WO2000079293A1 - Dispositif a sondes utilisant des elements de sonde superelastiques - Google Patents

Dispositif a sondes utilisant des elements de sonde superelastiques Download PDF

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Publication number
WO2000079293A1
WO2000079293A1 PCT/US2000/017238 US0017238W WO0079293A1 WO 2000079293 A1 WO2000079293 A1 WO 2000079293A1 US 0017238 W US0017238 W US 0017238W WO 0079293 A1 WO0079293 A1 WO 0079293A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
probe element
needle
elements
module
Prior art date
Application number
PCT/US2000/017238
Other languages
English (en)
Other versions
WO2000079293A9 (fr
Inventor
Alan E. Humphrey
Marshall J. Dana
Original Assignee
International Test Solutions, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Test Solutions, Inc. filed Critical International Test Solutions, Inc.
Priority to AU57596/00A priority Critical patent/AU5759600A/en
Publication of WO2000079293A1 publication Critical patent/WO2000079293A1/fr
Publication of WO2000079293A9 publication Critical patent/WO2000079293A9/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Definitions

  • This invention relates generally to a device for testing a semiconductor die or
  • a wafer or integrated circuit tester also known as a prober
  • the conventional wafer or integrated circuit tester may include a probe card.
  • the probe card is typically a structure including a printed circuit board, a support
  • cantilever probe elements or needles, or to use vertical probing elements.
  • vertical probing elements typically,
  • each probe element is inherently a resilient spring device acting as a cantilever beam
  • a variation is to mount multiple probe elements in a
  • tip and the bonding pad is proportional to the amount of deflection of the probe spring.
  • the probe card, and its multiple probe elements are held in
  • the typical probe card contains dozens or hundreds of probe elements, with one
  • contacts the bonding pad is related to the geometry and size of the probe tip and the
  • Probes may be present that tend to inhibit a good electrical connection.
  • element stiffness is related to characteristics of the probe element's material properties
  • Probe element elasticity may be
  • tip deflection, or overdrive, or the probe element elasticity characteristics may be
  • One conventional semiconductor die tester may use cantilever type probe
  • the cantilever type probe elements are typically made of beryllium-copper,
  • tungsten or tungsten-rhenium alloys. These materials are selected because of their
  • probes act as cantilever or leaf type springs so that the materials must also offer
  • Cantilever probes are typically anchored at
  • probe needles may be plated with gold or other conductive, oxidation resistant materials to enhance electrical properties, physical properties and service life.
  • Cantilever probe needles may also be coated or encased with an insulating material to
  • the tips of the cantilever probes are typically bent
  • the tip is generally contoured or sharpened to develop sufficient
  • the tip wear results in increased contact area, decreased contact pressure and
  • Cantilever tips therefore, require periodic removal and maintenance of the probe card to restore tip shape and restore contact resistance to
  • Cantilever probes are typically anchored in an epoxy matrix at the end away
  • the tips themselves are freely positioned in space as
  • the X-Y position of the probe tips is
  • the tip is brought into contact with a bonding pad of a semiconductor device, the tip is
  • the tips are typically positioned in their final free state by
  • Another conventional semiconductor testing apparatus is a vertical testing
  • the vertical testers may include vertical probe needles that are generally
  • the vertical probe needle When actuated, the vertical probe needle is loaded in compression and undergoes
  • the vertical probe will act as a spring and will be restored to its
  • the width or diameter of the vertical probe needles must decrease.
  • these vertical probe needles may be electrically insulated or encased with an insulating material to prevent shorting if they contact each other during the lateral
  • the vertical probes actuate along a longitudinal
  • probe tip is likely to not only penetrate the oxide film, but also penetrate and/or
  • the manufactured shape of the probe needle but more typically is controlled by the
  • the perforated guide plate is positioned in
  • the purpose of the guide is to control or constrain the probe tip during
  • the pointed tip configuration is typically configured with a pointed or sharpened tip.
  • the pointed tip configuration is typically configured with a pointed or sharpened tip.
  • a drawback presented by the pointed tip configuration is a reduction of
  • the invention provides a probe module and probe tester capable of testing
  • the probe module makes multiple
  • the probe module in accordance with the invention may have probe elements
  • nickel-titanium alloys and copper based alloys such as copper-zinc-
  • the superelastic characteristic provides the probe elements
  • the probe element may also include
  • the probe element may then be drawn and redrawn through sizing dies to achieve small diameter elements
  • microtubing may be manufactured from nickel-titanium alloys, and copper based
  • alloys such as copper-zinc-aluminum and copper-aluminum-nickel.
  • the probe elements may be any suitable probe elements.
  • the probe elements may be any suitable probe elements.
  • the probe elements may
  • the tip coating enhances the capability of the probe tip to penetrate the
  • the probe module in accordance with the invention further comprises a probe
  • the probe module may also include an integrated circuit
  • the probe module in accordance with the invention may also include
  • the alignment support in accordance with the invention may reduce
  • the probe element tips may
  • the probe module may provide an
  • the lateral motion may be a variety of conventional mechanical or electromechanical
  • the superelastic probe elements means that shorter probe elements
  • probe elements may be used since the typical probe elements need a longer length to achieve the same flexibility.
  • typical cantilever systems use probe elements that are 1- 2 "
  • superelastic probes may be 3/16" - V" long for fine pitch applications. The shorter
  • Figure 1 is a diagram illustrating a typical semiconductor testing apparatus
  • Figure 2 is a diagram illustrating a conventional probe module having
  • Figure 3 is a diagram illustrating more details of the bending of the
  • Figure 4 is a diagram illustrating a probe module in accordance with the
  • Figure 5 is a diagram illustrating a printed circuit board portion of the probe
  • Figures 6a - 6c are diagrams illustrating more details of the superelastic probe
  • Figure 4 Figures 7a and 7b are diagrams illustrating more details of the lower guide plate
  • Figure 8 is a diagram illustrating a guide plate hole
  • Figures 9a and 9b are diagrams illustrating two embodiments of the scrubbing
  • Figure 10a and 10b are diagrams illustrating two additional embodiments of the
  • the invention is particularly applicable to testing a semiconductor die or
  • Figure 1 is a diagram illustrating a conventional automated semiconductor die
  • testing apparatus 20 which may be used to test one or more integrated microcircuits 21.
  • the microcircuit 21 under test is mounted onto a moveable chuck 22 in the prober
  • the moveable chuck which moves the microcircuit in a vertical direction.
  • the moveable chuck For example, the moveable chuck
  • the moveable chuck 22 may move between a loading position in which the microcircuit or wafer is loaded onto the chuck and a testing position in which the moveable chuck 22 has moved the
  • microcircuit 21 upwards so that the probe elements of the testing apparatus are
  • microcircuit may occur.
  • the microcircuit may also be part of a wafer containing a
  • microcircuit on the wafer may be automatically tested.
  • the moveable chuck may thus
  • probe needles also known as probe needles
  • the probe card 26 may in turn be electrically connected to a prober test head 30 by
  • the prober test head 30 may in turn be
  • electrical signals to the prober test head e.g., test signals, a power signal and a ground
  • microcircuit test system 34 may analyze the resultant signals and generate test results
  • the chuck may moves in the vertical "Z" direction to precisely
  • automated tester 34 provides power, ground and test signals through the prober test
  • the testing apparatus 20 provides a means for testing the probe card 26 and into the microcircuit 21 .
  • the probe card may typically provide a mechanism for aligning the probe card and the probe needles
  • Figure 2 is a diagram illustrating more details of the conventional cantilevered
  • the probe card may include a printed circuit
  • the ring may be made of a polymeric of ceramic material.
  • probe needles 24 may be anchored at one end by embedding the probe needles in a
  • the probe needles may flex which causes the probe needle to apply a
  • each probe needle may have a characteristic
  • the probe needle may depends on the probe wire diameter, the tip length.
  • electrical contact between the bonding pad and the probe needle may depend on the tip
  • Figure 3 illustrates how a conventional cantilever probe needle contacts a
  • the figure also shows how the probe needle 26 exerts a contact
  • Figure 4 illustrates a probe module 60 in accordance with the invention.
  • probe module 60 may replace the conventional probe card 26 and may operate with the
  • probe module 60 in accordance with the invention may replace
  • the conventional probe card 26 and be used to permit the testing apparatus 20 shown in
  • Figure 1 to test microcircuits having high density, closely spaced bonding pads.
  • the moveable chuck 22 may move the
  • the probe module 60 may comprise a probe card 64 which may be
  • the probe module 60 may
  • first and second layer 66, 68 of semiconductor material also include a plurality
  • the probe module may further
  • the probe module may also comprise a lower guide plate 76 which is attached to the housing 74.
  • the probe module 60 may
  • cover 76 which covers the layers of semiconductor material 66, 68.
  • a space 80 between the layers 66, 68 and the cover may be
  • an encapsulation material which may preferably be epoxy or another potting
  • the encapsulating material may help to further ensure that the pieces of the
  • the layers 66, 68 may preferably be made out of semiconductor material which
  • the layers 66, 68 also permit the discrete components, such as the
  • microcircuit to be formed directly on the layers as will be described with reference to
  • Each probe element may be connected to either the first layer 66 or the
  • the probe elements 70 may be made of a superelastic material that may also be
  • NiTi nickel titanium
  • the nickel and the titanium in the alloy are selected as is well known so that the
  • transition temperature of the alloy e.g., the temperature at which the alloy is
  • composition of the nickel and titanium in the alloy may be varied such that the probe
  • Each superelastic probe element may preferably be any superelastic probe element.
  • the tip may preferably be sharpened to a size of about 5 ⁇ m.
  • Figure 5 is a top view of the semiconductor layer 68 showing a method of
  • the layer 68 may preferably be fabricated using reactive ion etching. Because the layer 68 is made
  • an impedance control device 96 such as a resistive and/or capacitive
  • the first layer 66 may be similarly fabricated with the in-place
  • FIG. 6a is a diagram illustrating a probe element in accordance with the
  • Figure 6b is a diagram illustrating more details of the tip of the probe
  • each probe element 70 may
  • the dielectric layer 102 may encase
  • the dielectric layer 102 may preferably be any material that can be accurately test the microcircuit.
  • the dielectric layer 102 may preferably be any material that can be used to accurately test the microcircuit.
  • dielectric material that may be vapor deposited onto the surface of the probe material to
  • the dielectric material may be ParyleneTM which is very flexible and
  • Figure 6b shows another embodiment of the probe element and in particular
  • the probe 98 may comprise an inner
  • conductive core 104 which may be any conductive material and may preferably be
  • the probe 98 may further comprise a superelastic microtube layer 106 which
  • the microtube layer may
  • transition temperature chosen (based on the composition of the alloy) so that the
  • microtube layer is superelastic at the testing temperature.
  • the probe 98 may
  • the highly conductive tip portion the tip may be treated and alloyed to provide a hard
  • the outer casing 110 may be highly conductive, may be formed
  • the outer casing 110 may further comprise a matrix of highly organic compound
  • Figure 6c illustrates the contact force of each probe element in relation to the
  • the contact force may initially
  • the predetermined point at which the contact force does not increase is
  • Figure 7a is a top view of the lower guide plate 76 and Figure 7b is a side view
  • the lower guide plate may include an
  • the pattern may be a rectangular pattern which may be used to test a memory
  • Each hole 120 in the array may have a predetermined shape which will be
  • the guide plate and the holes in the guide plate may guide the probe elements as the probe elements contact the
  • each hole 120 may be triangular shaped so
  • each hole may provide three points of support of the probe element.
  • the guide plate may be sized as appropriate for the bonding pad array for
  • the guide plate may accommodate any bonding
  • pad array configuration such as peripheral, multi-device, or fine pitch area a ⁇ ays.
  • guide plate may be manufactured out of silicon material so that the guide plate material
  • microcircuit or wafers are made from. Additionally, since photo-lithographic and
  • etching methods may be used for the fabrication of the microcircuit devices as well as
  • Figure 8 is a diagram illustrating an example of a preferred guide plate hole 120
  • the guide plate hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the hole 120 may also be any other shape which provides some support to the probe element.
  • the diamond shaped hole may be round, octagonal shape or diamond shaped. In the diamond shaped hole, the
  • probe element may be supported at four points instead of three in the preferred
  • the probe element 70 may be any material.
  • the probe element 70 may be any material.
  • each support point 124 is 120° apart as defined by the equilateral triangle
  • triangular shaped hole 120 is formed in the silicon, or similar guide plate material
  • hole 120 may have sloped sides for about two-thirds of the material thickness to further
  • Figures 9a and 9b are diagrams illustrating a first embodiment of the vertical
  • probe element 70 in accordance with the invention providing a scrubbing action
  • Figures 10a and 10b are diagrams illustrating a second embodiment of the probe
  • the amount of scrub is a function of the inclination
  • the hole 120 in the guide plate 76 may be tilted
  • the holes 120 in the guide plate 76 may be manufactured by drilling or etching the guide plate. This embodiment permits holes
  • Figures 10a and 10b illustrate a second embodiment that provides scrubbing
  • the guide plate 76 may
  • first layer 142 includes a first layer 142, a second layer 144 and a third layer 146.
  • second layer 144 includes a first layer 142, a second layer 144 and a third layer 146.
  • third layer 146 includes a third layer 146.
  • the holes 120 within each layer of the guide plate may be slightly offset to form the
  • the holes may be drilled or etched into each plate as the layers are held
  • each layer may be
  • the probe module in accordance with the invention may have
  • the module may be used for very fine pitch bonding pads.
  • the superelastic probe elements may be used for very fine pitch bonding pads.
  • the superelastic probe elements in accordance with the invention may be shorter than conventional probe elements since conventional probe elements need the longer length
  • the low DC resistance means that
  • a concern for testing apparatus is the loss of signal or noise caused by the
  • inductance of the probe elements especially at high frequencies, such as microwaves.
  • the shorter length of the superelastic probe element means a low inductance of the

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne un module de sondes verticales (20) qui sert à tester des dispositifs à circuits intégrés (21) et qui utilise des éléments de sonde (24) construits en matériaux superélastiques. En outre, le module utilise un mécanisme de guidage des sondes inférieures (22) et un dispositif de retenue des sondes supérieures et de matrice de circuits (28) construit en matériaux au silicium selon des procédés de photolithogravure et de gravure ionique réactive. La matrice de circuit gravé et imprimé fait interface directement avec la carte des sondes (26), qui, en ce qui la concerne, fait interface avec l'appareil de test de circuits intégrés. Le mécanisme de guidage des pointes de sonde (22) utilise une logique de repère et de guidage sur trois ou quatre points de façon à assurer un positionnement latéral précis de la pointe des sondes pendant le test et entre deux lancements de tests. Le module de sondes verticales dispose de plusieurs possibilités pour réaliser un grattage latéral de la pointe de sonde sur la surface des pavés de contacts du dispositif à circuits intégrés, ce qui permet d'améliorer la résistance de contact.
PCT/US2000/017238 1999-06-22 2000-06-22 Dispositif a sondes utilisant des elements de sonde superelastiques WO2000079293A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU57596/00A AU5759600A (en) 1999-06-22 2000-06-22 Probe device using superelastic probe elements

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US14023199P 1999-06-22 1999-06-22
US60/140,231 1999-06-22
US60254500A 2000-06-21 2000-06-21
US09/602,545 2000-06-21

Publications (2)

Publication Number Publication Date
WO2000079293A1 true WO2000079293A1 (fr) 2000-12-28
WO2000079293A9 WO2000079293A9 (fr) 2002-04-25

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Application Number Title Priority Date Filing Date
PCT/US2000/017238 WO2000079293A1 (fr) 1999-06-22 2000-06-22 Dispositif a sondes utilisant des elements de sonde superelastiques

Country Status (2)

Country Link
AU (1) AU5759600A (fr)
WO (1) WO2000079293A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011110255A2 (fr) 2010-03-11 2011-09-15 Rohde & Schwarz Gmbh & Co. Kg Pointe de mesure à transducteur intégré
JP2014112115A (ja) * 2009-12-24 2014-06-19 Gardian Japan Co Ltd 配線検査治具用上板部材
WO2016107729A1 (fr) * 2014-12-30 2016-07-07 Technoprobe S.P.A. Sonde de contact pour tête d'essai
CN106154136A (zh) * 2016-06-20 2016-11-23 东莞市联洲知识产权运营管理有限公司 一种运算放大器集成电路的检测治具
WO2019187957A1 (fr) * 2018-03-30 2019-10-03 日本電産リード株式会社 Gabarit d'inspection et dispositif d'inspection équipé de celui-ci
JP2020509371A (ja) * 2017-02-24 2020-03-26 テクノプローべ ソシエタ ペル アチオニ 改善された周波数特性を有する垂直プローブ試験ヘッド
WO2024132683A1 (fr) * 2022-12-21 2024-06-27 Technoprobe S.P.A. Tête de sonde verticale améliorée

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731710A (en) * 1993-12-24 1998-03-24 Nippondenso Co., Ltd. Contact probe apparatus used in electric tests for a circuit board
US6084420A (en) * 1998-11-25 2000-07-04 Chee; Wan Soo Probe assembly for testing
US6091256A (en) * 1995-05-19 2000-07-18 Microconnect, Inc. Contact device for making connection to an electronic circuit device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5731710A (en) * 1993-12-24 1998-03-24 Nippondenso Co., Ltd. Contact probe apparatus used in electric tests for a circuit board
US6091256A (en) * 1995-05-19 2000-07-18 Microconnect, Inc. Contact device for making connection to an electronic circuit device
US6084420A (en) * 1998-11-25 2000-07-04 Chee; Wan Soo Probe assembly for testing

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014112115A (ja) * 2009-12-24 2014-06-19 Gardian Japan Co Ltd 配線検査治具用上板部材
WO2011110255A2 (fr) 2010-03-11 2011-09-15 Rohde & Schwarz Gmbh & Co. Kg Pointe de mesure à transducteur intégré
DE102010033991A1 (de) 2010-03-11 2011-12-01 Rhode & Schwarz Gmbh & Co. Kg Messspitze mit integriertem Messwandler
US9081035B2 (en) 2010-03-11 2015-07-14 Rohde & Schwarz Gmbh & Co. Kg Test probe with integrated test transformer
US11131690B2 (en) 2014-12-30 2021-09-28 Technoprobe S.P.A. Contact probe for testing head
KR20220153661A (ko) * 2014-12-30 2022-11-18 테크노프로브 에스.피.에이. 테스트 헤드용 접촉 프로브
CN107257928A (zh) * 2014-12-30 2017-10-17 泰克诺探头公司 用于测试头的接触探针
TWI679425B (zh) * 2014-12-30 2019-12-11 義大利商技術探測股份有限公司 用於測試頭之接觸式探針
WO2016107729A1 (fr) * 2014-12-30 2016-07-07 Technoprobe S.P.A. Sonde de contact pour tête d'essai
KR102542154B1 (ko) 2014-12-30 2023-06-13 테크노프로브 에스.피.에이. 테스트 헤드용 접촉 프로브
CN106154136B (zh) * 2016-06-20 2018-11-16 泉州市弘丰农农业技术有限公司 一种运算放大器集成电路的检测治具
CN106154136A (zh) * 2016-06-20 2016-11-23 东莞市联洲知识产权运营管理有限公司 一种运算放大器集成电路的检测治具
JP2020509371A (ja) * 2017-02-24 2020-03-26 テクノプローべ ソシエタ ペル アチオニ 改善された周波数特性を有する垂直プローブ試験ヘッド
JP7315462B2 (ja) 2017-02-24 2023-07-26 テクノプローべ ソシエタ ペル アチオニ 改善された周波数特性を有する垂直プローブ試験ヘッド
WO2019187957A1 (fr) * 2018-03-30 2019-10-03 日本電産リード株式会社 Gabarit d'inspection et dispositif d'inspection équipé de celui-ci
US11327094B2 (en) 2018-03-30 2022-05-10 Nidec-Read Corporation Inspection jig, and inspection device including the same
JPWO2019187957A1 (ja) * 2018-03-30 2021-04-22 日本電産リード株式会社 検査治具、及びこれを備えた検査装置
WO2024132683A1 (fr) * 2022-12-21 2024-06-27 Technoprobe S.P.A. Tête de sonde verticale améliorée

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Publication number Publication date
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