WO2001005868A1

WO2001005868A1 - Polycarbonate resin material for case for carrying parts associated with semiconductor

Info

Publication number: WO2001005868A1
Application number: PCT/JP2000/004633
Authority: WO
Inventors: Tadashi Shinomiya; Ichiro Kondo
Original assignee: Sumitomo Dow Limited
Priority date: 1999-07-16
Filing date: 2000-07-11
Publication date: 2001-01-25
Also published as: JP4356828B2

Abstract

A polycarbonate resin material for a case for carrying parts associated with a semiconductor, characterized in that when the resin material is dried at 80°C for 30 minutes, it generates gases in an amount not more than 3650 ppb; and a polycarbonate resin material for a case for carrying parts associated with a semiconductor, which comprises the above-defined resin material and also electrically conductive carbon black in an amount of up to 20 wt % of the above-defined resin material. The polycarbonate resin material for a case for carrying parts associated with a semiconductor exhibits significant effect for preventing parts associated with a semiconductor from the failure in action, since, when parts associated with a semiconductor are placed in a carrying case manufactured of the resin material, the amount of gases evolved is significantly small and hence only a significantly small amount of organic substances such as a hydrocarbon is adhered to the parts associated with a semiconductor. Further, the resin material comprising a conductive carbon black can also prevent the deposition of dusts and the like.

Description

TECHNICAL FIELD The present invention relates to a polycarbonate resin material used for a semiconductor-related component carrying case and a conductive polycarbonate resin material containing conductive carbon black. More specifically, the present invention provides a polycarbonate resin material for a semiconductor-related component transfer case, which is made of a polycarbonate resin or a conductive polycarbonate resin composition in which the total amount of generated gas is suppressed. In recent years, the spread of electronic devices such as computers has been remarkable. Semiconductor-related components such as semiconductor wafers, disks, and hard disks are used for computers and other storage disks. In the assembly of computers, etc., these semiconductor-related components must be transported and transported in order to supply them to the assembly line.Conventionally, transport cases made of thermoplastic resins such as polycarbonate resin and polypropylene have been used for this purpose. . As the shape of the transfer case, for example, a disk package as disclosed in Japanese Patent Application Laid-Open No. 7-300138 can be mentioned. In particular, polycarbonate resin has been attracting attention as a material for semiconductor-related parts transport cases because of its excellent transparency and impact resistance.

Here, semiconductor-related components include silicon wafers, hard disks, disk substrates, IC chips, magneto-optical disks, high-performance glass substrates for LCDs, LCD color filters, hard disk magnetoresistive heads, and the like.

However, as semiconductor-related components become more highly integrated in order to increase the storage capacity of computers, the frequency of performance problems occurring in the semiconductor-related components housed in the above-mentioned transport case increases. The problem arose. Specifically, there are problems such as malfunction of the storage disk caused by organic substances adhering to the storage disk and dust and dirt adhering thereto.

The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that trace gases such as hydrocarbons generated from the case material for transporting semiconductor-related parts can be used for semiconductor-related parts. It has been found that the above-mentioned problems occur because they act and deposit on the surface, and that the occurrence of problems with semiconductor-related components housed in the transport case is significantly reduced by suppressing the amount of gas below a specified value. Thus, the present invention has been completed.

As such a technique, Japanese Patent Application Laid-Open No. 2000-686363 discloses that the amount of gas generated when a polycarbonate resin pellet is placed in a closed container and heated at 150 ° C for 1 hour is toluene. It is disclosed that contamination of a silicon wafer or the like can be reduced by using a container made of an aromatic polycarbonate having a weight conversion of 1.5 ppm or less. However, the present inventors have studied the method of measuring the gas amount, and have found a method of appropriately detecting gas components acting on and depositing on semiconductor-related components by a simpler method. That is, the polycarbonate resin pellets are placed in an atmosphere of an inert gas at 80 ° C. for 30 minutes, and the thermally desorbed organic substances are collected in an adsorbent to measure the generated organic substance gas having a low boiling point to a high boiling point. They found that it was more appropriate to see the degree of failure of semiconductor-related components. It is thought that higher boiling point gas components can be detected more appropriately by this method. It has been found that, when used as a case material for transporting semiconductor-related components, a polycarbonate resin with a small amount of gas components that thermally desorbs under such conditions does not contaminate the semiconductor-related components in the case.

That is, the present invention is characterized in that the total amount of generated gas that thermally desorbs when left at 80 ° C. for 30 minutes is 365 ° ppb or less, and the polycarbonate for a semiconductor-related component transport case is characterized in that: It is intended to provide a resin material.

Further, the present inventors have given conductivity to the polycarbonate resin material constituting the transfer case in order to prevent adhesion of dust and the like to the semiconductor-related components housed in the transfer case, It has also been found that the occurrence of defects in semiconductor-related components can be significantly reduced by suppressing the generation amount to a specific value or less. In such a case, another embodiment of the present invention relates to a semiconductor-related product comprising a conductive polycarbonate resin composition comprising a polycarbonate resin having a total gas generation amount equal to or less than a specific value and a conductive carbon black content of up to 20% by weight. Parts transfer case guide The present invention provides an electrically conductive polycarbonate resin material.

Hereinafter, the polycarbonate resin material for a semiconductor-related component carrying case and the conductive polycarbonate resin material of the present invention will be described in detail.

The polycarbonate resin used in the present invention may be a phosgene method for reacting various dihydroxydiaryl compounds with phosgene, or an ester for reacting a dihydroxydiaryl compound with a carbonate such as difluorocarbonate. It is a polymer obtained by an exchange method, and a typical example is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).

The above dihydroxydiaryl compounds include, in addition to bisphenol A, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, and 2,2-bis ( 4-Hydroxyphenyl) butane, 2,2-bis (4-hydroxypheny ^^) octane, bis (4-hydroxyphenyl) ^ 2 / lemethane, 2,2-bis (4-hydroxyphenyl / leh3) —Methinolepheninole) Propane, 1,1-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxy-13-bromopheninole) pronone, 2,2,1- Bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis (4-hydroxy-1,3,5-dichlorophenyl) propane-like bis (hydroxyaryl) alkanes, 1,2 1 Bis (4-hydroxyphenyl) cyclopentane, 1,1-bis (4-hydroxyphenylene) bis (hydroxyaryl) cycloalkanes such as cyclohexane, 4, A'dihydroxy diphenyl ether, 4,4'-dihydroxy-3,3'-dihydroxydiaryl ethers, such as dimethyldiphenyl ether; 4,4'-dihydroxydiarylsulfonides, such as dihydroxydiphenyl sulfide , 4, 'Dihydroxydiphenylsulfoxide, 4,4'Dihydroxydiarylsulfoxides such as dimethyldiphenylsulfoxide, 4,4'Dihydroxydiphenylsulfoxide, 4 , 4 'dihydroxy-3, 3'-dihydroxysulfur such as dimethyldiphenylsulfone And aryl sulfones.

These may be used alone or as a mixture of two or more. In addition, piperazine, dipiperidyl hydroquinone, resorcin, 4,4′-dihydroxydiphenyl, etc. may be used in combination. .

Further, the above-mentioned dihydroxyaryl compound and a phenol compound having three or more valences as shown below may be mixed and used.

Examples of phenols having three or more valences include fluorodalsin, 4,6-dimethyl-2,4,6-tri (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6-tri- (4-hi) 1-heptane, 1,3,5-tree (4-hydroxyphenyl) benzol, 1,1,1-tree (4-1hydroxyphenyl) -ethane and 2,2-bis-1- [4,4- (4, 4'-dihydroxydiphenyl) -cyclohexyl] -propane. The viscosity average molecular weight of the polycarbonate resin is usually 10,000 to 100,000, preferably 15,000 to 3000 °. In producing such a polycarbonate resin, a molecular weight regulator, a catalyst and the like can be used as required. The method for analyzing the total amount of generated gas according to the present invention is as follows. 1 g of a polycarbonate resin pellet was placed in an inert gas stream at 80 ° C for 30 minutes, and the thermally desorbed organic matter was collected once by a column filled with an adsorbent, and then the collected organic matter was collected. Is again thermally desorbed and concentrated from the adsorbent using an injection device equipped with a cooling trap, and injected into the GC-MS. Various organic substances thermally desorbed were separated by GC-MS. • The chemical structure was analyzed and the amount of organic substances thermally desorbed was determined. The sum of the thermally desorbed organic substances was used as the total amount of generated gas. As a result of these analyses, aliphatic hydrocarbons, phthalates, phosphates, siloxane compounds, etc. are detected as the organic substances thermally desorbed.

When the total amount of generated gas is 3650 ppb, preferably less than l OOO ppb, and more preferably more than 800 ppb, the deposition of organic substances such as hydrocarbons on semiconductor-related parts increases, and operation failures are generated. Absent.

There is no particular limitation on the method of reducing the total amount of generated gas. In the production of resin, methods such as selecting and using raw materials and auxiliary raw materials that do not contain organic impurities, or avoiding the use of equipment such as resin piping for the purpose of preventing the contamination of organic impurities from the production line Is mentioned.

In particular, it is preferable to check the amount of the generated gas for each production port of the polycarbonate resin, select a production lot that satisfies the above-mentioned standard, and use it for molding the semiconductor-related component transport case of the present invention.

There are no particular restrictions on the raw material and production method of the conductive ribbon used in the present invention, but its DBP oil absorption is 10 Om1 / 100 g or more, preferably 300 ml. / 100 g or more and carbon black having a specific surface area of 50 m ² Z g or more, preferably 50 M ² Z g or more can be suitably used. The DBP oil absorption is a value measured with a dibutyl phthalate uptake meter and is the number of ml of oil (dibutyl phthalate) contained per 1 g of carbon black. Indicates the degree of The specific surface area is a value obtained according to the liquid nitrogen adsorption method, and indicates a surface area per unit weight of carbon black.

The conductive carbon black may be contained up to 20% by weight based on the polycarbonate resin. If the content of the conductive carbon black is more than 20% by weight, the impact strength and the fluidity decrease, which is not preferable.

The method of mixing the conductive carbon black is not particularly limited, and includes a known mixer, for example, mixing using a tumbler, a ribbon blender, or the like, or melt-kneading using an extruder.

In addition, various additives such as an antioxidant, an antistatic agent, a lubricant, a light stabilizer, an ultraviolet absorber, a dye, a pigment, and a reinforcing material are required for the polycarbonate resin as long as the effects of the present invention are not impaired. May be blended according to the conditions.

Hereinafter, the present invention will be described specifically with reference to examples, but the present invention is not limited to the examples. In addition, “ppb”, “part”, and “%” are based on the weight basis. After drying each pellet of polycarbonate resin (polycarbonate resin with a viscosity-average molecular weight of 20000 synthesized from bisphenol A and phosgene) with different total generated gas amounts shown in Table 1, each was dried at 125 ° C for 4 hours, and then injected. (Toshiba IS550FX) using a resin temperature of 300 ° C and an injection pressure of 170 OKg / cm ^2, 25 hard disks (each using ICM NX-340) without contact A transfer case that can be stored was molded.

The method of analyzing the total amount of generated gas is as follows.

After 1 g of a polycarbonate resin pellet was placed in an atmosphere of nitrogen gas at 80 ° C. for 30 minutes, the thermally desorbed organic matter was once collected by a column filled with an adsorbent (Sigma Aldrich Japan N5020). The collected organic matter is again thermally desorbed and concentrated from the adsorbent using an injection device equipped with a cooling trap. GC-MS (GCMS-QP 1 000 EX manufactured by Shimadzu Corporation) (Column: DB-1 manufactured by Shimadzu Corporation) , 0.53mmX30m, thickness 0.1 / m)). Various organic substances thermally desorbed were separated by GC-MS, and their chemical structures were analyzed to quantify the thermally desorbed organic substances. GC-MS measures until DOP is detected, that is, until DOP retention time. The components detected are aliphatic hydrocarbons, aromatic hydrocarbons, and phthalates. Phthalate esters such as D〇P and DBP were converted to DBP weight, and other components were converted to toluene weight, and the total amount of thermally desorbed organic substances was used as the total amount of generated gas.

Twenty-four hours after the transfer case was molded, 25 hard disks (using NX-340 manufactured by ICM) were stored in the case. Using an aluminum foil film (thickness: 0.1 mm), wrap the case with the aluminum foil side inside, fill with nitrogen gas, and leave at 50 ° C, 90% RH atmosphere for 8 hours did. After that, remove the stored hard disk from the case, install it in a hard disk drive (NX-340 made by ICM), and use it with 98 note SX / E manufactured by NEC Corporation to operate 25 hard disks in each case. Confirmation was made. As a result of the operation check, the number of hard disks that failed due to hard disk drive operation, such as a flying head, which is considered to be due to organic matter accumulation, was counted. The defect rate was determined and those with a defect rate of 10% or less were accepted. Table 1 shows the results.

Examples 4 to 5 and Comparative Example 2

Pellets of polycarbonate resin with a total gas generation of 2020 ppb (polycarbonate resin with a viscosity average molecular weight of 2000 ° synthesized from bisphenol A and phosgene) and conductive carbon black (Ketjen manufactured by Ketjen Black International Ketjen) Black EC, DBP oil absorption 360 m 1 Z 100 g, specific surface area 800 m ² / g), using a twin screw extruder (KTX-37 manufactured by Kobe Steel) based on the compounding ratio shown in Table 2, cylinder temperature The mixture was melt-kneaded at 280 ° C to obtain various conductive polycarbonate resin bellets.

Using the obtained pellets, the same operation as in the above example was performed to form a transfer case, and the operation of the hard disk was confirmed. The results are shown in Table 2.

On the other hand, the conductivity, fluidity, and impact strength of the obtained conductive polycarbonate resin were measured. Each test method is as follows.

Conductivity:

Using the obtained Peretsuto, after drying, respectively 4 hours at 1 25 ° C, set by using an injection molding machine (Japan Steel Works J 100E- C 5) a resin temperature of 300 ° C, the pressure 1600KgZcm ² out morphism To make a flat plate (40 X 60 X 3 mm). Twenty-four hours after shaping, conductivity was measured according to ASTM D-257. Liquidity:

Using the obtained pellets, each was dried at 125 ° C. for 4 hours, and the fluidity was measured in accordance with ASTM D-1238.

Impact strength: After drying the obtained pellets at 125 ° C for 4 hours, the resin temperature was set at 300 ° C using an injection molding machine (J100E—C5 manufactured by Nippon Steel Works). created by I De pressure 1 6 0 0 K gZc m ² impact test pieces (1 2. 7 X 6 3 X 3. 2mm). Twenty-four hours after molding, the impact strength was measured according to ASTM D-256.

Table 2

The polycarbonate resin material for the semiconductor-related parts transport case of the present invention has a small amount of gas generated when the semiconductor-related parts are housed in a transport case made of the same, so that the adhesion of organic substances such as hydrocarbons to the semiconductor-related parts is small. It has a remarkable effect on preventing malfunctions of semiconductor related parts. In addition, the inclusion of conductive carbon black can prevent the attachment of dust and dirt, and has a remarkable effect in preventing malfunction of semiconductor-related components.

Claims

The scope of the claims

1. Polycarbonate resin material for semiconductor-related parts transport cases that has a total generated gas amount of 3650 ppb or less that is thermally desorbed when left at 80 ° C for 30 minutes.

2. The polycarbonate resin material according to claim 1, which contains 20% by weight or less of conductive carbon black.

3. The polycarbonate resin material according to claim 2, wherein the conductive carbon black has a dibutyl phthalate (DBP) oil absorption of at least 100 g / m ² and a specific surface area of 5 g / m ² Zg or more. .

4. A semiconductor-related component transport case manufactured using a polycarbonate resin material that emits less than 3650 ppb of gas when thermally desorbed when left at 80 ° C for 30 minutes.

5. The semiconductor-related component carrying case according to claim 4, wherein the polycarbonate resin material contains 20% by weight or less of a conductive carbon black.

6. The semiconductor-related component carrying case according to claim 5, wherein the conductive carbon black has a dibutyl phthalate (DBP) oil absorption of 10 Om 1 Z 100 g or more and a specific surface area of 5 Om ² Zg or more.

7. Use of a polycarbonate resin material with a total released gas amount of 3650 ppb or less when left at 80 ° C for 30 minutes as a case for transporting semiconductor-related parts.

8. The use according to claim 7, wherein the polycarbonate resin material contains 20% by weight or less of a conductive carbon black.

9. The use according to claim 8, wherein the dibutyl phthalate (DBP) oil absorption of the conductive carbon black is at least 10 Om 1 Zl 00 g and its specific surface area is at least 5 Om ² Zg.