WO2000019794A1 - Verfahren zur rüstungskontrolle an bestückautomaten - Google Patents
Verfahren zur rüstungskontrolle an bestückautomaten Download PDFInfo
- Publication number
- WO2000019794A1 WO2000019794A1 PCT/DE1999/002786 DE9902786W WO0019794A1 WO 2000019794 A1 WO2000019794 A1 WO 2000019794A1 DE 9902786 W DE9902786 W DE 9902786W WO 0019794 A1 WO0019794 A1 WO 0019794A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- image
- control
- components
- pattern
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/084—Product tracking, e.g. of substrates during the manufacturing process; Component traceability
Definitions
- the invention relates to a method for armament control on automatic placement machines.
- the individual components are removed from a feed device by means of an assembly head and then positioned in a predetermined position on the substrate.
- substrates for example circuit boards or ceramic substrates
- SMD Surface Mounted Device
- a camera takes a picture of the surface of the component to be assembled in the feed device before the placement head exits the feed device takes.
- the term surface also includes connections of the component which can be recognized from above.
- a downstream image evaluation unit compares the image with a previously stored pattern of the component and the component is only fitted if the image matches the pattern. This check is carried out automatically by the camera and the image evaluation unit. It is not dependent on the operator and evaluates the component directly and not an intermediate carrier such as a coil former.
- the position of the component in the feed device can also be determined by comparing the image with the pattern.
- the placement head can already be brought into a favorable position for picking up before the component is picked up.
- This method is also particularly suitable for components that are located in pockets that are too large, so that their position is initially only vaguely known.
- the stored pattern contains lettering such as company names, company logos or type designations, which are identified with the help of the image evaluation unit on the image of the component for armament control.
- coded identifiers bar codes, matrix codes
- markings function or position markings
- connection which can be recognized from above, these are also included in the pattern in accordance with claim 6 in order to identify the correct armor or the correct position of the components with the aid of them.
- the placement head mounted on the camera, which is used in addition for the detection of He ⁇ substrate marks for position detection of the substrate.
- FIG. 1 shows a schematic top view of an automatic placement machine with feeding devices and FIG. 2 shows a schematic top view of a component.
- FIG. 1 shows an automatic placement machine 1 for loading a substrate 2 (for example a printed circuit board or a ceramic substrate).
- a substrate 2 for example a printed circuit board or a ceramic substrate.
- the components 3 are removed from a feed device 5 with the aid of an assembly head 4.
- the placement head 4 is moved over the substrate 2 with the aid of an x-y portal system 6, 7.
- a control device 8 ensures that the component 3 is placed on a predetermined position on the substrate 2.
- the placement head 4 has, for example, suction pipettes, not shown, which suck the component 3 under vacuum and release it when it is set down.
- a transport system 9 is shown, on which the substrate 2 is transported through the automatic placement machine and to further, not shown, automatic processing machines (for example for loading further components).
- the feed devices 5 are shown as belts which have pockets in which the component 3 is transported and provided. However, other feed units such as flat magazines are also known for which the method according to the invention can also be used.
- a comb arranged on the placement head 4 is ra 11 is provided, which takes within its field of view 12 is an illustration of the device 3 in the feeding device 5 on ⁇ .
- An image evaluation unit (not shown) connected downstream of the camera 11, which, for example, can be assigned to the camera 11 or integrated in the control device 8, evaluates the image. For this purpose, the image is compared with a pattern of the component 3 which was previously stored in the image evaluation unit and which describes certain characteristics of the component 3.
- FIG. 2 further features of the surface 14 of the component 3.
- These features may include: lettering such as company names or company logos 15, type designations 16 of the component 3, coded identifiers 17, such as barcodes or matrix codes, or other markings 18 applied, for example, by means of a laser description.
- the position of the connections 13 on the component 3 can, as far as can be seen from above, be stored in the pattern and used for evaluation.
- the position of the component 3 in the feed device 5 can also be seen if, for example, an angle between the image of the lettering 15 and the pattern of the lettering 15 is recognized.
- This position in particular the rotational position, can then already be taken into account by the placement head 4 before the component 3 is picked up, so that the component moves to the pick-up position safely.
- Cameras 11, which are attached to the placement head 4 and additionally have substrate marking markers, are particularly suitable for the method.
- the method according to the invention thereby ensures automatic armament control on automatic placement machines 1, which is suitable for different supply devices 5.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT99953699T ATE233987T1 (de) | 1998-09-29 | 1999-09-02 | Verfahren zur rüstungskontrolle an bestückautomaten |
DE59904479T DE59904479D1 (de) | 1998-09-29 | 1999-09-02 | Verfahren zur rüstungskontrolle an bestückautomaten |
KR1020017003974A KR20010075434A (ko) | 1998-09-29 | 1999-09-02 | 피크-앤-플레이스 로봇 내에서 소자를 검사하는 방법 |
EP99953699A EP1118258B1 (de) | 1998-09-29 | 1999-09-02 | Verfahren zur rüstungskontrolle an bestückautomaten |
JP2000573144A JP2003504833A (ja) | 1998-09-29 | 1999-09-02 | 自動装着装置で装填チェックする方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19844661 | 1998-09-29 | ||
DE19844661.6 | 1998-09-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000019794A1 true WO2000019794A1 (de) | 2000-04-06 |
Family
ID=7882660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1999/002786 WO2000019794A1 (de) | 1998-09-29 | 1999-09-02 | Verfahren zur rüstungskontrolle an bestückautomaten |
Country Status (8)
Country | Link |
---|---|
US (1) | US6801652B1 (de) |
EP (1) | EP1118258B1 (de) |
JP (1) | JP2003504833A (de) |
KR (1) | KR20010075434A (de) |
CN (1) | CN1206900C (de) |
AT (1) | ATE233987T1 (de) |
DE (1) | DE59904479D1 (de) |
WO (1) | WO2000019794A1 (de) |
Cited By (4)
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---|---|---|---|---|
EP1343363A1 (de) * | 2002-03-08 | 2003-09-10 | TraceXpert A/S | Prüfung einer Zufuhreinrichtung mit einer Kamera |
DE10344409A1 (de) * | 2003-09-25 | 2005-04-28 | Marconi Comm Gmbh | Verfahren zum Fertigen einer Hochfrequenzbaugruppe |
WO2005115073A2 (en) * | 2004-05-18 | 2005-12-01 | Cyberoptics Corporation | Component feeder exchange diagnostic tool |
US11415967B2 (en) * | 2017-08-04 | 2022-08-16 | Electrolux Appliances Aktiebolag | Method for assembling a cooling apparatus, an assembling line implementing the same, and a compartment of said cooling apparatus |
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US7813559B2 (en) * | 2001-11-13 | 2010-10-12 | Cyberoptics Corporation | Image analysis for pick and place machines with in situ component placement inspection |
US7555831B2 (en) * | 2001-11-13 | 2009-07-07 | Cyberoptics Corporation | Method of validating component feeder exchanges |
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US7559134B2 (en) * | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
US7706595B2 (en) | 2003-11-07 | 2010-04-27 | Cyberoptics Corporation | Pick and place machine with workpiece motion inspection |
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JP6000533B2 (ja) * | 2011-11-30 | 2016-09-28 | ヤマハ発動機株式会社 | 電子部品装着装置 |
JP5944283B2 (ja) * | 2012-09-11 | 2016-07-05 | 株式会社東芝 | 設備の製造支援装置、方法及びプログラム |
EP2732968A1 (de) | 2012-11-16 | 2014-05-21 | Kuraray Europe GmbH | Penetrationsfeste Mehrschichtfolien aus weichmacherhaltigem Polyvinylacetal mit schalldämpfenden Eigenschaften |
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CN103984611A (zh) * | 2013-02-07 | 2014-08-13 | 纬创资通股份有限公司 | 自动测试系统和自动测试方法 |
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JP6972010B2 (ja) | 2016-04-08 | 2021-11-24 | クラレイ ユーロップ ゲゼルシャフト ミット ベシュレンクテル ハフツングKuraray Europe GmbH | 流動性が低減された可塑化ポリビニルアセタールの層を有する多層フィルム |
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JP6983229B2 (ja) | 2016-09-13 | 2021-12-17 | ユニバーサル インスツルメンツ コーポレーションUniversal Instruments Corporation | フィーダ・システム、ピック・アンド・プレース機、および方法 |
KR20190060784A (ko) | 2016-10-11 | 2019-06-03 | 쿠라라이 유럽 게엠베하 | 높은 가소제 함량을 갖는 폴리비닐 아세탈을 기반으로 한 다층 필름 |
US11871521B2 (en) * | 2019-01-22 | 2024-01-09 | Fuji Corporation | Component mounting machine |
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US5099522A (en) * | 1989-05-29 | 1992-03-24 | Rohm Co., Ltd. | Method and apparatus for performing head-tail discrimination of electronic chip components |
US5667129A (en) * | 1994-05-06 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | IC component mounting method and apparatus |
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US5490084A (en) * | 1987-06-01 | 1996-02-06 | Hitachi Techno Engineering Co., Ltd. | Method and apparatus for detecting bent leads in electronic components |
DE3823836A1 (de) | 1988-07-14 | 1990-01-18 | Fraunhofer Ges Forschung | Verfahren zum vermessen von der bestueckung von leiterplatten dienenden bauelementen und einrichtung zur durchfuehrung des verfahrens |
JP2620646B2 (ja) * | 1989-06-07 | 1997-06-18 | 三洋電機株式会社 | 電子部品自動装着装置 |
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DE4232036A1 (de) | 1992-09-24 | 1994-03-31 | Siemens Ag | Verfahren zur Erkennung von Lageabweichungen |
JPH07175894A (ja) | 1993-11-05 | 1995-07-14 | Toshiba Corp | ニューラルネットワークと文字認識方法と電子部品実装検査装置及びそれを用いた管理方法 |
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JPH1065392A (ja) * | 1996-08-19 | 1998-03-06 | Matsushita Electric Ind Co Ltd | 電子部品供給装置及び電子部品実装方法 |
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1999
- 1999-05-03 US US09/303,642 patent/US6801652B1/en not_active Expired - Fee Related
- 1999-09-02 DE DE59904479T patent/DE59904479D1/de not_active Expired - Lifetime
- 1999-09-02 WO PCT/DE1999/002786 patent/WO2000019794A1/de not_active Application Discontinuation
- 1999-09-02 AT AT99953699T patent/ATE233987T1/de not_active IP Right Cessation
- 1999-09-02 CN CNB998115525A patent/CN1206900C/zh not_active Expired - Lifetime
- 1999-09-02 JP JP2000573144A patent/JP2003504833A/ja active Pending
- 1999-09-02 KR KR1020017003974A patent/KR20010075434A/ko active Search and Examination
- 1999-09-02 EP EP99953699A patent/EP1118258B1/de not_active Expired - Lifetime
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US5099522A (en) * | 1989-05-29 | 1992-03-24 | Rohm Co., Ltd. | Method and apparatus for performing head-tail discrimination of electronic chip components |
US5667129A (en) * | 1994-05-06 | 1997-09-16 | Matsushita Electric Industrial Co., Ltd. | IC component mounting method and apparatus |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1343363A1 (de) * | 2002-03-08 | 2003-09-10 | TraceXpert A/S | Prüfung einer Zufuhreinrichtung mit einer Kamera |
WO2003077628A1 (en) * | 2002-03-08 | 2003-09-18 | Valor Denmark A/S | Feeder verification with a camera |
US7083082B2 (en) | 2002-03-08 | 2006-08-01 | Valor Denmark A/S | Feeder verification with a camera |
DE10344409A1 (de) * | 2003-09-25 | 2005-04-28 | Marconi Comm Gmbh | Verfahren zum Fertigen einer Hochfrequenzbaugruppe |
WO2005115073A2 (en) * | 2004-05-18 | 2005-12-01 | Cyberoptics Corporation | Component feeder exchange diagnostic tool |
WO2005115073A3 (en) * | 2004-05-18 | 2006-01-26 | Cyberoptics Corp | Component feeder exchange diagnostic tool |
US11415967B2 (en) * | 2017-08-04 | 2022-08-16 | Electrolux Appliances Aktiebolag | Method for assembling a cooling apparatus, an assembling line implementing the same, and a compartment of said cooling apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP1118258A1 (de) | 2001-07-25 |
DE59904479D1 (de) | 2003-04-10 |
ATE233987T1 (de) | 2003-03-15 |
CN1206900C (zh) | 2005-06-15 |
EP1118258B1 (de) | 2003-03-05 |
CN1320358A (zh) | 2001-10-31 |
KR20010075434A (ko) | 2001-08-09 |
US6801652B1 (en) | 2004-10-05 |
JP2003504833A (ja) | 2003-02-04 |
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