WO2000043180A1 - Meche et procede de perçage, procede d'usinage par etapes et procede de fabrication d'un dispositif d'exposition - Google Patents

Meche et procede de perçage, procede d'usinage par etapes et procede de fabrication d'un dispositif d'exposition Download PDF

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Publication number
WO2000043180A1
WO2000043180A1 PCT/JP2000/000122 JP0000122W WO0043180A1 WO 2000043180 A1 WO2000043180 A1 WO 2000043180A1 JP 0000122 W JP0000122 W JP 0000122W WO 0043180 A1 WO0043180 A1 WO 0043180A1
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WO
WIPO (PCT)
Prior art keywords
drill
grinding
stage
shank
tip
Prior art date
Application number
PCT/JP2000/000122
Other languages
English (en)
Japanese (ja)
Inventor
Shigeru Hanai
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to AU20033/00A priority Critical patent/AU2003300A/en
Publication of WO2000043180A1 publication Critical patent/WO2000043180A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/04—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs
    • B28D1/041—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing with circular or cylindrical saw-blades or saw-discs with cylinder saws, e.g. trepanning; saw cylinders, e.g. having their cutting rim equipped with abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B51/00—Tools for drilling machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/10—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with cooling provisions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/14—Zonally-graded wheels; Composite wheels comprising different abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/18—Wheels of special form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/021—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by drilling

Definitions

  • the present invention relates to a drill and a drilling method used when drilling a workpiece, and more particularly to a drill and a drilling method used when drilling a deep hole with a relatively small hole diameter, and a stage processing method and exposure.
  • the present invention relates to a device manufacturing method. Background art
  • Static pressure gas bearings which are used as bearing mechanisms for various precision stage devices such as semiconductor exposure stage devices, allow gas to be ejected between the guide and moving body, and guide the gas by the pressure of the static gas.
  • a predetermined gap is formed between the body and the moving body to function as a bearing.
  • the gas ejected from the hydrostatic gas bearing is supplied through a ceramic-to-glass (for example, quartz glass) guide or a small-diameter pipe formed in a moving body.
  • the thin tube formed inside the ceramic material or the like is processed using a small-diameter, deep-hole drill.
  • FIG. 11 shows a partial cross section of a core drill and a ceramic material in a state where a small-diameter deep hole is ground in the ceramic material using a core drill.
  • the core drill has a hollow pipe-shaped shank 104. At the tip of the shank 104, there is formed a grinding portion 106 in which abrasive grains are electrodeposited on the outer wall surface.
  • the shank 104 is rotated around the center axis of the hollow pipe as a rotation axis and fed in the direction of the rotation axis, and the grinding portion 106 is pressed against the workpiece to perform drilling.
  • the inner wall surface 100a of the ceramic material 100 is adjacent to the outer peripheral surface of the shank 104 of the core drill.
  • a core 102 made of ceramic material 100 that has not been ground is formed inside the hollow shank 104.
  • the outer peripheral surface 10a of the core 102 is adjacent to the inner peripheral surface of the shank 104.
  • the grinding portion 106 It reaches the grinding portion 106 through a gap between the outer peripheral surface 102 a of the core 102 and the grinding portion 106, and then the outer peripheral surface of the shank 104 and the inner wall surface 100 a of the ceramic material 100. Is discharged to the outside through the gap between the two.
  • the core drill is pulled out, and the remaining core 102 is removed by cutting or breaking using another tool, and the small diameter deep hole drilling is completed.
  • the core 102 is always formed in the small-diameter deep hole processing using the conventional core drill.
  • the core 102 it becomes more difficult to supply the grinding fluid from the inside of the shank 104 as the depth of the hole increases in the machining, and the cooling and lubrication of the grinding section 106 or the removal of chips And it becomes difficult to perform the processing with the desired accuracy.
  • the core drill shank 104 which receives an axial force while rotating, undergoes bending deformation.
  • the bending deformation causes the core 100 of the ceramic material 100 to deform. 2 and the inner wall of the core drill shank 104 interfere with each other.
  • the ceramic material 100 is harder than the base metal of the core drill, so if the outer peripheral surface 102 a of the core 102 of the ceramic material 100 and the inner wall of the shank 104 of the core drill interfere with each other, the shank The inner wall of 104 is shaved, and the inner wall of shank 104 is thinned and eventually damaged, or the core 102 is broken by colliding with a core drill that rotates at high speed while deforming. And then There is a problem that the broken core 1002 hits the core drill and the shank 104 is damaged. Further, as a result, there is a problem that the inner wall of the processed hole formed in the ceramic material 100 is also damaged.
  • the present invention has been made to solve the above-mentioned technical problems of the conventional technology, and its purpose is to sufficiently supply a grinding fluid from inside the shank to cool and lubricate the grinding portion. It is to provide a drill that can be performed.
  • Still another object of the present invention is to provide a processing method capable of boring an inner wall surface with high surface accuracy without requiring an additional processing step.
  • a protective layer (32) for protecting the outer wall from the surface of the workpiece is provided on the outer wall up to a predetermined distance from the tip of the shank (2) formed continuously with the grinding portion (4). ) Is formed. Further, the protective layer (32) is characterized by being formed by adhering abrasive grains (32) having a finer grain size than the abrasive grains (30) fixed to the grinding portion (4).
  • Part (22) A processing method characterized by punching a predetermined hole without leaving a core in the workpiece by pressing the grinding part (4) fixed to the surface against the workpiece to form a hole. Achieved.
  • the above object is to provide a stage processing method for processing a stage movable on a base, wherein the stage is ground by using the drill of the present invention for processing the stage.
  • the stage may move on a base via a gas bearing, and may process a gas supply hole for supplying gas to the gas bearing using the drill of the present invention. It is characterized by.
  • FIG. 1 is a sectional view showing a schematic structure of a drill according to one embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing a schematic structure of a tip portion of a drill according to one embodiment of the present invention.
  • FIG. 3 is a cross-sectional view showing a schematic structure of a modification of the tip of the drill according to one embodiment of the present invention.
  • FIG. 4 is a view schematically showing an outer diameter shape of the drill according to the embodiment of the present invention.
  • FIG. 5 is a diagram showing a structure of abrasive grains and a protective film fixed to a drill according to an embodiment of the present invention.
  • FIG. 6 is a diagram showing a structure of abrasive grains and a protective film fixed to a drill according to an embodiment of the present invention.
  • FIG. 7 is a diagram showing a schematic structure of a stage device in which a hole is formed by a drill according to an embodiment of the present invention.
  • FIG. 8 is a diagram illustrating a stage device equipped with an air bearing having an air supply hole formed by a drill according to the present embodiment.
  • FIG. 9 is a diagram illustrating a stage device equipped with an air bearing having an air supply hole formed by a drill according to the present embodiment.
  • FIG. 10 is a diagram for explaining an exposure apparatus provided with a stage device equipped with an air bearing having an air supply hole formed by a drill according to the present embodiment.
  • FIG. 11 is a cross-sectional view showing a state where a hole is formed in a ceramic material by a conventional core drill.
  • a drill, a processing method, a stage processing method, and a method of manufacturing an exposure apparatus according to a first embodiment of the present invention will be described with reference to FIGS.
  • a schematic configuration of the drill according to the present embodiment will be described with reference to FIG.
  • the drill and the processing method according to the present embodiment are used, for example, for forming a gas ejection pipe of a static pressure gas bearing provided in a bearing mechanism of a precision stage device mounted on a semiconductor exposure apparatus or the like. .
  • FIG. 1A shows a cross section along a rotation axis of a drill used for deep hole drilling according to the present embodiment.
  • the drill according to the present embodiment has a shank 2 and a grinding portion 4 provided at the tip of the shank 2.
  • the material (base material) of the shank 2 can be high-speed steel (high-speed steel), cobalt high-speed (high-speed steel containing cobalt (Co)), or powder high-speed A high-speed steel, which is obtained by adding a binder to the components, molding by pressing and sintering, or the like can be used. According to these materials, ordinary carbon steel for tools cannot withstand the grinding resistance of the drill according to the present embodiment, while cemented carbide can be sufficiently used without the problem that it is brittle and breaks. A durable drill can be made.
  • a cemented carbide class K in the K classification of the selection criteria for using cemented carbide in JIS standards can be used.
  • the grinding part 4 and the shank 2 are fixed at the joint part 8 by brazing or welding, but the modification of FIG. 1 (b) is used.
  • the shank 2 and the grinding portion 4 may be integrally formed using high-speed steel or the like as a forming material. As shown in Fig.
  • a pipe 6 for carrying the grinding fluid into the grinding section 4 is formed inside the shank 2 along the rotation axis of the shank 2. Further, inside the polishing section 4, the grinding fluid that has passed through the piping 6 is branched and guided to the two grinding fluid ejection holes 14 and 16, ⁇ Piping 10 and 12>. Although not shown, the outer wall surface of the grinding section 4 is electrodeposited with abrasive grains for grinding ceramic material and glass material.
  • FIG. 2 (a) shows a state in which the tip of the grinding portion 4 is viewed from the rotation axis direction of the drill.
  • FIG. 2 (b) shows the state of the grinding part 4 viewed from the side corresponding to FIG. 2 (a).
  • FIG. 2 (c) shows the shape of the grinding portion 4 when viewed from the direction of arrow A shown in FIG. 2 (b).
  • the rotation center 22 at the tip of the grinding unit 4 according to the present embodiment is provided with a grinding fluid ejection hole for supplying grinding fluid like a conventional core drill.
  • the grinding part of the drill according to the present embodiment is 4 has a substantially hemispherical tip as a whole.
  • a centrifugal force when drilling by pressing the tip of the grinding part 4 against the workpiece together with the shank rotating at 300 to 700 RPM. can be improved, and high-precision drilling with less bending can be performed.
  • the groove portion 20 has a V-shaped groove shape opened at about 120 °.
  • the groove 18 also has a similar V-shape.
  • the width of the rotation center portion 22 sandwiched between these grooves 18 and 20 also depends on the particle size of the abrasive grains to be electrodeposited.
  • the outer diameter d of the grinding portion 4 is about 3 mm. On the other hand, it is about 0.4 mm.
  • the shapes of the grooves 18 and 20 and the width of the rotation center 22 are determined as described above.
  • the present invention is not limited to this, and the rotation speed of the drill and the workpiece It is possible to change the shape according to various conditions such as hardness or the inner diameter and depth of the hole to be machined.
  • the grinding resistance will increase, while if the contact area is reduced, the life of the abrasive grains will be shortened. Points should also be considered.
  • the width of the rotation center portion 22 is too wide, the grinding resistance increases, and if it is too narrow, the abrasive grains are easily peeled off.
  • the angle and the like are determined in consideration of the balance of the sides.
  • the width of the rotation center portion 22 is adjusted in consideration of the above various points.
  • a drill with a V-shaped groove shape with grooves 45 and 20 at an angle of about 45 ° from the axis of rotation passing through the center of rotation 22 May be.
  • a drill with a semi-spherical tip as shown in Fig. 2. .
  • FIGS. 3 (a) to 3 (c) a modified example of a drill in which the tip of the grinding portion 4 provided on the shank 2 is flat will be described.
  • FIG. 3 (a) shows a state in which the tip of the grinding unit 4 is viewed from the direction of the rotation axis of the drill.
  • FIG. 3 (b) shows the state of the grinding part 4 viewed from the side corresponding to FIG. 3 (a).
  • FIG. 3 (c) shows the shape of the grinding portion 4 when viewed from the direction of arrow A shown in FIG. 3 (b). As shown in Figs.
  • the rotation center of the tip of the grinding part 4 of the drill of this modification is
  • the part 22 is also not provided with a grinding fluid jetting hole for supplying a grinding fluid as in a conventional core drill, and abrasive grains (not shown) are fixed to the surface of the center of rotation. Further, two grinding fluid ejection holes 14 and 16 are provided at a predetermined distance from the rotation center portion 22.
  • the drill of this modification also has a shank 2 that can be rotated about the cylindrical central axis as a rotation axis, and has at least the center of rotation 2 of at least the abrasive grains for grinding. Is provided at the tip of the shank 2. Therefore, by rotating the shank 2 to feed the grinding portion 4 in the direction of the rotation axis, and pressing the surface of the rotation center portion 22 to which the abrasive grains for grinding are fixed against the workpiece to perform the drilling, the core is formed during the drilling. Is not formed.
  • the periphery of the tip of the grinding part 4 is chamfered with a radius of about 0.3 mm to 0.5 mm.
  • the abrasive grains can be fixed more easily and more reliably than when a large number of corners are formed.
  • the degree of wear due to the processing of the abrasive grains fixed to the corner becomes greater than others, so it is difficult to make the degree of wear of the abrasive grains at the tip uniform, but around the tip
  • the wear of the abrasive grains electrodeposited on the outer wall surface of the grinding portion 4 can be made uniform and a long-life drill can be realized.
  • the tip of the grinding unit 4 has two grooves 18 and 20 at positions shifted from the rotation center 22.
  • the above-mentioned grinding fluid ejection holes 14 and 16 are formed in the grooves 18 and 20, respectively.
  • the grooves 18 and 20 serve to discharge chips generated by grinding the workpiece in the grinding section 4 into spiral grooves formed on the outer peripheral surface of the shank 2.
  • the grooves 18 and 20 are formed substantially point-symmetric about the rotation center 22. As shown in Fig. 3 (b), the grooves 18 and 20 are located at an angle of about 45 ° from the axis of rotation (dashed line) passing through the center of rotation 22 and the shank 2 near the center of rotation 22. It is formed diagonally toward the side. Also, the arrow in Fig. 3 (b) As shown in FIG. 3C viewed in the direction A, the groove 20 has a V-shaped groove shape opened at about 120 °. Although not shown, the groove 18 also has a similar V-shaped shape.o
  • grooves 18 and 20 can be obtained by placing a convex V-shaped grindstone of about 120 ° at an angle of 45 ° with respect to the rotation axis of the drill and grinding the drill's grinding section 4 Can be.
  • the width of the rotation center portion 22 sandwiched between the grooves 18 and 20 also depends on the particle size of the abrasive grains to be electrodeposited.
  • the outer diameter d of the grinding portion 4 is 3 mm. About 0.4 mm.
  • the grinding part 4 of the drill according to the present embodiment described above does not need to fix the abrasive grains in the grooves 18 and 20 that do not grind the object to be ground. Therefore, there is no problem even if the grinding flow adheres to the entire grinding section 4 o
  • the drill according to the present embodiment is characterized in that a core is not formed at the time of drilling a workpiece because the abrasive grains for grinding are fixed to the rotation center portion 22. Therefore, the grinding fluid ejection holes 14 and 16 from which the grinding fluid is ejected are formed off the center of rotation 22 of the drill tip, and the ejection holes 14 and 16 are located in the grooves 18 and 20. As a result, the grinding fluid can be efficiently blown out from the ejection holes 14 and 16, and the chip discharge and the cooling effect during grinding can be improved.
  • FIG. 4 shows the outer shape of the drill according to the present embodiment as viewed from the groove 20 side.
  • a groove 26 is spirally formed on the outer wall of the shank 2 from the groove 20.
  • the groove 24 is spirally formed on the outer wall of the shank 2.
  • the flutes 24 and 26 are connected to the grooves 18 and 20, respectively, and are approximately 15 with respect to the rotation axis.
  • the shank 2 is spirally formed on the outer wall surface.
  • the depth of the flutes 24 and 26 will be determined according to the strength of the shank 2 (generally depending on the outer diameter). In this example, the depth of the flute is about 0.2 mm. Has formed.
  • the oblique lines applied to the grinding portion 4 indicate the portions where the abrasive grains to be ground are fixed.
  • an electrodeposition diamond is used as the abrasive grains, and the abrasive grains are fixed to the grinding portion 4 by a plating method.
  • Grinding part 4 The electrodeposition length of the abrasive grains from the tip is set in consideration of the drill length and the depth of the hole to be machined. In particular, when machining small diameter and deep holes, the shank 2 is likely to bend during machining, so use abrasive grains to prevent shaving even if the shank 2 outer wall surface contacts the inner wall of the workpiece. Of course, the electrodeposition may be longer for the shank 2 side.
  • FIG. 5 shows the structure of the abrasive grains and the protective film fixed to the drill according to the present embodiment, and the illustration of the inside of the drill and the groove at the tip of the grinding portion 4 is omitted.
  • Fig. 5 shows a drill for drilling a hole with a hole diameter of 3.3 mm as an example.
  • the grinding section 4 and the shank 2 have different diameters.
  • the outer diameter X of the grinding section 4 is 2.92 mm
  • the shank is The outer diameter of 2 is 3.16 mm.
  • # 100 abrasive grains 30 are electrodeposited on the outer wall surface of the grinding unit 4
  • finer # 400 abrasive grains 32 are electrodeposited on the outer wall face of the shank 2. ing.
  • the notches 24 and 26 formed on the outer wall surface of the shank 2 are not shown.
  • a predetermined gap 3 4 where the abrasive particles are not fixed between the abrasive particles 30 electrodeposited on the grinding unit 4 and the abrasive particles 32 electrodeposited on the shank 2 is used.
  • the gap 34 may be omitted.
  • highly efficient grinding can be realized by the relatively coarse abrasive grains 30 fixed to the grinding portion 4, and the relatively fine grain abrasive grains fixed to the shank 2 According to 32, it is possible to realize a protective film for preventing the outer surface of the shank 2 from being ground by the surface of the workpiece. Further, by forming the abrasive grains 32 on the outer surface of the shank 2, the shank 2 can be used as a guide when drilling. In addition, by making the average outer diameter of the grinding portion 4 to which the abrasive grains 30 are fixed substantially equal to the outer diameter of the shank 2 including the thickness of the protective layer, the diameter of the shank 2 can be reduced. It is possible to increase the strength of the drill without deteriorating the highly efficient grinding performance by the coarse abrasive grains 30.
  • the rate of shaving the inner wall surface of the machined hole in the workpiece is reduced, and the diameter of the machined hole is increased. Can be prevented.
  • Further increase the grain size of abrasive grains 32 By observing, the grind grooves 24, 26 formed on the outer wall surface of the shank 2 will not be filled with abrasive grains. Functions can be fully exploited. Further, the finer the grain size of the abrasive grains 32 is, the smoother the surface thereof is, so that there is also an advantage that the flow of the grinding fluid flowing through the grooves 24 and 26 becomes smooth.
  • a protective layer using abrasive grains is formed on the shank 2.
  • the grain size of the abrasive grains of the protective layer is preferably as small as possible. 2 It is desirable to form on the outer surface. According to the diamond thin film or the like, since the inner wall of the hole to be processed on the workpiece is less likely to be cut, even if the protective film is formed on the outer surface of the shank 2, the processing can be performed with a desired hole.
  • the deep hole processing by the drill according to the present embodiment described above will be briefly described. First, a guide hole is formed in a predetermined processing area with a short ordinary drill.
  • the drill according to the present embodiment is attached to a machining center or the like, rotated and sent in the direction of the rotation axis, and the grinding portion 4 is pressed against the guide hole to start deep hole machining.
  • the grinding fluid flows out from the grinding fluid ejection holes 14 and 16 through the pipe 6 to cool the grinding part 4, and the shank 2 formed on the outer peripheral surface of the shank 2 from the grooves 18 and 20. Discharge the ground ceramic chips through 26. If the feed rate of the drill is increased, the shank 2 will bend, and if the grinding becomes deeper, the outer peripheral surface of the shank 2 will contact the inner wall surface of the ceramic material of the workpiece.
  • the base material does not wear.
  • the conventional core is not formed, and the inner wall surface can be drilled with high surface accuracy without requiring an extra processing step.
  • the gas ejection port 42 of the ceramic movable body 40 faces the guide body 46 via a predetermined gap. Air is supplied to the gas ejection port 42 through an air supply hole 44 formed inside the moving body 40. It is embedded.
  • the air supply holes 44 are formed by using the drill according to the present embodiment. Air from the air supply holes 44 is blown out from the gas jets 42 at a predetermined pressure, and a predetermined static pressure gas layer is formed between the gas jets 42 of the moving body 40 and the guides 46. This allows the moving body 40 to float and move with respect to the guide body 46 via a predetermined gap.
  • FIG. 8 schematically shows an XY stage device 210 as a stage device according to the present embodiment.
  • the XY stage device 210 includes a surface plate 212, an X guide 214 fixed as a guide bar fixed on the surface plate 212, an upper surface of the surface plate 212, and an X guide.
  • a first moving body 2 16 movable in the X direction (predetermined first direction) in FIG. 8 along 2 14 and Y as a moving guide constituting the first moving body 2 16
  • a second moving body 236 movable along a guide 222 in a Y direction (second direction) orthogonal to the X direction.
  • the surface plate 2 12 a rectangular plate made of alumina ceramics, which is lighter and less likely to be damaged than iron, is used.
  • the upper surface of the surface plate 2 12 is a reference surface.
  • the X guide 2 14 As the X guide 2 14, the same ⁇ alumina ceramic product is used.
  • the X guide 2 14 is arranged along the X direction near one end surface in the Y direction on the surface plate 2 12.
  • the surface on the other end side in the Y direction of the X guide 214 is a reference surface.
  • the first moving body 2 16 is a first moving guide transporting body composed of an L-shaped cross-section member arranged in the X direction in the vicinity of the X guide 2 14 on the surface plate 2 12.
  • a first Y-guided carrier 2 18 as a pair, and a platen 2 parallel to the first Y-guided carrier 2 18 at a predetermined distance from the first Y-guided carrier 2 18 1 2 Slender plate shape arranged on
  • a second Y-guide carrier 220 as a second movable guide carrier composed of members, and a first Y-guide carrier 212 and a second Y-guide carrier 220 are erected between the first and second Y-guide carriers 220 and 220.
  • a Y guide 222 extending in the Y direction.
  • the stator 2 2 4 A of the first X linear motor 2 2 4 It extends in the direction. Also, on the other side in the Y direction of the second Y guide carrier 220 near the other end in the Y direction on the surface plate 211, the stator of the second X linear motor 222 is provided. 2 26 A extends in the X direction.
  • so-called moving magnet type linear motors are used as the first and second X linear motors 224, 226.
  • the mover 2 2 4 B of the first X linear motor 2 2 4 is connected to one end of the guide 2 2 2 via a connecting member 2 2
  • the child 222B is connected to the other end of the Y guide 222 via a connecting member 230. Therefore, the first moving body is driven in the X direction by the movement of the movers 2224B and 2226B of the first and second X linear motors 222 and 222. ing.
  • the stators 2 32 A and 2 34 A of the first and second Y linear motors 2 3 2 and 2 3 4 are mounted in the Y direction.
  • the first and second Y guide carriers 218 and 220 are arranged along the first and second Y guide carriers.
  • the mover of the second Y linear motor on the far side is not shown.
  • Moving magnet type linear motors are also used as the first and second Y linear motors.
  • the second moving body 2 36 is placed in parallel with the upper surface (reference surface) of the platen 2 1 2 with the Y guide 2 2 2 sandwiched from above and below.
  • Y-direction bearing bodies 242, 242 are Y guides with a predetermined gap formed between them and Y guides 222. It is arranged parallel to 222.
  • the movers 232B, 234B of the first and second Y linear motors 232, 234 constituting the driving means of the second moving body 236 are provided.
  • the second moving body 236 is driven in the Y direction by the movement of the movers 232B and 234B of the Y linear motors 232 and 234. I have. Further, an air blowing portion (not shown) is provided on the inner surface of the Y-direction bearing body 242. Further, the dimension in the height direction of these Y-direction bearing members 242 is set to be larger than that of Y guide 222.
  • the top plate 238 also serves as a substrate stage.
  • a laser interferometer 244 for X coordinate measurement and a laser interference for Y coordinate measurement fixed on the surface plate 2 1 2 are provided on the top surface of the top plate 238, a laser interferometer 244 for X coordinate measurement and a laser interference for Y coordinate measurement fixed on the surface plate 2 1 2 are provided.
  • An X moving mirror 248, a Y moving mirror 250, and a substrate 252 to be exposed, which reflect laser light emitted from the total 246, are mounted. Note that the exposed substrate 252 is actually moved through the top plate 238 via a not-shown ⁇ repelling stage capable of moving up and down (in the Z direction) and rotating around the X, ⁇ , and ⁇ axes. Mounted on top.
  • FIG. Fig. 9 (A) is a view of the main part centering on the first mobile unit 2 16 and the second mobile unit 236 viewed from the direction of arrow A in Fig. 8, and 9 (B) is the same figure.
  • FIG. 9 (A) is a bottom view
  • FIG. 9 (C) is a cross-sectional view taken along line CC of FIG. 9 (A).
  • each air ejection portion 254 is supplied with a vacuum preload.
  • Part 25 A vacuum pump 262 as a vacuum source is connected via a vacuum pressure regulating valve 258 capable of manually adjusting only the pressure of the bearing 6. It is possible to adjust the gap between the upper surface of the Y guide carrier and the Y guide carrier.
  • the air ejection portions 264 ( ⁇ ⁇ ⁇ , ⁇ ⁇ ⁇ ⁇ VPL unit 266 and (266 ,, 266 2) are provided alternately.
  • an air supply hole which is processed by the drill according to this embodiment A vacuum pump 262 is provided to each vacuum precompression unit 266 via a vacuum pressure regulating valve 268 that can manually adjust the pressure of only the vacuum precompression unit 266. Is connected, so that the bearing gap (gap generated between the upper surface of the platen 212 and the Y guide carrier 220) generated by the balance between the air pressure and the vacuum suction force can be adjusted.
  • the air ejection portions 270 ( ⁇ ,, ⁇ ⁇ vacuum pre pressure part 272 (272, ⁇ 272 4) are provided with Omicron Alpha). Compressed air from the compressor is supplied to each air ejection portion 270 through the air supply holes 302 to 308 formed by using the drill described in the present embodiment.
  • a vacuum pressure regulating valve 274 that can manually adjust the pressure of only the vacuum preloading section 272, thereby providing a bearing clearance (constant) caused by a balance between air pressure and vacuum suction force.
  • the gap between the panel 2 12 and the bottom plate 240 can be adjusted. In this case, by adjusting the gap, the distance between the 222 guide 222 and the top plate 238 and the bottom plate 240 can be adjusted. A predetermined clearance can be set and maintained.
  • the air ejection portions 276 ( ⁇ , ⁇ ) are provided on the surface of the first ⁇ guide carrier 2 18 facing the X guide 2 14.
  • ⁇ and vacuum Pressure section 2 7 8 (2 7 8 ,, 2 7 8 2) are provided alternately. Compressed air from the compressor is supplied to the air jetting section 276 and the vacuum preloading section 278 is provided via a vacuum pressure regulating valve 280 that can manually adjust the pressure of only the vacuum preloading section 278.
  • Vacuum preload part that constitutes each vacuum preload type static air bearing 2 56, 2 66, 2
  • the bearing clearance of each vacuum preload type hydrostatic air bearing is set appropriately. Is done.
  • the vacuum pressure regulating valves 258, 268, 274, and 280 are manually operated, but the pressure of the vacuum preload unit can be automatically adjusted by computer control based on predetermined conditions. It may be something.
  • the second moving body 2 36 on which the substrate to be exposed 2 52 is mounted moves in the X and Y two-dimensional directions in accordance with the Measured by 4 4 and 2 4 6.
  • FIG. 10 the Z axis is taken parallel to the optical axis AX of the projection optical system PL, The X and Y axes perpendicular to.
  • illumination light from a light source such as a mercury lamp or a KrF excimer laser or an ArF excimer laser was mounted on a reticle stage RST via a fly-eye lens, a condenser lens, and the like. Irradiation is evenly applied to the reticle R.
  • the reticle stage R ST can be moved in the scanning direction by a drive system 602.
  • lightwave interference measuring device 603 At one end in the scanning direction of reticle stage R ST, lightwave interference measuring device 603 according to the present embodiment is mounted as a position measuring system for reticle stage R ST.
  • the image of the pattern formed on the reticle R is reduced to, for example, 1/4 by the projection optical system PL and formed on the wafer W.
  • Wafer W is held on wafer stage WST by wafer holder 610.
  • the wafer stage WST includes an X stage moving in the X direction and a Y stage moving in the Y direction.
  • the wafer stage WST has an air supply hole processed using the drill according to the present embodiment, and an air bearing is fixedly provided in accordance with the air supply hole.
  • the movement amount of the X stage and the Y stage is measured by a laser interferometer 605 or the like, and the XY coordinates are measured based on the movement amount.
  • a laser interferometer 605 or the like the XY coordinates are measured based on the movement amount.
  • the wafer stage WST moves in the X or Y direction under the control of the control system 606 executed based on the measured XY coordinates.
  • the drill of the present embodiment may be used for processing reticle stage R ST.
  • the exposure sequence control in the scanning projection exposure apparatus is managed by the main control section 606 as a whole.
  • the main controller 606 receives movement information from the laser interferometers 603 and 605 provided on the reticle stage RST and wafer stage WST, and speed information from the drive systems 602 and 604. Based on the input of During scan exposure, the relative position relationship between the pattern formed on reticle R and the pattern formed on wafer W is maintained within a specified alignment error while maintaining a predetermined speed ratio between reticle stage RST and wafer stage WST.
  • the entire pattern of the reticle R can be accurately transferred to a predetermined short area on the wafer W by relatively moving the reticle R.
  • the processing of a deep hole has been described as an example.
  • the present invention is not limited to this, and the inner diameter of the hole to be processed is several mm to several cm (for example, 5 cm). Can be applied to
  • a liquid is used as the grinding fluid.
  • any of a water-soluble and an oil-based grinding fluid can be used, and a gas can of course be used as the grinding fluid.
  • the deep hole processing of the air pipe for the air bearing is taken as an example.
  • the present invention is not limited to this, and the present invention can be applied to the processing of a general ventilation hole or pipe through which gas or liquid passes. it can.
  • the grinding fluid ejection holes 14 and 16 are formed one by one in the grooves 18 and 20 so as to be displaced from the rotation center portion 22 of the drill tip.
  • the present invention is not limited to this.
  • only the grinding fluid ejection hole 14 may be formed in the groove 18.
  • the tip of the grinding unit 4 is substantially hemispherical or has a flat shape.
  • the present invention is not limited to these, and the shape of the tip of the grinding unit 4 is: It can take various shapes depending on the drill application.
  • the F 2 laser light (wavelength 1 X-ray exposure equipment, as well as other VUV exposure equipment that uses vacuum ultraviolet light such as (57 nm) as exposure illumination light, and EUV exposure equipment that uses light with a wavelength of 5 to 15 nm as exposure illumination light.
  • the present invention can be applied to an exposure apparatus using a charged particle beam, such as an ion beam exposure apparatus and an ion beam exposure apparatus.
  • an illumination optical system and a projection optical system (or an electron optical system) composed of a plurality of lenses are incorporated into the exposure apparatus main body to perform optical adjustment, and the reticle stage and the stage using the drill of the present embodiment.
  • the exposure apparatus according to the above-described embodiment can be manufactured by processing the exposure apparatus, attaching wires and pipes to the exposure apparatus body, and performing comprehensive adjustment (electrical adjustment, operation confirmation, etc.). It is desirable to manufacture the exposure equipment in a clean room where the temperature and cleanliness are controlled.
  • a step of designing the function and performance of the device a step of manufacturing a reticle based on the design step, a step of manufacturing a wafer from a silicon material, and a step of forming a predetermined pattern by the exposure apparatus of the above embodiment. It is manufactured through the steps of transferring to a wafer, device assembling steps (including dicing, bonding, and packaging processes) and inspection steps.
  • a drill capable of sufficiently supplying a grinding fluid from the inside of a shank to cool and lubricate a grinding portion. Also, it is possible to realize a drill that can easily carry out chips generated from the grinding section. Further, according to the present invention, it is possible to realize a drill that prevents shank shaving on the inner wall surface of the workpiece. Further, according to the present invention, it is possible to realize a processing method capable of boring an inner wall surface with high surface accuracy without requiring an additional processing step, and a stage processing method and a manufacturing method of an exposure apparatus.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Drilling Tools (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

L'invention concerne une mèche et un procédé de perçage utilisé pour percer un trou profond à diamètre relativement faible et servant à percer un trou sans former de carotte ainsi qu'à usiner les parois internes du trou avec une précision de surface très élevée, sans qu'on ait besoin de recourir à un usinage supplémentaire. La mèche comporte une queue rotative (2), un axe de cylindre central servant d'axe de rotation, et une partie de coupe (4) comportant une partie rotative centrale (22) de la queue (2); du grain abrasif destiné à la coupe est collé au moins à la surface de cette partie, à l'extrémité de la queue (2). On fait tourner la queue (2) pour entraîner la partie de coupe (4) dans le même sens que l'arbre rotatif, de manière à presser la surface de la partie rotative centrale (22), à laquelle est collé du grain abrasif, contre une pièce de travail pour effectuer le perçage. Grâce à cette invention, on peut faire un trou sans former de carotte pendant le perçage.
PCT/JP2000/000122 1999-01-21 2000-01-13 Meche et procede de perçage, procede d'usinage par etapes et procede de fabrication d'un dispositif d'exposition WO2000043180A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU20033/00A AU2003300A (en) 1999-01-21 2000-01-13 Drill and drilling method, stage working method, and method of manufacturing exposure device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/12916 1999-01-21
JP11012916A JP2000210874A (ja) 1999-01-21 1999-01-21 ドリル及び加工方法、並びにステ―ジ加工方法及び露光装置の製造方法

Publications (1)

Publication Number Publication Date
WO2000043180A1 true WO2000043180A1 (fr) 2000-07-27

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JP (1) JP2000210874A (fr)
AU (1) AU2003300A (fr)
TW (1) TW425328B (fr)
WO (1) WO2000043180A1 (fr)

Cited By (1)

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CN109940521A (zh) * 2019-04-10 2019-06-28 国宏工具系统（无锡）股份有限公司 专用于陶瓷类材料加工的硬质合金切削刀具

Families Citing this family (6)

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Publication number Priority date Publication date Assignee Title
JP2007211259A (ja) * 2004-02-20 2007-08-23 Yoshinobu Kobayashi 金属粉末の成形法及び同成形法で成形した加工工具
JP4693479B2 (ja) * 2005-04-28 2011-06-01 セントラル硝子株式会社 ガラス基板の孔あけドリル
FR2955510B1 (fr) * 2010-01-26 2012-04-20 Snecma Outil et procede de percage par ultrasons des materiaux en composite a matrice ceramique
WO2012046751A1 (fr) * 2010-10-06 2012-04-12 国立大学法人徳島大学 Foreuse
JP5890699B2 (ja) * 2012-02-09 2016-03-22 株式会社アライドマテリアル 穴開け用超砥粒工具およびこれを用いた穴加工方法
FR2994871B1 (fr) * 2012-09-05 2015-05-01 Snecma Outil cylindrique de percage, notamment pour materiau composite a matrice organique, et procede de percage correspondant

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JPS54130683U (fr) * 1978-03-03 1979-09-11
DE2948665A1 (de) * 1979-12-04 1981-06-11 Friedrich Duss Maschinenfabrik GmbH & Co, 7265 Neubulach Schlagbohrer mit zentralem absaugkanal fuer das bohrklein
JPS61252631A (ja) * 1985-05-02 1986-11-10 Hitachi Electronics Eng Co Ltd ウエハのアライメント装置
JPH01131512U (fr) * 1988-03-03 1989-09-06
JPH03161280A (ja) * 1989-08-31 1991-07-11 Nachi Fujikoshi Corp 硬脆材穴加工用工具
JPH045367U (fr) * 1990-04-28 1992-01-17

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JPS58181447U (ja) * 1982-05-28 1983-12-03 同和工営株式会社 孔底研磨用のフラツトビツト
JPH0530891Y2 (fr) * 1987-06-30 1993-08-09
JPH0235676U (fr) * 1988-08-30 1990-03-07
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Publication number Priority date Publication date Assignee Title
JPS54130683U (fr) * 1978-03-03 1979-09-11
DE2948665A1 (de) * 1979-12-04 1981-06-11 Friedrich Duss Maschinenfabrik GmbH & Co, 7265 Neubulach Schlagbohrer mit zentralem absaugkanal fuer das bohrklein
JPS61252631A (ja) * 1985-05-02 1986-11-10 Hitachi Electronics Eng Co Ltd ウエハのアライメント装置
JPH01131512U (fr) * 1988-03-03 1989-09-06
JPH03161280A (ja) * 1989-08-31 1991-07-11 Nachi Fujikoshi Corp 硬脆材穴加工用工具
JPH045367U (fr) * 1990-04-28 1992-01-17

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109940521A (zh) * 2019-04-10 2019-06-28 国宏工具系统（无锡）股份有限公司 专用于陶瓷类材料加工的硬质合金切削刀具

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TW425328B (en) 2001-03-11
AU2003300A (en) 2000-08-07

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