WO2000031774A3 - Halteeinrichtung für ein substrat - Google Patents

Halteeinrichtung für ein substrat Download PDF

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Publication number
WO2000031774A3
WO2000031774A3 PCT/DE1999/003638 DE9903638W WO0031774A3 WO 2000031774 A3 WO2000031774 A3 WO 2000031774A3 DE 9903638 W DE9903638 W DE 9903638W WO 0031774 A3 WO0031774 A3 WO 0031774A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
supporting plate
exposure
optic
holding
Prior art date
Application number
PCT/DE1999/003638
Other languages
English (en)
French (fr)
Other versions
WO2000031774A2 (de
Inventor
Gerhard Schubert
Ulf-Carsten Kirschstein
Stefan Risse
Gerd Harnisch
Gerhard Kalkowski
Volker Guyenot
Original Assignee
Leica Microsys Lithography Ltd
Gerhard Schubert
Kirschstein Ulf Carsten
Stefan Risse
Gerd Harnisch
Gerhard Kalkowski
Volker Guyenot
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leica Microsys Lithography Ltd, Gerhard Schubert, Kirschstein Ulf Carsten, Stefan Risse, Gerd Harnisch, Gerhard Kalkowski, Volker Guyenot filed Critical Leica Microsys Lithography Ltd
Priority to US09/600,630 priority Critical patent/US6426860B1/en
Priority to DE59912677T priority patent/DE59912677D1/de
Priority to JP2000584509A priority patent/JP4499293B2/ja
Priority to EP99963248A priority patent/EP1050070B1/de
Publication of WO2000031774A2 publication Critical patent/WO2000031774A2/de
Publication of WO2000031774A3 publication Critical patent/WO2000031774A3/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Abstract

Die Erfindung bezieht sich auf eine Einrichtung zum Halten eines Substrates (18) in einer Belichtungsanlage, in der die zu belichtende Fläche des Substrates (18) in einer von den Koordinaten X,Y aufgespannten Ebene liegt, das Substrat (18) mit einem in den Koordinaten X, Y verfahrbaren Tisch (1) verbunden ist und zwischen Tischfläche (5) und Substrat (18) massverkörpernde Mittel zur Abstandseinstellung und zur Ausrichtung des Substrates (18) relativ zu einer Belichtungsoptik (2) vorgesehen sind, aus welcher eine Korpuskularstrahlung rechtwinklig, der Koordinate Z entsprechend, auf die Substratoberfläche gerichtet ist. Bei einer Einrichtung der vorgenannten Art sind auf dem Tisch (1) in Richtung zur Belichtungsoptik (2) in unterschiedlichen Abständen zur Tischfläche (5) zwei parallel zur Ebene X, Y ausgerichtete Tragplatten (3, 16) vorgesehen, von denen eine erste Tragplatte (3) unmittelbar mit dem Tisch (1) verbunden ist und die zweite Tragplatte (16) über mindestens eine Haltevorrichtung, deren Haltefunktion aus- und einschaltbar ist, mit der ersten Tragplatte (3) in Verbindung steht. Dabei ist auf der der Belichtungsoptik (2) zugewandten Seite der zweiten Tragplatte (16) eine Auflageebene für das Substrat (18) ausgebildet.
PCT/DE1999/003638 1998-11-20 1999-11-16 Halteeinrichtung für ein substrat WO2000031774A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US09/600,630 US6426860B1 (en) 1998-11-20 1999-11-16 Holding device for a substrate
DE59912677T DE59912677D1 (de) 1998-11-20 1999-11-16 Belichtungsanlage mit halteeinrichtung für ein substrat
JP2000584509A JP4499293B2 (ja) 1998-11-20 1999-11-16 基板支持装置
EP99963248A EP1050070B1 (de) 1998-11-20 1999-11-16 Belichtungsanlage mit halteeinrichtung für ein substrat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19853588A DE19853588B4 (de) 1998-11-20 1998-11-20 Halteeinrichtung für ein Substrat
DE19853588.0 1998-11-20

Publications (2)

Publication Number Publication Date
WO2000031774A2 WO2000031774A2 (de) 2000-06-02
WO2000031774A3 true WO2000031774A3 (de) 2000-11-23

Family

ID=7888462

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/003638 WO2000031774A2 (de) 1998-11-20 1999-11-16 Halteeinrichtung für ein substrat

Country Status (6)

Country Link
US (1) US6426860B1 (de)
EP (1) EP1050070B1 (de)
JP (1) JP4499293B2 (de)
DE (2) DE19853588B4 (de)
TW (1) TW452674B (de)
WO (1) WO2000031774A2 (de)

Families Citing this family (10)

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Publication number Priority date Publication date Assignee Title
DE10057292C2 (de) * 2000-11-17 2003-02-13 Leica Microsystems Vorrichtung zum Aufnehmen von Mirodissektaten
DE10134387A1 (de) * 2001-07-14 2003-01-23 Zeiss Carl Optisches System mit mehreren optischen Elementen
US7154731B1 (en) * 2003-07-18 2006-12-26 Novellus Systems, Inc. Reflective coating for electrostatic chucks
US20060194516A1 (en) * 2005-01-31 2006-08-31 Tokyo Electron Limited Processing apparatus and processing method
JP5635240B2 (ja) * 2009-03-17 2014-12-03 株式会社ニューフレアテクノロジー 校正ブロック及び荷電粒子ビーム描画装置
KR101410071B1 (ko) * 2009-11-09 2014-06-25 엔에스케이 테쿠노로지 가부시키가이샤 마스크 유지 기구
US11473081B2 (en) 2016-12-12 2022-10-18 xCella Biosciences, Inc. Methods and systems for screening using microcapillary arrays
US11085039B2 (en) 2016-12-12 2021-08-10 xCella Biosciences, Inc. Methods and systems for screening using microcapillary arrays
US11156626B2 (en) 2016-12-30 2021-10-26 xCella Biosciences, Inc. Multi-stage sample recovery system
CN115309004B (zh) * 2022-08-09 2023-04-11 上海图双精密装备有限公司 一种多尺寸兼容光刻机的传输系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0486966A1 (de) * 1990-11-17 1992-05-27 Tokyo Electron Limited Elektrostatische Halteplatte
US5644137A (en) * 1996-03-04 1997-07-01 Waggener; Herbert A. Stabilizing support mechanism for electron beam apparatus

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JPS62295430A (ja) * 1986-06-16 1987-12-22 Toshiba Corp 縦形移動テ−ブル
US4758091A (en) * 1986-11-20 1988-07-19 Ateo Corporation Pattern generator part holder
DE69126719T2 (de) * 1990-03-09 1997-11-06 Canon Kk Belichtungsvorrichtung
JP3027165B2 (ja) * 1990-05-17 2000-03-27 キヤノン株式会社 位置決め装置
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US5883778A (en) * 1994-02-28 1999-03-16 Applied Materials, Inc. Electrostatic chuck with fluid flow regulator
US5535090A (en) * 1994-03-03 1996-07-09 Sherman; Arthur Electrostatic chuck
JPH07273383A (ja) * 1994-03-30 1995-10-20 Canon Inc 真空封入式圧電アクチュエータおよび該真空封入式圧電アクチュエータを用いた位置決め装置
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JPH08288372A (ja) * 1995-04-11 1996-11-01 Nippon Pillar Packing Co Ltd ウエハ支持プレート
JP3274791B2 (ja) * 1995-07-28 2002-04-15 株式会社日立製作所 電子線描画装置
JP3596127B2 (ja) * 1995-12-04 2004-12-02 ソニー株式会社 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法
JPH09266166A (ja) * 1996-03-28 1997-10-07 Nikon Corp 露光装置
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0486966A1 (de) * 1990-11-17 1992-05-27 Tokyo Electron Limited Elektrostatische Halteplatte
US5644137A (en) * 1996-03-04 1997-07-01 Waggener; Herbert A. Stabilizing support mechanism for electron beam apparatus

Also Published As

Publication number Publication date
JP4499293B2 (ja) 2010-07-07
EP1050070A2 (de) 2000-11-08
EP1050070A3 (de) 2002-09-11
EP1050070B1 (de) 2005-10-19
TW452674B (en) 2001-09-01
WO2000031774A2 (de) 2000-06-02
US6426860B1 (en) 2002-07-30
DE19853588B4 (de) 2005-04-21
JP2002530880A (ja) 2002-09-17
DE19853588A1 (de) 2000-06-21
DE59912677D1 (de) 2005-11-24

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