breaking, injection molding temperature 3 30 ° C, mold temperature 100 ° C molding conditions, the rest are the same as the implementation Example 1. The modulus of elasticity of the molded product formed as described above is 1 2 GP a, and the paper size of the cross section on the molded product forming the conductor circuit is measured by the China National Standards (CNS) A4 specification (210X297 Mm) ~ -18---------- {-installed ----- order ----- A spicy (please read the precautions on the back before filling this page) Central Standard of the Ministry of Economic Affairs Bureau employee consumption cooperation Du printed equipment A7 _B7___ V. Description of invention (ie) The modulus of elasticity of the adhesive layer is 2. 6GPa. After roughening, the adhesive layer on the molded product forming the conductor circuit is measured The curvature of the intersection is 2 0 »An electroless copper plating film is formed on the surface of the printed circuit board, and the film thickness is 2.2 μm R max. A thermal cycle test (150 ° C, 50 ° C, 100 times), the result is no abnormality, and has high reliability. (Example 8) Except for the use of polyphenylene sulfide polyether polyether master, the rest are the same as Example 1. The measurements are as described above The modulus of elasticity of the formed molded product was 5.4 GPa, and the curvature of the intersection on the molded product forming the conductor circuit was measured to be 8 μιη. The elastic modulus of the adhesive layer is 2.3 GPa. After the roughening process, the curvature of the intersection of the molded product forming the conductor circuit was measured to be 3 1. An electroless copper plating film was formed on the surface of the printed circuit board, and the thickness of the film was 3.8 β m Rmax. This substrate was subjected to a thermal cycle test (150 ° C, 150 ° C, 100 times), and as a result, there was no abnormality and high reliability. (Embodiment 9) A printed circuit board of the shape and pattern of FIG. 1 was produced by the method of FIG. This method is described below. In the same manner as in Example 1, a plastic molded body was formed, and then an adhesive layer was formed, and then a roughening treatment was performed to provide a plating catalyst and electroless plating treatment. The modulus of elasticity of the molded product molded as described above is 7.2 GPa, and the curvature of the intersection of the molded product forming the conductor circuit is measured to be 14em. 6GPa。 The elastic modulus of the adhesive layer is 2. 6GPa. This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) (please read the precautions on the back before filling this page).

1T -19-Printed and printed 20g / 9. 30g / 9. 30g / of 1. 5 parts by weight of 30 g / Si methyl ethyl ketone B7 of the Central Consumer ’s Bureau of the Central Ministry of Economic Affairs of the Ministry of Economic Affairs 5. Description of invention (17) Roughening After the treatment, the curvature of the intersection of the adhesive layer on the molded product forming the conductor circuit was measured to be 30 Mm »Secondly, the etching corrosion resistance was formed on the conductor circuit portion on the surface of the plastic molded body to etch copper other than the conductor circuit portion. Then, the aforementioned etching resist is removed to form a conductor circuit on the surface of the plastic molded body. As described above, electroless copper plating was formed on the surface of the printed circuit board, and the thickness of the observed film was 3.8 to mR max. A thermal cycle test (150 ° C * — 50 ° C, 100 times) was carried out on this substrate, and no abnormality was found, with high reliability. (Example 1 0) Except for using the spray coating method to apply the adhesive layer to plastic molding The surface of the body, and the composition of the adhesion promoting layer is changed to the following composition, the rest is the same as in Example 9. Phenolic epoxy resin Acrylonitrile butadiene rubber Alkyl modified phenol resin Diaminoxylene calcium carbonate Solvent The elastic modulus of the adhesive layer formed above was measured to be 2. 9GPa. After the roughening treatment, the curvature of the intersection of the molded product formed by the conductor circuit was measured to be 3 4 / zm. Secondly, observe that the thickness of the electroless plated film forming the conductor circuit on the surface of the printed circuit board is 3.9jumRmax · In addition, the paper size of this substrate is applicable to China National Standard (CNS) A4 specification (210X297mm) ---- ----- ^ Installed ------ ordered ------ ^, 1 (please read the precautions on the back before filling out this page) _ 20 _ Printed by Zhengong Consumer Cooperative, Central Bureau of Standards, Ministry of Economic Affairs A7 _B7 V. Description of the invention (18) The thermal cycle test (150 ° C, _50 ° C, 100 times) was carried out. The results showed no abnormality and high reliability. (Example 11) The same as Example 9 except that the adhesive layer was applied to the surface of the plastic molded body by electrostatic spraying. The elastic modulus of the adhesive layer formed above was measured to be 3.1 GPa. After the roughening process, the curvature of the intersection on the molded product forming the conductor circuit was measured as 32; am. Observe that its thickness is 3.2 m

Rmax. This substrate was subjected to a thermal cycle test (150 ° C, 150 ° C, 100 times). As a result, no abnormality occurred and it was highly reliable. (Example 12) Instead of using "plating grade" liquid crystal polymer (Vectra c.810 manufactured by polyplastic company) containing 50% by weight of inorganic filler instead of polysilicon, injection molding temperature is 3 3 0 ° C, mold temperature Except for the forming conditions of 100 ° C, the rest is the same as in Example 9. The elastic modulus of the molded product formed as above is measured to be 11. 3 GP a, and the curvature of the cross section on the molded product forming the conductor loop is measured 15 # m. The elastic modulus of the adhesive layer is 2.7 G P a. After the roughening process, the curvature of the intersection of the molded product forming the conductor circuit was measured to be 2 2 / zm. An electroless copper plating film was formed on the surface of the printed circuit board with a film thickness of 1.9 jumR max. The substrate was subjected to a thermal cycle test (150 ° C, 50-1,100 times). As a result, no abnormalities occurred and it was highly reliable degree. This paper standard is universal Chinese National Standard Rate (CNS) A4 specification (210X297mm) II II — ^ installed IIIII — ^ line (please read the precautions on the back before filling this page) Central Bureau of Standards of the Ministry of Economic Affairs-Industrial and Consumer Cooperative Printed Preparation ^^ S2S2 A? ________B7 V. Description of the invention (19) (Example 1 3) Except for the use of polyphenylene sulfide instead of polyether research I, the rest is the same as Example 9. The modulus of elasticity of the molded product formed as described above was measured to be 6 G Pa, and the curvature of the intersection of the molded product forming the conductor loop was measured to be 10. The elastic modulus of the adhesive layer is 2.4 GPa. After the roughening treatment, the curvature of the intersection of the adhesive layer on the molded product forming the conductor circuit was measured to be 10%. An electroless copper plating film was formed on the surface of the printed circuit board, and the film thickness was 3.8 from mRmax. This substrate was subjected to a thermal cycle test (150 ° C, 50 ° C, 100 times), and as a result, no abnormality occurred, with high reliability ”(Example 1 4) The graph was prepared by the method of FIG. 5 1 shape, printed circuit board for graphic products. This method is described below. Comparing with Example 1, a plastic molded body was formed, and then an adhesive layer was formed, and then a roughening treatment was performed to provide a plating catalyst and an electroless ammonium plating treatment. The elastic modulus of the molded product formed as above is 2.8 GPa. After the roughening process, the curvature of the cross section on the molded product forming the conductor circuit was measured to be 3 2 »Second, the plastic molded body surface was formed with plating resist other than the conductor circuit, and then immersed in the same as Example 1 The thickness of the precipitated copper in the electroless copper plating solution is about 30 μm. Then, solder plating is performed on the conductor circuit, and then the plating resist is removed. Next, the copper outside the conductor circuit part is etched. Then, the aforementioned solder layer is removed. As mentioned above, electroless copper plating was formed on the surface of the printed circuit board, and the thickness of the film was observed to be 3.8MmRraax. The substrate was subjected to a thermal cycle test (χδΟΙ '-50 ° C' 100 times). As a result, no abnormality occurred. With high reliability, this paper standard is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm> -22---------- ^-(please read the precautions on the back before filling this page)這 -1 ../ 1 The Ministry of Economic Affairs, Central Bureau of Customs and Excise, DuPont Printing A7 __._ B7_ V. Description of the invention (20) 〇 (Example 1 5) In addition to using the spray method to apply the adhesive layer to the plastic Form the hip surface, and change the composition of the adhesion promoting layer to the following composition, the rest is the same as in Example 1 4 Phenolic epoxy resin 20g / i Acrylonitrile butadiene rubber 30g / 9. Alkyl modified phenol resin 30g / 9. Diaminoxylene 1.5 replacement calcium carbonate 30 g / 9. Solvent methyl ethyl ketone measured the elastic modulus of the adhesive layer formed above is 3.2 GPa. After roughening treatment, the conductor is measured The curvature of the intersection on the molded product formed by the circuit is 2 9. Secondly, it is observed that there is no formation on the surface of the printed circuit board. The thickness of the uncoated copper film is 3.5 iimRmax. In addition, a thermal cycle test (150 1, 50 ° C, 100 times) was carried out on this substrate, and the results showed no abnormality and high reliability. (资 施 16) Except for applying the electrostatic spraying method to apply the adhesive layer to the surface of the plastic molded body, the rest is the same as in Example 1 4. The elastic modulus of the adhesive layer formed above is measured. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 Mm) '-23---------- 1 installed ------ ordered ------ jr line (please read the note Ϋ on the back before filling in this page) Ministry of Economic Affairs Sample A7 B7 printed by Beigong Consumer Cooperative. V. Description of invention (21) is 2. 6GPa. After roughening, the curvature of the intersection on the molded product forming the conductor circuit is measured as 24 # m. Observe the thickness It is 3.2 mRaiax. This substrate was subjected to a thermal cycle test (150 ° C, 50 ° C, 100 times). The results showed no abnormality and high reliability. (Example 17) Inorganic filler 50% by weight of "plating grade" liquid crystal polymer (Vectra c. 8 1 0 made by polyplastic company) instead of polyether iodine, injection molding temperature 3 3 0 C, except for the molding conditions at a mold temperature of 100 ° C, the rest are the same as in Example 14. The elastic modulus of the adhesive layer formed as above was measured to be 3 GP a, and after roughening, the conductor circuit was formed. 9 / zmR max。 The curvature of the intersection on the molded product is 2 5 »Electroless copper plating film is formed on the surface of the printed circuit board, the thickness of the film is 1.9 / zmR max. A thermal cycle test (150 ° C, -50 ° C, 100 times) was conducted on this substrate, and the results showed no abnormality and high reliability. (Example 18) Except that polyphenylene sulfide is used instead of polyether, the same as in Example 14. The elastic modulus of the adhesive layer formed as described above was measured to be 2.9 GPa. After roughening, the formation was measured. The curvature of the intersection of the molded product of the conductor circuit is 3 2. An electroless copper plating film was formed on the surface of the printed circuit board, and the thickness of the film was 3.8 // mRmax. This substrate was subjected to a thermal cycle test (150 ° (:, 50, 1,100 times), and no abnormalities were found. The Chinese paper standards (CNS) A4 specifications (210X297 mm) ~ 1 24 _- -------- ^ -installed ------ ordered ------ (please read the precautions on the back before filling in this page) A7 B7 printed by the Employee Consumer Cooperative of Central Central Bureau of Economics of the Ministry of Economic Affairs 5. Description of the invention (22) High reliability. (Example 1 9) After forming a plastic molded body as in Example 1, after forming an adhesive layer, it is roughened to provide a plating catalyst, and electroless plating is applied. The elastic modulus of the formed adhesive layer was 2-6 GPa. After the roughening treatment, the curvature of the intersection on the molded product forming the conductor circuit was measured to be 2 6 μιη. The elastic modulus of the adhesive layer was 2.7 GPa. After the roughening process, the curvature of the cross section on the molded product forming the conductor circuit was measured to be 2 6. Secondly, a plating resist was formed on the part other than the conductor circuit part on the surface of the plastic molded body, and about 3 was deposited by electroplating 0 Thick copper. Then etch the copper other than the conductor circuit part to remove the solder layer on the conductor circuit. As above As described, electroless copper plating was formed on the surface of the printed circuit board, and the thickness of the film was observed to be 2.3 β m R max. A thermal cycle test was performed on this substrate (150 ° C, —50 ° C, 100 times) The results showed no abnormality and high reliability. (Example 2 0) The printed circuit board with the shape and shape shown in Figure 6 was produced by the following method (圔 7). The molding material was polyether iodine, Injection molding is used to make a primary molded product. At this time, the injection molding temperature is 3 60 ° C and the mold temperature is 150 ° C. Secondly, as in Example 1, an adhesive layer is formed on the entire surface of the primary molded product, and then roughened Processing, coating the catalyst. The modulus of elasticity of the molded product as described above is 6.8 GPa, and the curvature of the intersection on the molded product forming the conductor circuit is measured to be 14. The elastic modulus of the adhesive layer is based on The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm L ^ _ (please read the precautions on the back before filling in this purchase).

.1T _B7_ V. Description of the invention (23) 2. 9GPa. After the roughening process, the curvature of the intersection on the molded product forming the conductor circuit was measured to be 3 4. Next, a secondary molded body was produced by injection molding around the primary molded body, the circuit portion was exposed, and then immersed in the same electroless copper plating solution as in Example 1 to precipitate copper with a film thickness of about 30. As described above, electroless copper plating was formed on the surface of the printed circuit board, and the thickness of the observed film was 4 jumR max. A thermal cycle test (150 ° C, -50 ° C, 100 times) was conducted on this substrate, and the results showed no abnormality and high reliability. (Example 21) Except for changing the adhesion promoting layer to the following composition, the rest is the same as Example 20. Printed by the Ministry of Economic Affairs Central Standards Bureau Beigong Consumer Cooperative Society 40g / 9. 30g / 9. 30g / i? 2 Reset Servings 35 g / 9. Methyl ethyl ketone (Please read the precautions on the back before filling this page) Bisphenol A epoxy resin acrylonitrile butadiene rubber alkyl modified phenol resin diamino xylene calcium carbonate 1GP a。 Solvent determination of the elastic modulus of the adhesive layer formed above is 3. 1GP a. After the roughening treatment, the curvature of the intersection on the molded product formed of the conductor circuit was measured to be 40 Mm. Next, the thickness of the electroless copper plating film formed on the surface of the printed circuit board was 4.8 #mR max. In addition, the paper standard of this substrate applies the Chinese National Standard (CNS) A4 specification (210X297 mm) 26 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Beigong Consumer Cooperative A7 _B7 V. Invention description (24) Thermal cycle test (150 ° C, a 50 ° C, 100 times), the results did not occur abnormally, the reliability is high. (Example 2 2) Except for applying the adhesive layer to the surface of the plastic molded body by spraying, and changing the composition of the adhesion promoting layer to the following composition, the rest is the same as in Example 1. Phenolic epoxy resin 20g / 9. Acrylonitrile butadiene rubber 30g / Alkyl modified phenol resin 30g / il Diamino xylene 1.5 parts by weight calcium carbonate 30 g / 9. Solvent methyl ethyl ketone 6GPa。 The elastic modulus of the adhesive layer formed above was measured 2. 6GPa. After the roughening treatment, the curvature of the intersection of the molded product formed by the conductor circuit was measured to be 2 8. Next, observe that the thickness of the electroless copper plating film formed on the surface of the printed circuit board is 3.2; tzmRmax. Furthermore, a thermal cycle test (150 ° C, -50 ° C, 100 times) was conducted on this substrate, and as a result, no abnormality occurred and the reliability was high. (Example 2 3) Except for applying the spray coating method to the surface of the primary molded body, and changing the composition of the adhesion promoting layer to the following composition, the rest is the same as Example 2 1 (CNS > A4 specification (210X297mm) _ binding ^ travel (please read the notes on the back before filling in this page) 29S2S2 A7 B7 V. Description of invention (25 bisphenol A epoxy resin acrylonitrile butadiene rubber Alkyl modified phenol resin diaminoxylene calcium carbonate solvent 20g / 9. 30g / 4 0 g / 5 1. 5 replacement parts 4 5 g /) 2 Methyl ethyl ketone Determination of the adhesion layer formed above The modulus of elasticity is 2. 8GPa · After roughening, the curvature of the intersection of the molded product formed by the conductor circuit is measured to be 2 9 Mm. Secondly, the thickness of the electroless copper plating film formed on the surface of the printed circuit board is 3 . 8 // mR max * In addition, a thermal cycle test (150 ° C, -50 ° C, 100 times) was performed on this substrate, and the results were not abnormal, and the reliability was high. (Please read the precautions on the back before filling in this Page) Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (Example 2 4) 4GPa。 After using the electrostatic spraying method to apply the adhesive layer on the surface of the plastic molded body, the rest is the same as in Example 22. The elastic modulus of the adhesive layer formed above was measured to be 2.4 GPa. After roughening, the conductor circuit was formed The curvature of the cross section on the molded product is 26jt / m. Observe that the thickness is 3.2 // mRmax. The substrate was subjected to a thermal cycle test (150 ° C, 50 ° C, 100 times). Abnormality occurs and the reliability is high. The paper standard is in accordance with the Chinese National Standard (CNS) A4 (210X297mm). The Ministry of Economic Affairs, Central Bureau of Economic and Technical Cooperation, Co., Ltd. prints the A7 B7. Invention description (26) (Examples) 2 5) Except for using the electrostatic spraying method to apply the adhesive layer to the surface of the plastic molded body, the rest is the same as in Example 23. The elastic modulus of the adhesive layer formed above was measured to be 2.8 GPa. After the roughening treatment, the measurement The curvature of the intersection on the molded product forming the conductor circuit is 21m »Observe that the thickness is 2. 5 # m R max. A thermal cycle test (1 50 ° C, a 50 ° C, L00 times) was performed on this substrate , The result is not abnormal, and has high reliability. (Example 2 6) In addition to using inorganic filler Agent 50% by weight of "plating grade" liquid crystal polymer (Vectra c. 8 1 0 made by Po 1 yp 1 ast ic company) instead of poly-charm, injection molding temperature 3 3 0 ° C, mold temperature 10 0 0 ° Except for the forming conditions of C, the rest is the same as in Example 20. The modulus of elasticity of the molded product molded as described above was measured to be 12. 3GPa, and the curvature of the intersection of the molded product forming the conductor circuit was measured to be 9 / zm. The elastic modulus of the adhesive layer is 2.6 G P a. After the roughening treatment, the curvature of the cross section on the molded product forming the conductor circuit was measured to be 2 3 * An electroless copper plating film was formed on the surface of the printed circuit board, and the thickness of the film was 1.9 #mR max. A thermal cycle test (150t :, -50 ° C, 100 times) was carried out on this substrate, and as a result, no abnormality occurred * with high reliability. (Example 2 7) The same as in Example 20 except that polyphenylene sulfide polyether polyether is used. The measured elastic modulus of the adhesive layer formed as above is 2.4 GP a, (please read the precautions on the back and then fill out this page). Binding, ordering, spring. The paper size is applicable to China National Standard (CNS) A4 Specifications (210X297mm) A7 B7 293232 V. Description of the invention (27) After roughening * The curvature of the cross section on the molded product forming the conductor circuit is measured to be 2 5 / zm. Electroless copper plating is formed on the surface of the printed circuit board The thickness of the film is 3.6; amR max »The substrate was subjected to a thermal cycle test (150 ° (:, -50 ° (:, 100 times)). As a result, no abnormality occurred and the reliability was high. The above example The coating strength of the copper-plated film made in 1 ~ 27 is 1.9 ~ 2.8KN / m (kgf / cm). (Comparative Example 1) The 2 shot mould method (Figure 9) was used to produce the one shown in Figure 8. The printed circuit board of the shape and the graphic product. The primary molded material is made of polyether mixed with the plating catalyst, which is injection molded to make the primary molded product. At this time, the injection molding temperature is 360 ° C and the mold temperature is 150 ° C. The elastic modulus of the molded product is measured to be 7.2 GPa. The secondary molding is formed around the primary molded body by injection molding The molded part is made into a molded body in which the circuit part of the primary molded body is exposed. At this time, the material of the secondary molded body is polyphenylene sulfide. The injection molding temperature is 280 ° (:, the mold temperature is 120 ° (:. The molded body was subjected to roughening treatment under the conditions shown in Fig. 10. After the roughening treatment, the curvature of the intersection portion on the molded product formed of the conductor circuit was measured. Next, the molded body was impregnated with Example 1 In the electroless copper plating solution, copper is precipitated. The film thickness of the metal film formed on the surface of the printed circuit board made above is measured to be 18. 3 # m · In addition, the surface of the film formed on the surface of the printed circuit board The hole-shaped roughened surface generated during the roughening process is not applicable to this paper standard. The Chinese National Accreditation (CNS) A4 specification (210X297mm) -30---------- installed ------ Order ------ ^ Travel (please read the precautions on the back before filling out this page) Printed by the Ministry of Economic Affairs, Central Bureau of Industry and Commerce, Beigong Consumer Cooperative Printed by the Ministry of Economic Affairs, Central Bureau of Industry and Commerce, Beigong Consumer Investment Cooperative, A7 B7 2. Description of the invention (28) Fully plated, therefore, the film surface has holes. At this time, the roughness of the film surface is 7 5 // mR max · The measured film strength of the copper-plated film produced was 0.5 to 1.3 kN / m (kgf / cm). When the substrate was annealed, cracks occurred in the conductor circuit part of the intersection. (Comparative Example 2) The degree of solution of the adhesive layer lower than that of Example 1 is such that the curvature of the adhesive layer formed at the intersection of the conductor circuit on the molded product is 1 5 and the rest is the same as in Example 1. The above molding was measured The elastic modulus of the molded product is 7GPa, and the measured curvature is 12 # m. The elastic modulus of the adhesive layer is 2.7 GPa. The roughness of the film surface of the printed circuit board produced above was 3.8 / zmR max. The film strength of the copper-plated film produced was measured to be 1.5 to 2.3 kN / m (kgf / cm). When this substrate was annealed, cracks occurred in the conductor circuit part of the intersection. (Comparative Example 3) Except for reducing the content of the acrylonitrile butadiene rubber of the adhesive layer so that the elastic modulus of the adhesive layer formed at the intersection of the conductor circuit formed on the molded product becomes 8. 7GPa, the rest is the same as the embodiment 1. The curvature of the intersection of the adhesive layer formed above was measured to be 3 2. The elastic modulus of the molded product is 6.8 GPa, and the curvature of the conductor circuit part is 10 em. The roughness of the film surface of the printed circuit board produced above was 4.2 emR max. The strength of the copper-coated film measured is 1.1 to 1. 9kN / m (kgf / cm) * When this substrate is annealed, the paper guide circuit of the cross section is in accordance with the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm). , —.Λ 1 — I 11 (^ Binding ^ .Λ (Please read the note on the back of the page before filling in this page) Central Bureau of Standards of the Ministry of Economic Affairs β; Industrial and Consumer Cooperatives printed A7 B7 V. Description of invention (29) Cracking occurred. (Comparative Example 4) In addition to the integral molding system, a material containing a catalyst mixed with an inorganic filler 50% by weight of a "mineral deposit" liquid crystal polymer (V ectra C. 810 manufactured by polyplastic company) was used and injected. Molding temperature 3 3 0 ° C, mold temperature 100 ° C forming conditions, and the molded body is immersed in 30 ° C sodium hydroxide aqueous solution (1 50g / J2) for 30 minutes by roughening treatment The rest is the same as Comparative Example 1. The modulus of elasticity of the above-mentioned molded product was measured to be 12. 3GPa. After the roughening process, the curvature of the intersection on the molded product formed of the conductor circuit was measured. Second, the measured The thickness of the metal film formed on the surface of the printed circuit board produced above was 22.6 vm. In addition, the surface of the film formed on the surface of the printed circuit board was not sufficiently plated due to the hole-shaped roughened surface generated during the roughening process As a result, there are holes on the surface of the membrane. At this time, the thickness of the membrane surface is 3 4 #mR m ax. The measured film strength of the copper-plated film made is 0.3 ~ 0.9kN / m (kgf / cm). When the substrate is annealed, the conductor circuit part of the intersection part is cracked. The present invention is a forming The body resin can form the printed circuit board, and the degree of freedom of resin selection is increased. By providing an adhesion promotion layer on the periphery of the primary molded body, even if the molded body resin is changed, roughening treatment can be performed under certain roughening conditions According to the present invention, the surface of the metal film formed on the printed circuit board is uniform, and the surface roughness of the metal film is 1/1 0 ~ 1/2 0 in the past. The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210Χ297 Mm) -32-(please read the precautions on the back before filling in this page). Packing. Order Α7 Β7 5. Description of the invention (30) The strength of the film is 1. 2 ~ 9 times of the past "[Simple description of circle surface] [Figure 1] shows the design drawing of the printed circuit board of the present invention. [Circle 2] shows the manufacturing process of the printed circuit board with a gold layer in the shape of a graph. [圚 3] shows the catalyst processing process of the present invention. [ Figure 4] It shows a graph shape The manufacturing process of the printed circuit board of the metal layer. [Circle 5] shows the manufacturing process of the printed circuit board with the ring-shaped gold lute layer. [Figure 6] shows the design drawing of the printed circuit board of the present invention. [圚 7] It shows the manufacturing steps of a printed circuit board with a pattern-shaped metal layer. [Figure 8] shows the design drawing of a conventional printed circuit board. [Figure 9] shows the manufacturing process of a conventional printed circuit board (2 shot mold method). Economy Printed by the Central Standards Bureau of the Ministry of Industry and Consumers Cooperatives (please read the precautions on the back before filling in this page) [Figure 10] is a roughening process for printed circuit boards in the past. [Description of Symbols] 1 ...... Plastic molded resin, 1 a ...... Intersection of two planes> 1 b ...... M resin molded at one time, 1 c ...... Two Sub-molded resin, 2 ...... adhesive, 3 ...... Metal film, 4 ...... Through hole · This paper standard uses China National Standards (CNS) Α4 specifications (210X297mm) -33-2d32o2 A? B7 5. Description of the invention (31) 1 side view nc ο 1 figure --------- ^ ▲ — (please read the precautions on the back before filling this page ) 定 ， 泉 _ The standard paper size of the printed copy of the Beigong Consumer Cooperative of the Central Prototype Bureau of the Ministry of Economic Affairs is applicable to China National Standard (CNS) A4 (210X 297mm)

Claims (1)

A8 B8 C8 D8 printed by the Negative Workers Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs VII. Patent application 1. A printed circuit board with at least one conductor circuit interposed between the adhesive layer and two or more planes that intersect each other In a printed circuit board formed on the surface of a continuous plane or a plastic molded body with a curved surface, continuous conductor circuits are formed between the intersecting planes, the curvature of the surface of the adhesive layer at the intersection is greater than the surface of the substrate at the intersection Curvature. 2. The printed circuit board as claimed in item 1 of the patent scope, wherein the curvature of the surface of the adhesive layer at the intersection is 2 Ο μ m or more. 3. A printed circuit board, in which at least one conductor circuit is interposed between the adhesive layer and the printed circuit board formed by the surface of a plastic plane with a curved surface or a plastic molded body substrate with two or more planes crossing each other , The conductor circuit that forms a succession between the intersecting planes' elastic modulus of the aforementioned adhesive layer is lower than the elastic modulus of the substrate. 4. A printed circuit board, characterized in that at least one conductor circuit is interposed between the adhesive layer and the printed circuit board formed on the surface of a continuous plane containing two or more planes crossing each other or a surface of a plastic molded body having a curved surface, A continuous hip conduction circuit is formed between the intersecting planes. The thickness of the surface of the adhesive layer is 10 ~ 5S. 5. A printed circuit board, characterized in that at least one conductor circuit is interposed between the adhesive layer and the printed circuit board formed by the surface of a continuous plastic plane or a plastic molded body with a curved surface formed by two or more planes crossing each other , The conductor circuit forming a continuous performance between the intersecting planes, the surface roughness of the conductor loop is 2 0 #mR max or less. 6. A printed circuit board, characterized in that at least one conductor circuit is interposed between an adhesive layer and a continuous plane containing two or more planes crossing each other. The paper size is applicable to China National Standard (CNS) A4 (210X297 Ali) ~~~~ -〇5-(Please read the precautions on the back before filling out this page) Order salty! In the printed circuit board formed by A8 B8 C8 D8々, the scope of patent application or the surface of a plastic molded body with a curved surface, continuous conductor circuits are formed between the intersecting planes, covering A second plastic molded body is formed except for the portion of the surface of the adhesive layer that becomes a conductor circuit. 7. A method of manufacturing a printed circuit board, which includes the steps of forming a plastic resin molded body, forming an adhesive layer on the surface of the plastic resin molded body, and attaching a plating catalyst to the surface of the adhesive layer, The step of forming a plating resist other than the conductor circuit part on the surface of the adhesive layer, the step of forming a conductor circuit pattern by electroless plating, and the step of removing the aforementioned resist. 8. A method for manufacturing a printed circuit board, which includes the steps of forming a plastic resin molded body, forming an adhesive layer on the surface of the plastic resin molded body, and attaching a plating catalyst to the surface of the adhesive layer , The step of forming a metal layer by electroless plating on the surface of the adhesive layer, the step of forming an anti-etching on the conductor circuit part of the surface of the gold tantalum, etching the gold layer to form a conductor circuit, and the step of removing the resist . 9. A method of manufacturing a printed circuit board, characterized in that it includes a step of forming a plastic molded body, a step of forming an adhesive layer on the surface of the plastic resin molded body, and a step of attaching a plating catalyst to the surface of the adhesive layer, the adhesive The step of forming a metal layer by electroless plating on the surface of the coating layer, the step of forming an anti-etching step other than the conductor circuit part on the surface of the metal layer, the step of forming the conductor circuit part by plating process, the surface of the conductor circuit is soldered Step of plating * Step of removing the aforementioned resist, step of removing the metal layer other than the conductor circuit portion by etching, and step of removing the aforementioned solder plating layer. (Read the precautions on the back of the poem before filling out this page) -The size of the revised paper is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) -36-B8 C8 D8, patent application siege 10 The method of manufacturing a circuit board includes the steps of forming a plastic molded body, forming an adhesive layer on the surface of the plastic resin molded body, and attaching a plating agent to the surface of the adhesive layer to cover the parts other than the circuit part The step of forming the second plastic resin molded body of the desired shape on the surface of the adhesive layer, and the step of forming a conductor circuit by electroless plating on the surface of the adhesive layer of the finished circuit. 1 1. The method for manufacturing a printed circuit board according to any one of patent application items 7 to 10, wherein an adhesive layer is formed on the surface of the plastic resin molded body by a spray coating method. 12. The method of manufacturing a printed circuit board according to any one of patent application items 7 to 10 is to form an adhesive layer β on the surface of the plastic resin molded body by a dipping method. The method of manufacturing a printed circuit board of the item is to use electroless plating to form a conductor circuit after forming the plating resist 1 4. The method of manufacturing a printed circuit board of the patent application No. 9 is to form the plating resistance After etching, conductor circuits are formed using electroplating. (Please read the precautions on the back first and then fill out this page) Ordered Printed by the Ministry of Economic Affairs of the Ministry of Economic Affairs of the Ministry of Economic Affairs of the Male Workers' Consumer Cooperative *. This paper standard applies to China National Standard (CNS) Α4 specification (210Χ297mm) -37-