WO1999011431A1 - Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage - Google Patents

Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage Download PDF

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Publication number
WO1999011431A1
WO1999011431A1 PCT/DE1998/002486 DE9802486W WO9911431A1 WO 1999011431 A1 WO1999011431 A1 WO 1999011431A1 DE 9802486 W DE9802486 W DE 9802486W WO 9911431 A1 WO9911431 A1 WO 9911431A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
processing
polishing pad
diamond pieces
base layer
Prior art date
Application number
PCT/DE1998/002486
Other languages
German (de)
English (en)
Inventor
Olaf Kühn
André RICHTER
Sigurd Zehner
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Priority to EP98949938A priority Critical patent/EP1007278A1/fr
Publication of WO1999011431A1 publication Critical patent/WO1999011431A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
    • B24D9/08—Circular back-plates for carrying flexible material
    • B24D9/085—Devices for mounting sheets on a backing plate

Definitions

  • the present invention relates to a device and a method for processing polishing pads, in particular polishing cloths.
  • polishing pads are used, for example, for polishing wafers in corresponding polishing devices.
  • a well-known method for polishing wafers is, among others, chemical mechanical polishing (CMP).
  • Polishing pads are usually subject to wear during use, so that they have to be refurbished from time to time and replaced if necessary. Especially with the
  • Refurbishing of polishing pads can result in individual particles of the refurbishing agent being deposited in the polishing pad, as a result of which the wafer surface can be damaged in the subsequent polishing process. This leads to increased wafer reject rates.
  • polishing pads can be worked up unevenly, so that the wafers are polished with different quality.
  • the present invention has for its object to provide a device for processing polishing pads, in which the disadvantages mentioned in the prior art are avoided.
  • a device is to be provided with which polishing pads can be worked up in a simple and safe manner without the disadvantageous effects described above occurring in the subsequent polishing process.
  • a corresponding, suitable method is to be provided.
  • the object is achieved by a device for processing polishing pads, in particular polishing cloths, which is characterized in that a processing disk is arranged on a carrying device, that the processing disk is brought into contact with the polishing pad via the carrying device and that the processing disk is a Has base layer on which metal-framed diamond pieces are arranged.
  • the service life of the polishing pads can be considerably improved by the device according to the invention. This leads to a cost reduction.
  • the diamond pieces evenly roughen the surface of the polishing pads, whereby a uniform, uniform surface structure of the polishing pads is achieved. In the subsequent polishing process, this leads to a constant polishing quality over the entire wafer surface.
  • the metal setting of the diamond pieces has the further advantage that the number of breaks out or breaks off of individual diamonds can be greatly reduced during the machining process. This prevents individual pieces of diamond deposited in the polishing pad from causing damage to the wafers in the subsequent polishing process.
  • the diamond pieces can be arranged on the surface of the base layer.
  • the processing disk can have any shape. For example, round, oval or square panes are conceivable. The invention is therefore not restricted to a special disk configuration.
  • the device can be used in general form for the conditioning of polishing pads.
  • a preferred embodiment of such a polishing pad is, for example, a polishing cloth.
  • the invention can also be applied to any other configuration of polishing pads.
  • the processing disk is detachable, preferably arranged on the carrier device via an adhesive layer.
  • a self-adhesive layer is particularly advantageous here. Due to the detachable connection of the processing disc and the carrying device, the processing disc can be replaced quickly and without effort when worn. This leads to an enormous reduction in set-up time and saves time.
  • the machining disk can be circular and preferably have a diameter of 30 to 150 mm, advantageously a diameter of 50 to 100 mm.
  • Preferred embodiments of the processing disk have a diameter of 50 mm or 100 mm.
  • the diamond pieces can be in the size range from 30 to 300 ⁇ .
  • the diamond pieces are preferably arranged at different densities on the base layer.
  • the diamond pieces can be nickel-set.
  • the base layer can advantageously be formed from a synthetic resin.
  • a method for processing polishing pads, in particular polishing cloths, using a device according to the invention as described above the method being characterized by the following steps: a) attaching a processing disc with a base layer, on which metal-framed diamond pieces are arranged, on a carrying device; b) bringing the processing disc into contact with the polishing pad to be processed via the carrying device; and c) moving the polishing pad and the machining wheel relative to one another in such a way that the diamond pieces of the machining wheel are guided over the polishing pad.
  • the process according to the invention enables polishing pads, for example polishing cloths, to be worked up in a simple and safe manner without the disadvantages mentioned in relation to the prior art occurring in the subsequent polishing process.
  • the processing disk and the po lierpad moved relative to each other in such a way that the processing disc is guided over the polishing pad.
  • the present invention is not limited to individual forms of movement.
  • the processing disk and / or the polishing pad perform a rotational movement, so that the processing disk is guided in a circle over the polishing pad.
  • the processing disk and / or the polishing pad can be moved relative to one another in a linearly directed movement.
  • the machining wheel is guided in a straight line, for example in a scrubbing movement, over the polishing pad.
  • a polishing pad to be processed is arranged on a rotating plate arranged in a polishing device for polishing wafers.
  • a processing disc which consists of a base layer made of synthetic resin, on the surface of which nickel-coated diamond pieces with a size of 30 to 300 ⁇ m are arranged in different densities, is detachably attached to a carrier device via an adhesive layer.
  • the carrying device can be pivoted by means of a supporting arm and its height is variable. Furthermore, the Device rotated via a drive.
  • the rotating processing disk is now pivoted over the likewise rotating polishing pad and placed on it until the diamond pieces of the processing disk come into contact with the surface of the polishing pad.
  • the processing disk and the polishing pad execute circular movements relative to one another, the processing disk is guided in a circle over the polishing pad. As a result, the surface of the polishing pad is roughened uniformly and uniformly at all points, without individual diamond pieces breaking out of the processing disk and being able to adhere disadvantageously to the polishing pad.
  • the support arm with the processing disk is pivoted out of the polishing device, so that the polishing process for the wafers can be continued.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention concerne un dispositif permettant de traiter un tampon de polissage, notamment un tissu de polissage, pour polir des tranches. Ce dispositif comprend un disque de traitement monté sur un système porteur. Ce disque de traitement comporte une couche de base sur laquelle sont disposés des morceaux de diamant sertis dans du métal. Pour polir le tampon de polissage au-dessus du système porteur, le disque de traitement est mis en contact avec ledit tampon. L'invention concerne en outre un procédé de traitement de tampons de polissage.
PCT/DE1998/002486 1997-08-29 1998-08-24 Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage WO1999011431A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98949938A EP1007278A1 (fr) 1997-08-29 1998-08-24 Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19737873 1997-08-29
DE19737873.0 1997-08-29

Publications (1)

Publication Number Publication Date
WO1999011431A1 true WO1999011431A1 (fr) 1999-03-11

Family

ID=7840668

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1998/002486 WO1999011431A1 (fr) 1997-08-29 1998-08-24 Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage

Country Status (2)

Country Link
EP (1) EP1007278A1 (fr)
WO (1) WO1999011431A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05154756A (ja) * 1991-12-02 1993-06-22 Yokohama Rubber Co Ltd:The 研磨装置
US5482496A (en) * 1992-04-13 1996-01-09 Minnesota Mining And Manufacturing Company Automated random orbital abrading system and method
EP0769350A1 (fr) * 1995-10-19 1997-04-23 Ebara Corporation Procédé et dispositif pour dresser un tissu de polissage
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05154756A (ja) * 1991-12-02 1993-06-22 Yokohama Rubber Co Ltd:The 研磨装置
US5482496A (en) * 1992-04-13 1996-01-09 Minnesota Mining And Manufacturing Company Automated random orbital abrading system and method
US5626509A (en) * 1994-03-16 1997-05-06 Nec Corporation Surface treatment of polishing cloth
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
EP0769350A1 (fr) * 1995-10-19 1997-04-23 Ebara Corporation Procédé et dispositif pour dresser un tissu de polissage

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 017, no. 552 (M - 1491) 5 October 1993 (1993-10-05) *

Also Published As

Publication number Publication date
EP1007278A1 (fr) 2000-06-14

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