WO1994029901A1 - Dispositif de fixation pour elements semi-conducteurs de circuit - Google Patents

Dispositif de fixation pour elements semi-conducteurs de circuit Download PDF

Info

Publication number
WO1994029901A1
WO1994029901A1 PCT/CH1994/000076 CH9400076W WO9429901A1 WO 1994029901 A1 WO1994029901 A1 WO 1994029901A1 CH 9400076 W CH9400076 W CH 9400076W WO 9429901 A1 WO9429901 A1 WO 9429901A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
spring
web
base plate
plate
Prior art date
Application number
PCT/CH1994/000076
Other languages
German (de)
English (en)
Inventor
Hans Ludwig Bosli
Original Assignee
Melcher Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Melcher Ag filed Critical Melcher Ag
Priority to US08/379,666 priority Critical patent/US5648889A/en
Priority to DE59406013T priority patent/DE59406013D1/de
Priority to EP94911819A priority patent/EP0654176B1/fr
Publication of WO1994029901A1 publication Critical patent/WO1994029901A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a device for fastening semiconductor control and switching elements, such as transistors, thyristors, triacs and others, which is designed to dissipate the heat loss, according to the preamble of patent claim 1.
  • Such devices are known per se. They consist, for example, of heat sinks of various designs, on which the semiconductor control and switching elements (henceforth referred to as semiconductors) are often fastened by means of screws, for which many such semiconductors have a fastening hole in their housing itself or in a cooling vane projecting therefrom.
  • semiconductors semiconductor control and switching elements
  • Devices which consist of a spring body with which the semiconductor to be fastened is pressed against the heat sink.
  • the spring body is attached to the heat sink, for example, by snapping it into suitable holes.
  • the known devices have properties which have disadvantages if the available height of the electronic components which are generally mounted on a printed circuit board is limited. This is often the case because the extensive standardization of component carriers, plug strips and the associated spacing in electronic devices means that the lateral distances between the printed circuit boards can only be selected within a fixed grid. Furthermore, there is an almost imperative wish from an economic point of view to arrange the printed circuit boards as close to one another as is possible to dissipate the heat loss.
  • Fastening devices are known which are designed as springs. Although these meet some requirements in terms of simplicity Installation and securing of the thermal contact, however, are generally only suitable for a certain type of semiconductor housing and are also of high construction and take up a relatively large amount of space on the circuit board.
  • the object that is to be achieved with the present invention is to provide a device for reliably fastening semiconductors with the required contact pressure, which provides good thermal contact between the semiconductor and the heat sink at a low overall height, can be used for a large number of housing types and is the simplest Installation permitted while complying with all necessary insulation requirements. Furthermore, the flow of the force required for pressing should not stress the circuit board.
  • FIG. 1c shows a detail of the first exemplary embodiment
  • FIG. 2 shows a further embodiment of a heat sink according to the invention
  • FIGS. La, b shows a first variant of FIGS. La, b,
  • Fig. 6 shows a second embodiment.
  • FIG. 1 a shows the side view of a fastening device according to the invention in the direction of the plane of a printed circuit board 1, which is shown in section; 1b shows the same device seen from above on the printed circuit board.
  • a heat sink 2 with an approximately T-shaped cross-section is attached with two screws 9 and has a web 14.
  • the heat sink 2 has two threaded holes 11 in the web 14.
  • This base plate 6 has two holes 10 which are aligned with the threaded holes 11. If the heat sink 2 is then tightened with the screws 9 on the circuit board 1, the base plate 6 is also fastened.
  • the base plate 6 On the two narrow sides, the base plate 6 has a tongue 12 angled against the printed circuit board 1. In FIG. 1c it is clear that the tongues 12 each protrude into a hole 13 in the printed circuit board 1. With the aid of these holes 13, the spring body 15 is positioned exactly.
  • the base plate 6 of the spring body 15 also has two lateral spring tongues 7, which due to their bending and pretensioning are able to press a semiconductor 3, 4 against the heat sink 2.
  • an insulating part for example a plate 8 made of aluminum oxide or an electrically insulating but good heat-conducting film, is inserted between the semiconductors 3, 4 and the heat sink 2.
  • Fig. 1b shows the situation from the circuit board 1 - with respect to the representation of Fig la - seen upwards;
  • Fig. Lc is a detail, again in section, with respect to Fig. La seen from the left.
  • the number 5 denotes the electrical connections of the semiconductors 3, 4.
  • La, b, c show two very differently sized semiconductors, for example the housing types TO 126 and TO 218.
  • the shape of the cooling body 2 shown here has the advantage that the heat flows from the semiconductors 3, 4 over a wide area over a short discharge path directly onto the cooling body 2 or its transverse plate 16, without the web 14 - and thus the printed circuit board 1 - to charge. The heat is then also dissipated over a wide area from the entire surface of the cross plate 16.
  • FIG. 2 shows a second embodiment of the heat sink 2.
  • the transverse plate 16 from FIG. 1 a which has just been formed, there is a rib plate 17 with a plurality of cooling fins 18.
  • This embodiment of the heat sink 2 is particularly advantageous for semiconductors on free-standing printed circuit boards , while the embodiment according to FIG. 1 a is particularly suitable where the circuit board 1 with the switching elements thereon is additionally installed in a housing, or a cover or heat dissipation plate is mounted on a plurality of heat sinks according to the invention. Then the just formed cross plate 16 can be in thermal contact with the mentioned housing or the cover plate, whereby effective heat dissipation to the ambient air is made possible.
  • the heat sink 2 is so large that four semiconductors 3, 4 can be placed on it.
  • the spring body 15 has four spring tongues 7, each of which presses a semiconductor 3, 4 against an insulating plate 8 and thus against the underside of the cross plate 16 or the rib plate 17.
  • the semiconductors 3, 4 shown are only to be understood as examples; all semiconductors that have just been designed can take their place.
  • the number of electrical connections 5 has no significance essential to the invention.
  • the number of holes 10 is increased to four. This number is only to be understood as an example; the dimensions of the fastening device may make five holes necessary or only two of them may appear sufficient.
  • FIG. 4 is a representation of a further variant of FIG. 1: here six semiconductors are mounted on the same - correspondingly lengthened - heat sink 2. Accordingly, the number of spring tongues 7 on the spring body 15 is increased to six. The other design features remain the same as in Fig. 3.
  • FIGS. 5a, b show a further embodiment of the fastening device according to the invention.
  • the cross plate 16 has a blind bore 19 above the web 14.
  • the temperature of the heat sink 2 can thus be continuously monitored electrically.
  • a rib plate 17 according to FIG. 2 can also take the place of a transverse plate 16; it is also possible to provide such a temperature sensor 21 at each end of a transverse plate 16 or fin plate 17, especially if these parts have the dimensions shown in FIG. 3. This enables the monitoring of possibly unequal pleasure performances of semiconductors 3, 4.
  • FIGS. 5.a, b The design of the web 14 in FIGS. 5.a, b is slightly different from that in FIG. 1: it is widened in a foot-like manner towards the printed circuit board, or is slimmer towards the transverse plate 16 or the ribbed plate 17. This increases the lateral insulation distance of the semiconductors 3, 4 to the web 14, and the heat flow to the printed circuit board 1 can also be reduced.
  • the distance between the transverse plate 16 and the printed circuit board 1 can be designed differently either by means of webs 14 of different heights, or by inserting spacers (not shown) between the printed circuit board 1 and the foot of the web 14. This allows the space between the halves conductors 3, 4 and the circuit board 1 can be used without restriction for conductor tracks and, if there is sufficient distance, also for electronic components.
  • 6 shows a further exemplary embodiment of the fastening device according to the invention.
  • the heat sink 2 is not T-shaped, but only one-sided. This one-sided design can still have space for several semiconductors.
  • the spring body 15 is provided on the side facing away from the spring tongue 7 with a spring spur 25 which engages at the point where the web 14 opens into the transverse plate 16.
  • This can cause the spring tongue 7 to have the same spring characteristic as in the aforementioned exemplary embodiments.
  • the design of the spring tongue 7 as essentially trapezoidal is not essential to the invention per se; Spring tongues 7 with a different shape and deflection characteristics are also included in the inventive concept.
  • the part of the spring tongue 7 which presses on the semiconductor 3, 4 can be designed differently, for example in such a way that the force is distributed over the area, instead of acting linearly on the semiconductor 3, 4 to be fastened.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif qui comprend un refroidisseur (2) sensiblement en forme de T, divisé en une barrette (14) et en une plaque transversale (16), qui est fixé à l'aide de vis (9) sur une carte de circuits (1). La plaque de base (6) d'un élément faisant ressort (15) est insérée entre la barrette (14) du refroidisseur (2) et la carte de circuits (1), et comporte de chaque côté au moins une lame de ressort (7). La barrette (14) comporte des trous taraudés (11) qui sont en alignement avec des trous pratiqués dans la carte de circuits (6). Afin d'obtenir un positionnement précis de la plaque de base (6), cette dernière comporte à chaque extrémité une lame (12) pliée en U qui est emboîtée dans un trou correspondant de la carte de circuits (1). Les semi-conducteurs (3, 4) à fixer, qui sont brasés à des connexions (5) électriques, sont pressés contre la surface de la plaque transversale (16), située côté carte de circuits, par les lames de ressort (7). Selon la position du potentiel des semi-conducteurs (3, 4), ou la structure du boîtier, une plaquette (8) isolante est insérée entre le semi-conducteur (3, 4) et la plaque transversale (16).
PCT/CH1994/000076 1993-06-07 1994-04-18 Dispositif de fixation pour elements semi-conducteurs de circuit WO1994029901A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US08/379,666 US5648889A (en) 1993-06-07 1994-04-18 Attachment device for semiconductor circuit elements
DE59406013T DE59406013D1 (de) 1993-06-07 1994-04-18 Befestigungsvorrichtung für halbleiter-schaltelemente
EP94911819A EP0654176B1 (fr) 1993-06-07 1994-04-18 Dispositif de fixation pour elements semi-conducteurs de circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH1698/93-1 1993-06-07
CH169893 1993-06-07

Publications (1)

Publication Number Publication Date
WO1994029901A1 true WO1994029901A1 (fr) 1994-12-22

Family

ID=4216514

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CH1994/000076 WO1994029901A1 (fr) 1993-06-07 1994-04-18 Dispositif de fixation pour elements semi-conducteurs de circuit

Country Status (4)

Country Link
US (1) US5648889A (fr)
EP (1) EP0654176B1 (fr)
DE (1) DE59406013D1 (fr)
WO (1) WO1994029901A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
EP1976358A2 (fr) 2007-03-28 2008-10-01 IXYS Semiconductor GmbH Agencement d'au moins un module semi-conducteur de puissance et une plaque conductrice
FR2931523A1 (fr) * 2008-05-21 2009-11-27 Fagorbrandt Sas Dispositif de fixation de composants et appareil electromenager associe
EP2172971A3 (fr) * 2008-10-01 2010-05-19 Siemens AG Österreich Système de refroidissement
WO2012113584A1 (fr) * 2011-02-22 2012-08-30 Infineon Technologies Bipolar Gmbh & Co. Kg Module à semi-conducteur de puissance
DE102021206934A1 (de) 2021-07-01 2021-11-11 Vitesco Technologies GmbH Leistungshalbleiterbauteil

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US5903434A (en) * 1997-06-10 1999-05-11 Chiou; Ming Chin CPU heat sink clamping device
US6049459A (en) * 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
DE19830576A1 (de) * 1998-07-08 2000-01-13 Iro Patent Ag Baar Fadenbearbeitungssystem
US6088226A (en) * 1999-03-31 2000-07-11 Lucent Technologies, Inc. Multiple-component clamp and related method for attaching multiple heat-generating components to a heatsink
JP2001051163A (ja) 1999-08-05 2001-02-23 Yazaki Corp 光コネクタの固定構造
DE10206271A1 (de) * 2002-02-15 2003-08-28 Conti Temic Microelectronic Wärmeableitvorrichtung
DE10246577A1 (de) * 2002-10-05 2004-04-15 Hella Kg Hueck & Co. Leiterplatte mit Metallgehäuse
EP1333492B1 (fr) * 2002-11-08 2006-03-01 Agilent Technologies Inc. a Delaware Corporation Dissipation de chaleur d'une puce à micro-circuits sur un panneau à circuit
JP2004348650A (ja) * 2003-05-26 2004-12-09 Toshiba Corp 電子機器
JP4387777B2 (ja) * 2003-11-28 2009-12-24 株式会社東芝 電子機器
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JP4334592B2 (ja) 2004-04-19 2009-09-30 リッタル ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディトゲゼルシャフト 電子的なコンポーネントのための組付けプレート
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JP4234635B2 (ja) * 2004-04-28 2009-03-04 株式会社東芝 電子機器
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
JP2005317796A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置および電子機器
JP2005315156A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプおよびポンプを備える電子機器
JP4343032B2 (ja) * 2004-05-31 2009-10-14 株式会社東芝 冷却構造および投射型画像表示装置
JP2005344562A (ja) * 2004-06-01 2005-12-15 Toshiba Corp ポンプ、冷却装置および冷却装置を有する電子機器
US7518872B2 (en) * 2004-06-30 2009-04-14 Intel Corporation Attaching heat sinks to printed circuit boards using preloaded spring assemblies
DE102005013762C5 (de) * 2005-03-22 2012-12-20 Sew-Eurodrive Gmbh & Co. Kg Elektronisches Gerät und Verfahren zur Bestimmung der Temperatur eines Leistungshalbleiters
DE102005047547B4 (de) * 2005-09-30 2008-02-14 Siemens Ag Andrückkonzept für ein Substrat eines Leistungsmoduls und Leistungsmodul
US20070097648A1 (en) * 2005-11-01 2007-05-03 Kevin Xu Method and apparatus for establishing optimal thermal contact between opposing surfaces
CN101305460A (zh) * 2005-11-11 2008-11-12 艾利森电话股份有限公司 冷却组件
US7388747B2 (en) * 2006-04-07 2008-06-17 Inventec Corporation Heat plate fixing structure
DE102006062711B4 (de) * 2006-06-09 2008-10-09 Fpe Fischer Gmbh Verfahren zur Überwachung und zum Schutz von einzelnen Solar-Panels vor Überhitzung
US8120171B2 (en) * 2007-12-26 2012-02-21 Keihin Corporation Power drive unit including a heat sink and a fastener
KR101065902B1 (ko) * 2009-07-10 2011-09-20 삼성에스디아이 주식회사 이차 전지
DE102009047703A1 (de) * 2009-12-09 2011-06-16 Robert Bosch Gmbh Befestigungsanordnung für leiterplattenmontierte Bauteile mit verbessertem Kühlkonzept
EP2458632B1 (fr) * 2010-11-24 2013-07-31 Gefran S.p.A. Module de dissipateur pour dispositifs de semi-conducteurs électroniques
JP5647912B2 (ja) * 2011-02-02 2015-01-07 新電元工業株式会社 電子回路装置及びその製造方法
JP2012182224A (ja) * 2011-02-28 2012-09-20 Tdk Corp 電子部品の固定用ばね具及び放熱構造体
KR101228841B1 (ko) * 2011-10-04 2013-02-04 엘에스산전 주식회사 일체형 탄성클립을 이용한 전력용반도체 고정장치
WO2015037047A1 (fr) 2013-09-10 2015-03-19 三菱電機株式会社 Dispositif à semi-conducteur et module à semi-conducteur
EP2927954B1 (fr) * 2014-04-02 2021-06-09 Brusa Elektronik AG Système de fixation pour un module de puissance
JP6898162B2 (ja) 2017-06-23 2021-07-07 矢崎総業株式会社 電子部品の固定構造
CN109428497B (zh) * 2017-08-23 2020-09-18 台达电子企业管理（上海）有限公司 电源模块的组装结构及其组装方法
DE102017126716B4 (de) * 2017-11-14 2021-07-22 Semikron Elektronik Gmbh & Co. Kg Anordnung mit einem Leistungshalbleitermodul mit einer Schalteinrichtung
EP3629687A1 (fr) * 2018-09-26 2020-04-01 Siemens Aktiengesellschaft Procédé permettant un montage d'un appareil électrique
JP6872085B6 (ja) * 2018-10-04 2021-06-23 パナソニック インテレクチュアル プロパティ コーポレーション オブ アメリカＰａｎａｓｏｎｉｃ Ｉｎｔｅｌｌｅｃｔｕａｌ Ｐｒｏｐｅｒｔｙ Ｃｏｒｐｏｒａｔｉｏｎ ｏｆ Ａｍｅｒｉｃａ 機器制御装置及び機器制御方法
US11063495B2 (en) * 2019-07-01 2021-07-13 Nidec Motor Corporation Heatsink clamp for multiple electronic components
CN113497015A (zh) * 2020-04-01 2021-10-12 阿特拉斯·科普柯(无锡)压缩机有限公司 功率模块
EP4128499A4 (fr) * 2020-04-01 2024-05-29 Atlas Copco (Wuxi) Compressor Co., Ltd. Bloc d'alimentation
FR3143846A1 (fr) * 2022-12-19 2024-06-21 Valeo Eautomotive France Sas Équipement électrique

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6035523A (en) * 1995-06-16 2000-03-14 Apple Computer, Inc. Method and apparatus for supporting a component on a substrate
DE10064194B4 (de) * 2000-12-22 2006-12-07 Infineon Technologies Ag Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls
EP1976358A2 (fr) 2007-03-28 2008-10-01 IXYS Semiconductor GmbH Agencement d'au moins un module semi-conducteur de puissance et une plaque conductrice
DE102007014789B3 (de) * 2007-03-28 2008-11-06 Ixys Ch Gmbh Anordnung mindestens eines Leistungshalbleitermoduls und einer Leiterplatte und Leistungshalbleitermodul
US7780469B2 (en) 2007-03-28 2010-08-24 Ixys Ch Gmbh Arrangement of at least one power semiconductor module and a printed circuit board
FR2931523A1 (fr) * 2008-05-21 2009-11-27 Fagorbrandt Sas Dispositif de fixation de composants et appareil electromenager associe
EP2172971A3 (fr) * 2008-10-01 2010-05-19 Siemens AG Österreich Système de refroidissement
WO2012113584A1 (fr) * 2011-02-22 2012-08-30 Infineon Technologies Bipolar Gmbh & Co. Kg Module à semi-conducteur de puissance
DE102021206934A1 (de) 2021-07-01 2021-11-11 Vitesco Technologies GmbH Leistungshalbleiterbauteil

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EP0654176B1 (fr) 1998-05-20
EP0654176A1 (fr) 1995-05-24
US5648889A (en) 1997-07-15
DE59406013D1 (de) 1998-06-25

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