WO1996031919A1 - Borne de mise a la masse - Google Patents

Borne de mise a la masse Download PDF

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Publication number
WO1996031919A1
WO1996031919A1 PCT/JP1996/000927 JP9600927W WO9631919A1 WO 1996031919 A1 WO1996031919 A1 WO 1996031919A1 JP 9600927 W JP9600927 W JP 9600927W WO 9631919 A1 WO9631919 A1 WO 9631919A1
Authority
WO
WIPO (PCT)
Prior art keywords
ground terminal
contact
terminal according
spring contact
main body
Prior art date
Application number
PCT/JP1996/000927
Other languages
English (en)
Japanese (ja)
Inventor
Izuru Kumagai
Akiyoshi Oshitani
Original Assignee
Thomas & Betts Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=13671890&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO1996031919(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Thomas & Betts Corporation filed Critical Thomas & Betts Corporation
Publication of WO1996031919A1 publication Critical patent/WO1996031919A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/26—Connections in which at least one of the connecting parts has projections which bite into or engage the other connecting part in order to improve the contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail

Definitions

  • the present invention relates to a ground terminal that is effective when a printed circuit board is grounded to a shield plate, a chassis, or the like in order to prevent electromagnetic induction disturbance, high-frequency induction disturbance, and the like.
  • the terminal board portion 10 ′ of the terminal is fixed to a shield plate 40 or the like with double-sided tape 50, and the leaf splits protruding from the board portion are fixed.
  • disclosure of c invention intended type of contacting ring section 2 0, the ground pattern 3 1 of yellowtail down bets circuit board 3 0 are known
  • such a ground terminal may come into contact with a portion other than the ground pattern on the printed circuit board (for example, a pattern provided in a through hole at the time of the ground pattern) unless the board portion is accurately attached to a shield plate or the like. Troubles, such as short-circuiting.
  • the board part of the ground terminal is attached to a shield plate or the like with double-sided tape, for example, even if the mounting position is accurate, the double-sided tape will later shift, causing the same short-circuit accident as described above. there were.
  • the pad area on the printed circuit board side must be made large in consideration of the displacement of the double-sided tape, which is inconvenient in the design of the board.
  • An object of the present invention is to eliminate the above-mentioned disadvantages, and to provide a ground terminal that is compatible with an automatic machine and that is small in size and low in cost.
  • the present invention provides a printed circuit board having a board portion to be attached to a ground pattern, and a spring contact projecting integrally from one side of the board portion to a side facing the board portion. And a first body portion provided integrally with the leading end portion, the leading end portion thereof, and provided so as to face the substrate portion, and the first body portion. And a second body unit integrally connecting the substrate unit and the substrate unit.
  • the grounding terminal of the present invention is soldered to the circuit board side, the grounding effect can be obtained even if it comes into contact with the other side to be grounded, for example, any part of the shield panel. Therefore, it is possible to eliminate the inconvenience that the double-sided tape for fixing the terminals is displaced and the portions other than the ground are dropped to the ground and short-circuited as in the conventional example.
  • the terminal size can be reduced accordingly. Also, in this case, the dimensions of the pattern for attaching the terminals can be made smaller, so that the board design becomes easier.
  • ground terminal of the present invention can be mounted on a circuit board in the same manner as other printed circuit elements, an automatic machine can be used, and therefore, the number of work steps can be reduced without human intervention. Can be reduced.
  • the ground terminal of the present invention since the ground terminal of the present invention has various advantages, it is effective for noise and EMI countermeasures in various electronic devices such as a display using a CRT, TFT, or STN color liquid crystal.
  • FIG. 1 is a perspective view showing a first embodiment of the present invention.
  • FIG. 2 is a perspective view showing a second embodiment of the present invention.
  • FIG. 3 is a perspective view showing a third embodiment of the present invention.
  • FIG. 4 is a perspective view showing a fourth embodiment of the present invention.
  • FIG. 5 is a perspective view showing a fifth embodiment of the present invention.
  • FIG. 6 is a sectional view showing a use state of the second embodiment of the present invention.
  • FIG. 7 is a perspective view showing a sixth embodiment of the present invention.
  • FIG. 8 is a sectional view showing a use state of the sixth embodiment of the present invention
  • FIG. 9 is a sectional view showing a use state of a conventional terminal.
  • FIG. 1 shows a first embodiment of the present invention.
  • the ground terminal includes a substrate 10 and a spring contact 20.
  • the board is attached to the ground pattern 31 (see Fig. 6) of the printed circuit board 30 by soldering.
  • the spring connector projects from one side of the board unit to the side facing the bracket unit. Solder plating is applied to the back surface of the substrate, and a curled portion 21 bent inward is provided at the tip of the spring contact.
  • the spring contact is connected to the distal end portion, the first main body portion 22 which is integrally connected from the distal end portion and is provided to face the substrate portion, and the first body portion 22 which connects the first main body portion and the substrate portion. It consists of 2 main body parts 2 3.
  • FIG. 2 shows a second embodiment of the present invention.
  • the contact edge 24 is provided at an appropriate position.
  • the contact edge is a ridge provided at a boundary between the first and second main bodies of the spring contact. This protrusion is provided so as to cross the spring contact.
  • the other configuration is the same as that of the first embodiment, and the description is omitted.
  • FIG. 3 shows a third embodiment of the present invention.
  • the contact edge 25 is a plurality of protrusions provided apart from each other across the spring contact.
  • the other configuration is the same as that of the first embodiment, and the description is omitted.
  • FIG. 4 shows a fourth embodiment of the present invention.
  • the contact edge 26 is a plurality of protrusions provided apart from each other in a direction crossing the spring contact.
  • the other configuration is the same as that of the first embodiment, and the description is omitted.
  • FIG. 5 shows a fifth embodiment of the present invention.
  • a notch 27 is provided in the substrate part of the spring contact to ensure soldering similarly to the through hole 11.
  • grounding terminal having any one of the above structures may be connected to form a grounding terminal in a direction crossing the spring contact.
  • FIG. 6 illustrates an actual use state of the ground terminal according to the second embodiment of the present invention.
  • the board portion of the ground terminal is fixed on the ground pattern 31 of the printed circuit board 30 by soldering.
  • a plurality of ground terminals of the present invention are mounted on a tape, and the first main body of the springing contact is vacuum-adsorbed by an automatic machine, and is carried to a predetermined position on a printed circuit board. Therefore, the terminals are placed on the circuit board with the soldered back of the board facing down by releasing the suction. Next, the terminals are soldered on the circuit board in the same manner as the other circuit elements on the printed circuit board by passing the circuit board through a solder bath.
  • this ground terminal is brought into contact with a shield panel 40 (for example, a chassis, a frame, or the like) for grounding the ground pattern 31 of the circuit board (see the position of the broken line in the drawing).
  • a shield panel 40 for example, a chassis, a frame, or the like
  • the shield panel is moved downward in the figure. This operation is considered, for example, when the circuit board is housed via the ground terminal in a case in which the shield panel is mounted inside.
  • the ground terminal is retracted, and the springing contact pivots about a side which is a boundary between the second main body and the substrate (the counterclockwise rotation in the figure).
  • the first part of the spring contact is bent further inward at the contact edge as shown in the drawing, and becomes a state shown by a solid line in the drawing.
  • the ground terminal according to the present embodiment is provided with a plate-like portion 28 bent inward from the first main body at the tip of the spring contact.
  • the plate-like portion has a smaller width than the first main body.
  • FIG. 8 shows an actual use state of the ground terminal according to the sixth embodiment of the present invention.
  • the ground terminal according to the present embodiment is brought into contact with the shield panel 40 (or chassis, frame, etc.).
  • the shield panel 40 or chassis, frame, etc.
  • there are three parts that act as springs the plate part of the terminal part, the first and second body parts, and the contact pressure can be increased.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

L'invention concerne une borne de mise à la masse comprenant une base à fixer à un motif servant de masse sur un substrat de circuit imprimé et un contact à ressort faisant saillie sur un côté de la base et opposé à celle-ci. Le contact à ressort comprend une extrémité distale, un premier corps principal opposé à la base et un second corps principal servant à connecter le premier corps principal à la base. Cette borne est utile quand le substrat de circuit imprimé est mis à la masse sur une plaque de blindage ou sur un châssis pour empêcher les interférences électromagnétiques.
PCT/JP1996/000927 1995-04-04 1996-04-04 Borne de mise a la masse WO1996031919A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP07879895A JP3192570B2 (ja) 1995-04-04 1995-04-04 アース用端子
JP7/78798 1995-04-04

Publications (1)

Publication Number Publication Date
WO1996031919A1 true WO1996031919A1 (fr) 1996-10-10

Family

ID=13671890

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1996/000927 WO1996031919A1 (fr) 1995-04-04 1996-04-04 Borne de mise a la masse

Country Status (2)

Country Link
JP (1) JP3192570B2 (fr)
WO (1) WO1996031919A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014774A2 (fr) * 1998-12-25 2000-06-28 Thomas & Betts International, Inc. Contact de mise à la masse
GB2371419A (en) * 2001-01-19 2002-07-24 Nec Corp Elastic ground connecting member for substrate or circuit board
FR2828020A1 (fr) * 2001-07-30 2003-01-31 Cinch Connecteurs Sa Organe de contact electrique
JP2016021331A (ja) * 2014-07-15 2016-02-04 竹内工業株式会社 表面実装コンタクト
EP3319178A1 (fr) * 2016-11-04 2018-05-09 Miele & Cie. KG Appareil ménager et module pour appareil ménager
EP3226355B1 (fr) * 2016-03-30 2020-05-27 Kitagawa Industries Co., Ltd. Contact

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3515479B2 (ja) 2000-04-05 2004-04-05 北川工業株式会社 導電部材及びその製造方法
JP2009211875A (ja) * 2008-03-03 2009-09-17 Kitagawa Ind Co Ltd 弾性コンタクト
KR100989547B1 (ko) * 2008-05-19 2010-10-25 박진우 안테나 접속장치
JP5246806B2 (ja) 2009-11-16 2013-07-24 北川工業株式会社 コンタクト
JP2012094530A (ja) * 2011-12-19 2012-05-17 Kitagawa Ind Co Ltd 弾性コンタクト
JP6500258B2 (ja) 2015-06-12 2019-04-17 北川工業株式会社 接触部材

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56139265U (fr) * 1980-03-19 1981-10-21
JPS61142483U (fr) * 1985-02-22 1986-09-03
JPS6230399U (fr) * 1985-08-07 1987-02-24
JPS6254472U (fr) * 1985-09-26 1987-04-04
JPS62184800U (fr) * 1986-05-15 1987-11-24
JPS6389673U (fr) * 1986-11-28 1988-06-10
JPS63191575U (fr) * 1987-05-28 1988-12-09
JPS6438767U (fr) * 1987-09-03 1989-03-08

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56139265U (fr) * 1980-03-19 1981-10-21
JPS61142483U (fr) * 1985-02-22 1986-09-03
JPS6230399U (fr) * 1985-08-07 1987-02-24
JPS6254472U (fr) * 1985-09-26 1987-04-04
JPS62184800U (fr) * 1986-05-15 1987-11-24
JPS6389673U (fr) * 1986-11-28 1988-06-10
JPS63191575U (fr) * 1987-05-28 1988-12-09
JPS6438767U (fr) * 1987-09-03 1989-03-08

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014774A2 (fr) * 1998-12-25 2000-06-28 Thomas & Betts International, Inc. Contact de mise à la masse
EP1014774A3 (fr) * 1998-12-25 2001-03-14 Thomas & Betts International, Inc. Contact de mise à la masse
US6555742B2 (en) 1998-12-25 2003-04-29 Tyco Electronics Logistics Ag Earth ground terminal
GB2371419A (en) * 2001-01-19 2002-07-24 Nec Corp Elastic ground connecting member for substrate or circuit board
GB2371419B (en) * 2001-01-19 2003-06-11 Nec Corp Ground-connection structure ground-connecting member and ground-connection method
US6916187B2 (en) 2001-01-19 2005-07-12 Nec Corporation Ground connection structure, ground connecting member and ground connection method
FR2828020A1 (fr) * 2001-07-30 2003-01-31 Cinch Connecteurs Sa Organe de contact electrique
JP2016021331A (ja) * 2014-07-15 2016-02-04 竹内工業株式会社 表面実装コンタクト
EP3226355B1 (fr) * 2016-03-30 2020-05-27 Kitagawa Industries Co., Ltd. Contact
EP3319178A1 (fr) * 2016-11-04 2018-05-09 Miele & Cie. KG Appareil ménager et module pour appareil ménager

Also Published As

Publication number Publication date
JPH08287980A (ja) 1996-11-01
JP3192570B2 (ja) 2001-07-30

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