DE102015012018A1 - Electronic assembly and method of making the same - Google Patents

Electronic assembly and method of making the same

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Publication number
DE102015012018A1
DE102015012018A1 DE102015012018.2A DE102015012018A DE102015012018A1 DE 102015012018 A1 DE102015012018 A1 DE 102015012018A1 DE 102015012018 A DE102015012018 A DE 102015012018A DE 102015012018 A1 DE102015012018 A1 DE 102015012018A1
Authority
DE
Germany
Prior art keywords
sensor
film
film piece
piece
particular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102015012018.2A
Other languages
German (de)
Inventor
Eike Kottkamp
Daniel Baasner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERWIN QUARDER SYSTEMTECHNIK GmbH
Original Assignee
ERWIN QUARDER SYSTEMTECHNIK GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ERWIN QUARDER SYSTEMTECHNIK GmbH filed Critical ERWIN QUARDER SYSTEMTECHNIK GmbH
Priority to DE102015012018.2A priority Critical patent/DE102015012018A1/en
Publication of DE102015012018A1 publication Critical patent/DE102015012018A1/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0277Bendability or stretchability details
    • H05K1/028Bending or folding regions of flexible printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/118Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means
    • G01N27/02Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material
    • G01N27/04Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating resistance
    • G01N27/06Investigating or analysing materials by the use of electric, electro-chemical, or magnetic means by investigating the impedance of the material by investigating resistance of a liquid
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/046Planar parts of folded PCBs making an angle relative to each other
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09081Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1327Moulding over PCB locally or completely
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Abstract

The invention relates to a method for producing a particularly dimensionally stable electronic assembly (11-11 '' ') with printed conductors (12) and with at least one sensor (14) comprising the following steps: a) applying electrically conductive printed conductors (12) and one , with at least one of the conductor tracks (12) connected to a sensor (14) on a preferably plastically deformable, flat, unconverted film piece (10) by printing or by thin film techniques, such as sputtering or etching, b) reshaping a portion of the sheet-like film piece (10 ), in particular by deep-drawing, namely a region in which the sensor (14) sits, in particular such that this film portion after forming along with the sensor (14) is arranged at an angle or at a distance parallel to the unconverted film gap plane.

Description

  • The present invention relates to a preferably dimensionally stable electronic assembly with printed conductors and at least one sensor for measuring physical, chemical or biological properties and to a method for producing such an assembly.
  • There are various types of electronic assemblies with printed conductors and at least one sensor known. As a rule, rigid printed circuit boards (printed circuit boards) are provided with conductor tracks for the production of the same and then fitted separately with electronic components designed as measuring sensors. The production of such assemblies is relatively expensive. In contrast to this, electronic assemblies are also known in which elastic-flexible printed circuit films are generally used and equipped with separate electronic components.
  • It is an object of the present invention to provide a preferably dimensionally stable electronic assembly with printed conductors and at least one sensor, which is as simple and inexpensive to manufacture. It is another object of the invention to provide a corresponding manufacturing method for such modules.
  • These objects are achieved by a method having the features of claim 1 and a device having the features of claim 9.
  • The inventive method for producing a preferably dimensionally stable electronic assembly with interconnects and at least one sensor is characterized by the following steps:
    • a) First, both the electrically conductive interconnects and at least one sensor, which is electrically conductively connected to at least one of the interconnects (preferably with at least two of the interconnects), applied to a preferably plastically deformable, flat, unconverted film piece. The film piece can also be part of a (larger) film section or a film web. The application of the conductor tracks on the film piece is preferably carried out by printing, but can also be done by means of suitable known thin-film techniques, such as sputtering, etching or the like.
    • b) After applying the conductor tracks and the at least one sensor then at least a portion of the sheet-like film piece is preferably plastically deformed, in particular deep-drawn. Namely, at least the area in which the at least one sensor sits. The reshaping can take place in such a way that this film piece area is arranged together with the sensor after forming at an angle or at a distance parallel to the unconverted film gap plane.
  • The preferred use of plastically deformable film pieces, such as PC, PET, PEI, PI, PS, thereby allowing the manufacturing technology relatively inexpensive design of three-dimensional, in this case dimensionally stable electronic assemblies with sensors by appropriate forming the same into the desired shape. The required plastically deformable piece of film is then designed to delimit, for example, elastic film pieces in such a way that it retains its end shape induced thereby after the forming process.
  • The sensor or sensor (Meßgrößenaufnehmer) is defined in a known manner as a device that can detect (physical, biological or chemical) properties, in particular its environment, such as an impedance, conductivity, temperature, etc. as a measure.
  • In the simplest case, for example, the sensor may consist of (or comprise) printed circuit traces that may be designed to measure characteristics, such as impedances. These conductor track sections can be designed, for example, as a meander structure.
  • The sensor can also consist of one or more electrodes, in particular a pair of electrodes (or have them). All types of sensor that can be applied by printing or by thin-film techniques are conceivable.
  • By the sensor according to the invention preferably printed together with the conductor tracks on the flat output film piece, eliminates a manufacturing complex, separate placement of a created in a first manufacturing process interconnect structure with a separate Meßaufnehmerbauteil, as is necessary in the prior art and usually by mechanical loading equipment he follows.
  • The electronic assembly according to the invention may have a corresponding measuring technology or measuring electronics which processes and optionally evaluates the measured variables transmitted by the measuring sensor. The module can also be connected to an external measuring electronics, which makes this possible.
  • Appropriately, it is generally envisaged that the film gap area, in which the applied sensor sits, is reshaped so that it defines a staggered to the unconverted film gap level space - sensor space - in which then sits the sensor.
  • By ultimately at least one formation in the aforementioned, initially planar-flat foil portion is created in each case in the forming process, preferably several embodiments, can be created in a simple and cost-effective manner an electronic assembly in which the Meßaufnehmerraum as a sample or analysis room or as a sample chamber is trained. This can then serve to receive samples to be analyzed, such as liquids, solids, etc. The respective sensor detects or measures at least one property of the respective sample. In this way, a multi-well plate with a multiplicity of sample chambers can also be inexpensively manufactured from a film piece with a (at least one) sensor arranged in the individual sample chambers.
  • In a further concretization of the invention, the film piece region in which the printed sensor is seated is preferably reshaped such that the sensor sits against a side wall of the sensor chamber which is formed from the film piece and extends at an angle to the unformed film piece plane, specifically on a side facing the sensor chamber this side wall.
  • Alternatively, the film piece in the aforementioned range could also be reshaped in such a way that the sensor is seated on a bottom wall of the sensor chamber running parallel to the unconverted film gap plane, insofar as provided.
  • It is again emphasized that in particular a printing of the conductor tracks and the sensor offers particular advantages. In such a case, the printed conductors and the sensor are preferably printed on the film using one or more printable materials enriched with electrically conductive components. In particular, a printable material may be a polymer matrix material enriched accordingly with conductive particles. Inkjet printing processes can be used as well as mass printing processes such as gravure, offset and flexographic printing processes.
  • It is important in this context at least for the application of the conductor (s), which ends at the sensor, but possibly also for the sensor to use in each case a sufficiently flexible material, such as PC, PET, PEI, PI, PS, the Accordingly, during the forming process described above, such as a deep drawing process, would not break or form cracks, which then affect the electrical conductivity of the conductor or the sensor.
  • In a further embodiment of the invention, the printed conductors and possibly additionally provide the sensor after application to the film piece on its side facing away from the film piece with a protective layer, in particular with a side facing away from this and possibly also other sides overlapping film layer or a covering of this plastic coating.
  • Regardless of whether such a protective layer is applied, provision can be made for the film piece to be injection-molded onto the side facing away from the strip conductors and the sensor in an injection molding process with plastic or for the film piece to be glued or laminated onto a prefabricated injection molded part on this side, to further improve the stability of the dimensionally stable assembly according to the invention.
  • According to the invention, a preferably dimensionally stable electronic assembly produced in particular by the above method has correspondingly printed conductors and at least one sensor which, as already explained above, has been applied to the film by printing or thin-film techniques such as sputtering or etching, wherein the sensor is arranged in a formed by a forming process foil portion. Preferably, this is arranged at an angle or at a distance parallel to an unconverted film gap plane of the film piece of the assembly.
  • Preferably, the plastically deformed piece of film at least in the region of the conductor tracks and the sensor on a protective layer for protecting the conductor tracks / the sensor, in particular a covering this film layer or a coating of plastic.
  • Further, the side facing away from the conductor track and the sensor side of the film piece is preferably firmly connected to an injection molded plastic part.
  • Further features of the invention will become apparent from the appended claims, from the following description of preferred embodiments of the invention and from the accompanying drawings.
  • It shows:
  • 1 an unconverted, sheet-like film piece with applied conductor tracks and sensors in cross-section,
  • 2 the piece of film out 1 after a forming process,
  • 3 the piece of film out 2 after a back injection with plastic,
  • 4 a representation of a piece of film accordingly 1 , but with additionally applied protective layer,
  • 5 the piece of film out 4 after a forming process,
  • 6 a piece of film similar to the 4 but with an interruption of the protective layer in the area of the sensors,
  • 7 the piece of film out 6 after a forming process.
  • In the drawings, various embodiments of inventive, in the present case dimensionally stable electronic assemblies 11 . 11 ' . 11 '' and 11 ''' shown.
  • Such an assembly 11 - 11 ''' has a foil piece or a foil 10 , to which at first in a flat, that is in a not yet transformed initial state, cf. for example 1 , electrically conductive tracks 12 be applied. On such a piece of film 10 become the tracks 12 preferably printed by means of known printing methods for electronic circuits on one of the film back pages. The conductor track structure can assume any shape and is ultimately determined by the desired electronic properties of the later electronic module 11 - 11 ''' ,
  • An important feature of the invention is that in the inter alia in 1 shown, essentially two-dimensional or planar state of the film piece 10 not just the tracks 12 by printing or alternatively by (other) thin-film techniques, but also sensors 14 , With the sensors 14 For example, they may be electrodes that are so on the film piece 10 be placed in electrically conductive contact with at least one track 12 stand. As a rule, they are connected to one or at least two tracks 12 connected. Alternatively, it may also be, for example, meandering sections of printed conductors 12 act, which are designed to measure, for example, impedances.
  • If the finished electronic dimensionally stable assembly 11 - 11 ''' It is also conceivable to have properties of a complete circuit, by means of the printing or thin-film techniques additionally required for such circuits electronic (semiconductor) components, such as resistors, transistors, capacitors or the like, on the film piece 12 imprint or applied by means of thin-film techniques.
  • Both suitable printing materials and corresponding printing devices that make this possible are known in the art. The printing could be done, inter alia, by inkjet printers by means of per se known plastic-based "inks" which are enriched with electrically conductive particles.
  • In particular, it is conceivable to apply such structures of electronic circuits by means of 3D printers.
  • In 2 is another feature of the invention shown by way of example. After applying the conductor tracks 12 and the sensor 14 becomes the foil piece 10 in the area of the sensors 14 transformed, deep-drawn here. This is in 2 a thermoforming stamp 16 indicated in the drawing, which transforms certain sections of this area down.
  • Specifically, sections become 10a of the film piece 10 on which the sensors are located 14 located, each together with the respective sensor 14 in the context of the forming operation relative to the previous film gap level or to each unillustrated during the process sheet sections 10b (Downwards or alternatively upwards) bent, namely to form a funnel-shaped in the present embodiment Meßaufnehmerraums 18 , This sensor room 18 In the present case, it is open at the bottom because the film piece 10 between the two sensors 14 an opening 19 having. This opening 19 but it is not mandatory.
  • As can be seen, the sensors are located 14 after the forming process within the sensor chamber 18 , The foil pieces sections 10a each form at an angle to the unconverted film gap plane extending side walls of the sensor chamber 18 ,
  • The use of plastically deformable foil material and the use of sufficiently flexible conductor material ensures that each of the respective sensor 14 ending track 12 in the area of the transition between the film piece 10a and 10b is bent during the forming process (in the present case down, alternatively up), even after the plastic deformation is still functional, since no cracks or breaks in the respective trace 14 occur. In addition, the electronic module 11 dimensionally stable in that it remains in its final shape after forming.
  • In the 3 is an assembly 11 ' shown off the assembly 11 of the 2 originated. This was after the forming of the film piece 10 or the respective film sections 10a with a plastic layer 20 back-molded. The plastic layer 20 then simultaneously forms the bottom wall of the sensor chamber 18 , The sensor room 18 can then be filled, for example from above with analysis fluids, which then by means of the sensor 14 can be examined.
  • As can be seen, the back molding is done with the plastic compound 20 on the side of the film piece 10 that the conductor tracks 12 or the sensors 14 turned away. Alternatively, a similar plastic part 20 also be made separately and the piece of film 2 be laminated or glued to the separate plastic part.
  • In 4 . 5 is another assembly 11 '' shown at the conductor tracks 12 and the sensor 14 upwards, that is on the film piece 10 opposite side completely with a protective layer 22 are covered. The tracks 12 and the sensor 14 are in the protective layer 22 embedded. The protective layer is preferred 22 between the application of the conductor tracks 12 and the sensor 14 and later forming the film piece sections 10a applied.
  • In the 6 and 7 is another assembly 11 '' shown in which the sensor 14 in contrast to the assembly 11 '' at least in some areas not from the protective layer 22 are covered. This is to make a direct contact with the sensor 14 by allowing, for example, an analysis fluid or the like.
  • LIST OF REFERENCE NUMBERS
  • 10
    foil
    10a
    Foil piece portion
    10b
    Foil piece portion
    11-11 '' '
    module
    12
    conductor tracks
    14
    sensor
    16
    Ironing punch
    18
    Messaufnehmerraum
    19
    opening
    20
    Plastic layer
    22
    protective layer

Claims (11)

  1. Process for producing a preferably dimensionally stable electronic assembly ( 11 - 11 ''' ) with conductor tracks ( 12 ) and with at least one sensor ( 14 ) for the measurement of physical, chemical or biological properties, comprising the following steps: a) application of electrically conductive interconnects ( 12 ) and one, with at least one of the tracks ( 12 ) connected sensors ( 14 ) on a preferably plastically deformable, flat, unconverted film piece ( 10 ) by printing or by thin-film techniques, such as sputtering or etching, b) reshaping a region of the sheet-like film piece ( 10 ), in particular by deep drawing, namely an area in which the sensor ( 14 ) is seated, in particular in such a way that this film piece area after forming together with the sensor ( 14 ) is arranged at an angle or at a distance parallel to the unconverted film gap plane.
  2. Method according to claim 1, characterized in that the film piece region in which the applied sensor ( 14 ), is reshaped so that it has a space arranged offset to the non-deformed film plane ( 18 ) - measuring sensor compartment - in which the sensor ( 14 ) sits.
  3. Method according to claim 2, characterized in that the film piece region in which the applied sensor ( 14 ) is reshaped so that the sensor ( 14 ) on one of the pieces of film ( 10 ) formed side wall ( 10a ) of the sensor room ( 18 ), which runs at an angle to the unconverted film gap plane, at one of the sensor chamber ( 18 ) side facing the side wall ( 10a ).
  4. Method according to one or more of the preceding claims, characterized in that the conductor tracks ( 12 ) and the sensor ( 18 ) using one or more, with electrically conductive constituents enriched, printable materials, in particular plastic materials, on the film piece ( 10 ) are printed.
  5. Method according to one or more of the preceding claims, characterized in that on the film piece ( 10 ) between the application of the conductor tracks ( 12 ) and the sensor ( 14 ) and the following Forming process at least in the area of the tracks ( 12 ) and possibly also of the sensor ( 14 ) a protective layer ( 22 ) to protect the tracks ( 12 ) / of the sensor ( 14 ) is applied, in particular a covering this film layer or a coating of plastic.
  6. Method according to one or more of the preceding claims, characterized in that the film piece ( 10 ) after the forming process on the of the conductor track ( 12 ) and the sensor ( 14 ) is back-injected with plastic in an injection molding process, or that the film piece ( 10 ) is glued or laminated on this side after the forming process on a prefabricated Spritzgutssteil.
  7. Method according to one or more of the preceding claims, characterized in that the sensor is formed by one or more, in particular meandering, preferably printed printed conductor sections.
  8. Method according to one or more of the preceding claims, characterized in that the sensor comprises one or more, in particular printed electrodes.
  9. Electronic, preferably dimensionally stable assembly ( 11 - 11 ''' ) with at least one sensor ( 14 ) for the measurement of physical, chemical or biological properties, in particular produced by the method according to one of claims 1-8, characterized in that the assembly is a preferably plastically deformed piece of film ( 10 ) has with conductor tracks ( 12 ) and at least one sensor ( 14 ), each of which has been applied to the film by printing or thin-film techniques, such as sputtering or etching, the sensor ( 14 ) is arranged in a film piece area formed by a forming process, preferably in a film piece area which is at an angle or at a distance parallel to an unconverted film piece plane of the film piece (US Pat. 10 ) of the assembly ( 11 - 11 ''' ) is arranged.
  10. Assembly ( 11 - 11 ''' ) according to claim 9, characterized in that the preferably plastically deformed piece of film ( 10 ) at least in the area of the tracks ( 12 ) and the sensor ( 14 ) a protective layer ( 22 ) to protect the tracks ( 12 ) / of the sensor ( 14 ), in particular a film layer covering this or a coating of plastic.
  11. Assembly ( 11 - 11 ''' ) according to claim 9 or 10, characterized in that the of the conductor track ( 12 ) and the sensor ( 14 ) facing away from the film piece ( 10 ) Is firmly connected to an injection molded plastic part.
DE102015012018.2A 2015-09-21 2015-09-21 Electronic assembly and method of making the same Pending DE102015012018A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102015012018.2A DE102015012018A1 (en) 2015-09-21 2015-09-21 Electronic assembly and method of making the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015012018.2A DE102015012018A1 (en) 2015-09-21 2015-09-21 Electronic assembly and method of making the same
PCT/EP2016/001496 WO2017050417A1 (en) 2015-09-21 2016-09-05 Electronic assembly and method for production thereof

Publications (1)

Publication Number Publication Date
DE102015012018A1 true DE102015012018A1 (en) 2017-04-06

Family

ID=56896502

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102015012018.2A Pending DE102015012018A1 (en) 2015-09-21 2015-09-21 Electronic assembly and method of making the same

Country Status (2)

Country Link
DE (1) DE102015012018A1 (en)
WO (1) WO2017050417A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010019597A1 (en) * 2010-05-05 2011-11-10 Albert-Ludwigs-Universität Freiburg Method for producing an electrode structure and electrode structure for a neuronal interface
DE102011087659A1 (en) * 2010-12-03 2012-06-06 Ngk Spark Plug Co., Ltd. Method for forming a conductor pattern
DE102013003541A1 (en) * 2013-03-02 2014-09-04 Leopold Kostal Gmbh & Co. Kg Process for the preparation of a functionalized thermoplastic film with hybrid layer structures and plastic film processed according to this method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2692351B1 (en) * 1992-06-15 1994-09-23 Jaeger Sensor, in particular rotation sensor integrated in a motor vehicle bearing.
DE10023015A1 (en) * 2000-05-05 2002-01-24 Inst Chemo Biosensorik Process to produce a three-dimensional sensor element

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010019597A1 (en) * 2010-05-05 2011-11-10 Albert-Ludwigs-Universität Freiburg Method for producing an electrode structure and electrode structure for a neuronal interface
DE102011087659A1 (en) * 2010-12-03 2012-06-06 Ngk Spark Plug Co., Ltd. Method for forming a conductor pattern
DE102013003541A1 (en) * 2013-03-02 2014-09-04 Leopold Kostal Gmbh & Co. Kg Process for the preparation of a functionalized thermoplastic film with hybrid layer structures and plastic film processed according to this method

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