WO1997043623A1 - Appareil et procede de detection de defaut - Google Patents

Appareil et procede de detection de defaut Download PDF

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Publication number
WO1997043623A1
WO1997043623A1 PCT/JP1997/001562 JP9701562W WO9743623A1 WO 1997043623 A1 WO1997043623 A1 WO 1997043623A1 JP 9701562 W JP9701562 W JP 9701562W WO 9743623 A1 WO9743623 A1 WO 9743623A1
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WO
WIPO (PCT)
Prior art keywords
brightness
predetermined threshold
pixel
threshold value
defect
Prior art date
Application number
PCT/JP1997/001562
Other languages
English (en)
Japanese (ja)
Inventor
Kimio Nakano
Satoshi Nishida
Yoshihiko Nakakoji
Toru Inomoto
Original Assignee
Komatsu Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ltd. filed Critical Komatsu Ltd.
Publication of WO1997043623A1 publication Critical patent/WO1997043623A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

Definitions

  • the present invention relates to a defect detection apparatus and method for capturing an image of a detection target and detecting an uneven defect appearing on the detection target.
  • irregularities may occur on a surface that should be originally smooth. If there is such an uneven portion, the wire may be bonded to the uneven portion in the wire bonding step, and poor bonding may occur. Therefore, it is necessary to reliably detect such irregularities appearing on the smooth surface in the inspection process and treat them as defective.
  • the defect portion is imaged as having a different brightness from the surroundings.
  • the illumination of the inspection stage provided in the process, the position of the camera, and the like are adjusted, and the above-described irregularities such as voids have lower brightness than the surroundings. (Blackened).
  • the areas determined to be low in brightness below the predetermined threshold include non-defective surface irregularities in addition to voids, which are original defects.
  • unevenness is a slight change in unevenness that appears on the surface of an electronic component such as an IC mold and is not a defect. If the normal surface is a mirror surface, the shallow, fine and subtle irregularities (none) will be uneven. On the other hand, if the normal surface is shallow and fine and delicate irregularities (plain ground), the mirror surface will be uneven.
  • Such uneven parts are imaged on a normal electronic component surface as having a different brightness than the surroundings. Therefore, as described above, when the illumination of the inspection stage and the camera position are adjusted so that the unevenness defect portion such as a void becomes lighter (blacker) than the surroundings, the unevenness portion also becomes the unevenness defect portion. Similarly, since the brightness is low, the unevenness may be erroneously detected as a “defect” and may be erroneously recognized as a defective product although it is a good product. Disclosure of the invention
  • the present invention has been made in view of such circumstances, and has as its object to clearly identify non-defective irregularities and original irregular-shaped defects so that defect detection can be performed accurately. Is what you do.
  • a defect detection apparatus that captures an image of a detection target and detects an uneven defect appearing on the detection target includes:
  • First binarizing means for binarizing the brightness of each pixel of the captured image with a predetermined threshold
  • Differentiating means for calculating the amount of change in brightness of each surface element of the captured image
  • Second binarizing means for binarizing the change in brightness of each pixel calculated by the differentiating means with a predetermined threshold value
  • the first binarizing means provides a predetermined threshold value, brightness equal to or less than a predetermined value, and (2) a binarizing means for obtaining a coordinate position of a pixel having a brightness change amount equal to or greater than a predetermined threshold value, and a detecting means for detecting that there is an irregular defect at this coordinate position;
  • the brightness of each pixel of the captured image is binarized by a predetermined threshold value, and assuming that the brightness is equal to or less than the predetermined threshold value, irregularities such as voids and the like are considered. Are extracted.
  • the amount of change in the brightness of each pixel of the captured image is calculated, and the calculated amount of change in the brightness of each pixel is binarized by a predetermined threshold value.
  • irregular defects such as voids and characters and circuit patterns printed on the surface are extracted.
  • an uneven defect is detected by obtaining an area having a common coordinate position among the areas extracted by these two types of thresholds.
  • 1 (a) to 1 (d) are plan views of an inspection object according to an embodiment of a defect detection device and method according to the present invention, and are diagrams used to explain a defect inspection processing procedure. ⁇ .
  • FIGS. 2A and 2B are diagrams used to explain a defect inspection method capable of performing arithmetic processing at high speed.
  • FIG. 3 is a flowchart showing a processing procedure performed in the embodiment.
  • FIG. 4 is a flowchart showing a processing procedure capable of reducing the area for calculating the brightness change amount.
  • FIG. 5 is a flowchart showing a processing procedure capable of reducing the area for performing the brightness binary processing.
  • FIG. 1A is a plan view showing an IC mold 1 which is a defect inspection object assumed in the embodiment, and the surface of the IC mold 1 has a void 3 as a defect and a void 3 as a defect. Surface unevenness (dirt) 4 and printed characters “123” appear.
  • an inspection area 2 to be imaged by a camera (not shown) is set on the surface of the IC mold 1 (step 101).
  • the inspection area 2 is picked up by the camera as a light and shade image, and the brightness of each pixel of the picked-up image is binarized by a threshold C1 for distinguishing the void 3 from a normal part.
  • a threshold C1 for distinguishing the void 3 from a normal part.
  • an area of a pixel having a brightness equal to or less than the threshold value C1 (referred to as a blob) is obtained.
  • the barycentric coordinate positions Gl (X1, Yl) and G2 (X2, Y2) of the blobs Pl and P2 are obtained, and these barycentric coordinate positions Gl and G2 are
  • the blobs to be extracted are blob P1 indicating the body 3 and blob P2 indicating the surface unevenness 4.
  • the printed character 5 has a high brightness and has a brightness equal to or higher than the threshold value C1. Is not extracted as a blob (step 103).
  • a differential calculation process is performed to determine the amount of change in brightness (brightness gradient) of each pixel of the grayscale image of the inspection area 2 imaged by the camera (step 104).
  • the brightness change amount of each pixel of the differentiated picked-up image is binarized by the threshold value C2 for discriminating between the void 3 and the normal state (step 105). Then, a blob having a brightness change amount equal to or greater than the threshold value C2 is obtained.
  • the coordinates of the centroid of each blob P3, P4, P5, P6 Positions G3 (X3, Y3), G4 (X4, Y4), G5 (X5, Y5), G6 (X6, Y6) are obtained, and these barycentric coordinate positions G3, G4, G5, G6 are determined by the respective blobs P3, P4, It is stored in a predetermined memory in association with P5 and P6.
  • the extracted blobs are blob P3 indicating void 3 and blobs P4, P5, and P6 each indicating the printed character “123”.
  • the surface unevenness (dirt) 4 since the boundary edge is not clear and the brightness change amount is low, the brightness change amount is smaller than the threshold value C2 and is not extracted as a blob (step 106).
  • This threshold value C3 is a threshold value for judging whether or not the positions of the centers of gravity of both blobs coincide (step 109).
  • step 109 If the distance between the positions of the centers of gravity of both blobs is greater than the threshold value C3, i is incremented by +1 (step 1 1 1), and the processing of step 109 is executed until i reaches n ( Step 108).
  • the distance between the barycenter coordinate position G1 of blob P1 and the barycenter coordinate position G3 of blob P3 is equal to or smaller than the threshold value C3.
  • the determination 109 it can be determined that the coordinate position G1 or G3 has the center of gravity of the void 3 (step 110).
  • a loop may be provided to shift from step 110 to step 111.
  • the brightness is binarized for the entire inspection area A, as in steps 101, 102, and 103 in FIG. 3, and the brightness becomes equal to or less than the threshold value C1.
  • the brightness change amount of each pixel of the local area 6 subjected to the differential processing is binarized by the threshold value C2 for discriminating the void 3 from a normal part (step 208). Then, a blob having a brightness change amount equal to or greater than the threshold value C2 is obtained.
  • the barycentric coordinate position G3 (X3, Y3) is obtained.
  • the barycentric coordinate position G3 is obtained by the blob P3 And is stored in a predetermined memory.
  • blobs P4, P5, and P6 indicating the printed character "123" are outside the local area 6, and are not extracted as blobs.
  • the brightness change amount is smaller than the threshold value C2 and is not extracted as a blob (step 209).
  • a loop that shifts from step 210 to step 211 may be provided as shown by a broken line E.
  • the size B of the region to be differentiated is smaller than when the whole A is differentiated.
  • the search for the void 3 is performed only by differentiating the area around the low brightness area, the blob indicating the print character 5 is not extracted in the search process.
  • arithmetic processing can be performed at high speed.
  • a large-capacity memory is required to store an image obtained by differentiating the entire inspection area 2.
  • the area to be stored can be reduced, so that a large-capacity memory is required. No memory is required. Therefore, the cost of the device can be reduced.
  • the processing speed may be increased by reducing the area for performing the brightness binary processing.
  • steps 301, 302, and 303 the process of binarizing the brightness change amount for the entire inspection area A by the threshold value C2 in the same manner as steps 101, 104, and 105 in FIG. Done.
  • step 304 a blob having a brightness change amount equal to or greater than the threshold value C2 is obtained.
  • the blob P1 indicating the void 3 and the blobs P2, P3, and P4 respectively indicating the printed character "123" are extracted, and the center-of-gravity coordinate positions G1 to G4 of these blobs are stored.
  • a process of binarizing the brightness of each pixel of the grayscale image with the threshold value C1 is executed (step 308).
  • a blob having brightness equal to or less than the threshold value C1 is obtained.
  • the blob P5 indicating the body 3 is extracted. Blobs showing surface unevenness 4 are outside the local area 6 and are not extracted as blobs (step 309).
  • Step 310 the distance between the barycentric coordinate position G1 of the blob P1 and the barycentric coordinate position G5 of the blob P5 matches, so that it is possible to determine that the coordinate position G1 or G5 is the barycenter of the void 3. It should be noted that, as described above, without determining whether or not the distances match, at the time when the determination YES of step 309 is reached (at the time of detecting the probe P5), it is determined that it is void 3. (Step 310).
  • a loop may be provided to shift from step 310 to step 311 as shown by the broken line F.
  • the size B of the area where the brightness is binarized is smaller than when the entire A is binarized. Moreover, since the brightness 3 is binarized only in the area around the area where the brightness variation is high, the search for the void 3 is performed, and in the search process, blobs showing surface unevenness (dirt) 4 are extracted. Not done. For this reason, arithmetic processing can be performed at high speed.
  • a defect called void 3 is generated on the surface of the IC mold, but the inspection object to be inspected and the type of the defect are arbitrary.
  • the present invention can be applied to the detection of unevenness defects appearing on a wafer chip, unevenness defects appearing on a ceramic substrate, unevenness defects on a circuit pattern, and concave defects appearing on the side surface of a laminated substrate.
  • the thresholds C l and C 2 may be varied according to the type of defect. ,.
  • the present invention is not limited to the detection of defects in electronic components, but can be applied to any inspection object as long as it detects irregular defects.
  • the processing contents of the above-described first to third embodiments may be appropriately stored in a floppy disk, and distributed and distributed to a user or an operator who performs a defect inspection.
  • the storage medium to be distributed and distributed may be a storage medium other than a floppy disk, such as a hard disk, an IC card, or a CD-ROM.
  • hardware that uses the software of the present embodiment and software of the present embodiment are developed for distribution.
  • a development computer containing the software may be communicably connected via a public line or a network, and may be distributed via the network.
  • an installer may be attached and distributed to distribute the software.
  • Data may be distributed and distributed c Industrial availability
  • the present invention is not limited to the detection of defects in electronic components, and detects irregular defects. If applicable, it can be applied to any inspection object.

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)

Abstract

L'invention concerne un appareil et un procédé pour détecter un défaut avec une grande précision tout en distinguant une luminosité irrégulière, qui n'est pas un défaut, d'un défaut réel consistant en un creux ou un relief. La luminosité de chaque pixel d'une image captée est binarisée avec une valeur de seuil prédéterminée, et les défauts en creux et en relief, tels que les vides, ainsi que le manque d'homogénéité sont extraits sous forme de portions où les valeurs de luminosité sont inférieures à cette valeur de seuil prédéterminée. L'ampleur de la variation de la luminosité de chaque pixel de l'image est calculée, binarisée avec une valeur de seuil prédéterminée, et les défauts en creux/en relief, tels que les vides, ainsi que les caractères et les motifs de circuit imprimés sur la surface sont extraits sous forme de variations de luminosité d'un niveau supérieur à cette valeur de seuil prédéterminée. Un défaut en creux/en relief est détecté par localisation d'une région présentant une position de coordonnées communes, parmi les régions extraites à l'aide de ces deux types de valeur de seuil.
PCT/JP1997/001562 1996-05-10 1997-05-09 Appareil et procede de detection de defaut WO1997043623A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8116670A JPH09304292A (ja) 1996-05-10 1996-05-10 欠陥検出装置および方法
JP8/116670 1996-05-10

Publications (1)

Publication Number Publication Date
WO1997043623A1 true WO1997043623A1 (fr) 1997-11-20

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JP (1) JPH09304292A (fr)
WO (1) WO1997043623A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117409001A (zh) * 2023-12-14 2024-01-16 合肥晶合集成电路股份有限公司 一种晶圆键合的气泡分析方法及分析装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4978215B2 (ja) * 2007-01-30 2012-07-18 トヨタ自動車株式会社 加工面欠陥判定方法
JP5358383B2 (ja) * 2009-09-30 2013-12-04 パナソニック デバイスＳｕｎｘ株式会社 変位センサ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133342A (en) * 1981-02-12 1982-08-18 Sanki Denshi Kogyo Kk Detector for contamination
JPS61126437A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 画像処理装置
JPH01175351U (fr) * 1988-05-26 1989-12-13
JPH03295408A (ja) * 1990-04-14 1991-12-26 Matsushita Electric Works Ltd 凹凸面の検査方法およびその装置
JPH05280959A (ja) * 1992-03-30 1993-10-29 Fuji Photo Film Co Ltd 欠陥検査装置
JPH0815172A (ja) * 1994-06-27 1996-01-19 Matsushita Electric Works Ltd 外観検査方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57133342A (en) * 1981-02-12 1982-08-18 Sanki Denshi Kogyo Kk Detector for contamination
JPS61126437A (ja) * 1984-11-26 1986-06-13 Matsushita Electric Works Ltd 画像処理装置
JPH01175351U (fr) * 1988-05-26 1989-12-13
JPH03295408A (ja) * 1990-04-14 1991-12-26 Matsushita Electric Works Ltd 凹凸面の検査方法およびその装置
JPH05280959A (ja) * 1992-03-30 1993-10-29 Fuji Photo Film Co Ltd 欠陥検査装置
JPH0815172A (ja) * 1994-06-27 1996-01-19 Matsushita Electric Works Ltd 外観検査方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117409001A (zh) * 2023-12-14 2024-01-16 合肥晶合集成电路股份有限公司 一种晶圆键合的气泡分析方法及分析装置
CN117409001B (zh) * 2023-12-14 2024-04-05 合肥晶合集成电路股份有限公司 一种晶圆键合的气泡分析方法及分析装置

Also Published As

Publication number Publication date
JPH09304292A (ja) 1997-11-28

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