WO1996030942A1 - Components for housing an integrated circuit device - Google Patents
Components for housing an integrated circuit device Download PDFInfo
- Publication number
- WO1996030942A1 WO1996030942A1 PCT/US1996/003258 US9603258W WO9630942A1 WO 1996030942 A1 WO1996030942 A1 WO 1996030942A1 US 9603258 W US9603258 W US 9603258W WO 9630942 A1 WO9630942 A1 WO 9630942A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- circuit traces
- package
- metallic substrate
- integrated circuit
- Prior art date
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Definitions
- Microelectronic devices are typically manufactured from a semiconductor material such as silicon, germanium or gallium/arsenide.
- the semiconductor material is fashioned into a die, a generally rectangular structure having circuitry formed on one surface. Along the periphery of that electrically active surface are input/output pads to facilitate electrical interconnection to external circuitry.
- the sealing glass 98 bonds to a peripheral surface 100 of the cover component 96 and to the mid-portion 84 of the first plurality of conductive circuit traces 26, as well as to the dielectric layer 94, if present or else to the substrate 92 if the substrate 92 is non- conductive.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8529426A JPH11503565A (ja) | 1995-03-29 | 1996-03-11 | 集積回路装置を収容するための部品 |
AU53604/96A AU5360496A (en) | 1995-03-29 | 1996-03-11 | Components for housing an integrated circuit device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41314995A | 1995-03-29 | 1995-03-29 | |
US08/413,149 | 1995-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1996030942A1 true WO1996030942A1 (en) | 1996-10-03 |
Family
ID=23636049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1996/003258 WO1996030942A1 (en) | 1995-03-29 | 1996-03-11 | Components for housing an integrated circuit device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH11503565A (ja) |
AU (1) | AU5360496A (ja) |
TW (1) | TW309654B (ja) |
WO (1) | WO1996030942A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6946728B2 (en) | 2004-02-19 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | System and methods for hermetic sealing of post media-filled MEMS package |
EP1630864A3 (en) * | 2004-08-23 | 2008-02-13 | Tecnisco Ltd. | Substrate with many via contact means disposed therein |
CN104952741A (zh) * | 2014-03-27 | 2015-09-30 | 英特尔公司 | 柔性基板上的电气电路 |
WO2016061306A1 (en) * | 2014-10-17 | 2016-04-21 | Rsm Electron Power, Inc. | Low cost high strength surface mount package |
CN111295748A (zh) * | 2017-10-05 | 2020-06-16 | 德州仪器公司 | 半导体装置中的引线框 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005002335A (ja) * | 2003-05-21 | 2005-01-06 | Japan Gore Tex Inc | 接着フィルムおよびこれを使った半導体装置 |
US7886437B2 (en) * | 2007-05-25 | 2011-02-15 | Electro Scientific Industries, Inc. | Process for forming an isolated electrically conductive contact through a metal package |
JP2010245337A (ja) * | 2009-04-07 | 2010-10-28 | Elpida Memory Inc | 半導体装置及びその製造方法 |
KR101381438B1 (ko) * | 2010-04-30 | 2014-04-04 | 유보틱 인텔릭츄얼 프라퍼티 컴퍼니 리미티드 | 인쇄회로기판에 전기적으로 결합되도록 구성된 에어 캐비티 패키지 및 상기 에어 캐비티 패키지의 제공 방법 |
JP5987222B2 (ja) * | 2011-09-30 | 2016-09-07 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136348A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | 半導体装置 |
US4806503A (en) * | 1985-10-25 | 1989-02-21 | Sharp Kabushiki Kaisha | Method for the replacement of semiconductor devices |
US4888449A (en) * | 1988-01-04 | 1989-12-19 | Olin Corporation | Semiconductor package |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
JPH0260149A (ja) * | 1988-08-26 | 1990-02-28 | Matsushita Electric Works Ltd | 半導体パッケージ |
US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
US4968552A (en) * | 1989-10-13 | 1990-11-06 | International Business Machines Corp. | Versatile reactive ion etch barriers from polyamic acid salts |
JPH04216655A (ja) * | 1990-12-18 | 1992-08-06 | Nec Kyushu Ltd | 半導体装置 |
US5352926A (en) * | 1993-01-04 | 1994-10-04 | Motorola, Inc. | Flip chip package and method of making |
-
1996
- 1996-02-27 TW TW085102238A patent/TW309654B/zh active
- 1996-03-11 WO PCT/US1996/003258 patent/WO1996030942A1/en active Application Filing
- 1996-03-11 AU AU53604/96A patent/AU5360496A/en not_active Abandoned
- 1996-03-11 JP JP8529426A patent/JPH11503565A/ja active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60136348A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Ltd | 半導体装置 |
US4806503A (en) * | 1985-10-25 | 1989-02-21 | Sharp Kabushiki Kaisha | Method for the replacement of semiconductor devices |
US4888449A (en) * | 1988-01-04 | 1989-12-19 | Olin Corporation | Semiconductor package |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
JPH0260149A (ja) * | 1988-08-26 | 1990-02-28 | Matsushita Electric Works Ltd | 半導体パッケージ |
US4939316A (en) * | 1988-10-05 | 1990-07-03 | Olin Corporation | Aluminum alloy semiconductor packages |
US4968552A (en) * | 1989-10-13 | 1990-11-06 | International Business Machines Corp. | Versatile reactive ion etch barriers from polyamic acid salts |
JPH04216655A (ja) * | 1990-12-18 | 1992-08-06 | Nec Kyushu Ltd | 半導体装置 |
US5352926A (en) * | 1993-01-04 | 1994-10-04 | Motorola, Inc. | Flip chip package and method of making |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6946728B2 (en) | 2004-02-19 | 2005-09-20 | Hewlett-Packard Development Company, L.P. | System and methods for hermetic sealing of post media-filled MEMS package |
US7534662B2 (en) | 2004-02-19 | 2009-05-19 | Hewlett-Packard Development Company, L.P. | Methods for hermetic sealing of post media-filled MEMS package |
EP1630864A3 (en) * | 2004-08-23 | 2008-02-13 | Tecnisco Ltd. | Substrate with many via contact means disposed therein |
CN104952741A (zh) * | 2014-03-27 | 2015-09-30 | 英特尔公司 | 柔性基板上的电气电路 |
US9930793B2 (en) | 2014-03-27 | 2018-03-27 | Intel Corporation | Electric circuit on flexible substrate |
WO2016061306A1 (en) * | 2014-10-17 | 2016-04-21 | Rsm Electron Power, Inc. | Low cost high strength surface mount package |
US9392713B2 (en) | 2014-10-17 | 2016-07-12 | Rsm Electron Power, Inc. | Low cost high strength surface mount package |
CN111295748A (zh) * | 2017-10-05 | 2020-06-16 | 德州仪器公司 | 半导体装置中的引线框 |
Also Published As
Publication number | Publication date |
---|---|
AU5360496A (en) | 1996-10-16 |
TW309654B (ja) | 1997-07-01 |
JPH11503565A (ja) | 1999-03-26 |
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