SG69071A1 - A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam - Google Patents

A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam

Info

Publication number
SG69071A1
SG69071A1 SG9602294A SG1996002294A SG69071A1 SG 69071 A1 SG69071 A1 SG 69071A1 SG 9602294 A SG9602294 A SG 9602294A SG 1996002294 A SG1996002294 A SG 1996002294A SG 69071 A1 SG69071 A1 SG 69071A1
Authority
SG
Singapore
Prior art keywords
leads
semiconductor devices
single point
point contact
swing cam
Prior art date
Application number
SG9602294A
Inventor
Eng Hwee Seow
Original Assignee
Advanced Systems Automation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Systems Automation filed Critical Advanced Systems Automation
Priority to SG9602294A priority Critical patent/SG69071A1/en
Priority to GB9307663A priority patent/GB2277702B/en
Publication of SG69071A1 publication Critical patent/SG69071A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
SG9602294A 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam SG69071A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
SG9602294A SG69071A1 (en) 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam
GB9307663A GB2277702B (en) 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG9602294A SG69071A1 (en) 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam
GB9307663A GB2277702B (en) 1993-04-14 1993-04-14 A method and apparatus for forming leads of semiconductor devices using a single point contact swing cam

Publications (1)

Publication Number Publication Date
SG69071A1 true SG69071A1 (en) 2002-01-15

Family

ID=26302751

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9602294A SG69071A1 (en) 1993-04-14 1993-04-14 A method and apparatus for performing leads of semiconductor devices using a single point contact swing cam

Country Status (2)

Country Link
GB (1) GB2277702B (en)
SG (1) SG69071A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2771431B2 (en) * 1993-09-07 1998-07-02 日本電気株式会社 Lead forming equipment
JP3053582B2 (en) * 1996-11-29 2000-06-19 株式会社石井工作研究所 Lead bending equipment for electronic components
NL1012105C2 (en) * 1999-05-19 2000-11-21 Fico Bv Apparatus and method for bending the connections of electronic components.
CN102013401A (en) * 2009-02-27 2011-04-13 伟仕高(肇庆)半导体有限公司 Non-destructive arc moulding mechanism for integrated circuit pin, and method thereof
CN103579040A (en) * 2013-10-30 2014-02-12 山东泰吉星电子科技有限公司 No-damage chip molding and packaging process
CN113333628A (en) * 2021-05-21 2021-09-03 田文勇 Pin dog-ear device is used in piezo-resistor production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001702A1 (en) * 1991-07-03 1993-01-21 Asm-Fico Tooling B.V. Bending device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993001702A1 (en) * 1991-07-03 1993-01-21 Asm-Fico Tooling B.V. Bending device

Also Published As

Publication number Publication date
GB2277702B (en) 1996-05-29
GB2277702A (en) 1994-11-09
GB9307663D0 (en) 1993-06-02

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