WO1992003903A1 - Procede pour la realisation d'une jonction par brasage et appareil presentant de telles jonctions - Google Patents

Procede pour la realisation d'une jonction par brasage et appareil presentant de telles jonctions Download PDF

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Publication number
WO1992003903A1
WO1992003903A1 PCT/DE1991/000570 DE9100570W WO9203903A1 WO 1992003903 A1 WO1992003903 A1 WO 1992003903A1 DE 9100570 W DE9100570 W DE 9100570W WO 9203903 A1 WO9203903 A1 WO 9203903A1
Authority
WO
WIPO (PCT)
Prior art keywords
soldering
contact pin
eye
solder
circuit board
Prior art date
Application number
PCT/DE1991/000570
Other languages
German (de)
English (en)
Inventor
Heinz Siegel
Volker Schurr
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO1992003903A1 publication Critical patent/WO1992003903A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60T—VEHICLE BRAKE CONTROL SYSTEMS OR PARTS THEREOF; BRAKE CONTROL SYSTEMS OR PARTS THEREOF, IN GENERAL; ARRANGEMENT OF BRAKING ELEMENTS ON VEHICLES IN GENERAL; PORTABLE DEVICES FOR PREVENTING UNWANTED MOVEMENT OF VEHICLES; VEHICLE MODIFICATIONS TO FACILITATE COOLING OF BRAKES
    • B60T8/00—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force
    • B60T8/32—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration
    • B60T8/34—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration having a fluid pressure regulator responsive to a speed condition
    • B60T8/36—Arrangements for adjusting wheel-braking force to meet varying vehicular or ground-surface conditions, e.g. limiting or varying distribution of braking force responsive to a speed condition, e.g. acceleration or deceleration having a fluid pressure regulator responsive to a speed condition including a pilot valve responding to an electromagnetic force
    • B60T8/3615—Electromagnetic valves specially adapted for anti-lock brake and traction control systems
    • B60T8/3675—Electromagnetic valves specially adapted for anti-lock brake and traction control systems integrated in modulator units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1031—Surface mounted metallic connector elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10916—Terminals having auxiliary metallic piece, e.g. for soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the invention is based on a method for producing a soldered connection according to the preamble of patent claim 1.
  • the invention also relates to a device with soldered connections produced in this way according to the preamble of patent claim 2.
  • valve block for a hydraulic brake system is known.
  • the valve block is equipped with an elastic plastic injection molded board with hot-stamped copper conductor tracks for contacting coil wires protruding from solenoid valve coils.
  • the coil wires are passed through hole-punched coil wire solder joints on the board and. connected to this by wave soldering.
  • the aim is to manufacture individual parts with the greatest possible tolerances and to add them to assemblies or devices. Difficulties arise, however, when contact pins of electrical components having considerable position tolerances are to be combined with the soldering eyes of flexible printed circuit boards because these cannot absorb the forces exerted by the contact pins. In addition, the solder is unable to bridge gaps several millimeters wide between the contact pin and the pad. In addition, the strength of a solder joint decreases with increasing gap width.
  • the method according to the invention with the characterizing steps of claim 1 has the advantage that a simple to produce solder joint of sufficient strength can be produced with little effort because the disc serves as an intermediary between the contact pin and the pad.
  • the solder can therefore wet the contact pin, the soldering eye and the disk area enclosed by it without interruption, fill the relatively small gaps between the contact pin and the disk on the one hand and the soldering eye and the disk on the other hand and produce a resilient, electrically secure bond.
  • the device according to the invention with the characterizing features of claim 2 is advantageous in that it can be manufactured inexpensively with relatively large tolerances, which are bridged when the electrical components are contacted with the printed circuit board by the washers involved in the soldered connection.
  • FIG. 1 shows a plan view of a device with solenoid valves, the contact pins of which are contacted by a soldered connection to a flexible printed circuit board
  • FIG. 2 shows a section along the line II-II in FIG. 1 through the device
  • FIG. 3 shows as detail III from FIG View of a solder pad on the circuit board in front of the Soldering process on a different scale
  • FIG. 4 as detail IV from FIG. 2 shows a section through a soldered connection with a flat disk pressed onto the contact pin for supporting the soldering eye as a first exemplary embodiment on a different scale
  • FIG. 5 also as a detail corresponding to FIG Disk as a second embodiment on a different scale.
  • the device 10 partially shown in FIGS. 1 and 2 is a hydraulic unit for vehicle brake systems with an anti-lock device.
  • the device 10 has a multi-part housing 11, in which the solenoid valves 12 are accommodated.
  • the solenoid valves 12 are each provided with two contact pins 13 arranged in parallel, which emerge from insulating sleeves 14.
  • the solenoid valves 12 and further electrical components, not shown, are contacted with a flexible printed circuit board 15.
  • the flexible printed circuit board 15 is formed from two interconnected foils 18 and 19, between which conductor tracks 20 made of copper foil are embedded (FIG. 3).
  • the (lower) insulating film 18 and the (upper) cover film 19 consist of a highly heat-resistant plastic.
  • the conductor tracks 20 are formed into an annular solder pad 21. While the insulating film 18 extends below the pad 22, the cover film 19 releases the conductor track 20 in the area of the pad 21.
  • the soldering eye 21 has a circular opening 22 which is free of foil.
  • the annular disk 25 has an outer diameter which projects beyond the solder eye 21.
  • the discs 25 are with the Contact pins 13 are firmly connected and are supported on the insulating sleeves 14, so that the end faces 26 of the disks 25 of all the solenoid valves 12 facing the conductor track 20 preferably run in one plane.
  • connection of the disk 25 to the contact pin 13 can be produced in different ways:
  • the disk 25 has a central opening 27 with a diameter which is smaller than the diagonal of the contact pin cross section.
  • the disc 25 is therefore connected to the contact pin 13 by a press fit.
  • the disk 25 has an opening 27 which is formed into a nozzle-shaped passage 28.
  • the passage 28 is directed towards the free end of the contact pin 13 and, after the disk 25 has been fitted onto the contact pin, is caulked therewith that a press fit is also achieved.
  • the circular opening 22 of the soldering eye 21 has an internal diameter of approximately 3 mm which corresponds to a multiple of the diagonal of the contact pin cross section.
  • the contact pin 13 is in a central position to the opening 22 of the pad 21.
  • This idealized illustration clarifies the case of the tolerance-free assignment of contact pin 13 to the solder pad 21 of the conductor track 20.
  • these tolerances can be accommodated because the contact pin 13 can assume any position within the opening 22 of the soldering eye 21. Even if the contact pin 13 is positioned on the edge of the opening 22, its clear opening always remains underlaid by the disk 25.
  • solder connection 31 solder is preferably applied to the corresponding soldering eye 21 with piston soldering, and a wetting with solder which detects the contact pin 13, the soldering eye and the region of the disk 25 lying within the soldering eye is produced.
  • FIGS. 4 and 5 which shows the cross section of the soldered connection 31, the soldering eye 21 and the contact pin 13 are contacted with cooled solder 32 by a bond which also covers the area of the disk 25 lying within the soldering eye. Due to the median function of the disk 25, the solder 32 is able to bridge gaps several millimeters wide between the pad 21 and the contact pin 13.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Fluid Mechanics (AREA)
  • Transportation (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Regulating Braking Force (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Magnetically Actuated Valves (AREA)

Abstract

Le respect de tolérances de position entre les broches de contact de composants électriques et les pastilles de plaquettes à circuits imprimés flexibles rendent délicats le montage ainsi que la réalisation de jonctions par brasage. Selon l'invention, on fixe sur la broche de contact (13) de composants électriques (12) un disque (25); la cosse à braser (21) de la plaquette à circuits imprimés (15) entourant la broche de contact (13) avec un jeu relativement grand est appliquée sur le disque (25) et l'on procède à un mouillage avec du métal d'apport (32) s'étendant sur la broche de contact (13), la cosse à braser (21) et la zone du disque (25) située à l'intérieur de la cosse à braser (21). Dans un appareil comportant des jonctions par brasage (31) réalisées de cette manière, les cosses (21) de la plaquette à circuits imprimés (15) sont mises en contact avec les broches de contact (13) des composants électriques (12) par l'intermédiaire d'une liaison avec du métal d'apport (32) couvrant la cosse correspondante (21) avec la broche de contact (13), ainsi que la zone du disque (25) située à l'intérieur de la cosse (21).
PCT/DE1991/000570 1990-08-24 1991-07-11 Procede pour la realisation d'une jonction par brasage et appareil presentant de telles jonctions WO1992003903A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP4026722.9 1990-08-24
DE4026722A DE4026722A1 (de) 1990-08-24 1990-08-24 Verfahren zum herstellen einer loetverbindung und geraet mit derartigen loetverbindungen

Publications (1)

Publication Number Publication Date
WO1992003903A1 true WO1992003903A1 (fr) 1992-03-05

Family

ID=6412789

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1991/000570 WO1992003903A1 (fr) 1990-08-24 1991-07-11 Procede pour la realisation d'une jonction par brasage et appareil presentant de telles jonctions

Country Status (3)

Country Link
CS (1) CS253391A3 (fr)
DE (1) DE4026722A1 (fr)
WO (1) WO1992003903A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4041507A1 (de) * 1990-12-22 1992-06-25 Bosch Gmbh Robert Verfahren zum fuegen einer leiterbahnfolie mit einem elektrischen bauteil, damit erzeugtes geraet sowie vorrichtung zum montieren einer leiterbahnfolie
DE4118935A1 (de) * 1991-06-08 1992-12-10 Bosch Gmbh Robert Elektrisches geraet mit wenigstens einem kontaktstift und einer leiterbahnfolie

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (de) * 1971-11-05 1973-05-10 Nordmende Sicherheitsloetstelle in hochspannungsfuehrenden leiterbahnen in gedruckten schaltungen
EP0153451A1 (fr) * 1984-02-23 1985-09-04 Umeda Kogyo Co., Ltd. Elément de construction pour fixer un objet difficile à braser

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2154958A1 (de) * 1971-11-05 1973-05-10 Nordmende Sicherheitsloetstelle in hochspannungsfuehrenden leiterbahnen in gedruckten schaltungen
EP0153451A1 (fr) * 1984-02-23 1985-09-04 Umeda Kogyo Co., Ltd. Elément de construction pour fixer un objet difficile à braser

Also Published As

Publication number Publication date
CS253391A3 (en) 1992-03-18
DE4026722A1 (de) 1992-02-27

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