WO1993001702A1 - Dispositif de pliage - Google Patents
Dispositif de pliage Download PDFInfo
- Publication number
- WO1993001702A1 WO1993001702A1 PCT/EP1992/001492 EP9201492W WO9301702A1 WO 1993001702 A1 WO1993001702 A1 WO 1993001702A1 EP 9201492 W EP9201492 W EP 9201492W WO 9301702 A1 WO9301702 A1 WO 9301702A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- bending
- bending tool
- leads
- tool
- movement
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0092—Treatment of the terminal leads as a separate operation
Definitions
- the invention relates to a device for bending through two angles of roughly 90° the leads of a lead frame for carrying an encapsulated chip, comprising a cavity formed by mould halves movable relative to one* another for clampingly receiving a lead frame, a bending tool movable in the direction of the leads, means for driving and guiding the bending tool and a support mould for supporting bent leads.
- the leads for bending are usually tin coated. Care has to be taken that the tin layer is not damaged during bending.
- the bending tool is guided such that a movement is performed approximately perpendicular to the lead for bending.
- the bending tool was guided such that the direction of movement of the bending tool was directed at an oblique angle relative to the leads for bending.
- the bending tool performs a pivoting movement around a shaft roughly transversely of the direction of movement, wherein the guide path is formed by a curved stop surface of a guide block which co-acts with a curved end portion of the bending tool.
- a different movement contour can be selected by exchanging the bending tool and/or the guide block. This is of importance in the case for instance of wear.
- Fig. 1 shows a lengthwise section through a bending device according to the invention
- fig. 2 shows schematically the path of movement followed by the bending tool
- fig. 3 is a perspective view of the bending tool from the bending device according to fig. l.
- the bending device 1 comprises a base plate 2 on which is mounted a table 3.
- the latter serves to support the lead frame for machining.
- the device 1 is intended as a manual operation device for use in for instance the manufacture of pilot series on laboratory and development scale.
- Recessed into the table 3 is a cavity 4 in which can be placed a chip already encapsulated with plastic.
- the cavity is bounded at the top by a vertically movable upper mould 5 connecting onto table 3.
- the table 3 can be moved as according to arrow PI by means of operating a pull rod 6.
- a lead frame In the pulled out position a lead frame can be placed, taken out or have its position changed. This is carried out manually.
- the table has on the underside a flange-like edge 7 received slidably in the guide member 8.
- a similar flange ⁇ like edge and guide member are arranged on the opposite side.
- the upper mould half 5 is driven from the motor 20.
- a resetting spring 9 is placed round the drive shaft 8.
- the leads of a lead frame placed in the cavity 4 are bent in the desired manner by the bending tool 10.
- a pivoting movement round the rotating shaft ' 11 is performed as well as a vertical movement.
- the movement of the bending tool is guided by the co-acting contour surfaces 12 on a guide block 13 and the contour line 14 of the bending tool.
- the contour lines are chosen such that the point of engagement 15 of the bending tool on the leads for bending does not change during the displacement along the path 16. No shear forces are therefore exerted on the lead 17 so that the tin layer present on the lead is not damaged.
- the lead 17 is bent in accordance with the shape 18 in the table 3. Attention is drawn to the fact that the bending tool 10 has the form shown in fig. 2.
- the bending tool is biased in horizontal direction of the spring 19. During the pivoting movement round the shaft 10 the bending tool moves counter to the spring tensioning 19. Per bending stroke all leads on one side of the frame are bent. After the bending stroke has been performed the upper mould 5 is raised, the pull rod 6 operated and the lead frame turned (manually) through 90° for bending of the leads on one of the other sides.
- clamping of the lead frame using the clamping block 20 and bending by means of the bending tool 10 takes place in one stroke. After clamping, the bending tool 10 moves further counter to the spring tensioning.
- the bending tool is arranged exchangeably so that the device according to the invention can easily be adapted to other dimensions, bending angles and the like, which is a great advantage for the production of pilot series on smaller scale.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Bending Of Plates, Rods, And Pipes (AREA)
- Wire Processing (AREA)
Abstract
Dispositif de pliage servant à serrer et à plier les connexions d'une grille de connexions portant une puce enrobée de matière plastique. Le pliage s'effectue à l'aide d'un outil de pliage guidé de telle sorte que, pendant le pliage, aucun déplacement relatif du point de contact entre l'outil de pliage et les connexions à plier ne se produise. Ainsi, on évite d'abîmer la couche d'étain recouvrant les connexions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE9100638A BE1005064A4 (nl) | 1991-07-03 | 1991-07-03 | Buiginrichting. |
BE9100638 | 1991-07-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1993001702A1 true WO1993001702A1 (fr) | 1993-01-21 |
Family
ID=3885598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1992/001492 WO1993001702A1 (fr) | 1991-07-03 | 1992-07-02 | Dispositif de pliage |
Country Status (2)
Country | Link |
---|---|
BE (1) | BE1005064A4 (fr) |
WO (1) | WO1993001702A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2277702A (en) * | 1993-04-14 | 1994-11-09 | Advanced Systems Automation Pt | A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam |
US9949983B2 (en) | 2013-10-18 | 2018-04-24 | Psyadon Pharmaceuticals, Inc. | Fused benzazepines for treatment of stuttering |
EP3919060A1 (fr) | 2012-07-12 | 2021-12-08 | Emalex Biosciences, Inc. | Ecopipam pour le traitement du syndrome de tourettes |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952858A (ja) * | 1982-09-18 | 1984-03-27 | Mitsubishi Electric Corp | 半導体装置のリ−ド成形装置 |
-
1991
- 1991-07-03 BE BE9100638A patent/BE1005064A4/nl not_active IP Right Cessation
-
1992
- 1992-07-02 WO PCT/EP1992/001492 patent/WO1993001702A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5952858A (ja) * | 1982-09-18 | 1984-03-27 | Mitsubishi Electric Corp | 半導体装置のリ−ド成形装置 |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 8, no. 142 (E-254)(1579) 3 July 1984 & JP,A,59 052 858 ( MITSUBISHI ) 27 March 1984 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2277702A (en) * | 1993-04-14 | 1994-11-09 | Advanced Systems Automation Pt | A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam |
GB2277702B (en) * | 1993-04-14 | 1996-05-29 | Advanced Systems Automation Pt | A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam |
SG69071A1 (en) * | 1993-04-14 | 2002-01-15 | Advanced Systems Automation | A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam |
EP3919060A1 (fr) | 2012-07-12 | 2021-12-08 | Emalex Biosciences, Inc. | Ecopipam pour le traitement du syndrome de tourettes |
US11298361B2 (en) | 2012-07-12 | 2022-04-12 | Emalex Biosciences, Inc. | Fused benzazepines for treatment of Tourette's Syndrome |
US9949983B2 (en) | 2013-10-18 | 2018-04-24 | Psyadon Pharmaceuticals, Inc. | Fused benzazepines for treatment of stuttering |
Also Published As
Publication number | Publication date |
---|---|
BE1005064A4 (nl) | 1993-04-06 |
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