AU2001248395A1 - Method of manufacturing a membrane sensor - Google Patents

Method of manufacturing a membrane sensor

Info

Publication number
AU2001248395A1
AU2001248395A1 AU2001248395A AU4839501A AU2001248395A1 AU 2001248395 A1 AU2001248395 A1 AU 2001248395A1 AU 2001248395 A AU2001248395 A AU 2001248395A AU 4839501 A AU4839501 A AU 4839501A AU 2001248395 A1 AU2001248395 A1 AU 2001248395A1
Authority
AU
Australia
Prior art keywords
manufacturing
membrane sensor
membrane
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001248395A
Inventor
Altti Torkkeli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Oyj
VTI Hamlin Oy
Original Assignee
Nokia Oyj
VTI Hamlin Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Oyj, VTI Hamlin Oy filed Critical Nokia Oyj
Publication of AU2001248395A1 publication Critical patent/AU2001248395A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L13/00—Devices or apparatus for measuring differences of two or more fluid pressure values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
AU2001248395A 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor Abandoned AU2001248395A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FI20000661 2000-03-21
FI20000661A FI115500B (en) 2000-03-21 2000-03-21 Method of manufacturing a membrane detector
PCT/FI2001/000278 WO2001078448A1 (en) 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor

Publications (1)

Publication Number Publication Date
AU2001248395A1 true AU2001248395A1 (en) 2001-10-23

Family

ID=8557994

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001248395A Abandoned AU2001248395A1 (en) 2000-03-21 2001-03-20 Method of manufacturing a membrane sensor

Country Status (7)

Country Link
US (1) US6901804B2 (en)
EP (1) EP1273203B1 (en)
JP (1) JP5123457B2 (en)
KR (1) KR100809674B1 (en)
AU (1) AU2001248395A1 (en)
FI (1) FI115500B (en)
WO (1) WO2001078448A1 (en)

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US6715359B2 (en) * 2001-06-28 2004-04-06 Tactex Controls Inc. Pressure sensitive surfaces
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
US7592239B2 (en) 2003-04-30 2009-09-22 Industry University Cooperation Foundation-Hanyang University Flexible single-crystal film and method of manufacturing the same
JP2004356707A (en) * 2003-05-27 2004-12-16 Hosiden Corp Sound detection mechanism
DE102004011145B4 (en) * 2004-03-08 2006-01-12 Infineon Technologies Ag Microphone e.g. semiconductor-condenser microphone, for use in mobile phone, has membrane structure with boundary region, which is not movable due to pressure, on which carrier is attached, where region and opposing structure have recesses
CN101151939B (en) * 2005-03-28 2012-08-08 美商楼氏电子有限公司 Acoustic assembly for a transducer
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
DE102006023165B4 (en) * 2006-05-17 2008-02-14 Infineon Technologies Ag Method for producing an acoustic mirror from alternately arranged layers of high and low acoustic impedance
US8569850B2 (en) * 2006-10-11 2013-10-29 Sensfab Pte Ltd Ultra low pressure sensor
JP4144640B2 (en) 2006-10-13 2008-09-03 オムロン株式会社 Method for manufacturing vibration sensor
DE102006055147B4 (en) 2006-11-03 2011-01-27 Infineon Technologies Ag Sound transducer structure and method for producing a sound transducer structure
US8661910B2 (en) * 2007-01-19 2014-03-04 Ipg, Llc Capacitive sensor
DE102007010913A1 (en) * 2007-03-05 2008-09-11 Endress + Hauser Gmbh + Co. Kg pressure sensor
DE102008040521A1 (en) * 2008-07-18 2010-01-21 Robert Bosch Gmbh Method for producing a component, method for producing a component arrangement, component and component arrangement
US8345895B2 (en) 2008-07-25 2013-01-01 United Microelectronics Corp. Diaphragm of MEMS electroacoustic transducer
BRPI0920481A2 (en) * 2009-01-27 2015-12-22 Hewlett Packard Development Co acoustic transducer device, microphone and transducer
US8334159B1 (en) * 2009-03-30 2012-12-18 Advanced Numicro Systems, Inc. MEMS pressure sensor using capacitive technique
CN101534466A (en) * 2009-04-15 2009-09-16 无锡市纳微电子有限公司 Silicon microphone chip and manufacture method thereof
CN201467442U (en) * 2009-05-15 2010-05-12 瑞声声学科技(常州)有限公司 Capacitor microphone
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
JP4947220B2 (en) * 2010-05-13 2012-06-06 オムロン株式会社 Acoustic sensor and microphone
US8316718B2 (en) * 2010-08-23 2012-11-27 Freescale Semiconductor, Inc. MEMS pressure sensor device and method of fabricating same
US8794075B2 (en) * 2011-08-11 2014-08-05 Nxp, B.V. Multilayered NONON membrane in a MEMS sensor
EP2674392B1 (en) 2012-06-12 2017-12-27 ams international AG Integrated circuit with pressure sensor and manufacturing method
JP6426620B2 (en) * 2012-12-18 2018-11-21 Tdk株式会社 Top port MEMS microphone and method of manufacturing the same
KR101346583B1 (en) * 2013-05-23 2014-01-03 (주)에스엠인스트루먼트 Sound measuring apparatus having flexible substrate using mems microphone and method for making the apparatus
TWI523808B (en) * 2014-01-29 2016-03-01 先技股份有限公司 Mems gas sensing device
CN105142092A (en) * 2015-07-21 2015-12-09 合肥鑫晟光电科技有限公司 Substrate and manufacturing method thereof and display device
WO2017105351A1 (en) * 2015-12-15 2017-06-22 Agency For Science, Technology And Research Method and deployable multi-spine apparatus for catheter-based renal denervation
CN107690115B (en) * 2016-08-04 2023-03-17 山东共达电声股份有限公司 Micro-electro-mechanical microphone and manufacturing method thereof
GB2557364B (en) * 2016-11-29 2020-04-01 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes
US12075223B2 (en) * 2016-12-29 2024-08-27 Gmems Tech Shenzhen Limited Process of fabricating capacitive microphone comprising movable composite conductor and stationary single conductor
US11601763B2 (en) * 2016-12-29 2023-03-07 Gmems Tech Shenzhen Limited Lateral mode capacitive microphone including a capacitor plate with sandwich structure for ultra high performance
US12075222B2 (en) * 2016-12-29 2024-08-27 Gmems Tech Shenzhen Limited Process of fabricating capacitive microphone comprising moveable single conductor and stationary composite conductor
US11765533B2 (en) * 2016-12-29 2023-09-19 Gmems Tech Shenzhen Limited Capacitive microphone with two signal outputs that are additive inverse of each other
US11765534B2 (en) * 2016-12-29 2023-09-19 Gmems Tech Shenzhen Limited Capacitive microphone with two signal outputs that are additive inverse of each other
US10798508B2 (en) * 2016-12-29 2020-10-06 Gmems Tech Shenzhen Limited Process of fabricating lateral mode capacitive microphone
US12069455B2 (en) * 2016-12-29 2024-08-20 Gmems Tech Shenzhen Limited Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure
FR3061558B1 (en) * 2017-01-04 2019-08-16 Rubix MICROPHONE COMPRISING MEANS FOR MEASURING GAS AND METHOD FOR MEASURING GAS USING SUCH A MICROPHONE
GB2563091A (en) * 2017-05-31 2018-12-05 Cirrus Logic Int Semiconductor Ltd MEMS devices and processes

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AT392182B (en) 1989-07-31 1991-02-11 Akg Akustische Kino Geraete ELECTRICALLY CONDUCTIVE CARRIER FOR A COUNTERELECTRODE OF A CONDENSER MICROPHONE
AT399230B (en) * 1992-04-02 1995-04-25 Avl Verbrennungskraft Messtech DEVICE FOR SELECTIVE FEEDING OF AN ANALYZER
FR2695787B1 (en) * 1992-09-11 1994-11-10 Suisse Electro Microtech Centr Integrated capacitive transducer.
US5369544A (en) * 1993-04-05 1994-11-29 Ford Motor Company Silicon-on-insulator capacitive surface micromachined absolute pressure sensor
US5949118A (en) 1994-03-14 1999-09-07 Nippondenso Co., Ltd. Etching method for silicon substrates and semiconductor sensor
FI100918B (en) * 1995-02-17 1998-03-13 Vaisala Oy Surface micromechanical, symmetrical differential pressure sensor
DE19648424C1 (en) 1996-11-22 1998-06-25 Siemens Ag Micromechanical sensor
US5944970A (en) 1997-04-29 1999-08-31 Honeywell Inc. Solid state electrochemical sensors
DE19741046C1 (en) 1997-09-18 1999-05-06 Sennheiser Electronic Single chip microphone is produced using only three photolithographic masking steps

Also Published As

Publication number Publication date
EP1273203A1 (en) 2003-01-08
FI20000661A (en) 2001-09-22
KR20030053467A (en) 2003-06-28
FI20000661A0 (en) 2000-03-21
US20030094047A1 (en) 2003-05-22
KR100809674B1 (en) 2008-03-05
FI115500B (en) 2005-05-13
JP2003530717A (en) 2003-10-14
WO2001078448A1 (en) 2001-10-18
EP1273203B1 (en) 2013-07-10
JP5123457B2 (en) 2013-01-23
US6901804B2 (en) 2005-06-07

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