WO1999042851A1

WO1999042851A1 - Structure of test fixture interface

Info

Publication number: WO1999042851A1
Application number: PCT/JP1999/000740
Authority: WO
Inventors: Susumu Kondo; Takashi Sekizuka; Hiroto Satoh
Original assignee: Advantest Corporation
Priority date: 1998-02-20
Filing date: 1999-02-19
Publication date: 1999-08-26
Also published as: KR20010006422A; TW420304U; JPH11237439A

Abstract

A test fixture is interposed between a performance board (62) and a socket board (10) to carry out high-density transmission of high-frequency signals. In such a structure of test fixture interface, the thermal conduction from IC sockets (11) on the socket board to a connector board is restricted, and IC sockets (11) are arranged flat on the socket board. A socket board on a test handler side is provided with a surface mount connector, and a connector board for transmitting signals from one end of the board to the other end is provided with a connector that can be engaged with the surface mount connector.

Description

Description Test Fixture Structure of Interface Section

The present invention relates to a performance board that is mounted on a test head of a semiconductor test system and serves as an interface with a device under test on the test system side, and a socket board that is mounted on a test handler and into which a device under test is inserted and removed. The structure of the interface part of the test fixture that transmits signals between and. Background art

An example of the prior art will be described with reference to FIGS.

First, an overview of a semiconductor test system using a test handler is explained.

As shown in FIG. 4, one example of the semiconductor test system includes a workstation 90, a semiconductor test apparatus main body 70, a test head 71, and a test handler 80.

The workstation 90 is an engineering workstation connected to the semiconductor test apparatus main body 70 and serving as an interface with the operator.

The semiconductor test equipment main body 70 includes a test processor that controls the entire system including peripheral devices, and various units that generate and measure test signals.

And a power supply for supplying various voltages.

The path from the semiconductor test equipment main body 70 to the electronic circuit built in the test head 71 is connected by a cable, and transmission of test signals and the like is performed. You.

Then, a test signal and the like from an electronic circuit built in the test head 71 are electrically connected to a performance board 62 mounted in the test head 71.

The test signal on the performance board 62 is electrically connected to a plurality of IC sockets 11 mounted on the socket board 10 via the test fixture 100 and transmitted.

On the contrary, the output signal from the IC socket 11 is transmitted to the semiconductor test equipment main body along the reverse route.

The test fixture 100 can be separated and replaced according to the type of the performance board 62 and the socket board 100.The test handler 80 is mounted on the socket board 10. This is an automatic transport device that automatically transports the device under test to multiple IC sockets 11, inserts and tests it, removes it from the IC socket based on the test results, sorts it, and transports it to the storage location.

In general, the test handler 80 mounts the IC socket 11 side of the socket board 10 in a constant temperature chamber to enable high and low temperature testing of the device under test.

With the above semiconductor test system configuration, an automatic test of the device under test is performed.

Next, the test fixture 100 for transmitting signals between the performance board 62 mounted on the test head 71 and the socket board 10 will be described.

Signals are mainly transmitted between the performance board 62 and the socket board 10 via the connect board 40. The connection between the performance board 62 and the connect board 40 is generally the same as the connection between the socket board 10 and the connect board 40.

Therefore, the following description will focus on the connection relationship between the socket board 10 and the connect board 40 shown in FIG. 5 and FIG.

Conventionally, as shown in FIGS. 5 and 6, a socket board 10 having a contact piece therein is embedded in a socket board 10 and provided.

At this time, since the pin socket 60 is longer than the thickness of the socket board 10, it protrudes by about 1 mm.

The reason is that the distance between the test fixture 100 and the IC socket must be kept short in order to improve the high-frequency characteristics during signal transmission, and the thickness of the socket board 10 cannot be increased. .

At the end of the connect board 40, a pin 61 and a pin header 50 molded with resin or the like and supporting the pin 61 are provided at both ends.

The pin header 50 is fixed to the pad 44 by soldering the pin 61 to the pad 44 of the connect board 40.

The signal pattern 43 serving as a signal path forms a strip line between the signal board 43 and the inner layer GND pattern 45 of the connect board 40 to have a characteristic impedance of, for example, 50 Ω.

In addition, the GND pattern 41 has an inner layer GND due to the through hole 42. Connected to turns 4-5.

On the other hand, a pad 44 at one end of the connect board 40 is connected to a pad at the other end of the connect board 40 via a signal pattern 43.

Further, pin headers 50 are provided at both ends of the connect board 40, respectively. Although not shown in the figure, the other end of the connect board 40 is similarly electrically connected to the performance board 62 via the pin header 50. Thus, the performance board 62 and the A signal is transmitted to and from the socket board 100 via the test fixture 100.

By the way, when the signal of the connect board 40 passes through the pin 61, the characteristic impedance cannot be matched in the pin header 50, and thus the waveform is disturbed.

For this reason, high-frequency signals are generated by soldering the 2-pin terminals directly from the performance board 62 to the socket board 10 using a coaxial cable with 2-pin terminals.

Conventionally, signal transmission between the performance board 62 and the socket board 10 is performed by the test fixture 100 as described above.

As described above, the conventional technology has practical problems in the following points.

(A) When passing high-frequency signals between the performance board 62 on the test head 71 and the socket board 10 on the test handler 80, use the pin header 50 to transfer high-frequency signals. Since the characteristic impedance could not be matched, waveform distortion due to reflection of the transmitted signal is likely to occur as the test signal speeds up.

(B) Since the pin socket 60 has a built-in contact piece, it is difficult to reduce the outer diameter, which limits the arrangement pitch and increases the mounting density.

(C) The IC socket 11 mounted on the socket board 10 needs to be kept at a constant temperature for the temperature test. However, the heat conduction from the pin socket 60 has poor heat insulation properties.

(D) The IC socket 11 mounted on the socket board 10 has the measured Since a socket guide is used as a guide when inserting and removing a fixed device, it is desirable that the socket board 10 has as few projections as possible. However, the distance between the IC socket 11 and the test fixture 100 is increased, which is not preferable for transmitting high-frequency signals, such as an increase in capacity. There are practical problems (A) to (D) described above.

Accordingly, the present invention has been made in view of such a problem, and its purpose is to transmit a high-frequency test signal, enable a high-density pin arrangement, and conduct heat from the IC socket 11 side of the socket board through heat conduction. An object of the present invention is to provide a structure of an interface portion of a test fixture, in which the connection is hardly conducted to the connect board side and the IC socket 11 side of the socket board is flat. Disclosure of the invention

That is, a first aspect of the present invention to achieve the above object is a performance board mounted on a test head of a semiconductor test system and serving as an interface with a device under test on the test system side, and a performance board mounted on a test handler. In the structure of the interface board of the test fixture that transmits signals between the socket board from which the measuring device is inserted and the

A plurality of surface mount connectors 20 which are surface mounted only on the side opposite to the IC socket mounting side of the socket board 10;

A connect board 40 for transmitting a signal from one end to the other end of the board, and a connector which is fitted to one end of the connect board 40 to maintain characteristic impedance matching and to be fitted to each of the surface mount connectors 20 described above. The feature of the structure of the test fixture ' are doing. In order to achieve the above object, a second aspect of the present invention is a performance board that is mounted on a test head of a semiconductor test system and serves as an interface with a device under test on the test system side, and mounted on a test handler. In the structure of the interface board of the test fixture that transmits signals between the socket board from which the device under test is

A plurality of surface mount connectors 20 mounted on the surface of the performance board 62 only while being surface mounted only on the opposite side of the socket board 10 to the IC socket mounting side;

A connect board 40 for transmitting a signal from one end to the other end of the board; and a fit to one end of the connect board 40 and a fit to the other end of the connect board 40 to maintain matching of characteristic impedance. A plurality of connectors 30 respectively mating with the respective surface mount connectors 20 of the socket board 10 or the performance board 62;

It is characterized by the structure of the test fixture's interface part, which has: BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a cross-sectional view of a signal portion on the socket board side of the test fixture of the present invention.

FIG. 2 is a cross-sectional view of the GND section on the socket board side of the test fixture of the present invention.

FIG. 3 is a partial plan view of the test fixture of the present invention on the socket board side. Figure 4 is a configuration diagram of the semiconductor test system.

Fig. 5 is a cross-sectional view of the conventional test fixture on the socket board side.

FIG. 6 is a cross-sectional view taken along line AA of FIG. 5 of the conventional test fixture. BEST MODE FOR CARRYING OUT THE INVENTION

An embodiment of the present invention will be described with reference to FIGS.

In the structure of the interface part of the test fixture 100 according to the present invention,

As shown in FIGS. 1 and 2, a surface mount connector 20 is provided on the socket board 10.

A connector 30 fitted to the connect board 40 is provided at a fitting portion of the test fixture 100 with the surface mount connector 20.

Alternatively, the fitting part of the test fixture 100 with the surface mount connector 20 may be provided with a coaxial cable connected to the connector 30.

Although the configuration of the test fixture 100 on the performance board 62 side is not shown in the figure, similarly, the performance board 62 is provided with the surface mount connector 20 and the connection board 4 is provided. Alternatively, the connector 30 may be provided with a connector 30 fitted to the connector 0.

Alternatively, as the configuration of the performance board 62 of the test fixture 100, the coaxial cable may be directly attached to the performance board 62 by soldering.

Further, the performance board 62 may be electrically connected to the test head 71 via a plurality of layers of boards (for example, a mother board). As described above, the signal is transmitted between the socket board 10 and the performance board 62 via the interface of the test fixture 100.

Next, each component will be described.

The surface mount connector 20 is a surface mount connector to which the connector 30 is fitted and electrically connected.

As the type of the surface mount connector 20, the signal pin 21 and the GND pin 24 that can be surface mounted on the socket board 10 may be selectively used. For example, signal pin 21 is composed of 36 pins, and GND pin 24 is composed of 4 pins.

At both ends of the connect board 40, the connector 30 is fixed and attached by soldering the signal contact 31 to the signal pattern 43 and the GND contact 32 to the GND pattern 41.

The connector 30 has a structure in which the signal contact 31 and the GND contact 32 of the part that is inserted into and mated with the surface mount connector 20 and the force and insulator are sandwiched, that is, a structure similar to a strip line. I have. That is, similar to the characteristic impedance of the signal pattern 43 of the connect board 40, matching can be achieved by setting the characteristic impedance between the signal contact 31 and the GND contact 32 to 50Ω.

Therefore, the signal transmission between the connect board 40 and the socket board 10 and the signal transmission between the connect board 40 and the performance board 62 maintain the characteristic impedance matching, so that high-frequency signals can be transmitted. You.

Also, since the surface mount connector 20 is mounted only on the side opposite to the side on which the IC socket 11 is mounted, there is no protrusion on the IC socket 11 side of the socket board 10. Therefore, even if a socket guide is used as a guide for inserting and removing the device under test, since there is no protrusion on the IC socket 11 side of the socket board 10, the device can be used smoothly without any trouble.

Furthermore, since pin sockets are not used, heat conduction from the IC socket 11 side of the socket board 10 to the surface mount connector 20 side is reduced. In addition, since the surface mount connector 20 is small and it is easy to narrow the pitch between the signal pins 21, the mounting density can be increased.

For example, while the pitch of the conventional pin socket 60 is 2.54 mm, the pitch between the signal pins 21 of the surface mount connector 20 can be narrowed to about 0.8 mm to 0.5 mm.

As described above, the transmission path conventionally performed by soldering the 2-pin terminals from the performance board 62 directly to the socket board 10 using the coaxial cable with the 2-pin terminals has been replaced by the test fixture of the present embodiment. The transmission of high-frequency signals through the interface has made it possible to configure the system without using coaxial cables directly.

If the soldered coaxial cable is abolished, the test fixture 100 and the socket board 10 can be easily separated or replaced by removing the mating of the surface mount connector. Industrial applicability

The present invention is embodied in the form described above, and has the following effects.

The present invention has overcome all of the above-mentioned problems (A) to (D) that the conventional technology has.

That is, the characteristic impedance is matched between the connect board and the socket board 10 by the surface mount connector, and the connect board and the performance board are matched. Since the characteristic impedance is matched with the board, the high-frequency signal can be transmitted.

In addition, there is an effect S that enables high-density signal transmission by using surface mount connectors.

Furthermore, there is an effect that the heat on the IC socket 11 side of the socket board is hardly conducted to the connect board side by heat conduction.

Furthermore, there is no protrusion on the IC socket 11 side of the socket board, and the IC board becomes flat, so that even if a socket guide is used as a guide for extracting and removing a device under test, the socket board can be used smoothly without any trouble.

As described above, the structure of the test fixture interface according to the present invention has a great advantage when a device under test operating with a high frequency signal is tested with high accuracy by combining a semiconductor test system and a test handler. Having.

Claims

The scope of the claims

1. Signals are sent between the performance board that is mounted on the test head of the semiconductor test system and interfaces with the device under test on the test system side, and the socket board that is mounted on the test handler and through which the device under test is extracted. In the structure of the interface part of the test fixture to be transmitted,

A plurality of surface mount connectors (20), which are surface mounted only on the side of the socket board (10) opposite to the side on which the IC socket is mounted;

A connect board (40) for transmitting a signal from one end of the board to the other end, and the above-mentioned surface mount connectors (20) are fitted to one end of the connect board (40) to maintain the characteristic impedance matching. ) And the connector (30)

The structure of the test fixture's interface unit, characterized by comprising:

2. Signals are sent between the performance board that is mounted on the test head of the semiconductor test system and interfaces with the device under test on the test system side, and the socket board that is mounted on the test handler and through which the device under test is inserted. In the structure of the interface part of the test fixture to be transmitted,

A plurality of surface mount connectors (20) mounted on the surface of the socket board (10) only on the side opposite to the IC socket mounting side and mounted on the surface of the performance board (62);

A connect board (40) for transmitting a signal from one end of the board to the other end; and a fit to one end of the connect board (40) and a fit to the other end of the connect board (40); Keeping the characteristic impedance matching, A test fixture, comprising: a plurality of connectors (30) that are respectively fitted to the surface mounting connectors (20) of the socket board (10) or the performance board (62). 'Structure of the interface part.