EP1007278A1 - Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage - Google Patents
Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissageInfo
- Publication number
- EP1007278A1 EP1007278A1 EP98949938A EP98949938A EP1007278A1 EP 1007278 A1 EP1007278 A1 EP 1007278A1 EP 98949938 A EP98949938 A EP 98949938A EP 98949938 A EP98949938 A EP 98949938A EP 1007278 A1 EP1007278 A1 EP 1007278A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- polishing
- processing
- polishing pad
- diamond pieces
- base layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D9/00—Wheels or drums supporting in exchangeable arrangement a layer of flexible abrasive material, e.g. sandpaper
- B24D9/08—Circular back-plates for carrying flexible material
- B24D9/085—Devices for mounting sheets on a backing plate
Definitions
- the present invention relates to a device and a method for processing polishing pads, in particular polishing cloths.
- polishing pads are used, for example, for polishing wafers in corresponding polishing devices.
- a well-known method for polishing wafers is, among others, chemical mechanical polishing (CMP).
- Polishing pads are usually subject to wear during use, so that they have to be refurbished from time to time and replaced if necessary. Especially with the
- Refurbishing of polishing pads can result in individual particles of the refurbishing agent being deposited in the polishing pad, as a result of which the wafer surface can be damaged in the subsequent polishing process. This leads to increased wafer reject rates.
- polishing pads can be worked up unevenly, so that the wafers are polished with different quality.
- the present invention has for its object to provide a device for processing polishing pads, in which the disadvantages mentioned in the prior art are avoided.
- a device is to be provided with which polishing pads can be worked up in a simple and safe manner without the disadvantageous effects described above occurring in the subsequent polishing process.
- a corresponding, suitable method is to be provided.
- the object is achieved by a device for processing polishing pads, in particular polishing cloths, which is characterized in that a processing disk is arranged on a carrying device, that the processing disk is brought into contact with the polishing pad via the carrying device and that the processing disk is a Has base layer on which metal-framed diamond pieces are arranged.
- the service life of the polishing pads can be considerably improved by the device according to the invention. This leads to a cost reduction.
- the diamond pieces evenly roughen the surface of the polishing pads, whereby a uniform, uniform surface structure of the polishing pads is achieved. In the subsequent polishing process, this leads to a constant polishing quality over the entire wafer surface.
- the metal setting of the diamond pieces has the further advantage that the number of breaks out or breaks off of individual diamonds can be greatly reduced during the machining process. This prevents individual pieces of diamond deposited in the polishing pad from causing damage to the wafers in the subsequent polishing process.
- the diamond pieces can be arranged on the surface of the base layer.
- the processing disk can have any shape. For example, round, oval or square panes are conceivable. The invention is therefore not restricted to a special disk configuration.
- the device can be used in general form for the conditioning of polishing pads.
- a preferred embodiment of such a polishing pad is, for example, a polishing cloth.
- the invention can also be applied to any other configuration of polishing pads.
- the processing disk is detachable, preferably arranged on the carrier device via an adhesive layer.
- a self-adhesive layer is particularly advantageous here. Due to the detachable connection of the processing disc and the carrying device, the processing disc can be replaced quickly and without effort when worn. This leads to an enormous reduction in set-up time and saves time.
- the machining disk can be circular and preferably have a diameter of 30 to 150 mm, advantageously a diameter of 50 to 100 mm.
- Preferred embodiments of the processing disk have a diameter of 50 mm or 100 mm.
- the diamond pieces can be in the size range from 30 to 300 ⁇ .
- the diamond pieces are preferably arranged at different densities on the base layer.
- the diamond pieces can be nickel-set.
- the base layer can advantageously be formed from a synthetic resin.
- a method for processing polishing pads, in particular polishing cloths, using a device according to the invention as described above the method being characterized by the following steps: a) attaching a processing disc with a base layer, on which metal-framed diamond pieces are arranged, on a carrying device; b) bringing the processing disc into contact with the polishing pad to be processed via the carrying device; and c) moving the polishing pad and the machining wheel relative to one another in such a way that the diamond pieces of the machining wheel are guided over the polishing pad.
- the process according to the invention enables polishing pads, for example polishing cloths, to be worked up in a simple and safe manner without the disadvantages mentioned in relation to the prior art occurring in the subsequent polishing process.
- the processing disk and the po lierpad moved relative to each other in such a way that the processing disc is guided over the polishing pad.
- the present invention is not limited to individual forms of movement.
- the processing disk and / or the polishing pad perform a rotational movement, so that the processing disk is guided in a circle over the polishing pad.
- the processing disk and / or the polishing pad can be moved relative to one another in a linearly directed movement.
- the machining wheel is guided in a straight line, for example in a scrubbing movement, over the polishing pad.
- a polishing pad to be processed is arranged on a rotating plate arranged in a polishing device for polishing wafers.
- a processing disc which consists of a base layer made of synthetic resin, on the surface of which nickel-coated diamond pieces with a size of 30 to 300 ⁇ m are arranged in different densities, is detachably attached to a carrier device via an adhesive layer.
- the carrying device can be pivoted by means of a supporting arm and its height is variable. Furthermore, the Device rotated via a drive.
- the rotating processing disk is now pivoted over the likewise rotating polishing pad and placed on it until the diamond pieces of the processing disk come into contact with the surface of the polishing pad.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
L'invention concerne un dispositif permettant de traiter un tampon de polissage, notamment un tissu de polissage, pour polir des tranches. Ce dispositif comprend un disque de traitement monté sur un système porteur. Ce disque de traitement comporte une couche de base sur laquelle sont disposés des morceaux de diamant sertis dans du métal. Pour polir le tampon de polissage au-dessus du système porteur, le disque de traitement est mis en contact avec ledit tampon. L'invention concerne en outre un procédé de traitement de tampons de polissage.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19737873 | 1997-08-29 | ||
DE19737873 | 1997-08-29 | ||
PCT/DE1998/002486 WO1999011431A1 (fr) | 1997-08-29 | 1998-08-24 | Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1007278A1 true EP1007278A1 (fr) | 2000-06-14 |
Family
ID=7840668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP98949938A Withdrawn EP1007278A1 (fr) | 1997-08-29 | 1998-08-24 | Procede et dispositif pour traiter des tampons de polissage, notamment des tissus de polissage |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1007278A1 (fr) |
WO (1) | WO1999011431A1 (fr) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05154756A (ja) * | 1991-12-02 | 1993-06-22 | Yokohama Rubber Co Ltd:The | 研磨装置 |
US5231803A (en) * | 1992-04-13 | 1993-08-03 | Minnesota Mining And Manufacturing Company | Automated random orbital abrading method |
JP2914166B2 (ja) * | 1994-03-16 | 1999-06-28 | 日本電気株式会社 | 研磨布の表面処理方法および研磨装置 |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
EP0769350A1 (fr) * | 1995-10-19 | 1997-04-23 | Ebara Corporation | Procédé et dispositif pour dresser un tissu de polissage |
-
1998
- 1998-08-24 WO PCT/DE1998/002486 patent/WO1999011431A1/fr not_active Application Discontinuation
- 1998-08-24 EP EP98949938A patent/EP1007278A1/fr not_active Withdrawn
Non-Patent Citations (1)
Title |
---|
See references of WO9911431A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO1999011431A1 (fr) | 1999-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20000218 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20010301 |