WO1991007527A1 - Vorrichtung zum abblenden von feldlinien in einer galvanikanlage - Google Patents

Vorrichtung zum abblenden von feldlinien in einer galvanikanlage Download PDF

Info

Publication number
WO1991007527A1
WO1991007527A1 PCT/DE1990/000884 DE9000884W WO9107527A1 WO 1991007527 A1 WO1991007527 A1 WO 1991007527A1 DE 9000884 W DE9000884 W DE 9000884W WO 9107527 A1 WO9107527 A1 WO 9107527A1
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
anode
field lines
diaphragm
shape
Prior art date
Application number
PCT/DE1990/000884
Other languages
German (de)
English (en)
French (fr)
Inventor
Manfred Kallweit
Walter Meyer
Rolf Schröder
Original Assignee
Schering Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering Aktiengesellschaft filed Critical Schering Aktiengesellschaft
Publication of WO1991007527A1 publication Critical patent/WO1991007527A1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008Current shielding devices
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Definitions

  • the invention relates to a device for stopping field lines in a galvanic system for treating essentially plate-shaped workpieces, which is provided with a diaphragm.
  • a circuit board as a workpiece to be treated in a diving galvam system is assigned a shielding and positioning frame, with a roof-shaped base that is guided so as to be displaceable in a vertical direction.
  • the screen is in a basic position on the bath surface and is carried along by it when the workpiece is immersed.
  • the known diaphragm which is assigned to a workpiece, can only be used in vertical galvanizing systems. Their effectiveness is further limited by the fact that a workpiece is to be electroplated, regardless of its size and / or shape, a single aperture of unchangeable size and shape. To achieve a uniform layer thickness distribution in the
  • the invention has for its object to develop a generic device so that a substantially uniform field line density between an anode and the workpiece is achieved in a simple manner and adapted to the respective size and shape of a workpiece, while avoiding places high Feldli ⁇ ien Concentration, is achieved.
  • one or more electrically non-conductive screen devices with a shape and size that is independent of the respective workpiece size and workpiece shape are assigned to a side of the anode facing the workpiece.
  • the assignment takes place depending on the respective workpiece size and the respective workpiece shape in such a way that field lines between the anode and the workpiece are completely or partially dimmed.
  • the device according to the invention can thus be used very flexibly and can also be retrofitted in a simple manner even in the case of existing galvanic systems.
  • one or more of the plate devices are arranged movably and can be locked in at least one dimming and at least one open position.
  • a single diaphragm device can thus be moved into a dimming position determined by the workpiece size and workpiece shape and can be fixed there.
  • anode devices are assigned to the anode, then for an essentially homogeneous field line distribution with respect to a surface of a workpiece to be electroplated, and in order to avoid the occurrence of a high field line density at least in one edge area of the workpiece, individual of the plate devices in the passage position and others can be used diaphragm devices adjoining an edge region of the workpiece are moved into a dimming position and are fixed there for the duration of the treatment of the workpiece.
  • Baffles of this type can be inserted into a cover in a particularly simple manner. dazzle position, in which they are arranged substantially parallel to the anode and in a passage position, in which they are arranged essentially at a right angle to the anode.
  • the axis is arranged essentially in a central region of the or each diaphragm.
  • a plurality of adjacent screens are designed and arranged in such a way that adjacent areas of adjacent screens overlap in a low position. This prevents in a simple and reliable manner that in areas of diaphragms arranged in a dimming position, field lines can run from the anode towards the workpiece.
  • a band-like diaphragm device which can be moved via at least one transport roller.
  • a screen can be easily wound onto or from the transport roller in accordance with the size and shape of a workpiece to be treated.
  • the band-like diaphragm device By winding or unwinding the band-like diaphragm device, the latter can be brought substantially continuously into a respectively dimmable or pass-through position in which it can then be fixed.
  • the band-like diaphragm device can be formed from a flexible film and / or interconnected thin plate segments.
  • one or more aperture devices can be moved via a controllable drive.
  • the controllable drive can be used with one axis connected diaphragms for pivoting the axis cooperate with this.
  • the controllable drive can interact with the transport roller.
  • the drive can also act on one end of the band-like diaphragm, for example via a rope as a tension element; in this case, the sports roll can be set in rotation over the wound-up part of the band-like screen.
  • controllable drive instead of the controllable drive or as an alternative to this, the possibility can also be created for manual movement of the lead devices.
  • a control circuit with a device for detecting the workpiece size or shape and an actuating device for a movement dependent on the detected workpiece size or shape one or more diaphragm devices are arranged in a Abble ⁇ d- or passage position.
  • screens connected to an axis and movable via them can be assigned to an anode in both a vertical and a horizontal arrangement.
  • screens can be assigned to an anode in both a vertical and a horizontal arrangement.
  • screens are arranged both in the vertical and in the horizontal direction.
  • diaphragms which are connected to an axis and can be moved via these, together with a band-like diaphragm which can be moved via a transport roller.
  • FIG. 2 a plan view of an anode and a workpiece corresponding to FIG. 1 with a first exemplary embodiment of a device according to the invention for stopping field lines,
  • Fig. 4 shown second exemplary embodiment.
  • the device according to the invention for stopping field lines can be used, for example, in vertical or horizontal electroplating systems and in automatically operating electroplating systems, regardless of the particular type.
  • the device according to the invention can, for example, also be installed in a simple manner in already existing electroplating systems and can be used advantageously in these.
  • an anode 1 is at a distance from an essentially plate-shaped workpiece to be provided with a metallic coating
  • the high exposure of the areas 5 to the field lines 4 results from the fact that the workpiece 2 is smaller than the anode 1, so that an upper and lower edge area 2 'or 2 "of the workpiece 2 has a larger anode area which is essentially extending from the upper and lower end regions 2 ', 2 "to the upper and lower ends of the anode 1, respectively.
  • a correspondingly large area of the anode 1 lies opposite a central area of the workpiece 2, so that there sets up an essentially homogeneous field line distribution.
  • each assigned to a workpiece 2 a high field line concentration can be achieved in the area of one of the ends 2 ', 2 "in vertical electroplating systems In vertical electroplating systems, a reduction in quality as a result of high field line concentrations occurring can be avoided if an end of the workpiece 2 opposite the screen is arranged congruently with one end of the anode 1.
  • the formation of essentially homogeneously distributed field lines is without restriction with regard to use in vertical or horizontal galvanizing systems and without the need for a special arrangement of the workpiece 2 enables.
  • the arrangement of the anode 1, the workpiece 2 and a circuit 3 corresponds to that of FIG. 1, so that corresponding reference numerals are used.
  • a diaphragm device generally designated 6, for stopping field lines, which consists of a plurality of diaphragms 7 spaced apart and adjacent to one another.
  • the arrangement of the screens 7 is independent of the shape or size of the workpiece 2 such that screens 7 are arranged essentially over the entire length of the anode 1.
  • Each of the diaphragms 7 can be made electrically non-conductive, for example from an insulating material, or can be provided with an insulating coating and has an essentially rectangular shape with a longitudinal direction running in the direction of the axis 8.
  • Each of the diaphragms 7 can be moved about the associated axis 8, which in the present case is arranged vertically, into a dimming position in which, as can be seen from FIG. 2, adjacent regions of mutually adjacent diaphragms 7 overlap. It is thus prevented in a safe and simple manner that, starting from the areas of the anode 1 which lie opposite the screens 7 in the dimming position, field lines run in the direction of the workpiece 2.
  • Apertures 7 are arranged essentially so that they lie in a plane running parallel to the array 1.
  • the diaphragms 7 opposite the workpiece 2 have been moved into a passage position which is essentially transverse to the dimming position and are fixed there in a manner not shown.
  • the screens 7 are arranged in this area, essentially parallel to one another, essentially at right angles to the anode 1 and the workpiece 2.
  • diaphragms 7 which can be moved from a dimming position into a passage position and which can be locked there can thus easily avoid the occurrence of locally high field line concentrations.
  • the workpiece 2 relative to the anode 1 it is only necessary, as can be seen in FIG. 2, that those screens 7 that are not between the workpiece 2 and the anode 1 are in their dipped position are moved and fixed there, while the screens 7 located between the respective workpiece 2 and the anode 1 are moved into their open position and are fixed there.
  • field lines 4 can thus be covered in a simple, quick and safe manner in such a way that a workpiece 2 to be treated, regardless of its size or shape, essentially with field lines of a homogeneous one Distribution is applied.
  • diaphragms 7 are determined according to the size, shape and arrangement of this workpiece with respect to the anode 1 in its shielding or open position. As can be seen from FIG.
  • diaphragms 7 are arranged with their axes 8 in the horizontal direction according to the first exemplary embodiment, the workpiece 2 likewise being immersed in an electroplating bath (not shown) opposite the anode 1 in the horizontal direction indicated by the arrow 9 is moved.
  • an electroplating bath not shown
  • comparable screens 7 can be arranged in the vertical direction, and it is also possible, if appropriate, for screens 7 to be arranged at least in regions both in the horizontal and in the vertical direction.
  • the diaphragm is formed in a band-like manner from a flexible film 15 and / or thin plate segments which are connected to one another and which are partially supported on a transport roller 11. and can be developed or moved in the directions indicated by the double arrow 12.
  • the band-like screen 15 can be moved essentially parallel to the anode 1 along the workpiece 2 such that its front end 15 'is arranged substantially congruently with the upper end 2' of the workpiece 2.
  • the band-like diaphragm 15 is connected at its end 15 'to a tension element 13, for example in the form of a rope, which can be moved in the directions of the double arrow 12 via a roller 14.
  • a tension element 13 for example in the form of a rope
  • the tension element 13 and the panel 15 can be kept under tension by fixing the transport roller 11 or the roller 14 or both. Since the band like screen 15 is capable of dimming the anode 1 from the workpiece 2 only from one side, it is expedient that, as shown in FIG. 4, the lower end 2 "of the workpiece 2 is arranged in correspondence with the lower end of the anode 1 becomes.
  • a device for detecting the workpiece size or shape and, if appropriate, the workpiece arrangement relative to the anode 1 may also be present. This then interacts via a control loop with an actuating device containing the controllable drive, in order to move one or more diaphragms 7, 15 into a shielding or passing position depending on the workpiece size or workpiece shape detected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
PCT/DE1990/000884 1989-11-15 1990-11-14 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage WO1991007527A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DEP3937926.4 1989-11-15
DE19893937926 DE3937926A1 (de) 1989-11-15 1989-11-15 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage

Publications (1)

Publication Number Publication Date
WO1991007527A1 true WO1991007527A1 (de) 1991-05-30

Family

ID=6393543

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1990/000884 WO1991007527A1 (de) 1989-11-15 1990-11-14 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage

Country Status (2)

Country Link
DE (1) DE3937926A1 (enrdf_load_stackoverflow)
WO (1) WO1991007527A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097445B2 (en) 2008-10-24 2015-08-04 Exxonmobil Research And Engineering Company System using unutilized heat for cooling and/or power generation
CN105316734A (zh) * 2014-05-26 2016-02-10 穆尔和本德公司 用于制造硬化成型部件的方法和设备

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5882822A (en) * 1995-09-28 1999-03-16 Shin-Etsu Chemical Co., Ltd. Battery electrode and method for the preparation thereof
DE19717510C1 (de) 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE730819C (de) * 1941-09-30 1943-01-28 Mechanik G M B H Vorrichtung zur Veraenderung der elektrolytisch wirksamen Oberflaeche der Anoden in galvanischen Baedern
US4426266A (en) * 1983-02-28 1984-01-17 Kawasaki Steel Corporation Strip edge overcoating preventing device for continuous electroplating
JPS62151593A (ja) * 1985-12-25 1987-07-06 Nippon Kokan Kk <Nkk> 金属ストリツプの連続電気メツキ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862891A (en) * 1973-09-24 1975-01-28 Gte Automatic Electric Lab Inc Uniform plating current apparatus and method
US4259166A (en) * 1980-03-31 1981-03-31 Rca Corporation Shield for plating substrate
JPS5751289A (en) * 1980-09-10 1982-03-26 Fuji Photo Film Co Ltd Electrolytic treating device for belt-like metallic plate
US4378283A (en) * 1981-07-30 1983-03-29 National Semiconductor Corporation Consumable-anode selective plating apparatus
DE3708779A1 (de) * 1986-11-22 1988-06-01 Schempp & Decker Maschinenbau Vorrichtung zum galvanischen beschichten eines elektrisch leitenden gegenstandes
DE3726571C1 (en) * 1987-08-10 1989-03-23 Siemens Ag Screening and positioning frame

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE730819C (de) * 1941-09-30 1943-01-28 Mechanik G M B H Vorrichtung zur Veraenderung der elektrolytisch wirksamen Oberflaeche der Anoden in galvanischen Baedern
US4426266A (en) * 1983-02-28 1984-01-17 Kawasaki Steel Corporation Strip edge overcoating preventing device for continuous electroplating
JPS62151593A (ja) * 1985-12-25 1987-07-06 Nippon Kokan Kk <Nkk> 金属ストリツプの連続電気メツキ装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan, Band 11, Nr. 381 (C-464)(2828), 12 Dezember 1987; & JP-A-62151593 (NIPPO N KOKAN) 6 Juli 1987 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9097445B2 (en) 2008-10-24 2015-08-04 Exxonmobil Research And Engineering Company System using unutilized heat for cooling and/or power generation
CN105316734A (zh) * 2014-05-26 2016-02-10 穆尔和本德公司 用于制造硬化成型部件的方法和设备
EP2949787A3 (de) * 2014-05-26 2016-03-16 Muhr und Bender KG Verfahren und anlage zum herstellen eines gehärteten formteils
US9938600B2 (en) 2014-05-26 2018-04-10 Muhr Und Bender Kg Manufacturing a hardened formed part
CN105316734B (zh) * 2014-05-26 2018-11-30 穆尔和本德公司 用于制造硬化成型部件的方法和设备

Also Published As

Publication number Publication date
DE3937926C2 (enrdf_load_stackoverflow) 1992-11-19
DE3937926A1 (de) 1991-05-16

Similar Documents

Publication Publication Date Title
DE3228292C2 (enrdf_load_stackoverflow)
WO2010034300A2 (de) Siebdruckform
DE2723465C2 (de) Maske zum Aufbringen eines Musters auf ein Substrat und Verfahren zu ihrer Herstellung
DE3100799C2 (de) Vorrichtung zum Eindicken von Schlamm
WO1998049375A2 (de) Vorrichtung zum elektrolytischen behandeln von plattenförmigem behandlungsgut und verfahren zum elektrischen abschirmen von randbereichen des behandlungsgutes bei der elektrolytischen behandlung
WO1991007527A1 (de) Vorrichtung zum abblenden von feldlinien in einer galvanikanlage
DE4106733C2 (enrdf_load_stackoverflow)
WO2010142271A2 (de) Siebdruckform
DE3631804C2 (enrdf_load_stackoverflow)
AT394215B (de) Verfahren zur elektrolytischen herstellung einer metallfolie
DE69112765T2 (de) Verfahren zum Aufbringen einer Schicht aus einer sensitiven Lösung auf eine Metallplatte zur Herstellung von Kolor-Kathodenstrahlröhren und Beschichtungsapparat.
DE19633797B4 (de) Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE4037336A1 (de) Galvanisiertrommel
DE69532422T2 (de) Bandbehandlungsvorrichtung
DE69003984T2 (de) Vorrichtung für Schön- und Wiederbeschichtung und Verfahren zum Beschichten einer Materialbahn.
DE69014067T2 (de) Wasserstopmodul.
WO1994003655A1 (de) Verfahren zum elektrolytischen behandeln von insbesondere flachem behandlungsgut, sowie anordnung, insbesondere zur durchführung dieses verfahrens
DE19811210C1 (de) Verfahren und Vorrichtung zum elektrolytischen Polieren chirurgischer Nadeln
DE3400084C2 (de) Vorrichtung zur Halterung und zum Transport von Platten für die Herstellung von Leiterplatten
WO1991008326A1 (de) Halte- und kontakteinrichtung für in einem elektrolysebad zu behandelnde bauelemente
DE2027158A1 (de) Vorrichtung für die Herstellung gedruckter Schaltungen
EP0568728A2 (de) Verfahren zum Galvanisieren von mit Lochungen versehenen Werkstücken, sowie Anordnung zur Durchführung dieses Verfahrens
DE69315118T2 (de) Einrichtung zum Herstellen von doppelseitig beschichteten Geweben
WO2007009448A1 (de) System zur galvanischen abscheidung einer leitfähigen schicht auf einem nicht-leitfähigen trägermaterial
DE4437848C1 (de) Vorrichtung zur kontinuierlichen Galvanisierung von ebenen Werkstücken und deren Verwendung

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): CA JP US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH DE DK ES FR GB GR IT LU NL SE

NENP Non-entry into the national phase

Ref country code: CA