Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/14—Structural association of two or more printed circuits
  • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3465—Application of solder
  • H05K3/3478—Application of solder preforms; Transferring prefabricated solder patterns
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/36—Assembling printed circuits with other printed circuits
  • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0284—Details of three-dimensional rigid printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09045—Locally raised area or protrusion of insulating substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10431—Details of mounted components
  • H05K2201/10439—Position of a single component
  • H05K2201/10477—Inverted
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/04—Soldering or other types of metallurgic bonding
  • H05K2203/041—Solder preforms in the shape of solder balls
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/082—Suction, e.g. for holding solder balls or components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/341—Surface mounted components
  • H05K3/3431—Leadless components
  • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
  • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
  • H05K3/3465—Application of solder
  • H05K3/3485—Application of solder paste, slurry or powder
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
  • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49147—Assembling terminal to base
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/49002—Electrical device making
  • Y10T29/49117—Conductor or circuit manufacturing
  • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
  • Y10T29/49147—Assembling terminal to base
  • Y10T29/49149—Assembling terminal to base by metal fusion bonding

Definitions

• the present invention relates to a method for producing electronic modules which comprise surface-mounted components as well as interconnection balls or preforms on the same face of a substrate.
• Electronic modules are used more and more because they offer multiple advantages. For example, they allow you to increase the density of components and thus put more functionality in an identical volume. They also make it possible to reduce the number of components to be transferred for the final assembly of the electronic cards and thus reduce the opportunities for faults because the module can be assembled and tested separately and then transferred as a component to the card.
• modules have several drawbacks such as a high manufacturing and implementation cost because on the one hand the positioning of the pins is difficult to automate and on the other hand the insertion of the pins into the through holes must be done manually because the vertically inserted modules do not lend themselves to automatic gripping by vacuum as is practiced for SMD components. In addition, these modules do not allow very high densities to be achieved given the limited number of interconnection pins. Finally, the size of these modules is hardly compatible with the needs for miniaturization of modern electronics.
• Another embodiment of electronic modules consists in placing a female connector on the module and a male connector on the card module receiver. In this case also the installation of the module must be done manually and the cost of these connectors remains significant.
• Another embodiment of electronic modules consists in placing the SMD components on the upper face of a ceramic or epoxy glass substrate and in making the interconnections on the other face by transferring and soldering therein. marbles. This module can then be transferred and soldered onto an electronic card in the same way as a standard ball component. The cost of producing this type of module remains important because billing is an additional operation.
• vacuum gripping can sometimes be difficult to implement because the components present on the upper face can be an obstacle to the passage of the gripping pipette.
• the process for producing an electronic module according to the invention is characterized in that: use is made of a substrate comprising, on the same face, receiving pads adapted on the one hand to the SMD components to ensure the electronic function of the module and on the other hand to the balls which make it possible to ensure the electrical connection and mechanical between the module and the printed circuit which must receive this module, - it is deposited in a single and same operation, a solder paste on the said areas corresponding to the SMD components as well as to those corresponding to the interconnection balls or preforms .
• the method for depositing soldering cream by screen printing is particularly suitable for carrying out this deposition simultaneously on the ranges of CMS and beads, but it is also possible to carry out this deposition of soldering cream by means of a dosage by syringe.
• the said interconnection balls generally made of high temperature tin-lead such as for example a 90% lead and 10% tin alloy, have a diameter greater than the height of the highest electronic component constituting the module,
• the said SMD components and the said interconnection balls are transferred one after the other onto the solder paste deposits previously made on the module substrate,
• the said balls are all transferred simultaneously in the manner of a CMS component, using a suitable gripper,
• the module thus obtained is directly connectable to a printed circuit like any other component having ball connections.
• the interconnection elements are produced in the same operation as the electronic function of the module, which makes it possible to perform the interconnection function at a price close to a penny per connection, while easily reaching 10 cents per connection according to the prior art.
• the electronic components being arranged on the same side as the interconnection balls, the other is therefore released in order to allow the module to be gripped by vacuum like any other SMD component.
• this box allows the implantation of components on its underside, among the connection balls.
• the supply decoupling capacitor between the ball of the highest supply and the ground ball the current pulses remain localized on a very short circuit, which greatly reduces the electromagnetic radiation and the pollution of the map.
• the problem of the radiation of clocks is also solved, by installing the quartz adaptation capacitors as close as possible to the chip, between the output balls and a local ground located on the case.
• the radiation can be further reduced by installing a resistor directly on the housing, in series with the output of the oscillating door. Very high frequency radiation is considerably reduced because the door output is no longer charged by the capabilities of the card. In general, all steep front outputs can be loaded by a small series resistor, on the housing itself.
• R.F. signals Some inputs may be disturbed by R.F. signals and therefore require filtering of these signals. These are, for example, the analog inputs of analog digital converters or else low level analog inputs. With the advent of low voltage logic circuits, R.F. disturbances can even affect logic inputs. Our system will allow a filter cell to be installed directly on the housing, among the balls. The reduced dimensions of this circuit will protect it from disturbing radiation, in particular that of tests for compatibility tests with the CE standard.
• FIGS. 1 and 2 illustrate electronic modules according to the prior art
• FIG. 3 illustrates an electronic module produced according to the present invention
• FIG. 4 shows the embodiment of a module according to the present invention.
• FIG. 5 shows a gripping device adapted to the present invention
• FIG. 6 shows another gripping device according to the invention, adapted to a three-dimensional circuit
• FIG. 7 illustrates the type of module that can be produced thanks to the present invention
• FIG. 8 - in Figure 8 is shown schematically a BGA with its connection balls and associated CMS
• - in Figure 9 is shown a bare ball circuit without component (neither chip, nor CMS) having a unique shielding function
• FIG. 10 a ball circuit which is a module simultaneously performing a function and shielding.
• an electronic module of the prior art consisting of a substrate 1, components 2 and a female connector 4 which is connected to a printed circuit 3 by means of the male connector 5.
• a male connector on the module and on the other hand a female connector on the printed circuit which added to the price of the connector makes this technique very expensive.
• this technique obliges the designer of the card and of the module to bring all the inputs and all the outputs to the same place, which generates space and product design constraints.
• FIG. 2 is shown in section another electronic module of the prior art constituted by a substrate 1 of the components 2 and is interconnected on the printed circuit 3 by means of the balls 7.
• the billing operation of the module is done after equipping the substrate with the electronic components and therefore requires an additional deposit of solder cream on the substrate, a transfer operation of beads on the cream deposits and requires a second reflow operation in order to perform the soldering of the beads on the substrate.
• This solution although it is advantageous in terms of the density of components that it makes it possible to achieve, remains an expensive solution and therefore difficult to generalize on mass market products.
• Figure 3 is shown in section a module made according to the present invention. The balls 7 and the components 2 are in this case transferred to the same face of the substrate 1.
• FIG 4 the manufacturing range of an electronic module according to the present invention is shown. Firstly, a deposition operation by screen printing of solder cream 8 is carried out on the reception areas relating to the electronic components as well as to the balls on the substrate 1. Then the deferral operation of the components is carried out electronics 2 on the substrate according to known means, followed by the taking and collective transfer of the balls 7 thanks to the gripper 9. Finally, the reflow soldering operation is carried out which allows the electronic components and the balls to be brazed simultaneously on the substrate. It should be noted that it is possible to invert the order of transfer of the components and of the balls without this calling into question the present invention.
• the method according to the present invention is therefore a means of producing electronic modules which are particularly inexpensive and which moreover may have shielding characteristics without the need to add additional parts.
• the device which is the subject of patent application FR98.13424 by the same inventor is particularly suitable for providing interconnection balls in order to carry them over simultaneously using a gripper.
• the gripper can be laminated in line with the surface components in order to avoid any interference between the components present on the module at the time of the ball transfer operation.
• the manufacturing range it is preferable to first deposit the electronic components and secondly the balls or preforms, because the latter have a very small contact surface and if their resistance on the soldering cream is certainly sufficient in the static state, as soon as a movement is applied with accelerations as is the case during transport on the component laying machines, the balls may move and go out of their range d 'Home.
• a device used for gripping and transferring the balls or preforms has a working face whose topography is adapted on the one hand to the dimensions and shapes of the balls or preforms to be gripped and on the other hand to avoid contact with electronic components or any other obstacle that may be present on the surface of the substrate and already in place when the said beads are installed.
• the gripper is provided with a working face 11 parallel to the face 12 of the substrate 1 to be fitted.
• This working face 11 has a countersink making it possible not to interfere with the components during the application of the balls. On this working face open out suction and holding orifices for all of the balls or preforms.
• the orifices are in communication with a vacuum chamber 13, itself in communication with a vacuum generator 14.
• a vacuum generator 14
• the gripper can then be placed opposite the substrate already equipped with the electronic surface components. A vertical downward movement of the gripper is carried out until the balls come into contact with the substrate, the suction is cut off, the gripper can then be raised.
• the device according to the invention and in application of the method is equipped with gripping or transfer holes for balls or preforms in accordance with the inter-ball pitches. These are generally constant for the same circuit, but it is possible to imagine different steps.
• balls or preforms on different planes or levels, these balls or preforms can also be of different diameter or shape, in this case the topography of the face of gripper work is adapted simultaneously to the topography of the printed circuit which can be in three dimensions and to the face defined by the lower part of the balls or preforms. In all cases there will be a parallelism of the faces between the surface of the substrate and the face defined by the lower part of the balls or preforms.
• the device according to the invention can receive a means for feeding known balls or preforms, it can be a reservoir where the balls or preforms are identical to each other but arranged in bulk, it can be a device such as that which was the subject of patent application No. FR98.13424 of the same inventor.
• Figure 6 there is shown a molded circuit 15 in three dimensions.
• the gripper 9 equipped with a vacuum chamber 13 has a working face 11 in three dimensions and with suitable topography. This is a further example of what can be achieved from this invention.
• FIG. 7 is shown an example of an electronic module which can be produced thanks to the present invention.
• the balls 7 and the components 2 can be arranged over the entire surface of the module, at the convenience of the designer. Thus, it becomes possible to reach very high densities and the designer of electronic products can optimize his product.
• FIG. 8 shows an installation of components on the ball circuit; it will of course be possible to provide locations for components even if they are not implanted, the implantation being configurable as required.
• In 17 there is a decoupling capacitor between two balls and in 16, there are resistors in series with the outputs.
• a Faraday cage By placing balls on the entire periphery of the housing, a Faraday cage can be produced, the height of which is equal to the diameter of the balls. It will suffice for this to create two ground planes (a lower plane and an upper plane) electrically connected together by balls which therefore become shielding balls by difference to the interconnection balls which make it possible to electrically connect the components of the electronic module to the module receiver PCB.
• the ball circuit is only used for shielding.
• a conducting plane 18 is arranged on the upper face of the ball circuit; conductive bushings 19 connect the balls to this plane.
• the components to be shielded are arranged on the main circuit 3.
• the underside of the main circuit constitutes the lower conductive plane 20 which is also connected to the balls 7 by means of the conductive bushings 21.
• the ball circuit is itself a module performing a function (oscillator, RF amplifier, RF filter, ...) in this case the lower conductive plane 20 is located on top of the printed circuit 3 and conductive bushings 21 allow the electrical signals to be brought back on the underside of the printed circuit 3. It has components on its underside.
• conductive balls are part of the shield. The distance between each ball will of course have an influence on the effectiveness of this shielding, since the interval between each shielding ball constitutes a hole in it.
• each shielding ball has its own contact bushing on the lower and upper conductive planes.
• the height of the components likely to be thus enclosed depends on the diameter of the balls.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Manufacturing & Machinery (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Combinations Of Printed Boards (AREA)

Priority Applications (7)

Applications Claiming Priority (2)

Publications (1)

Family

ID=9541674

Family Applications (1)

Country Status (10)

Cited By (2)

Families Citing this family (4)

Citations (8)

Family Cites Families (16)

• 1999
  • 1999-02-05 FR FR9901390A patent/FR2789541B1/fr not_active Expired - Fee Related
• 2000
  • 2000-01-06 WO PCT/FR2000/000018 patent/WO2000047027A1/fr not_active Ceased
  • 2000-01-06 AT AT00900531T patent/ATE233986T1/de not_active IP Right Cessation
  • 2000-01-06 KR KR1020017006166A patent/KR100709613B1/ko not_active Expired - Fee Related
  • 2000-01-06 CA CA002352138A patent/CA2352138C/fr not_active Expired - Fee Related
  • 2000-01-06 JP JP2000597989A patent/JP2002536836A/ja active Pending
  • 2000-01-06 EP EP00900531A patent/EP1155603B1/fr not_active Revoked
  • 2000-01-06 DE DE60001540T patent/DE60001540T2/de not_active Revoked
  • 2000-01-06 AU AU30510/00A patent/AU3051000A/en not_active Abandoned
  • 2000-01-06 US US09/830,253 patent/US7032306B1/en not_active Expired - Fee Related

Patent Citations (8)

Non-Patent Citations (4)

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