KR960031645A - Printed wiring board and manufacturing method thereof - Google Patents

Printed wiring board and manufacturing method thereof Download PDF

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Publication number
KR960031645A
KR960031645A KR1019960004103A KR19960004103A KR960031645A KR 960031645 A KR960031645 A KR 960031645A KR 1019960004103 A KR1019960004103 A KR 1019960004103A KR 19960004103 A KR19960004103 A KR 19960004103A KR 960031645 A KR960031645 A KR 960031645A
Authority
KR
South Korea
Prior art keywords
adhesive layer
conductor circuit
forming
wiring board
printed wiring
Prior art date
Application number
KR1019960004103A
Other languages
Korean (ko)
Inventor
도모아끼 다까하시
하루오 아까호시
미네오 가와모또
아끼오 다까하시
요시유끼 안도우
도시유끼 오오아꾸
료우 사또
Original Assignee
가나이 쯔도무
가부시키가이샤 히다치 세이사쿠쇼
하라 세이지
히다치 덴센 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가나이 쯔도무, 가부시키가이샤 히다치 세이사쿠쇼, 하라 세이지, 히다치 덴센 가부시키가이샤 filed Critical 가나이 쯔도무
Publication of KR960031645A publication Critical patent/KR960031645A/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

본 발명은 적어도 하나의 도체회로가 서로 교차하는 두 개 이상의 평면을 가지는 연속된 평면 혹은 곡면을 가지는 플라스틱 성형체 기판표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면사이에 연속된 도체회로가 형성되고, 그 교차부의 상기 기판표면의 곡율보다 그 교차부의 접착층 표면의 곡율이 큰 프린트배선기판 및 이러한 프린트배선기판의 제조방법을 제공한다.The present invention relates to a printed wiring board formed with an adhesive layer on a surface of a plastic molded body substrate having a continuous plane or curved surface having two or more planes with at least one conductor circuit intersecting with each other, And the curvature of the surface of the adhesive layer at the intersection is larger than the curvature of the surface of the substrate at the intersection, and a method of manufacturing such a printed wiring board.

본 발명에 의하면 입체프린트 배선기판이 성형체수지상에 형성된 적어도 두 개의 평면 혹은 곡면의 교차부에 형성된 도체회로에 발생하는 크랙을 방지한다.According to the present invention, cracks are prevented from occurring in the conductor circuit formed at the intersection of at least two planar or curved surfaces formed on the molded resin of the three-dimensional printed wiring board.

Description

프린트배선기판 및 그 제조방법Printed wiring board and manufacturing method thereof

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명의 프린트배선기판의 개략도를 나타내고,FIG. 1 shows a schematic view of a printed wiring board of the present invention,

제2도는 패턴형상의 금속층을 가지는 프린트배선기판의 제조공정을 나타낸다.FIG. 2 shows a manufacturing process of a printed wiring board having a patterned metal layer.

Claims (14)

적어도 하나의 도체회로가, 서로 교차하는 두 개 이상이 평면을 포함하는 연속된 평면 혹은 곡면을 가지는 플라스틱 성형체 기판 표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면 사이에 연속된 도체회로가 형성되고, 상기 교차부의 상기 기판표면의 곡율보다 상기 교차부의 접착층 표면의 곡율이 큰 것을 특징으로 하는 프린트배선기판.A printed wiring board in which at least one conductor circuit is formed via an adhesive layer on a surface of a plastic molded body substrate having a continuous plane or curved surface including two or more planes intersecting each other, And the curvature of the surface of the adhesive layer of the intersection is larger than the curvature of the surface of the substrate of the intersection. 제1항에 있어서, 상기 교차부의 접착층 표면 곡율이 20㎛ 이상인 것을 특징으로 하는 프린트배선기판.The printed wiring board according to claim 1, wherein the cross-sectional area of the adhesive layer surface curvature is 20 占 퐉 or more. 적어도 하나의 도체회로가, 서로 교차하는 두 개 이상의 평면을 포함하는 연속된 평면 혹은 곡명을 가지는 플라스틱 성형체기판 표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면 사이에 연속된 도체회로가 형성되고, 상기 접착층의 탄성율이 기판의 탄성율보다 작은 것을 특징으로 하는 프린트배선기판.A printed wiring board in which at least one conductor circuit is formed by interposing an adhesive layer on a surface of a plastic molded body substrate having a continuous plane or a musical composition name including two or more planes intersecting with each other, And the elastic modulus of the adhesive layer is smaller than the modulus of elasticity of the substrate. 적어도 하나의 도체회로가, 서로 교차하는 두 개 이상의 평면을 포함하는 연속된 평면 혹은 곡면을 가지는 플라스틱 성형체기판 표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면 사이에 연속된 도체회로가 형성되고, 상기 접착층 표면의 거칠기가 10 내지 5S인 것을 특징으로 하는 프린트배선기판.At least one conductor circuit is formed on a surface of a plastic molded body substrate having a continuous plane or a curved surface including two or more planes intersecting with each other with a bonding layer interposed therebetween, And the roughness of the surface of the adhesive layer is 10 SIMILAR 5S. 적어도 하나의 도체회로가, 서로 교차하는 두 개 이상의 평면을 포함하는 연속된 평면 혹은 곡면을 가지는 플라스틱 성형체기판 표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면 사이에 연속된 도체회로가 형성되고, 상기 도체회로의 표면 거칠기가, 20㎛ Rmax 이하인 것을 특징으로 하는 프린트배선기판.At least one conductor circuit is formed on a surface of a plastic molded body substrate having a continuous plane or a curved surface including two or more planes intersecting with each other with a bonding layer interposed therebetween, And the surface roughness of the conductor circuit is not more than 20 mu m Rmax. 적어도 하나의 도체회로가, 서로 교차하는 두 개 이상의 평면을 포함하는 연속된 평면 혹은 곡면을 가지는 플라스틱 성형체기판 표면에 접착층을 개재하여 형성된 프린트배선기판에 있어서, 교차하는 평면 사이에 연속된 도체회로가 형성되고, 상기 접착층표면을 덮고 도체회로가 되는 부분 이외에 제2플라스틱 성형체를 형성한 것을 특징으로 하는 프린트배선기판.At least one conductor circuit is formed on a surface of a plastic molded body substrate having a continuous plane or a curved surface including two or more planes intersecting with each other with a bonding layer interposed therebetween, And a second plastic molding body is formed in addition to a portion that covers the surface of the adhesive layer and becomes a conductor circuit. 플라스틱 수지성형체를 형성하는 공정과, 상기 플라스틱 수지성형체의 표면에 접착층을 형성하는 공정과, 상기 접착층 표면에 도금촉매를 부착시키는 공정과, 상기 접착층표면에 도체회로부분 이외에 도금레지스트를 형성하는 공정과, 무전해도금에 의하여 도체회로패턴을 형성하는 공정과, 상기 레지스트를 제거하는 고엊을 포함하는 것을 특징으로 하는 프린트배선기판.A step of forming an adhesive layer on the surface of the plastic resin molded article; a step of attaching a plating catalyst to the surface of the adhesive layer; a step of forming a plating resist in addition to the conductor circuit portion on the surface of the adhesive layer; A step of forming a conductor circuit pattern by electroless plating, and a step of removing the resist. 플라스틱 수지성형체를 형성하는 공정과, 상기 플라스틱 수지성형체의 표면에 접착층을 형성하는 공정과, 상기 접착층 표면에 도금촉매를 부착시키는 공정과, 무전해도금에 의하여 상기 접착층 표면에 금속층을 형성하는 공정과, 상기 금속층 표면의 도체회로가 되는 부분에 에칭레이지스트를 형성한 공정과, 상기 금속층을 에칭함으로써 도체회로를 형성하는 공정과, 상기 레지스트를 제거하는 공정을 포함하는 것을 특징으로 하는 프린트배선기판의 제조방법.A step of forming an adhesive layer on the surface of the plastic resin molded article; a step of attaching a plating catalyst to the surface of the adhesive layer; a step of forming a metal layer on the surface of the adhesive layer by electroless plating; A step of forming an etching resist on a portion of the surface of the metal layer which becomes a conductor circuit, a step of forming a conductor circuit by etching the metal layer, and a step of removing the resist. Gt; 플라스틱 수지성형체를 형성하는 공정과, 상기 플라스틱 수지성형체의 표면에 접착층을 형성하는 공정과, 상기 접착층 표면에 도금촉매를 부착시키는 공정과, 상기 접착층표면에 무전해도금에 의하여 금속층을 형성하는 공정과, 상기 금속층표면의 도체회로부분 이외에 도금레지스트를 형성하는 공정과, 도체회로 부분에 도금처리에 의하여 도체회로를 형성하는 공정과, 상기 도체회로의 표면에 땜납하는 공정과, 상기 레지스트를 제거하는 공정과, 에칭에 의하여 도체회로부분 이외의 금속층을 제거하는 공정과, 상기 땜납도금층을 제거하는 공정을 포함하는 것을 특징으로 하는 프린트배선기판의 제조방법.A step of forming an adhesive layer on the surface of the plastic resin molded article; a step of attaching a plating catalyst to the surface of the adhesive layer; a step of forming a metal layer on the surface of the adhesive layer by electroless plating; A step of forming a plating resist on the surface of the metal layer in addition to the conductor circuit portion, a step of forming a conductor circuit on the conductor circuit portion by plating, a step of soldering on the surface of the conductor circuit, A step of removing a metal layer other than the conductor circuit portion by etching, and a step of removing the solder plated layer. 제1플라스틱 수지성형체를 형성하는 공정과, 제1플라스틱 수지성형체의 표면에 접착층을 형성하는 공정과, 상기 접착층 표면에 도금촉매를 부착시키는 공정과, 회로가 되는 부분 이외의 접착층 표면을 덮고 소망하는 형상의 제2플라스틱 수지성형체를 형성하는 공정과, 회로가 되는 접착층 표면에 무전해도금에 의하여 도체회로를 형성하는 공정을 포함하는 것을 특징으로 하는 프린트배선기판의 제조방법.A step of forming a first plastic resin molded article, a step of forming an adhesive layer on the surface of the first plastic resin molded article, a step of adhering a plating catalyst on the surface of the adhesive layer, a step of covering the surface of the adhesive layer, And a step of forming a conductor circuit by electroless plating on the surface of the adhesive layer to be a circuit. 제7항 내지 제10항 중 어느 한 항에 있어서, 상기 플라스틱 수지성형체 표면에 접착층을 스프레이법에 의하여 형성하는 것을 특징으로 하는 프린트배선기판의 제조방법.11. The method of manufacturing a printed wiring board according to any one of claims 7 to 10, wherein an adhesive layer is formed on the surface of the plastic resin molded article by spraying. 제7항 내지 제10항 중 어느 한 항에 있어서, 상기 플라스틱 수지성형체 표면에 접착층을 디프법에 의하여 형성하는 것을 특징으로 하는 프린트배선기판의 제조방법.11. The method of manufacturing a printed wiring board according to any one of claims 7 to 10, wherein an adhesive layer is formed on the surface of the plastic resin molded article by a dipping method. 제9항에 있어서, 도금레지스트를 형성한 후에 무전해도금을 사용하여 구리체 회로를 형성하는 것을 특징으로 하는 프린트배선기판의 제조방법.10. The method of manufacturing a printed wiring board according to claim 9, wherein a copper resist circuit is formed by using electroless plating after forming a plating resist. 제9항에 있어서, 도금레지스트를 형성한 후에 전기도금을 사용하여 구리제 회로를 형성하는 것을 특징으로 하는 프린트배선기판의 제조방법The method for manufacturing a printed wiring board according to claim 9, wherein a copper circuit is formed by using electroplating after the plating resist is formed ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960004103A 1995-02-23 1996-02-22 Printed wiring board and manufacturing method thereof KR960031645A (en)

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