WO2001054460A1 - Materiau inorganique pour application de chauffage par induction haute frequence, materiau composite, moule et procede de production d'articles traites par fusion haute frequence - Google Patents

Materiau inorganique pour application de chauffage par induction haute frequence, materiau composite, moule et procede de production d'articles traites par fusion haute frequence Download PDF

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Publication number
WO2001054460A1
WO2001054460A1 PCT/JP2001/000312 JP0100312W WO0154460A1 WO 2001054460 A1 WO2001054460 A1 WO 2001054460A1 JP 0100312 W JP0100312 W JP 0100312W WO 0154460 A1 WO0154460 A1 WO 0154460A1
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WIPO (PCT)
Prior art keywords
heating
inorganic
frequency dielectric
dielectric heating
frequency
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PCT/JP2001/000312
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English (en)
Japanese (ja)
Inventor
Kenichi Fujiwara
Original Assignee
Idemitsu Petrochemical Co., Ltd.
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Publication date
Priority claimed from JP2000358173A external-priority patent/JP2004261962A/ja
Application filed by Idemitsu Petrochemical Co., Ltd. filed Critical Idemitsu Petrochemical Co., Ltd.
Publication of WO2001054460A1 publication Critical patent/WO2001054460A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04—Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • B29C65/24—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools characterised by the means for heating the tool
    • B29C65/30—Electrical means
    • B29C65/32—Induction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/74—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area
    • B29C65/743—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by welding and severing, or by joining and severing, the severing being performed in the area to be joined, next to the area to be joined, in the joint area or next to the joint area using the same tool for both joining and severing, said tool being monobloc or formed by several parts mounted together and forming a monobloc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/24—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight
    • B29C66/244—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being closed or non-straight said joint lines being non-straight, e.g. forming non-closed contours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/43—Joining a relatively small portion of the surface of said articles
    • B29C66/431—Joining the articles to themselves
    • B29C66/4312—Joining the articles to themselves for making flat seams in tubular or hollow articles, e.g. transversal seams
    • B29C66/43121—Closing the ends of tubular or hollow single articles, e.g. closing the ends of bags
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81261—Thermal properties, e.g. thermal conductivity, thermal expansion coefficient
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/81262—Electrical and dielectric properties, e.g. electrical conductivity
    • B29C66/81263—Dielectric properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
    • B29C66/81427—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined comprising a single ridge, e.g. for making a weakening line; comprising a single tooth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/818—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps
    • B29C66/8187—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the electrical insulating constructional aspects
    • B29C66/81871—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the electrical insulating constructional aspects of the welding jaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73117—Tg, i.e. glass transition temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B29C66/8122—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the composition of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/712—Containers; Packaging elements or accessories, Packages
    • B29L2031/7128—Bags, sacks, sachets

Definitions

  • the present invention relates to a method for producing an inorganic material for high-frequency dielectric heating, a composite material, a mold, and a high-frequency fusion-processed product, such as a process for fusing a thermoplastic resin film by heating an object to be heated by high-frequency dielectric heating.
  • a method for producing an inorganic material for high-frequency dielectric heating, a composite material, a mold, and a high-frequency fusion-processed product such as a process for fusing a thermoplastic resin film by heating an object to be heated by high-frequency dielectric heating.
  • the simplest method is a heat sealing method using a hot plate or the like.
  • this method requires a separate cooling and solidification step, and thus requires a long time for fusion, resulting in low productivity.
  • the structure of the molding die is simple, and when the high-frequency oscillation is stopped, both the anode (for example, the molding die) and the cathode (for example, aluminum platen) contribute to the cooling and solidification of the welded part. It has the advantage of high performance. In addition, there is an advantage that fusion and fusing can be performed at the same time, and the design of the fusion processed product is excellent.
  • heating by high-frequency dielectric requires a relatively large dielectric loss coefficient, so it is made of polyolefin resin with a small dielectric loss coefficient.
  • fusion processing by high-frequency dielectric heating is difficult, and it has been used exclusively for fusion processing of materials made of resin such as polyvinyl chloride having a large dielectric loss coefficient.
  • polyvinyl chloride resin materials has been withheld due to recent environmental pollution problems, and even in fields where processed products made of polyvinyl chloride resin materials have been used so far, polyolefin resins have been used. The replacement of slag has been considered. Under such circumstances, attempts have been made to perform the fusion processing of the polyolefin resin material by the high-frequency dielectric heating method, which has many advantages as described above.
  • a metal conductive element such as iron is scattered on a fusion surface when performing high-frequency dielectric heating, and heat generated by the metal conductive element due to application of a high-frequency voltage is applied to a polyolefin resin material. And a method for fusing by transmitting the same.
  • a metal conductive element such as iron powder comes into contact with the polyolefin resin material, there is a problem in that the hue and appearance of the fused product are impaired.
  • Japanese Patent Application Laid-Open No. 51-119771 proposes a method of performing high-frequency dielectric heating by bringing a resin sheet having polarity into contact with a polyolefin resin material.
  • Japanese Patent Application Laid-Open No. 160633 discloses a method of performing high-frequency dielectric heating by bringing a sheet made of any of chlorosulfonated polyethylene, chlorinated polyethylene, and ethylene monoacetate copolymer into contact with a polyolefin resin material. Has been proposed.
  • Japanese Patent Publication No. 7-5771 proposes a method using a sheet of a copolymer in which a liponyl group is introduced into a polymer side chain of a polyethylene used as an object to be fused. No.
  • 52802 proposes a method of performing high-frequency dielectric heating by heating a molding die and a base to a temperature slightly lower than the melting point of the object to be fused before performing high-frequency dielectric heating. I have. However, in the methods disclosed in the above publications, although the fusion of the polyolefin resin material by high-frequency dielectric heating is enabled, the mechanical strength, particularly the fusion strength, of the fusion-bonded part of the resulting fusion-processed product is obtained. Is not obtained sufficiently. Even if the required fusion strength is obtained, it takes too much processing time, There is a problem that product productivity is low.
  • An object of the present invention is to provide an inorganic material for high-frequency dielectric heating, a composite material, a mold, and a high-frequency fusion process capable of efficiently heating an object to be heated made of a material having a low level of self-heating by a high-frequency induction heating method. It is to provide a method of manufacturing a product. Disclosure of the invention
  • the high-frequency dielectric heating inorganic material includes a high-frequency dielectric heating electrode disposed between the high-frequency dielectric heating electrodes for heating an object to be heated by high-frequency dielectric heating.
  • a heating inorganic material characterized by including an inorganic heat generator having a dielectric loss coefficient of 0.01 or more.
  • the dielectric loss coefficient is a characteristic value inherent to a substance indicating the ease of self-heating. Specifically, if the heat value in high-frequency dielectric heating is P, the frequency between the electrodes is E, the dielectric constant of the inorganic heating element is, and the dielectric loss tangent is tan ⁇ , the heat value P can be obtained by the following equation. The product of the dielectric constant f and the dielectric loss tangent tan ⁇ in the equation ( ⁇ -tan ⁇ ) is called the dielectric loss coefficient.
  • the dielectric loss coefficient is less than 0.01, the self-heating property of the inorganic material is insufficient, which is not preferable. That is, when the content is 0.01 or more, the required self-heating property of the inorganic material is satisfied, and the high-frequency fusion processing can be performed efficiently.
  • the dielectric loss coefficient is large, a sufficient amount of heat can be obtained even at a low frequency, so that tuning during fusion processing can be easily performed.
  • the dielectric loss coefficient of the inorganic heating element is more preferably 0.1 or more. More preferably, the dielectric loss coefficient is 1.0 or more, particularly preferably 50 or more, and most preferably 100 or more.
  • the high-frequency dielectric heating inorganic material includes only an inorganic material without including an organic material.
  • the high-frequency dielectric heating inorganic material includes an inorganic heating element having a dielectric loss coefficient of 0.01 or more, when the object to be heated is subjected to high-frequency dielectric heating, the high-frequency dielectric heating inorganic material becomes Due to the self-heating property of the inorganic heating element, the object to be heated is heated via the inorganic heating element, and a polyolefin-based resin, a polyester-based resin, a polyamide such as NIPPON, polystyrene, Also, even an object to be heated made of a material such as polycarbonate can be efficiently heated.
  • the high-frequency dielectric heating inorganic material does not contain an organic material, it is less deteriorated by repeated use, has excellent durability and heat resistance, and is particularly preferable when performing fusion processing by high-frequency dielectric heating.
  • the inorganic material for high-frequency dielectric heating is made of an insulating material such as ceramics, sparks are less likely to occur, so that the film or the like can be stably fused.
  • the inorganic heating element having a dielectric loss coefficient of 0.01 or more includes oxide ceramic, composite oxide ceramic, nitride ceramic, carbide ceramic, titanium-containing composite oxide, and lead-containing composite. Any of the oxides or these At least a mixture of two or more types can be employed.
  • the oxide-based ceramics alumina (A1 2 0 3), titania (Ti0 2), Blow I Doo (Fe 2 0 3), it can be adopted Jirukoyua (Zr0 2) or the like.
  • alumina-titania-based powder is preferable because the raw material price is low and the dielectric loss coefficient is high.
  • Cody Elias bets (2MgO '2Al 2 0 3' 5Si0 2)
  • Fuorusuterai bets (2M g 0 'Si0 2)
  • Suteatai bets (3Mg0' 4Si0 2 'H 2 0) adopts the like Can be used.
  • Silicon nitride, aluminum nitride, or the like can be used as the nitride ceramic.
  • Silicon carbide or the like can be used as the carbide-based ceramic.
  • titanium-containing composite oxide various metal salts of titanic acid (alkali) such as magnesium titanate, calcium titanate, strontium titanate, barium titanate, potassium titanate, and aluminum titanate can be used.
  • alkali titanic acid
  • lead titanate As the lead-containing composite oxide, lead titanate, lead zirconium titanate, lead zirconate, or the like can be used.
  • zirconium-containing composite oxide various zirconate (alkali) metal salts such as calcium zirconate, strontium zirconate, and barium zirconate can be used.
  • the inorganic heating element need not be a pure product, but may be a mixture having different dielectric loss coefficients. However, at least one component of the inorganic heating element needs to have a dielectric loss coefficient of 0.01 or more.
  • the shape of the inorganic heating element is not particularly limited, but is preferably a powder.
  • the powder preferably has an average particle size (D50%) of 1.0 to 50 m.
  • the inorganic heating element is a mixture of two or more oxide-based ceramics. It is preferably an oxide-based ceramic mixture, and particularly preferably a mixture of alumina and titanium. Specifically, the mixing ratio of alumina and titania is preferably set in the range of ⁇ in terms of weight ratio (%).
  • oxide-based ceramics have high insulation properties and are more effective in preventing sparks, etc.
  • a synergistic effect of the two enables the heating of the object to be heated.
  • the heating of the material can be performed more efficiently, and the durability of the inorganic material for high-frequency dielectric heating can be sufficiently ensured.
  • the titanium-containing composite oxide is preferably aluminum titanate.
  • aluminum titanate can be obtained by electrofusion, firing, or the like using the above-mentioned alumina and titania as raw materials.
  • the obtained aluminum titanate may be used as a mixture with alumina or titanium used as a raw material, or may be used as isolated and pure aluminum titanate.
  • the object to be heated can be more efficiently heated by high-frequency dielectric when used as the inorganic heating element.
  • an inorganic heating element is layered on the surface of the base material.
  • a multi-layer structure having a multi-layer structure, a single-layer structure in which an inorganic heating element is mixed in a base material, a single-layer structure in which an inorganic heating element is mixed in a base material, What consisted of an inorganic heating element itself can be adopted.
  • the base material may be a low-strength borosilicate glass plate, a ceramic plate containing alumina, silicon nitride, zirconia, or silicon carbide as a main component.
  • various metal substrates and the like can be employed. Pressing, powder pressing, doctor blade, coating, spraying, or a combination of these methods can be used to form the inorganic heating element in a layer on the substrate surface. It is preferred to employ
  • the inorganic heating element in the inorganic material for high-frequency dielectric heating can be brought into more contact with the object to be heated. Is more preferable.
  • the substrate may be a glass fiber mat or glass cloth in which glass fibers are entangled. Ideally, all substrates have no defects such as microvoids inside.
  • an impregnation method As an operation of mixing the inorganic heating element into the substrate, an impregnation method is preferable.
  • the impregnation method a method in which an inorganic substance is added to a medium such as water or alcohol together with a binder to form a slurry, which is impregnated with a glass fiber mat, glass cloth, or the like, and then hot-pressed and molded. No.
  • the inorganic heating element when the inorganic heating element is mixed into the base material to form the inorganic material for high-frequency dielectric heating into a single layer structure, compared to the case where the inorganic heating element is formed in a layer on the surface of the base material, the hot working time of each layer is increased. It can prevent the occurrence of delamination, warpage, etc., due to the difference in behavior, and is preferred in terms of durability.
  • the base material mixed with the inorganic heating element may be further laminated to form a multilayer structure. It is preferable to employ a press method for such lamination.
  • the material By configuring the material, it is possible to adjust the calorific value of the inorganic material for high-frequency dielectric heating according to the number of layers, and to produce inorganic material for high-frequency dielectric heating that is highly durable and has the desired self-heating property. can do.
  • the high frequency dielectric heating inorganic material is composed of the inorganic heating element itself, molding using a reinforcing material can be employed.
  • a method of forming a layer of an inorganic heating element by forming a layer of an inorganic heating element on the surface of the reinforcing material and removing the reinforcing material after forming this layer can be employed.
  • a thermal spraying method can be adopted as an operation for forming the inorganic heating element layer on the surface of the reinforcing material.
  • the reinforcing material substrates made of various metallic materials and organic materials such as thermosetting resins can be used. Since the reinforcing material is a matrix of the inorganic material for high-frequency dielectric heating, an arbitrary shape can be obtained by appropriately setting the shape of the inorganic material for high-frequency dielectric heating.
  • the thickness of the inorganic heating element layer of the high-frequency dielectric heating inorganic material formed in a layer on the substrate surface, and the thickness of the high-frequency dielectric heating inorganic material formed only of the inorganic heating element itself, are preferably 0.1 to 2.0 mm. ( ⁇ 100 111), more preferably 0.5 to 1.0 mm (same).
  • the inorganic material for high-frequency dielectric heating preferably has no warpage or deformation, and the surface smoothness is preferably 20 m for Ra and 100 m for Rmax.
  • the thermal conductivity as an inorganic material for high-frequency dielectric heating is 4.19 X / K to 419 W / m / K (IX 1 (T 3 to 1. Ocal / cm / sec / ° C converted into SI unit system).
  • the thermal conductivity is smaller than 4.19 19101 / ⁇ / ⁇ , for example, when the inorganic material for high-frequency dielectric heating is used for heat fusion of a film or sheet material, Inorganic materials for high-frequency dielectric heating or molds for fusion processing are difficult to cool. As a result, the film or sheet material may be melted during the next processing, and the productivity may be degraded during subsequent processing.
  • the thermal conductivity is higher than 419 W / m / K, heat will escape to the electrode side through the inorganic base material even if the inorganic heating element self-heats due to high-frequency dielectric during heat fusion processing. Therefore, the object to be heated is not sufficiently heated, resulting in a decrease in the fusion strength and a prolonged working time.
  • the volume resistivity of the high-frequency dielectric heating inorganic material is not particularly limited, considering to prevent occurrence of deficiencies of sparks or the like when a voltage is applied, preferably rather is 10 3 Q 'cm or more, further Is preferably 10 6 ⁇ or more, and the higher the value, the higher the value.
  • the durability of the high-frequency dielectric heating inorganic material is such that it can withstand the temperature change from room temperature to 250 ° C in 1 to 10 seconds, and is locally 980 kPa (10 kgf / cm2 converted to SI unit in a width of 2 to 3 mm). Ideally, it should withstand such pressures, but it is not necessary to meet these requirements.
  • the high-frequency dielectric heating composite material according to the present invention is a high-frequency dielectric heating composite material disposed between the high-frequency dielectric heating electrodes to heat an object to be heated by high-frequency dielectric heating. It is characterized by including inorganic heating elements whose coefficient is 0.01 or more.
  • the high frequency dielectric heating composite material includes an organic material and an inorganic material including an inorganic heating element having a dielectric loss coefficient of 0.01 or more. According to the present invention, since the inorganic heating element having a dielectric loss coefficient of 0.01 or more is included, the same effect as the above-described inorganic material for high-frequency dielectric heating can be obtained by utilizing its self-heating property. be able to.
  • the inorganic heating element having a dielectric loss coefficient of 0.01 or more in the present invention the same inorganic heating element as the above-described inorganic heating element for high-frequency dielectric heating can be used. Here, duplicate description is omitted for simplification.
  • Organic materials include thermosetting resins, crystalline resins having a melting point of 200 ° C or higher, liquid crystalline resins having a melting point of 200 ° C or higher, non-crystalline resins having a glass transition temperature of 150 ° C or higher, and Any mixture of any of these can be used.
  • thermosetting resin for example, a phenol resin, a urea resin, a melamine resin, a furan resin, an unsaturated polyester resin, a diaryl phthalate resin, an epoxy resin, a silicone resin, a polyimide resin, or a combination thereof is used.
  • a phenol resin any of a novolak type resin and a resol type resin may be used.
  • epoxy resin glycidyl ether type, glycidyl ester type, glycidylamine type, alicyclic type and the like can be used, and among them, glycidyl ether type is preferable.
  • Examples of the crystalline resin having a melting point of 200 ° C or higher and the liquid crystalline resin having a melting point of 200 ° C or higher include, for example, polyimide resin, polyamide resin, polyester ether ketone resin, polyether ketone resin, polyether ketone resin. Tolyl resin, polyester resin, polyamide resin, polyphenylene sulfide resin, or a combination thereof can be used.
  • non-crystalline resin having a glass transition temperature of 150 ° C. or higher for example, polysulfone resin, polyether sulfone resin, polycarbonate resin, or a combination thereof can be used.
  • the composite material for high-frequency dielectric heating a multi-layer structure in which an inorganic heating element is formed in a layer on the surface of an organic-based material, or an inorganic heating element mixed in a base material made of an organic material It is possible to adopt a single-layer structure having the above-mentioned structure, a structure formed by further laminating them, a structure obtained by laminating them and a layer of the inorganic heating element itself, and the like. Further, it includes a simple mixture of an inorganic heating element and an organic material, for example, a liquid or slurry.
  • the above-described organic material and inorganic heat generator may be mixed, and heat-molded as necessary.
  • the organic material is liquid like a thermosetting resin or the like
  • an inorganic heating element may be mixed with the liquid and stirred. If the organic material is not liquid, it may be mixed by dry blending.
  • the high-frequency dielectric heating mold according to the present invention is a high-frequency dielectric heating mold for heating an object to be heated by high-frequency dielectric heating, and includes a coating containing an inorganic heating element having a dielectric loss coefficient of 0.01 or more. It is characterized in that it is formed on at least a part of the mold surface.
  • the material of the mold for forming the film is not particularly limited, but brass, aluminum, iron, or the like can be used.
  • any shape can be adopted as the mold shape, and one having a fusion blade consisting of only a flat fusion portion, or a fusion portion at the outer end of the fusion portion when fusing at the same time as fusion.
  • Fusing blades or the like can be employed.
  • the fusing part can be either a so-called wound blade type in which a part separate from the fusion part is screwed, or an integral type engraved from a solid metal block by NC processing or the like.
  • the film includes a high-frequency dielectric heating inorganic material or a high-frequency dielectric heating composite material layer of the present invention formed on the surface of a mold, and the high-frequency dielectric heating inorganic material. And those formed by laminating sheets or films of composite materials for high-frequency dielectric heating. In short, a relatively thin layer-like region formed on the surface of the mold and containing the inorganic heating element is suitable for the film according to the present invention. Applicable.
  • the method of forming the inorganic material film on the mold is not particularly limited, but a thermal spraying method such as a plasma spraying method, a method in which the mold is dipped into a solution containing the inorganic material, followed by drying and solidification, and a method using an inorganic material. It is possible to employ a method of coating the solution containing the composition on a mold and then drying and solidifying the solution. The same applies when a composite material for high-frequency dielectric heating is used instead of an inorganic material.
  • APS Atmospheric Plasma Spraying
  • VPS Vauum Plasma Spraying
  • Force VPS is used to form a dense and high-strength layer. Is preferred.
  • the coating only needs to be formed on at least a part of the surface of the mold.
  • the coating may be formed only around the front end portion of the fusion portion and the fusing portion that comes into contact with the object to be heated.
  • loss other than heat transfer to the object to be heated can be minimized, which is effective in terms of energy efficiency.
  • a film may be formed on the entire surface of the mold.
  • the inorganic heating element constituting the coating when a high-frequency electromagnetic wave is applied to a coating having a dielectric loss coefficient of 0.01 or more, the inorganic heating element constituting the coating easily self-heats, and the mold in contact with the heating element is heated. Is done.
  • this mold it is possible to efficiently heat an object to be heated made of a material such as polyolefin resin, polyester resin, polyamide, polystyrene, or polycarbonate having a low dielectric loss coefficient and a low self-heating property. Can be.
  • the inorganic heating element of the present invention is made of a material having a high insulating property, such as ceramics, sparks are unlikely to be generated when a voltage is applied, so that fusion processing can be performed stably. [Underlay for high frequency dielectric heating]
  • the underlay for high-frequency dielectric heating is an underlay for high-frequency dielectric heating installed to face the non-heated object to heat the object to be heated by high-frequency dielectric heating, and has a dielectric loss coefficient of 0. It contains 01 or more inorganic heating elements.
  • the underlay for high-frequency dielectric heating an inorganic material for high-frequency dielectric heating or a composite material for high-frequency dielectric heating formed into a sheet having a predetermined thickness may be used as the underlay for high-frequency dielectric heating. This sheet thickness may be appropriately set according to the required heat generation capacity.
  • the underlay for high-frequency dielectric heating can be applied to a fusion-molding die and used for fusion-bonding of an object to be heated.
  • the underlay for the high-frequency dielectric heating is appropriately formed into a planar shape and dimensions corresponding to the mold. I just need.
  • the inorganic heating element that constitutes the underlay easily self-heats, and an object to be heated that is in contact therewith is heated. Heated.
  • this underlay it is possible to efficiently heat an object to be heated made of a material such as polyolefin resin, polyester resin, polyamide, polystyrene, or polycarbonate having a low dielectric loss coefficient and a low level of self-heating. .
  • the underlay contains an inorganic heating element, it is less likely to deteriorate due to repeated use, has excellent durability and heat resistance, and is suitable for performing fusion processing by high-frequency dielectric heating.
  • the inorganic heating element of the present invention is made of a material having a high insulating property, such as ceramics, sparks are unlikely to be generated when a voltage is applied, so that fusion processing can be performed stably.
  • the method of manufacturing a fusion-bonded product according to the present invention includes the steps of: performing self-heating of the above-described mold for high-frequency dielectric heating or an underlay for high-frequency dielectric heating to perform high-frequency fusion processing; It is characterized by manufacturing processed products.
  • self-heating the mold or “self-heating the high-frequency dielectric heating underlay” means that a voltage is applied to the film containing the inorganic heating element or the high-frequency dielectric heating underlay formed on the mold. Means to generate heat.
  • An existing configuration or the like can be used as appropriate for the high-frequency welding machine.
  • a machine with a frequency of 1 to 300 MHz can be adopted. Generally, frequencies of 18 MHz, 27 MHz and 40 MHz are often used.
  • a machine having a matching circuit with a tuning machine may be used.
  • the mold as the electrode may be heated or cooled using a heater or a cooler.
  • a polyolefin resin having a small dielectric loss coefficient and a low self-heating property is used. Film, sheet, etc., made of, can be efficiently fused.
  • FIG. 1 is a partial side view showing the structure of a high-frequency dielectric heating and fusing apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a partial side view showing a structure of a high-frequency dielectric heat fusing apparatus according to a second embodiment of the present invention.
  • FIG. 3 is a partially enlarged cross-sectional view showing the fusion blade in the second embodiment.
  • FIG. 4 is a front view showing a bag with a ceiling zipper manufactured according to the second embodiment.
  • FIG. 1 shows a first embodiment of the present invention in which an inorganic material for high-frequency dielectric heating was used.
  • the mold part of the high-frequency dielectric heat fusing apparatus is shown.
  • This high-frequency dielectric heating and fusion processing apparatus consists of an upper platen 10, a heater 20, a mold 30, a lower platen 40, and a high-frequency dielectric heating underlay 50 (hereinafter referred to as an inorganic material for high-frequency dielectric heating). (Sometimes referred to simply as the underlaying 50).
  • the mold 30 is an upper electrode
  • the lower platen 40 is a lower electrode
  • two sheets of a polyolefin resin to be heated are interposed between the mold 30 and the lower platen 40.
  • the heat-sealing is performed by disposing the material 7 1 and 7 2.
  • heat-sealing processing is performed by disposing heat-resistant resin sheets 81 on the upper and lower surfaces of the sheet materials 71 and 72.
  • the upper stool 10 is a portion for supporting and fixing the heater 20 and the mold 30.
  • the upper stool 10 approaches and separates from the lower stool 40 by the drive mechanism of the fusion heating device main body. I have.
  • the heater 20 is a part that heats the mold 30 to a predetermined temperature. Specifically, the heater 30 is set at 10 ° C. higher than the melting point or the heat softening temperature of the sheet materials 71 and 72. Heat to a temperature within the lower temperature range. If the temperature of the mold 30 is lower than 20 ° C, it is not possible to sufficiently secure the mechanical strength and the transparency of the fused portion. If the temperature of the mold 30 exceeds 10 ° C lower than the thermal softening temperature of the sheet materials 71 and 72, deformation of the fused part is likely to occur, and the product after the fusion processing Causes poor appearance.
  • the mold 30 is provided with a fusion blade 31 at the outer peripheral end, and as the upper platen 10 descends, the sheet material 7 1, 7 2 is pressed by the fusion blade 31 to form two sheets.
  • the sheet materials 71 and 72 are heat-sealed.
  • the error between the fusion blade 31 and the lower platen 40 must be adjusted to within ⁇ 100 // m. is there.
  • the adjustment is performed by adjusting the mutual inclination of the upper stool 10 and the lower stool 40, and polishing the joint surface of the mold 30 with the upper stool 10. If the error of this interval exceeds 100 im, the distribution increases to the thickness of the sheet materials 71 and 72 when high-frequency dielectric heating is performed, and the applied voltage locally exceeds the dielectric breakdown voltage of the sheet. The spark The risk of occurrence is increased.
  • the temperature of the tip of the fusion blade 31 is adjusted so that the error is within ⁇ 3 ° C with respect to the predetermined temperature at any position. Maintain the temperature within the specified ⁇ 3 ° C without being affected by changes in the ambient temperature even after the production of dressed products starts.
  • the underlay 50 is placed on the lower platen 40, and the sheet materials 71 and 72 are placed on the underlay 50, and fusion processing is performed.
  • the underlay 50 is obtained by forming an inorganic heating element layer made of a mixture of alumina and titania having a dielectric loss coefficient of 0.01 or more on the surface of an inorganic base material by plasma spraying. The layer surface comes into contact with the sheet material 7 1.
  • a low alkali borosilicate glass plate, a ceramic plate containing alumina, silicon nitride, zirconia, silicon carbide as a main component, or the like is used.
  • the plasma spraying method includes APS (Atmospheric Plasma Spraying) performed under atmospheric pressure and VPS (Vacuum Plasma Spraying) performed under reduced pressure, but VPS is used to form a dense and high-strength layer. Is preferred.
  • the mixing ratio of the mixture of alumina and titania serving as the inorganic heating element can be arbitrarily set within a predetermined range.
  • the underlay 50 has a thickness of 0.1 to 2.0 mm ( ⁇ 100 ⁇ ), and warp, deformation, etc.
  • the surface smoothness is Ra 20 ⁇ m and Rmax ⁇ 100 ⁇ m.
  • this underlayment 5 0 withstands temperature changes from room temperature to about 10 to 30 seconds to 250 ° C, locally 9. 8 l X 10 2 kPa ( 10kg / cm 2 to SI units in 2 ⁇ 3mm width Even if a pressure of about the level acts, no damage will occur.
  • the heat-resistant resin sheet 81 used as necessary a sheet made of polyethylene terephthalate resin, polycarbonate resin, polyether sulfone resin, polyimide resin, or the like is preferable, and the thickness is 10 to 100 ⁇ m. What is necessary is just to use.
  • the smooth surface thereof becomes the surface of the fused portion of the sheet materials 71, 72. It is transferred, and the gloss of the fused portion can be improved.
  • fusion processing of various polyolefin resin materials can be performed. Examples of the material that can be processed include polyethylene resin, polypropylene resin and Polyolefin-based resin compositions containing these as main components are exemplified.
  • polyethylene resin examples include a high-density polyethylene, a low-density polyethylene, and a linear ethylene-monoolefin copolymer.
  • a linear ethylene- ⁇ -olefin copolymer is particularly preferable.
  • a copolymer having a long chain branch such as an ethylene-11-hexene copolymer or an ethylene-11-octene copolymer is preferable.
  • Those having a chemical structure randomly incorporated into the main chain are particularly preferred.
  • a so-called meta-portion containing ethylene and 1-hexene as main components for example, a transition metal complex compound such as titanium or zirconium is used.
  • a transition metal complex compound such as titanium or zirconium
  • copolymers having a narrow molecular weight distribution obtained by copolymerization using a cene-based catalyst or a meta-opened cene-based geometrically constrained catalyst are particularly preferred.
  • polypropylene resin a copolymer of propylene and ethylene or a copolymer of propylene with ethylene and 1-butene is preferably used in addition to homopolypropylene.
  • these propylene-based copolymers those having a content of 0.1 to 10% by weight of ethylene, which is a comonomer, based on propylene are preferred. More preferably, these comonomers are preferably randomly incorporated into the main chain.
  • polyolefin-based resin composition those composed of a combination of the above-mentioned polyethylene resins, those composed of a combination of polypropylene resins, those composed of a combination of a polyethylene resin and a polypropylene resin,
  • a mixture of a filler and a modifier commonly used for improving the physical properties of the resin it is possible to use a mixture of a filler and a modifier commonly used for improving the physical properties of the resin.
  • the high-frequency dielectric heat fusing apparatus is not limited to a single-layer film or sheet composed of each of the above-described compositions and compounds, but also a film having a different composition, a multilayer film in which sheets are laminated, It can also be applied to sheets.
  • the film or sheet comprising these polyolefin-based resins and their compositions those produced by a usual molding method can be used.
  • single-layer films and sheets can be extruded using a T-die, and multi-layer films and sheets can be co-extruded. Can be.
  • the appropriate range of the thickness of the sheet material 71, 72 that can be fused is determined by the type, molecular weight, molecular weight distribution, and chemical structure of the polymer chain of the resin constituting the sheet material 71, 72. Although different, it is usually 20 to 800 ⁇ , preferably 50 to 500 ⁇ m. If the thickness of the film or sheet is smaller than the above range, the risk of dielectric breakdown increases, and if the thickness is larger than the above range, the mechanical strength of the fused portion decreases and the transparency is maintained. It is not preferable because it becomes difficult and the appearance may be inferior.
  • Step 1 Place the underlay 50 on the lower platen 40, overlap the sheet materials 7 1 and 7 2, and cover the two sheet materials 7 1 and 7 2 with the heat-resistant resin sheet 8 1 , Set on 50 underlay.
  • Step 2 In this state, lower the upper platen 10 and press the sheet materials 7 1 and 7 2 with the fusion blade 31 of the mold 30. Make 0 generate heat.
  • the applied electric field can be set in the frequency range of l to 300 MHz, but is usually set to 18 ⁇ , 27 MHz, and 40 MHz.
  • Step 3 At the start of the application of the high-frequency electric field to the sheet materials 7 1 and 7 2, set the current value in a no-load state, and then 95% of the dielectric breakdown value of the sheet materials 7 1 and 7 2 High-frequency dielectric heating is performed by setting the applied current to a value less than that.
  • the current value in the no-load state at the start of application is set to avoid dielectric breakdown of the sheet materials 71 and 72 due to spark.
  • setting the applied current to less than 95% of the dielectric breakdown value after the start of application is also to avoid dielectric breakdown.
  • the applied current at this time varies depending on the type, thickness, and fusion area of the sheet materials 71 and 72, but is usually 0.1 to 0.8 mm, preferably 0.2 to 0.2 mm. Set within 5 ⁇ . If the applied current is higher than 0.5 mm, the risk of discharge between the electrodes increases, and if the applied current is lower than 0.2 mm, the appearance of the fused portion may be impaired.
  • the application time of the high-frequency electric field also varies depending on the type, thickness, and fusion area of the sheet materials 71 and 72, but is usually 0.5 to 10 seconds, preferably 1 to 6 seconds, and more preferably. Is 1 to 4 seconds. Also, the energization time for high-frequency dielectric heating is
  • Step 6 Further, during the cooling period during and after the application of the high-frequency electric field, a pressure is applied between the mold 30 and the lower platen 40 to prevent sparking between the two electrodes and to deform the fused portion.
  • the pressing force varies depending on the type and thickness of the sheet materials 71 and 72, but is usually set to 49.0 to 490 kPa (0.5 to 5 kgZcm 2 converted to SI unit system).
  • the sheet materials 7 1 and 7 2 to be heated can be used.
  • the sheet materials 71 and 72 are heated by the self-heating property of the inorganic heating element layer, and the sheet materials 71 and 72 made of polyolefin resin can be efficiently heated.
  • the underlayment 50 is formed without containing any organic material, deterioration due to repeated use can be reduced, and durability and heat resistance can be improved. It is suitable as an underlay used for a dressing device.
  • the underlay 50 is made of an insulating material such as ceramics, sparks and the like between the electrodes are less likely to occur, and the fusion of the sheet materials 71 and 72 is prevented. It can be performed stably.
  • the underlay 50 has a multilayer structure in which an inorganic heating element layer is formed by plasma spraying on an inorganic base material such as a glass plate, more sheet materials 71 and 7 2 are used.
  • the inorganic heating elements can be brought into contact with each other, and the sheet materials 71 and 72 can be heated more efficiently.
  • underlayment 5 0 electrically insulating (volume resistivity) Power 0 6 Q 'eyes is cm or more, the sheet material 7 ⁇ , 7 2 can be more efficiently fusing process.
  • the underlay 50 is manufactured by forming an inorganic heating element layer on the surface of the inorganic base material by a plasma spraying method, the underlay having excellent smoothness can be obtained. This is more advantageous in preventing the occurrence of a park or the like.
  • the inorganic heating element layer of the underlay 50 is composed of a mixture of alumina and titania, and the mixing ratio is set to 60Z40, the sheet materials 71 and 72 are further fused. It can be done efficiently.
  • the underlay 50 has a multilayer structure in which an inorganic heating element layer is formed on the surface of an inorganic base material by plasma spraying.
  • the present invention is not limited to this. That is, a single-layer structure in which a glass fiber mat is used as an inorganic base material and an inorganic heating element having a dielectric loss coefficient of 0.01 or more is included between the fibers of the glass fiber mat. It may be used as an underlay, or as an inorganic material for high-frequency dielectric heating obtained by laminating a plurality of the single-layer structures.
  • the underlay of the layered structure can be manufactured by adding a predetermined binder to a powder of an inorganic heating element composed of a mixture of glass fiber mat and alumina and titania, and press-molding the powder.
  • the inorganic material for high-frequency dielectric heating obtained by laminating such a single-layer structure is obtained by pressing the inorganic heat generating powder between a plurality of glass fiber mats and adding a predetermined binder. It can be manufactured by molding.
  • the inorganic heating element layer is composed of a mixture of two types of oxide ceramics, alumina and titania.
  • the present invention is not limited to this. That is, two or more kinds of other oxide-based ceramics may be mixed to form the inorganic heating element layer.
  • the composite oxide-based ceramic, the nitride-based ceramic, the titanium-containing composite oxide, and the lead-containing composite Any of the oxides or a mixture of at least two of them may be used as the inorganic heating element layer.
  • the underlay 50 is manufactured by the plasma spraying method.
  • the present invention is not limited to this, and is manufactured by other methods such as a pressing method, a powder pressing method, a doctor blade method, and a coating method.
  • the appropriate method according to the specifications of the underlay 50 Can be adopted.
  • the sheet material 7 made of a polyolefin resin is used.
  • the present invention has been applied to perform the fusing process of 1, 72, the present invention is not limited to this. That is, in short, the present invention can be applied to various materials as long as the material is a sheet material having a low level of self-heating due to high-frequency dielectric heating. For example, even when the present invention is applied to a sheet material made of a polyester resin such as PET, polyamide such as nylon, polystyrene, polycarbonate, etc., the same operation and effect as in the first embodiment can be obtained. can do.
  • the inorganic material for high-frequency dielectric heating according to the present invention is employed as the underlay 50 of the high-frequency induction heating and fusion device for performing the fusion processing of the sheet materials 71 and 72.
  • the present invention can be applied to various devices as long as the object to be heated is heated by high-frequency dielectric heating.
  • the shape of the inorganic material for high-frequency dielectric heating can be varied according to the application. It can be set to a shape.
  • the present invention is not limited to the first embodiment, and specific structures and shapes when carrying out the present invention are different from other structures and the like as long as the object of the present invention can be achieved.
  • FIG. 2 shows a high-frequency dielectric heating fusing apparatus using a high-frequency dielectric heating mold according to the present invention.
  • This high-frequency dielectric heating and fusion processing apparatus has a configuration basically similar to the high-frequency dielectric heating and fusion processing apparatus of the first embodiment (see FIG. 1).
  • the upper surface plate 10, the lower surface plate 40, the sheet materials 71, 72, and the heat-resistant resin film 81 are the same as those in the first embodiment.
  • the basic configuration of the mold 30 is the same.
  • FIG. 2 shows a main part of a mold 30 of the present embodiment.
  • the fusion blade 31 is formed by raising a fusion portion 31 A formed substantially horizontally with the lower platen 40 and along the outer periphery of the fusion portion 31 A, that is, along the outer peripheral edge of the mold 30. And a fusing portion 31 B having a substantially triangular cross section.
  • a coating 32 made of an inorganic material including an inorganic heating element having a dielectric loss coefficient of 0.01 or more is formed on the surface of the fusion blade 31.
  • the coating 32 is formed by a plasma spraying method, and is made of an inorganic material containing aluminum titanate having high electrical insulation as an inorganic heating element.
  • the thermal conductivity of the film 3 2 is preferably 4.
  • a 19 X 10- 1 ⁇ 419W / m / K in addition, the volume resistivity is preferably 10 5 ⁇ ⁇ ⁇ more.
  • the surface smoothness of the film 32 is set to 20 ⁇ for Ra and 100 ⁇ m for Rmax. In addition, it can withstand a temperature change from room temperature to 250 ° C in about 1 to 10 seconds, and does not break even if a pressure of about 980 kPa is applied locally with a width of 2 to 3 mm.
  • the procedure for fusing the sheet materials 71 and 72 by the high-frequency dielectric heat fusing apparatus of the present embodiment is basically the same as the processing procedure (steps 1 to 6) of the first embodiment described above. Therefore, the differences will be described.
  • Step 1 the operation of the underlay 50 as in the first embodiment is unnecessary, and the sheet materials 7 1 and 7 2 are overlapped and covered with the heat-resistant resin film 8 1, and the lower platen 40 Will only be installed at
  • the plasma spraying method is used for the method of forming the film 32.
  • the present invention is not limited to this.
  • any manufacturing method capable of forming the coating 32 made of an inorganic material on the surface of the mold 30 can be used.
  • other spraying methods, and dipping the mold into a solution containing an inorganic heating element can be used.
  • a method of drying and solidifying after drying a method of applying a solution containing an inorganic heating element to a mold and then drying and solidifying the solution can be adopted.
  • the film 31 is not limited to the one directly formed on the surface of the mold 30, and a separately formed sheet-like inorganic material may be laminated on the surface of the mold 30. .
  • the film 32 is formed only on the fusion blade 31 of the mold 30, but may be formed on the entire surface of the mold.
  • the mold 30 having the fusing portion 31B is used as the mold 30, but the mold is not limited to this, and a mold having only the fusion portion may be used.
  • the fusing portion 31 B an integrated structure with the fusing portion 31 A was adopted, but the invention is not limited to this, and the separate fusing portion and the fusing portion were fixed with screws or the like. Those can also be used.
  • the mold 30 is not provided with a heater or a cooler, the present invention is not limited to this, and a device for directly heating or cooling the mold itself by providing a heater or a cooler may be employed. Can also.
  • the sheets made of polyolefin resin are used as the sheet materials 71 and 72 to be heated.
  • the present invention is not limited to this. Polyester resin, polyamide, polystyrene, and polystyrene are used. A bottle or the like can also be used.
  • specific structures, shapes, and the like when implementing the present invention depend on the purpose of the present invention. With other structures within the achievable range
  • the underlay 50 of the first embodiment described above is formed of a composite material for high-frequency heating according to the present invention.
  • the composite material for high-frequency heating used for the underlay 50 is made of a thermoplastic resin such as an epoxy resin or a phenol resin, which is an organic material, and an inorganic heating element similar to that of the first embodiment at 20% by weight. It is considered to have been obtained by blending and thermosetting. Others are the same as in the first embodiment.
  • the durability may be inferior to that of the first embodiment composed of only an inorganic material.
  • the cushioning property and elasticity are higher than those of the underlay 50 of the first embodiment, and the non-heated material is uniformly contacted, so that the heating performance can be improved.
  • the coating 32 of the second embodiment is formed of the composite material for high-frequency heating according to the present invention.
  • the composite material for high-frequency heating used for the coating 32 is as described in the third embodiment, and a duplicate description will be omitted.
  • the durability may be inferior to that of the first embodiment composed of only an inorganic material.
  • the cushioning property and elasticity are higher than those of the film 32 of the second embodiment, and the non-heated material is uniformly contacted, so that the heating performance can be improved.
  • the base material was a glass mat as a reinforcing material and press-formed with silicon borate as a binder (substrate 1: PMX-573 manufactured by Ryoden Kasei Co., Ltd.), a low alkali borosilicate glass plate ( Base material 2: BLC 0.7 mm X 300 mm X 400 mm manufactured by Nippon Electric Glass Co., Ltd., soda glass plate (base material 3: UFF 0.7 X 300 mm X 400 mm manufactured by Nippon Sheet Glass Co., Ltd.), glass mat strengthened
  • the materials used are paper-laminated phenolic resin (paper baking board: PS-1131 manufactured by Sumitomo BeiKite Co., Ltd.) and cloth-laminated phenolic resin (cloth baking board: Sumitomo Bake Light (PS-2164) manufactured by the Company.
  • Table 1 shows the physical properties of each base material and each inorganic heating element.
  • Heating element 1 (60 / 40wt%)
  • the dielectric loss coefficient in Table 1 is based on JIS K6 911 using Yokogawa Hillett Packard test equipment (main unit: HP4284A frequency 1 mm, electrode: HP16451B applied voltage range: 42 V). And the dielectric loss tangent were measured and determined by their product.
  • Example 1 to Example 10 Comparative Examples 1 to 5 were set by changing the combination of the base material and the inorganic heating element described above, and each of the fusion processability was evaluated. Combinations in each example and comparative example are as follows. Further, an experiment was performed on a material containing an organic material (Examples 11 and 12).
  • Example 1 1. An inorganic heating element 1 having a thickness of 300 ⁇ m was formed on a substrate 1 having an Omm thickness.
  • Example 2 The thickness of the inorganic heating element 1 was reduced to 200 m in comparison with Example 1.
  • Example 3 In Example 1, the inorganic heating element was changed to inorganic heating element 2.
  • Example 4 The substrate was changed from Example 1 to a substrate 2 having a thickness of 0.7 mm.
  • Example 5 The substrate was changed from that of Example 1 to a substrate 3 having a thickness of 0.7 mm.
  • Example 6 The inorganic heating element was changed to the inorganic heating element 3 as compared with Example 1.
  • Example 7 In contrast to Example 4, the inorganic heating element was changed to inorganic heating element 3.
  • Example 8 In contrast to Example 5, the inorganic heating element was changed to the inorganic heating element 3.
  • Example 9 In contrast to Example 1, the inorganic heating element was changed to the inorganic heating element 4.
  • Example 10 In contrast to Example 1, the inorganic heating element was changed to the inorganic heating element 5.
  • Example 11 Bisphenol A type, which is a glycidyl ether type epoxy resin, is heated and liquefied, 20% by weight of inorganic heating element 3 is mixed, getyl triamine is added as a curing agent, and the mixture is thermally cured to a thickness of 0.7 mm. An epoxy resin-based composite material was formed.
  • Example 12 An acid catalyst and hexamethylenetetramine were added to a mixture of phenol, m-cresol, and 2.4-xylenol and formaldehyde, and further, 20% by weight of an inorganic heating element 3 was mixed and impregnated into glass mat. It was thermally cured to form a phenolic resin-based composite material having a thickness of 1.0 mm.
  • Comparative Example 1 Same as Example 1 1.0 mm thick substrate 1 but without inorganic heating element.
  • Comparative Example 2 Same as Example 4, except that the base material 2 has a thickness of 0.7 mm, but has no inorganic heating element.
  • Comparative Example 3 Same as Example 5, except that the base material 3 is 0.7 mm thick, but has no inorganic heating element.
  • Comparative Example 4 A paper beta plate having a thickness of 1.0 was used as a base material. There are no inorganic heating elements. Comparative Example 5: A 1.0-thick cloth board was used as a base material. There are no inorganic heating elements.
  • the evaluation of the fusing property of each of the examples and comparative examples was performed by a high-frequency ⁇ -elder test.
  • LW4060-APH high-frequency output: 3.6, transmission frequency: 41.1 MHz
  • the mold was 40 mm X 198 mm X 3 bandages.
  • Fusing tests were performed using anodes with a linear width and an anode current value in the range of 200 to 450 mA.
  • ethylene was used as the sheet materials 71 and 72 in the high-frequency elda test.
  • a polypropylene copolymer (melt index: 7, melting point: 137 ° C, manufactured by Idemitsu Petrochemical Co., Ltd.) was prepared with a T-die extruder to form a sheet with a width of 400 mra and a thickness of 0.3 mm. The one cut in the above was used.
  • Table 2 shows the high-frequency ⁇ -elder test results of each of the examples and comparative examples thus obtained.
  • the underlay 50 according to Examples 1 to 12 since the fusion strength of the sheet materials 71 and 72 is 3.3 kg or more, it can be seen that good fusion processing can be performed. Further, in Examples 1 to 12, fusion processing can be performed sufficiently even at a mold temperature of 100 ° C. or less, and in addition, the time for one shot can be set to within 5 seconds. It can be seen that high-frequency dielectric heating and fusion can be performed efficiently.
  • the bag 2 with a ceiling zipper has the ceiling zipper 21 A in the opening 21, and the other three sides are sealed portions 22.
  • the specific dimensions of the bag 2 with a top chuck are 150 (both sides) x 80 (bottom) bandits.
  • a substantially U-shaped fused part 31A and a fusing part 31B (winding blade type) having a size corresponding to the sealing part 22 of the bag 2 with the top chuck 3 1 A width dimension 2mra mold 30.
  • the above-mentioned inorganic heating elements 1 to 3 were each subjected to plasma spraying by the VSP method to form a coating.
  • Examples 13 to 18 a sheet impregnated with an epoxy resin and a phenol resin was laminated on a mold to form a film.
  • the top chuck 21 A was made of polypropylene. Table 3
  • the sealing strength was measured by cutting off the sealing portion 22 to a width of 15 mm and tearing both sheets.
  • the sealing portion of the ceiling chuck 21A was similarly cut to a width of 15 mm, and the sheet and the ceiling chuck were torn to measure the fusion strength.
  • the fusion strength of the sheet materials 7 1 and 7 2 in the sealing portion 22 is 32.3NZ15mm (3.3 kgfZ15mra converted to SI unit) or more. It can be seen that good fusion processing can be performed.
  • fusion strength of the top Chuck 2 1 A is, since at 41. 2N / / 15mm (4. value 2kgfZl5 hidden converted to SI units) or more, good It can be seen that fusion processing can be performed.
  • the method of manufacturing an inorganic material for high-frequency dielectric heating, a mold, and a high-frequency fusion-bonded product of the present invention includes the steps of: An excellent effect can be obtained by using this for heating.

Abstract

Cette invention se rapporte à un matériau inorganique pour application de chauffage par induction haute fréquence, à un matériau composite, à un moule et à un procédé de production d'articles traités par fusion haute fréquence, où un objet à chauffer, constitué par un matériau brut dont le niveau d'autochauffage est bas, tel qu'une résine de type polyoléfine, peut être chauffé efficacement par chauffage par induction haute fréquence. La totalité d'une couche inférieure (50) disposée entre des électrodes (30, 40) pour un chauffage par induction haute fréquence ou le matériau inorganique pour application de chauffage par induction haute fréquence se trouvant dans la couche de surface contient un élément chauffant inorganique ayant un coefficient de perte diélectrique égal ou supérieur à 0,01. Etant donné que le matériau inorganique pour application de chauffage par induction haute fréquence (50) contient cet élément chauffant inorganique ayant un coefficient de perte diélectrique égal ou supérieur à 0,01, le fait de soumettre l'objet à chauffer à un chauffage par induction haute fréquence assure que cet objet à chauffer est effectivement chauffé par la propriété autochauffante de l'élément chauffant inorganique.
PCT/JP2001/000312 2000-01-21 2001-01-18 Materiau inorganique pour application de chauffage par induction haute frequence, materiau composite, moule et procede de production d'articles traites par fusion haute frequence WO2001054460A1 (fr)

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Application Number Priority Date Filing Date Title
JP2000-12858 2000-01-21
JP2000012858 2000-01-21
JP2000326439 2000-10-26
JP2000-326439 2000-10-26
JP2000-358173 2000-11-24
JP2000358173A JP2004261962A (ja) 2000-11-24 2000-11-24 高周波誘電加熱用金型、およびこれを用いた高周波融着加工製品の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005120811A1 (fr) * 2004-06-11 2005-12-22 Stanelco Rf Technologies Limited Emballage de produit
WO2006136635A2 (fr) * 2005-06-21 2006-12-28 Pellicer Carlos F Procede destine au traitement d'elements techniques qui durcissent avec le temps
EP3311986A1 (fr) * 2016-10-18 2018-04-25 KIEFEL GmbH Outil pour soudage rf, installation de soudage de feuilles, installation de fabrication d'un sachet à des fins médicales, procédé de fonctionnement d'une installation et sachet

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Publication number Priority date Publication date Assignee Title
JPS5073950U (fr) * 1973-11-06 1975-06-28
JPS59198117A (ja) * 1983-04-26 1984-11-09 Asahi Chem Ind Co Ltd 高周波融着機用電極
JPH02281927A (ja) * 1989-04-24 1990-11-19 Shiigeru:Kk 高周波溶着用金型
JPH03245487A (ja) * 1990-02-21 1991-11-01 Matsushita Electric Ind Co Ltd ガラスセラミック発熱体とその製造法
JPH07249487A (ja) * 1994-03-09 1995-09-26 Chichibu Onoda Cement Corp マイクロ波吸収発熱体及びその製造方法並びに電子レンジ調理用容器
JPH08267586A (ja) * 1995-03-31 1996-10-15 Takiron Co Ltd ポリプロピレンシートの高周波溶着方法及びこの方法に用いる絶縁材
JPH11268134A (ja) * 1998-03-25 1999-10-05 Idemitsu Petrochem Co Ltd ポリオレフィン系樹脂の融着加工法および融着加工製品

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5073950U (fr) * 1973-11-06 1975-06-28
JPS59198117A (ja) * 1983-04-26 1984-11-09 Asahi Chem Ind Co Ltd 高周波融着機用電極
JPH02281927A (ja) * 1989-04-24 1990-11-19 Shiigeru:Kk 高周波溶着用金型
JPH03245487A (ja) * 1990-02-21 1991-11-01 Matsushita Electric Ind Co Ltd ガラスセラミック発熱体とその製造法
JPH07249487A (ja) * 1994-03-09 1995-09-26 Chichibu Onoda Cement Corp マイクロ波吸収発熱体及びその製造方法並びに電子レンジ調理用容器
JPH08267586A (ja) * 1995-03-31 1996-10-15 Takiron Co Ltd ポリプロピレンシートの高周波溶着方法及びこの方法に用いる絶縁材
JPH11268134A (ja) * 1998-03-25 1999-10-05 Idemitsu Petrochem Co Ltd ポリオレフィン系樹脂の融着加工法および融着加工製品

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005120811A1 (fr) * 2004-06-11 2005-12-22 Stanelco Rf Technologies Limited Emballage de produit
WO2006136635A2 (fr) * 2005-06-21 2006-12-28 Pellicer Carlos F Procede destine au traitement d'elements techniques qui durcissent avec le temps
WO2006136635A3 (fr) * 2005-06-21 2007-04-19 Pellicer Carlos F Procede destine au traitement d'elements techniques qui durcissent avec le temps
ES2273579A1 (es) * 2005-06-21 2007-05-01 Carlos Fradera Pellicer Procedimiento para el tratamiento de elementos tecnicos que endurecen en el tiempo.
EP3311986A1 (fr) * 2016-10-18 2018-04-25 KIEFEL GmbH Outil pour soudage rf, installation de soudage de feuilles, installation de fabrication d'un sachet à des fins médicales, procédé de fonctionnement d'une installation et sachet

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