GB2277702B - A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam - Google Patents

A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam

Info

Publication number
GB2277702B
GB2277702B GB9307663A GB9307663A GB2277702B GB 2277702 B GB2277702 B GB 2277702B GB 9307663 A GB9307663 A GB 9307663A GB 9307663 A GB9307663 A GB 9307663A GB 2277702 B GB2277702 B GB 2277702B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
single point
point contact
swing cam
forming leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9307663A
Other versions
GB9307663D0 (en
GB2277702A (en
Inventor
Eng Hwee Seow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Systems Automation Ltd Singapore
Original Assignee
Advanced Systems Automation Ltd Singapore
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation Ltd Singapore filed Critical Advanced Systems Automation Ltd Singapore
Priority to GB9307663A priority Critical patent/GB2277702B/en
Priority to SG9602294A priority patent/SG69071A1/en
Publication of GB9307663D0 publication Critical patent/GB9307663D0/en
Publication of GB2277702A publication Critical patent/GB2277702A/en
Application granted granted Critical
Publication of GB2277702B publication Critical patent/GB2277702B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB9307663A 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam Expired - Fee Related GB2277702B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9307663A GB2277702B (en) 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam
SG9602294A SG69071A1 (en) 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9307663A GB2277702B (en) 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam
SG9602294A SG69071A1 (en) 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam

Publications (3)

Publication Number Publication Date
GB9307663D0 GB9307663D0 (en) 1993-06-02
GB2277702A GB2277702A (en) 1994-11-09
GB2277702B true GB2277702B (en) 1996-05-29

Family

ID=26302751

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9307663A Expired - Fee Related GB2277702B (en) 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam

Country Status (2)

Country Link
GB (1) GB2277702B (en)
SG (1) SG69071A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2771431B2 (en) * 1993-09-07 1998-07-02 日本電気株式会社 Lead forming equipment
JP3053582B2 (en) * 1996-11-29 2000-06-19 株式会社石井工作研究所 Lead bending equipment for electronic components
NL1012105C2 (en) * 1999-05-19 2000-11-21 Fico Bv Apparatus and method for bending the connections of electronic components.
CN102013401A (en) * 2009-02-27 2011-04-13 伟仕高(肇庆)半导体有限公司 Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof
CN103579040A (en) * 2013-10-30 2014-02-12 山东泰吉星电子科技有限公司 No-damage chip molding and packaging process
CN113333628A (en) * 2021-05-21 2021-09-03 田文勇 Pin dog-ear device is used in piezo-resistor production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001702A1 (en) * 1991-07-03 1993-01-21 Asm-Fico Tooling B.V. Bending device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001702A1 (en) * 1991-07-03 1993-01-21 Asm-Fico Tooling B.V. Bending device

Also Published As

Publication number Publication date
GB9307663D0 (en) 1993-06-02
SG69071A1 (en) 2002-01-15
GB2277702A (en) 1994-11-09

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990414