WO2001005868A1 - Resine de polycarbonate pour cassettes de pieces associees a un semiconducteur - Google Patents

Resine de polycarbonate pour cassettes de pieces associees a un semiconducteur Download PDF

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Publication number
WO2001005868A1
WO2001005868A1 PCT/JP2000/004633 JP0004633W WO0105868A1 WO 2001005868 A1 WO2001005868 A1 WO 2001005868A1 JP 0004633 W JP0004633 W JP 0004633W WO 0105868 A1 WO0105868 A1 WO 0105868A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
resin material
polycarbonate resin
case
carbon black
Prior art date
Application number
PCT/JP2000/004633
Other languages
English (en)
Japanese (ja)
Inventor
Tadashi Shinomiya
Ichiro Kondo
Original Assignee
Sumitomo Dow Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Dow Limited filed Critical Sumitomo Dow Limited
Priority to JP2001511519A priority Critical patent/JP4356828B2/ja
Publication of WO2001005868A1 publication Critical patent/WO2001005868A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G64/00—Macromolecular compounds obtained by reactions forming a carbonic ester link in the main chain of the macromolecule
    • C08G64/04—Aromatic polycarbonates

Definitions

  • the present invention relates to a polycarbonate resin material used for a semiconductor-related component carrying case and a conductive polycarbonate resin material containing conductive carbon black. More specifically, the present invention provides a polycarbonate resin material for a semiconductor-related component transfer case, which is made of a polycarbonate resin or a conductive polycarbonate resin composition in which the total amount of generated gas is suppressed.
  • a semiconductor-related component transfer case which is made of a polycarbonate resin or a conductive polycarbonate resin composition in which the total amount of generated gas is suppressed.
  • Semiconductor-related components such as semiconductor wafers, disks, and hard disks are used for computers and other storage disks.
  • thermoplastic resins such as polycarbonate resin and polypropylene
  • polycarbonate resin has been attracting attention as a material for semiconductor-related parts transport cases because of its excellent transparency and impact resistance.
  • semiconductor-related components include silicon wafers, hard disks, disk substrates, IC chips, magneto-optical disks, high-performance glass substrates for LCDs, LCD color filters, hard disk magnetoresistive heads, and the like.
  • the inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that trace gases such as hydrocarbons generated from the case material for transporting semiconductor-related parts can be used for semiconductor-related parts. It has been found that the above-mentioned problems occur because they act and deposit on the surface, and that the occurrence of problems with semiconductor-related components housed in the transport case is significantly reduced by suppressing the amount of gas below a specified value. Thus, the present invention has been completed.
  • Japanese Patent Application Laid-Open No. 2000-686363 discloses that the amount of gas generated when a polycarbonate resin pellet is placed in a closed container and heated at 150 ° C for 1 hour is toluene. It is disclosed that contamination of a silicon wafer or the like can be reduced by using a container made of an aromatic polycarbonate having a weight conversion of 1.5 ppm or less.
  • the present inventors have studied the method of measuring the gas amount, and have found a method of appropriately detecting gas components acting on and depositing on semiconductor-related components by a simpler method. That is, the polycarbonate resin pellets are placed in an atmosphere of an inert gas at 80 ° C.
  • the present invention is characterized in that the total amount of generated gas that thermally desorbs when left at 80 ° C. for 30 minutes is 365 ° ppb or less, and the polycarbonate for a semiconductor-related component transport case is characterized in that: It is intended to provide a resin material.
  • the present inventors have given conductivity to the polycarbonate resin material constituting the transfer case in order to prevent adhesion of dust and the like to the semiconductor-related components housed in the transfer case, It has also been found that the occurrence of defects in semiconductor-related components can be significantly reduced by suppressing the generation amount to a specific value or less.
  • another embodiment of the present invention relates to a semiconductor-related product comprising a conductive polycarbonate resin composition comprising a polycarbonate resin having a total gas generation amount equal to or less than a specific value and a conductive carbon black content of up to 20% by weight.
  • Parts transfer case guide The present invention provides an electrically conductive polycarbonate resin material.
  • the polycarbonate resin used in the present invention may be a phosgene method for reacting various dihydroxydiaryl compounds with phosgene, or an ester for reacting a dihydroxydiaryl compound with a carbonate such as difluorocarbonate. It is a polymer obtained by an exchange method, and a typical example is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).
  • the above dihydroxydiaryl compounds include, in addition to bisphenol A, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, and 2,2-bis ( 4-Hydroxyphenyl) butane, 2,2-bis (4-hydroxypheny ⁇ ) octane, bis (4-hydroxyphenyl) ⁇ 2 / lemethane, 2,2-bis (4-hydroxyphenyl / leh3) —Methinolepheninole) Propane, 1,1-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-13-bromopheninole) pronone, 2,2,1- Bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis (4-hydroxy-1,3,5-dichlorophenyl) propane-like bis (hydroxyaryl) alkanes, 1,2 1 Bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxypheny
  • dihydroxyaryl compound and a phenol compound having three or more valences as shown below may be mixed and used.
  • phenols having three or more valences include fluorodalsin, 4,6-dimethyl-2,4,6-tri (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6-tri- (4-hi) 1-heptane, 1,3,5-tree (4-hydroxyphenyl) benzol, 1,1,1-tree (4-1hydroxyphenyl) -ethane and 2,2-bis-1- [4,4- (4, 4'-dihydroxydiphenyl) -cyclohexyl] -propane.
  • the viscosity average molecular weight of the polycarbonate resin is usually 10,000 to 100,000, preferably 15,000 to 3000 °.
  • a molecular weight regulator, a catalyst and the like can be used as required.
  • the method for analyzing the total amount of generated gas according to the present invention is as follows. 1 g of a polycarbonate resin pellet was placed in an inert gas stream at 80 ° C for 30 minutes, and the thermally desorbed organic matter was collected once by a column filled with an adsorbent, and then the collected organic matter was collected. Is again thermally desorbed and concentrated from the adsorbent using an injection device equipped with a cooling trap, and injected into the GC-MS. Various organic substances thermally desorbed were separated by GC-MS. • The chemical structure was analyzed and the amount of organic substances thermally desorbed was determined.
  • the total amount of generated gas is 3650 ppb, preferably less than l OOO ppb, and more preferably more than 800 ppb, the deposition of organic substances such as hydrocarbons on semiconductor-related parts increases, and operation failures are generated. Absent.
  • DBP oil absorption is 10 Om1 / 100 g or more, preferably 300 ml. / 100 g or more and carbon black having a specific surface area of 50 m 2 Z g or more, preferably 50 M 2 Z g or more can be suitably used.
  • the DBP oil absorption is a value measured with a dibutyl phthalate uptake meter and is the number of ml of oil (dibutyl phthalate) contained per 1 g of carbon black. Indicates the degree of The specific surface area is a value obtained according to the liquid nitrogen adsorption method, and indicates a surface area per unit weight of carbon black.
  • the conductive carbon black may be contained up to 20% by weight based on the polycarbonate resin. If the content of the conductive carbon black is more than 20% by weight, the impact strength and the fluidity decrease, which is not preferable.
  • the method of mixing the conductive carbon black is not particularly limited, and includes a known mixer, for example, mixing using a tumbler, a ribbon blender, or the like, or melt-kneading using an extruder.
  • additives such as an antioxidant, an antistatic agent, a lubricant, a light stabilizer, an ultraviolet absorber, a dye, a pigment, and a reinforcing material are required for the polycarbonate resin as long as the effects of the present invention are not impaired. May be blended according to the conditions.
  • the method of analyzing the total amount of generated gas is as follows.
  • GC-MS measures until DOP is detected, that is, until DOP retention time.
  • the components detected are aliphatic hydrocarbons, aromatic hydrocarbons, and phthalates. Phthalate esters such as D ⁇ P and DBP were converted to DBP weight, and other components were converted to toluene weight, and the total amount of thermally desorbed organic substances was used as the total amount of generated gas.
  • Pellets of polycarbonate resin with a total gas generation of 2020 ppb polycarbonate resin with a viscosity average molecular weight of 2000 ° synthesized from bisphenol A and phosgene
  • conductive carbon black Ketjen manufactured by Ketjen Black International Ketjen
  • EC conductive carbon black
  • KTX-37 twin screw extruder
  • each was dried at 125 ° C. for 4 hours, and the fluidity was measured in accordance with ASTM D-1238.
  • Impact strength After drying the obtained pellets at 125 ° C for 4 hours, the resin temperature was set at 300 ° C using an injection molding machine (J100E—C5 manufactured by Nippon Steel Works). created by I De pressure 1 6 0 0 K gZc m 2 impact test pieces (1 2. 7 X 6 3 X 3. 2mm). Twenty-four hours after molding, the impact strength was measured according to ASTM D-256.
  • the polycarbonate resin material for the semiconductor-related parts transport case of the present invention has a small amount of gas generated when the semiconductor-related parts are housed in a transport case made of the same, so that the adhesion of organic substances such as hydrocarbons to the semiconductor-related parts is small. It has a remarkable effect on preventing malfunctions of semiconductor related parts.
  • the inclusion of conductive carbon black can prevent the attachment of dust and dirt, and has a remarkable effect in preventing malfunction of semiconductor-related components.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une résine de polycarbonate destinée à une cassette de pièces associées à un semiconducteur, caractérisée en ce que lorsque la résine est séchée à 80 °C pendant 30 minutes, celle-ci produit des gaz dans des proportions ne dépassant pas 3650 ppb; et une résine de polycarbonate destinée à une cassette de pièces associées à un semiconducteur, qui comprend la résine précitée, ainsi que du noir de carbone électroconducteur, dans des proportions allant jusqu'à 20 % en poids maximum de la résine précitée. En outre, la résine de polycarbonate destinée à une cassette de pièces associées à un semiconducteur présente une action importante empêchant les pièces associées au semiconducteur de tomber en panne en cours de fonctionnement, puisque, lorsque les pièces associées à un semiconducteur sont placées dans une cassette fabriquée avec cette résine, la quantité de gaz émise est très petite, et par conséquent seulement une infime quantité de substances organiques comme les hydrocarbures adhèrent au pièces associées au semiconducteur. Par ailleurs, la résine contenant du noir de carbone peut également empêcher le dépôt de poussières et analogues.
PCT/JP2000/004633 1999-07-16 2000-07-11 Resine de polycarbonate pour cassettes de pieces associees a un semiconducteur WO2001005868A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001511519A JP4356828B2 (ja) 1999-07-16 2000-07-11 半導体関連部品搬送ケース用ポリカーボネート樹脂材料

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/203709 1999-07-16
JP20370999 1999-07-16

Publications (1)

Publication Number Publication Date
WO2001005868A1 true WO2001005868A1 (fr) 2001-01-25

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WO (1) WO2001005868A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003040997A (ja) * 2001-07-26 2003-02-13 Mitsubishi Engineering Plastics Corp 電気電子部品搬送用部品製造用ポリカーボネート樹脂及び電気電子部品搬送用部品
JP2008141130A (ja) * 2006-12-05 2008-06-19 Shin Etsu Polymer Co Ltd 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150038969A (ko) 2013-10-01 2015-04-09 제일모직주식회사 정밀 부재용 수납 용기 및 이의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04342758A (ja) * 1991-05-21 1992-11-30 Teijin Chem Ltd 導電性熱可塑性樹脂組成物
US5907027A (en) * 1997-04-11 1999-05-25 General Electric Company Reducing ionic impurities content in aromatic polycarbonate resins
JPH11163115A (ja) * 1997-11-28 1999-06-18 Shin Etsu Polymer Co Ltd ウェーハ押さえ部材、これを組み込んだウェーハ収納用容器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04342758A (ja) * 1991-05-21 1992-11-30 Teijin Chem Ltd 導電性熱可塑性樹脂組成物
US5907027A (en) * 1997-04-11 1999-05-25 General Electric Company Reducing ionic impurities content in aromatic polycarbonate resins
JPH11163115A (ja) * 1997-11-28 1999-06-18 Shin Etsu Polymer Co Ltd ウェーハ押さえ部材、これを組み込んだウェーハ収納用容器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003040997A (ja) * 2001-07-26 2003-02-13 Mitsubishi Engineering Plastics Corp 電気電子部品搬送用部品製造用ポリカーボネート樹脂及び電気電子部品搬送用部品
JP2008141130A (ja) * 2006-12-05 2008-06-19 Shin Etsu Polymer Co Ltd 半導体搬送容器用部品用導電性樹脂組成物及びこれを用いた半導体搬送容器用部品並びに半導体搬送容器

Also Published As

Publication number Publication date
JP4356828B2 (ja) 2009-11-04

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