WO1998049646A2 - Chaine d'assemblage reconfigurable dynamiquement d'articles electroniques - Google Patents
Chaine d'assemblage reconfigurable dynamiquement d'articles electroniques Download PDFInfo
- Publication number
- WO1998049646A2 WO1998049646A2 PCT/US1998/008811 US9808811W WO9849646A2 WO 1998049646 A2 WO1998049646 A2 WO 1998049646A2 US 9808811 W US9808811 W US 9808811W WO 9849646 A2 WO9849646 A2 WO 9849646A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- placement
- workcell
- controller
- activity
- conveyor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000000712 assembly Effects 0.000 claims abstract description 14
- 238000000429 assembly Methods 0.000 claims abstract description 14
- 230000004044 response Effects 0.000 claims abstract description 13
- 230000000694 effects Effects 0.000 claims description 23
- 238000004891 communication Methods 0.000 abstract description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 9
- YTBRNEUEFCNVHC-UHFFFAOYSA-N 4,4'-dichlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=C(Cl)C=C1 YTBRNEUEFCNVHC-UHFFFAOYSA-N 0.000 description 5
- YKKYCYQDUUXNLN-UHFFFAOYSA-N 2,4-dichloro-1-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1Cl YKKYCYQDUUXNLN-UHFFFAOYSA-N 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000872 buffer Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000036528 appetite Effects 0.000 description 1
- 235000019789 appetite Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32019—Dynamic reconfiguration to maintain optimal design, fabrication, assembly
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32297—Adaptive scheduling, feedback of actual proces progress to adapt schedule
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32305—Fastest interrupt time, change jobs dynamically to fastest machine
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45035—Printed circuit boards, also holes to be drilled in a plate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Definitions
- This invention relates to an assembly line for manufacturing electronic assemblies such as printed circuit boards containing discrete components .
- the invention is particularly useful for, but not necessarily limited to, maximizing the utilization of the assembly line while at the same time providing maximum flexibility in product mix and volume .
- the circuit boards are generally conveyed through the assembly line on conveyors .
- Various assembly processes such as solder stenciling, component mounting and reflow soldering are typically performed.
- the conveyors are parallel tracks that carry the circuit board through the various stages of assembly, from one station to another. During conveying it is common practice to support the circuit boards along the edges and maintain them in a substantially horizontal plane and isolated from vibration so that the possibility of component misalignment is reduced.
- the assembly line is usually optimized to enable high efficiency and throughput. This is because of the substantial capital cost of the highly sophisticated and automated equipment employed in modern circuit board assembly lines. A typical line costs two million dollars, and some are as high as ten million dollars. Obviously, one is desirous of operating at highest efficiency in order to realize maximum return on the dollars invested in the equipment, and assembly lines are typically dedicated to a single product so that down time required to reconfigure the assembly line is minimized. On the other hand, the demands of the modern marketplace are such that it is desirous to produce a variety of products in order to satisfy the increasing appetite for electronics that provide features that are tailored to the individual consumer. This means that either several dedicated lines must be employed, or the line must be frequently reconfigured.
- FIGs . 1 and 2 are schematic views illustrating a dynamically reconfigurable production line in accordance with a preferred embodiment of the invention.
- FIG. 3 is a schematic view illustrating a placement workcell for a dynamically reconfigurable production line in accordance with an alternate embodiment of the invention.
- a method of reconfiguring a production line for fabricating printed circuit board assemblies to achieve maximum efficiency and maximum flexibility is disclosed.
- the production line has one or more placement stations, a reflow oven, a conveyor and a controller.
- the controller communicates with the various components (placement stations, a reflow oven, a conveyor) of the production line to transfer information related to the state of assembly of some of the printed circuit board assemblies that are being processed.
- the controller also communicates information related to the status of the various other stations .
- the operational functionality of one or more of the placement stations, the reflow oven, or the conveyor is altered in response to the communication by the controller .
- the other remaining modules continue operation unaltered during this step of dynamic reconfiguration.
- a controller monitors other placement workcells that are downstream. If a downstream workcell is idle, then it sends a signal to the controller that indicates such, and the first placement workcell is dynamically reconfigured. This can occur while the first workcell is in operation, in response to a signal from the controller.
- the conveyor transports the first electronic assembly from the first placement workcell to the second placement workcell.
- a second electronic assembly is then conveyed into the first placement workcell, and a second activity is performed on the first electronic assembly in the second placement workcell.
- the required activity is also performed on the second electronic assembly in the dynamically reconfigured first placement workcell .
- the controller is responsive to information related to the degree of completion of the activity that is being performed on the various electronic assemblies . In some instances, the operation of the remaining modules continues unaltered during the step of dynamically reconfiguring.
- the components are placed onto the board by robots or other highly automated machines, such as chip shooters . It should be understood and appreciated that our invention is directed to the use of robots or other machinery as opposed to manual systems where components are placed onto the board by human hands . These various components are then typically attached by reflow soldering them onto the printed circuit board.
- the production line consists of one or more (typically several) placement machines such as robots.
- the placement machines are variously referred to as pick-and-place machines, workcells, robots, workstations, placement modules, chip- shooters , etc. in the industry parlance . Each workcell or station typically has a predetermined set of components that can be placed on the PCB.
- These components are loaded into feeders contained in the workcell, and the robot or placement means selects from the various feeders to place the desired set of components on the PCB.
- a software program resident in the workcell directs the robot as to which components to select and where to place them on the PCB.
- the placement of components in each workcell requires a finite period of time, and when the cycle in each workcell is complete, the PCB is then conveyed into the next workcell .
- a first PCB 15 enters the first workcell 16 and the workcell begins placing components or parts onto the PCB.
- Another PCB 17 is queued up waiting for the first workcell 16 to finish its cycle. If, during the course of the cycle of placing the various components, another workcell 18, 20 that is downstream (i.e. farther down the production line) is idle or is nearing the end of its cycle, the first workcell is dynamically reconfigured (i.e. the program is altered while it is running) .
- the cycle of placing components in the first workcell 16 is interrupted and abbreviated so that the PCB 15 can now move into the next, or second, workcell 18, which was idle.
- the first PCB 15 exits the first workcell 16
- another, or second, PCB 17 enters the first workcell to have various components placed thereon.
- the first workcell can either be reconfigured prior to the second PCB 17 entering, or it can remain in the same configuration state as it was when the first PCB 15 left.
- the second workcell 18 now places the components that were originally destined to be placed on the first PCB 15 prior to the first workcell being dynamically reconfigured.
- the second workcell 18 typically has a set of components that it normally places on the PCB, and depending on the available time and state of the workcells further downstream, these may or may not be completely placed.
- the feeders in the second workcell 18 contains a subset of the components found in the first workcell.
- the principle, heretofore unrealized, is that each workcell is capable of placing some or all of the parts of the workcell that is upstream of itself, and both workcells are capable of being dynamically reconfigured. Thus, the amount of time that any single workcell in the production line is idle is minimized and the efficiency of the line is maximized.
- it can be immediately alleviated by shifting some of the workload to one or more downstream stations that have idle capacity.
- some of the workload can be shifted to one or more upstream stations that have idle capacity.
- the controller is typically a high speed computer that serves to allocate resources amongst the various workcells in order to optimize the efficiency of the production line.
- the controller 30 may simply pass a signal to the first and second workcells 16, 18 and these workcells then alter the software within their respective systems .
- the controller can actively modify the software program for each workcell and pass it to the respective workcell for implementation.
- some type of information on the state of the cycle in each workcell is being passed from the workcells to the controller 30, and other information (e.g. instructions for dynamically reconfiguring) is passed back to these same workcells .
- the operational functionality of one of the workcells can be dynamically reconfigured while the others continue to operate unaltered.
- the principles of our invention can also be applied to other segments of the assembly line, for example, to the conveyor 24, the reflow oven 22 or the solder printer.
- the screen printer and the reflow oven can be dynamically reconfigured to adjust to the dynamic needs of the product mix.
- the reflow is typically an oven, but can also be a robot with a heating chamber, thus lending itself to quick reconfiguration.
- U.S. Patent No. 4,840,268 discloses an adjustable width chain conveyor.
- the conveyor has two parallel and inclined channels within which are mounted a respective continuous chain coupled to a drive. Each chain can slide inwardly or outwardly to accommodate for small variations in widths of circuit boards being conveyed.
- Still another means of conveying various sized PCBs is to utilize dual, parallel conveyors on the production line. Two conveyors are run side by side through each of the workstations .
- the conveyor can convey circuit boards of different widths without the need for completely conveying one board through the conveyor before boards of a different width can conveyed.
- the above preferred embodiment of our novel invention provides a method to process a sequence of electronic assemblies, where the activity being performed on each assembly is different, and where the various workcells can be dynamically reconfigured.
- Placement workcell 32 comprises placement executor 33, a conveyor 34 and a controller 35.
- Placement executor 33 includes a component feeder 36 and a component placer 37.
- Controller 35 couples to control placement executor 33 and conveyor 34.
- Conveyor 34 is associated with placement executor 33 and conveys PCBs (not shown) from a preceding placement workcell (not shown) to placement workcell 32 or from placement workcell 32 to a placement workcell (not shown) .
- the preceding or subsequent placement workcell need not be next in sequence with placement workcell 32. For example, there may be one or more intermediate placement workcells between the preceding placement workcell and placement workcell 32.
- Controller 35 determines one or more operations for executing by placement executor 33.
- the operations are placement operations in which component placer 37 places components from component feeder 36 onto PCBs.
- Information associated with the PCBs may be provided to controller 35 by the preceding placement workcell to determine the operations.
- Controller 35 can reduce these operations by controlling placement executor 33 in response to an idle status signal from the subsequent placement workcell.
- the idle status signal indicates to controller 35 that the subsequent placement workcell is ready to accept a PCB from placement workcell 32.
- Controller 35 also provides information on executed or unexecuted operations for the PCB to the subsequent placement workcell.
- the invention advantageously executes operations on PCBs with placement workcell 32 depending on how many of the operations have been executed or unexecuted by preceding placement workcells.
- placement workcell 32 can also be executed by subsequent placement workcells depending on availability of the subsequent placement workcells to execute the operations .
- a production line having two or more placement workcell 32 coupling together can attain a dynamic line balance with a minimum use of buffers.
- placement workcell 32 in the invention continuously execute operations without slowing down or stopping because of performance of other placement workcells .
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automation & Control Theory (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- Operations Research (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU72731/98A AU7273198A (en) | 1997-05-01 | 1998-05-01 | Dynamically reconfigurable assembly line for electronic products |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/846,451 US6104965A (en) | 1997-05-01 | 1997-05-01 | Control of workstations in assembly lines |
US08/846,451 | 1997-05-01 | ||
US08/933,319 US6378200B1 (en) | 1997-09-18 | 1997-09-18 | Dynamically reconfigurable assembly line for electronic products |
US08/933,319 | 1997-09-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1998049646A2 true WO1998049646A2 (fr) | 1998-11-05 |
WO1998049646A3 WO1998049646A3 (fr) | 1999-02-04 |
Family
ID=27126639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1998/008811 WO1998049646A2 (fr) | 1997-05-01 | 1998-05-01 | Chaine d'assemblage reconfigurable dynamiquement d'articles electroniques |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU7273198A (fr) |
WO (1) | WO1998049646A2 (fr) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005044A2 (fr) * | 2000-07-06 | 2002-01-17 | Siemens Dematic Electronics Assembly Systems, Inc. | Systeme de programmation pour unite de fabrication de composants electroniques |
GB2372884A (en) * | 2001-02-28 | 2002-09-04 | Speedprint Ltd | Multifunction machine and method of forming a control interface |
EP1600836A2 (fr) * | 2004-05-27 | 2005-11-30 | Xerox Corporation | Traitement d'erreur dans des systèmes de production, combinant une planification en ligne avec des règles prédéterminées |
WO2006079569A1 (fr) * | 2005-01-27 | 2006-08-03 | Siemens Aktiengesellschaft | Systeme permettant l'adaptation rapide de processus industriels |
WO2006080366A2 (fr) * | 2005-01-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | Procede et appareil de surveillance et monteur |
EP2111091A3 (fr) * | 2008-04-16 | 2012-01-04 | ASM Assembly Systems GmbH & Co. KG | Agencement de transport de substrats, agencement de manipulation de substrats, agencement de fabrication de composants électroniques ainsi que procédé de manipulation de substrats |
EP2555238A1 (fr) * | 2010-03-31 | 2013-02-06 | Fujitsu Limited | Module à puces multiples, unité de carte de circuits imprimés, procédé de fabrication d'un module à puces multiples et procédé de fabrication d'une unité de carte de circuits imprimés |
EP2840600A1 (fr) * | 2013-08-22 | 2015-02-25 | Robert Bosch Gmbh | Station de traitement pour une machine et contrôleur et méthode de contrôle pour contrôler un mouvement dans un procédé de la machine |
CN110827652A (zh) * | 2019-11-29 | 2020-02-21 | 无锡职业技术学院 | 多功能工业机器人技术应用实训平台 |
EP3582049A4 (fr) * | 2017-02-09 | 2020-04-08 | Fuji Corporation | Dispositif d'optimisation pour chaîne de production |
DE102018133183A1 (de) * | 2018-12-20 | 2020-06-25 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Steuerung eines Bestückprozesses von Bestückautomaten, Elektronische Steuerung von Bestückautomaten, Bestückautomat und System zur Steuerung einer Fertigungslinie in der Leiterplattenfertigung |
CN117525694A (zh) * | 2023-10-12 | 2024-02-06 | 惠州久久犇科技有限公司 | 电池防火隔热片自动化封装设备 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5104621A (en) * | 1986-03-26 | 1992-04-14 | Beckman Instruments, Inc. | Automated multi-purpose analytical chemistry processing center and laboratory work station |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
US5258915A (en) * | 1990-09-28 | 1993-11-02 | Hewlett-Packard Company | System and method for optimum operation assignments in printed circuit board manufacturing |
-
1998
- 1998-05-01 AU AU72731/98A patent/AU7273198A/en not_active Abandoned
- 1998-05-01 WO PCT/US1998/008811 patent/WO1998049646A2/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5104621A (en) * | 1986-03-26 | 1992-04-14 | Beckman Instruments, Inc. | Automated multi-purpose analytical chemistry processing center and laboratory work station |
US5170554A (en) * | 1990-09-28 | 1992-12-15 | Hewlett-Packard Company | High mix printed circuit assembly technique |
US5258915A (en) * | 1990-09-28 | 1993-11-02 | Hewlett-Packard Company | System and method for optimum operation assignments in printed circuit board manufacturing |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002005044A2 (fr) * | 2000-07-06 | 2002-01-17 | Siemens Dematic Electronics Assembly Systems, Inc. | Systeme de programmation pour unite de fabrication de composants electroniques |
WO2002005044A3 (fr) * | 2000-07-06 | 2003-03-13 | Siemens Dematic Electronics As | Systeme de programmation pour unite de fabrication de composants electroniques |
GB2372884A (en) * | 2001-02-28 | 2002-09-04 | Speedprint Ltd | Multifunction machine and method of forming a control interface |
WO2002069688A1 (fr) * | 2001-02-28 | 2002-09-06 | Blakell Europlacer Limited | Machine multifonctionnelle et procede de conception d'une interface de controle |
GB2372884B (en) * | 2001-02-28 | 2005-01-05 | Speedprint Ltd | Multifunction machine and method of forming a control interface |
EP1600836A2 (fr) * | 2004-05-27 | 2005-11-30 | Xerox Corporation | Traitement d'erreur dans des systèmes de production, combinant une planification en ligne avec des règles prédéterminées |
EP1600836A3 (fr) * | 2004-05-27 | 2007-07-18 | Xerox Corporation | Traitement d'erreur dans des systèmes de production, combinant une planification en ligne avec des règles prédéterminées |
WO2006079569A1 (fr) * | 2005-01-27 | 2006-08-03 | Siemens Aktiengesellschaft | Systeme permettant l'adaptation rapide de processus industriels |
WO2006080366A2 (fr) * | 2005-01-27 | 2006-08-03 | Matsushita Electric Industrial Co., Ltd. | Procede et appareil de surveillance et monteur |
WO2006080366A3 (fr) * | 2005-01-27 | 2006-09-21 | Matsushita Electric Ind Co Ltd | Procede et appareil de surveillance et monteur |
EP2111091A3 (fr) * | 2008-04-16 | 2012-01-04 | ASM Assembly Systems GmbH & Co. KG | Agencement de transport de substrats, agencement de manipulation de substrats, agencement de fabrication de composants électroniques ainsi que procédé de manipulation de substrats |
EP2555238A1 (fr) * | 2010-03-31 | 2013-02-06 | Fujitsu Limited | Module à puces multiples, unité de carte de circuits imprimés, procédé de fabrication d'un module à puces multiples et procédé de fabrication d'une unité de carte de circuits imprimés |
EP2555238A4 (fr) * | 2010-03-31 | 2013-06-12 | Fujitsu Ltd | Module à puces multiples, unité de carte de circuits imprimés, procédé de fabrication d'un module à puces multiples et procédé de fabrication d'une unité de carte de circuits imprimés |
EP2840600A1 (fr) * | 2013-08-22 | 2015-02-25 | Robert Bosch Gmbh | Station de traitement pour une machine et contrôleur et méthode de contrôle pour contrôler un mouvement dans un procédé de la machine |
CN104418097A (zh) * | 2013-08-22 | 2015-03-18 | 罗伯特·博世有限公司 | 用于机器的处理站以及控制装置和控制方法 |
EP3582049A4 (fr) * | 2017-02-09 | 2020-04-08 | Fuji Corporation | Dispositif d'optimisation pour chaîne de production |
DE102018133183A1 (de) * | 2018-12-20 | 2020-06-25 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Steuerung eines Bestückprozesses von Bestückautomaten, Elektronische Steuerung von Bestückautomaten, Bestückautomat und System zur Steuerung einer Fertigungslinie in der Leiterplattenfertigung |
CN111356353A (zh) * | 2018-12-20 | 2020-06-30 | 先进装配系统有限责任两合公司 | 在印刷电路板生产中的自动装配机的电子控制 |
DE102018133183B4 (de) | 2018-12-20 | 2020-07-09 | Asm Assembly Systems Gmbh & Co. Kg | Verfahren zur Steuerung eines Bestückprozesses von Bestückautomaten, Elektronische Steuerung von Bestückautomaten, Bestückautomat und System zur Steuerung einer Fertigungslinie in der Leiterplattenfertigung |
CN111356353B (zh) * | 2018-12-20 | 2021-06-22 | 先进装配系统有限责任两合公司 | 在印刷电路板生产中的自动装配机的电子控制 |
CN110827652A (zh) * | 2019-11-29 | 2020-02-21 | 无锡职业技术学院 | 多功能工业机器人技术应用实训平台 |
CN117525694A (zh) * | 2023-10-12 | 2024-02-06 | 惠州久久犇科技有限公司 | 电池防火隔热片自动化封装设备 |
Also Published As
Publication number | Publication date |
---|---|
AU7273198A (en) | 1998-11-24 |
WO1998049646A3 (fr) | 1999-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6378200B1 (en) | Dynamically reconfigurable assembly line for electronic products | |
US7032304B2 (en) | Method for conveying printed circuit boards | |
WO1998049646A2 (fr) | Chaine d'assemblage reconfigurable dynamiquement d'articles electroniques | |
US6104965A (en) | Control of workstations in assembly lines | |
JP4278903B2 (ja) | 電子部品実装装置および電子部品実装方法 | |
JP6663845B2 (ja) | 電子部品の装着方法および電子部品装着システム | |
JP4342185B2 (ja) | 実装ラインにおける基板搬入方法および基板生産システム | |
US6836960B2 (en) | Board transfer apparatus, board transfer method, and component mounting apparatus | |
JP2004142299A (ja) | スクリーン印刷システムおよびスクリーン印刷方法 | |
JP5130030B2 (ja) | 電子部品装着装置 | |
JPH08279692A (ja) | 製品組立システム | |
CN111356353B (zh) | 在印刷电路板生产中的自动装配机的电子控制 | |
EP3484255B1 (fr) | Système de création de plan de production et procédé de création de plan de production | |
WO2023203610A1 (fr) | Système de production de substrat | |
JPH058835A (ja) | プリント基板搬送制御方法 | |
JP4132999B2 (ja) | 電子部品搭載装置、電子部品生産方法および該方法をコンピュータに実行させるプログラム | |
WO2023021549A1 (fr) | Procédé de génération de programme de production | |
JP2004128246A (ja) | 電子部品実装ラインおよび電子部品実装ラインにおける基板搬送方法 | |
EP2955987B1 (fr) | Système de transport de substrat d'un dispositif de montage de composant électronique | |
JPH10284886A (ja) | 部品装着方法及び装置 | |
Dillon et al. | PCB assembly line setup optimization using component commonality matrices | |
JP3664762B2 (ja) | 電子部品実装装置 | |
JPS60263654A (ja) | パレツト搬送式のプリント基板加工装置 | |
JP7018379B2 (ja) | 電子部品装着システムの制御装置 | |
JP2002036072A (ja) | 回転テーブルを利用した生産システム |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG UZ VN YU |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG |
|
AK | Designated states |
Kind code of ref document: A3 Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK TJ TM TR TT UA UG UZ VN YU |
|
AL | Designated countries for regional patents |
Kind code of ref document: A3 Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
NENP | Non-entry into the national phase |
Ref country code: JP Ref document number: 1998547422 Format of ref document f/p: F |
|
122 | Ep: pct application non-entry in european phase | ||
NENP | Non-entry into the national phase |
Ref country code: CA |