JPH05235511A - Synthetic resin composite molded object and manufacture thereof - Google Patents

Abstract

PURPOSE:To improve the pattern precision of a plating layer, and prevent the peeling of a plating layer. CONSTITUTION:A synthetic resin composite molded object and its manufacturing method are constituted of the following; a resin molded object easy to be plated 21 having a pattern surface 28 corresponding with an electric circuit pattern to be formed, a resin molded object hard to be plated 22 which surrounds the resin molded object easy to be plated 21 except the pattern surface 28 so as to situate the pattern surface 28 at a recessed position from the surface, and a plating layer 25 plated on the pattern surface 28 of the resin molded object easy to be plated 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a synthetic resin composite molded article and a method for producing the same, and in particular, it is formed of an easily plating resin and a difficult plating resin, and a plating layer is formed on the surface of the easily plating resin. The present invention relates to a synthetic resin composite molded article useful for a printed circuit board, a circuit component, etc., and a method for manufacturing the same.

[0002]

2. Description of the Related Art In recent years, MCB has been used as a base material for wiring boards in order to rationalize electric wiring and improve the degree of freedom in shape.
(Molded Circuit Board), MWB (Molded Wiring Bo)
ard), MID (Molded Interconnection Device) and other synthetic resin composite molded products are used.

This synthetic resin composite molded article is made of, for example, as shown in JP-A-63-50482, a resin to which metal plating is hard to adhere (hereinafter, simply referred to as "hard plating resin") and a metal. It is a so-called two-shot molded product that uses a resin to which plating easily adheres (hereinafter simply referred to as "easy-plating resin"). Secondary plating is performed on the easily-plating resin in a predetermined pattern, and metal plating is applied to the surface. By applying the above, a predetermined circuit pattern is formed on the surface of the molded product.

When manufacturing this synthetic resin composite molded article, as shown in FIG. 5 (a), the primary molded body 11 having a projected pattern surface 14 corresponding to the pattern of the electric circuit to be formed is projected.
After molding the resin with easy-plating resin,
The primary molded body 11 excluding the pattern surface 14 as shown in (b) of FIG.
A secondary molded body 12 is formed by surrounding the periphery of the base metal with a hard-to-plate resin, and a basic molded product 13 is molded by this. After that, the roughened pattern surface 14 as shown in FIG.
Electroless plating treatment is performed. At this time, as shown in FIG. 5D, the metal does not adhere to the portion of the resin 12 that is difficult to plate, and the metal plating 16 is applied only to the pattern surface 14 that is the easily plating resin.
Thus, various circuits can be formed by utilizing the metal plated portion 16.

[0005]

However, according to the above-mentioned synthetic resin composite molded article, since the pattern surface of the easy-plating resin and the surface of the difficult-plating resin are adjacent to each other in the same plane, electroless plating is used. When the plating layer is formed, the plating is deposited not only in the thickness direction but also in the width direction, and the width of the circuit pattern due to the plating layer becomes thicker than the pattern surface of the primary molding, and the plating is microscopically viewed. Since there are considerable irregularities, the width thereof varies. Therefore, there is a disadvantage that the pattern accuracy of the plating layer is low. Further, since the plating layer is provided so as to slightly project from the basic molded product, it may be peeled off when it collides with something else.

Therefore, an object of the present invention is to provide a synthetic resin composite molded article capable of improving the pattern accuracy of the plating layer and preventing the plating layer from peeling, and a method for producing the same.

[0007]

In view of the above problems, the present invention improves the pattern accuracy of the plating layer and prevents the plating layer from being peeled off. Therefore, the pattern surface corresponding to the pattern of the electric circuit to be formed is formed. Easy-plating resin molded body, a hard-plating resin molded body surrounding the easy-plating resin molded body excluding the pattern surface so that the pattern surface is located at a position recessed from the surface, and the easy-plating resin molding The present invention provides a synthetic resin composite molded article composed of a plated layer plated on the pattern surface of a body.

Further, in order to achieve the above object, the present invention provides:
The primary molded body is formed of an easily-platable resin so as to have a pattern surface corresponding to the pattern of the electric circuit to be formed, and the primary molded body is removed except for the pattern surface so that the pattern surface is located at a position recessed from the surface. A secondary molded body is formed by surrounding it with a non-plating resin, and a plating layer is applied to the pattern surface of the primary molded body to manufacture a synthetic resin composite molded article.

As the easily-platable resin used for molding the temporary molded body, among the hard-to-plate resins described later, those which are amorphous or have a low molecular weight and whose surface is easily roughened by chemicals or chemicals, palladium. , Mixed with an electroless plating catalyst such as a noble metal such as gold or silver is used.

On the other hand, as the non-plating resin, all ordinary plastic resins can be used, but a thermoplastic resin called an engineering plastic excellent in rigidity, dimensional stability, electrical characteristics, chemical resistance, etc., For example, polycarbonate, polyamide, polysulfone, polyetherimide, polyether sulfone, polyphenylene sulfide, liquid crystal polymer (trade name: Novacurate, Vectra, etc.), thermosetting resin such as phenol resin, epoxy resin, diallyl phthalate resin, Alternatively, a resin in which a filler such as glass fiber, potassium titanate fiber, or calcium carbonate is mixed is used.

[0011]

According to the synthetic resin composite molded article of the present invention having the above-mentioned structure, the circuit pattern formed by the plating layer on the pattern surface is formed depending on the concave portion formed with the width equal to or smaller than the pattern surface. Therefore, the pattern accuracy of the plating layer is determined by the recess, and the circuit pattern of the plating layer becomes thicker than the width of the pattern surface.
The width does not become uneven. Therefore, a highly accurate circuit pattern can be obtained. Further, since the plating layer is located in the recess, it does not collide with foreign matter and the like, and therefore the plating layer does not peel off.

[0012]

The synthetic resin composite molded article of the present invention and the method for producing the same will be described below in detail with reference to the accompanying drawings.

FIG. 1 shows the entire cross-sectional structure of a synthetic resin composite molded article 20 according to an embodiment. The synthetic resin composite molded article 20 includes a primary molded body 21 in which a pattern surface 28 corresponding to a pattern of an electric circuit to be formed is projected, and a secondary molded body 22 surrounding the primary molded body 21 except for the pattern surface 28. And the plating layer 25 applied to the pattern portion 28 of the primary molded body 21.

The primary molded body 21 has a pattern surface 2 as described above.
8 and the through-hole 29 filled with the resin that is difficult to plate in the secondary molding, the pattern surface 28 is roughened to improve the adhesion of the plating layer 25. Has been applied.

The secondary molded body 22 is formed by surrounding the primary molded body 21 with a hard-to-plate resin so that the pattern surface 28 of the primary molded body 21 is located at a position recessed from the surface thereof. Has been done. Therefore, the concave portion 27 is formed in accordance with the pattern of the electric circuit formed on the surface.

The plating layer 25 is formed in the recess 2 of the secondary molded body 22.
In the inside of 7, the roughened pattern surface 28 is plated.

The method for producing the synthetic resin composite molded article of the present invention will be described below with reference to FIGS. 2 (a), (b), (c) and (d). First, the primary molded body 21 is formed of an easily-platable resin so as to have the pattern surface 28 corresponding to the pattern of the electric circuit to be formed ((a) of FIG. 2).

Then, the primary molded body 21 is attached to the upper die 3
0 and the inside of the lower die 31 ((b) of FIG. 2).
The upper mold 30 is provided with the pattern surface 28 of the primary molded body 21.
Has a plurality of protrusions 26 corresponding to, and the width of the protrusions 26 is the same as or smaller than the width of the pattern surface 28. Then, the protrusion 26 is brought into contact with the pattern surface 28 of the primary molded body 21.

Next, the upper mold 30 and the lower mold 31 are filled with a hard-to-plate resin, and the primary molded body 21 is surrounded by the hard-plated resin to form a secondary molded body 22. ,
As a result, the basic molded product 23 is obtained ((c) of FIG. 2). At this time, since the protrusion 26 of the upper mold 30 is arranged above the pattern portion 28 of the primary molded body 21, the pattern portion 2
On the upper part of 8, the secondary molded body 22 is not formed, but a concave portion 27 based on the protrusion 26 is formed. The width of the recess 27 depends on the projection 26, that is, the same as or smaller than the pattern surface 28.

Thereafter, the pattern surface 28 exposed in the recess 27 of the basic molded product 23 is roughened ((d) of FIG. 2).

Finally, a plating layer 25 is applied to the roughened pattern surface 28 so as not to project from the surface of the secondary molded body 22, and the synthetic resin composite molded article 2 as shown in FIG.
Get 0.

According to the synthetic resin composite molded article having the above structure, the circuit pattern formed by the plating layer 25 on the pattern surface 28 depends on the recess 27 formed to have the same width as or smaller than the pattern surface 28. Because it is formed
The pattern accuracy of the plating layer 25 is determined by the recesses 27, and the circuit pattern of the plating layer 25 does not become thicker than the width of the pattern surface 28, nor does the width become uneven. Therefore, a highly accurate circuit pattern can be obtained. Further, since the plating layer 25 is located in the recess 27, it does not collide with foreign matter and the like, and therefore the plating layer 25 does not peel off.

As comparative examples, (a), (b), (c), and
Through the steps as shown in (d), a synthetic resin composite molded article as shown in FIG. 4 was manufactured. The manufacturing method is shown in FIGS.
Although substantially the same as (c) and (d), the width of the protrusion 26 of the upper mold 30 is larger than the width of the pattern surface 28 of the primary molded body 21. Therefore, the width of the recess 27 of the manufactured synthetic resin composite molded article 20 of FIG. 3 is also larger than the width of the pattern surface 28.

According to such a synthetic resin composite molded article,
Since the plating layer 25 is located inside the concave portion 27 to form a circuit pattern and the plating layer 25 does not collide with foreign matter or the like, there is no risk of the plating layer 25 peeling, but as shown in FIG. As with the synthetic resin composite molded product, the plating layer 25 is deposited in the width direction, and a problem that only low pattern accuracy can be obtained remains.

[0025]

As described above, according to the synthetic resin composite molded article of the present invention and the method for producing the same, an easily plateable resin molded body having a pattern surface corresponding to the pattern of the electric circuit to be formed, and the surface A hard-to-plate resin molded body that surrounds the easily-plated resin molded body excluding the pattern surface so that the pattern surface is located in a more recessed position, and a plating layer plated on the pattern surface of the easily-plated resin molded body. Since it is configured, it is possible to improve the pattern accuracy of the plating layer and prevent peeling of the plating layer.

[Brief description of drawings]

FIG. 1 is a sectional view showing a synthetic resin composite molded article of the present invention.

FIG. 2 is a sectional view showing a method for manufacturing a synthetic resin composite molded article of the present invention.

FIG. 3 is a sectional view showing a method for manufacturing a synthetic resin composite molded article as a comparative example.

FIG. 4 is a sectional view showing a synthetic resin composite molded article as a comparative example.

FIG. 5 is a sectional view showing a conventional synthetic resin composite molded article and a method for manufacturing the same.

[Explanation of symbols]

10 Synthetic resin composite molded product 11
Primary molded body 12 Secondary molded body 13
Basic molded product 14 Pattern surface 16
Plating layer 20 Synthetic resin composite molded product 21
Primary molded body 22 Secondary molded body 23
Basic molded product 25 Plating layer 26
Protrusion 27 Recess 28
Pattern surface 29 Through hole 30
Upper mold 31 Lower mold

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takanobu Ishibashi 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Hitachi Cable Electric Power Co., Ltd. Power Systems Laboratory (72) Inventor Hideki Asano 5 Hidakacho, Hitachi City, Ibaraki Prefecture 1-1-1 Hitachi Cable Co., Ltd. Power Systems Research Center

Claims (2)

[Claims] 1. An easy-plating resin molding having a pattern surface corresponding to a pattern of an electric circuit to be formed, and the easy-plating except for the pattern surface so that the pattern surface is located at a position recessed from the surface. A resin-molded product which is hard to plate and surrounds a resin-molded resin, and a plating layer plated on the pattern surface of the easily-plated resin-molded product. 2. A primary molded body is formed of an easily-platable resin so as to have a pattern surface corresponding to a pattern of an electric circuit to be formed, and the pattern surface is positioned to be recessed from the surface. Except that the primary molded body is surrounded by a hard-to-plate resin to form a secondary molded body, and a plating layer is applied to the pattern surface of the primary molded body to produce a synthetic resin composite molded article. ..