WO2000075963A3 - Thyristor mit integriertem freiwerdezeitschutz und herstellungsverfahren dafür - Google Patents
Thyristor mit integriertem freiwerdezeitschutz und herstellungsverfahren dafür Download PDFInfo
- Publication number
- WO2000075963A3 WO2000075963A3 PCT/DE2000/001609 DE0001609W WO0075963A3 WO 2000075963 A3 WO2000075963 A3 WO 2000075963A3 DE 0001609 W DE0001609 W DE 0001609W WO 0075963 A3 WO0075963 A3 WO 0075963A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- anode
- commutated
- recovery time
- cathode
- semiconductor body
- Prior art date
Links
- 238000011084 recovery Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000007547 defect Effects 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
- 239000002800 charge carrier Substances 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 238000005496 tempering Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1012—Base regions of thyristors
- H01L29/1016—Anode base regions of thyristors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
- H01L29/7428—Thyristor-type devices, e.g. having four-zone regenerative action having an amplifying gate structure, e.g. cascade (Darlington) configuration
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Thyristors (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP00945534A EP1218924A2 (de) | 1999-06-08 | 2000-05-19 | Thyristor mit integriertem freiwerdezeitschutz und herstellungsverfahren dafür |
JP2001502143A JP2003501825A (ja) | 1999-06-08 | 2000-05-19 | リカバリタイム保護機能が集積されたサイリスタ及びその製造方法 |
US10/018,592 US6723586B1 (en) | 1999-06-08 | 2000-05-19 | Thyristor provided with integrated circuit-commutated recovery time protection and production method therefor |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19926104 | 1999-06-08 | ||
DE19926104.0 | 1999-06-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000075963A2 WO2000075963A2 (de) | 2000-12-14 |
WO2000075963A3 true WO2000075963A3 (de) | 2002-05-02 |
Family
ID=7910555
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE2000/001609 WO2000075963A2 (de) | 1999-06-08 | 2000-05-19 | Thyristor mit integriertem freiwerdezeitschutz und herstellungsverfahren dafür |
Country Status (4)
Country | Link |
---|---|
US (1) | US6723586B1 (de) |
EP (1) | EP1218924A2 (de) |
JP (1) | JP2003501825A (de) |
WO (1) | WO2000075963A2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10330571B8 (de) * | 2003-07-07 | 2007-03-08 | Infineon Technologies Ag | Vertikale Leistungshalbleiterbauelemente mit Injektionsdämpfungsmittel im Rand bereich und Herstellungsverfahren dafür |
DE102004025082B4 (de) * | 2004-05-21 | 2006-12-28 | Infineon Technologies Ag | Elektrisch und durch Strahlung zündbarer Thyristor und Verfahren zu dessen Kontaktierung |
DE102004062183B3 (de) * | 2004-12-23 | 2006-06-08 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Thyristoranordnung mit integriertem Schutzwiderstand und Verfahren zu deren Herstellung |
DE102006035630B4 (de) * | 2006-07-31 | 2012-12-06 | Infineon Technologies Austria Ag | Verfahren zum Herstellen eines Halbleiterbauelements |
DE102007041124B4 (de) * | 2007-08-30 | 2009-06-04 | Infineon Technologies Ag | Thyristor mit verbessertem Einschaltverhalten, Thyristoranordnung mit einem Thyristor, Verfahren zur Herstellung eines Thyristors und einer Thyristoranordnung |
DE102009051828B4 (de) * | 2009-11-04 | 2014-05-22 | Infineon Technologies Ag | Halbleiterbauelement mit Rekombinationszone und Graben sowie Verfahren zu dessen Herstellung |
US8835975B1 (en) | 2013-05-10 | 2014-09-16 | Ixys Corporation | Ultra-fast breakover diode |
US9312135B2 (en) * | 2014-03-19 | 2016-04-12 | Infineon Technologies Ag | Method of manufacturing semiconductor devices including generating and annealing radiation-induced crystal defects |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0651446A2 (de) * | 1993-10-28 | 1995-05-03 | Kabushiki Kaisha Toshiba | GTO-Thyristor |
EP0767500A2 (de) * | 1995-10-03 | 1997-04-09 | Hitachi, Ltd. | Halbleiterleistungsbauteil mit Gitterfehlstellen |
DE19650762A1 (de) * | 1996-09-30 | 1998-07-02 | Eupec Gmbh & Co Kg | Thyristor mit Durchbruchbereich |
US5869358A (en) * | 1996-12-02 | 1999-02-09 | Asea Brown Boveri Ag | Method for the production of a gate turn-off thyristor having an anode-side stop layer and a transparent anode emitter |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0343369A1 (de) * | 1988-05-19 | 1989-11-29 | Siemens Aktiengesellschaft | Verfahren zum Herstellen eines Thyristors |
JPH0680820B2 (ja) * | 1989-10-16 | 1994-10-12 | 株式会社東芝 | 過電圧保護機能付半導体装置及びその製造方法 |
US5243205A (en) * | 1989-10-16 | 1993-09-07 | Kabushiki Kaisha Toshiba | Semiconductor device with overvoltage protective function |
WO1992017907A1 (de) * | 1991-03-27 | 1992-10-15 | Siemens Aktiengesellschaft | Thyristor mit einstellbarer kippspannung und verfahren zu seiner herstellung |
JP3238415B2 (ja) * | 1996-09-30 | 2001-12-17 | オイペツク オイロペーイツシエ ゲゼルシヤフト フユール ライスツングスハルプライター エムベーハー ウント コンパニイ コマンデイートゲゼルシヤフト | ブレークダウン領域をもつサイリスタ |
JP3488599B2 (ja) * | 1996-10-17 | 2004-01-19 | 株式会社東芝 | 半導体装置 |
US6274892B1 (en) * | 1998-03-09 | 2001-08-14 | Intersil Americas Inc. | Devices formable by low temperature direct bonding |
-
2000
- 2000-05-19 WO PCT/DE2000/001609 patent/WO2000075963A2/de active Application Filing
- 2000-05-19 US US10/018,592 patent/US6723586B1/en not_active Expired - Fee Related
- 2000-05-19 JP JP2001502143A patent/JP2003501825A/ja active Pending
- 2000-05-19 EP EP00945534A patent/EP1218924A2/de not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0651446A2 (de) * | 1993-10-28 | 1995-05-03 | Kabushiki Kaisha Toshiba | GTO-Thyristor |
EP0767500A2 (de) * | 1995-10-03 | 1997-04-09 | Hitachi, Ltd. | Halbleiterleistungsbauteil mit Gitterfehlstellen |
DE19650762A1 (de) * | 1996-09-30 | 1998-07-02 | Eupec Gmbh & Co Kg | Thyristor mit Durchbruchbereich |
US5869358A (en) * | 1996-12-02 | 1999-02-09 | Asea Brown Boveri Ag | Method for the production of a gate turn-off thyristor having an anode-side stop layer and a transparent anode emitter |
Also Published As
Publication number | Publication date |
---|---|
WO2000075963A2 (de) | 2000-12-14 |
US6723586B1 (en) | 2004-04-20 |
JP2003501825A (ja) | 2003-01-14 |
EP1218924A2 (de) | 2002-07-03 |
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