Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
  • B23K3/06—Solder feeding devices; Solder melting pans
  • B23K3/0646—Solder baths
  • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains

Definitions

• the present invention relates to a soldering machine, comprising a vessel for molten solder and at least one rise tower placed in the vessel, which tower is provided at its top with at least one outflow slot for forming a solder wave.
• soldering machines are generally known.
• soldering machines are mostly used for soldering chip components. These are components which are generally of small dimensions and which are fixed on the solder side of the printed circuit board. For this purpose they are initially positioned on the printed circuit board, for instance by means of glueing, wherein the solder surfaces of the chip components are fixed against the corresponding solder surfaces of the conductor paths on the printed circuit board. The printed circuit boards thus provided with components are then carried through a soldering machine of the type described in the preamble, wherein the soldering process takes place.
• the rise tower of the soldering machine is provided with a narrow outflow slot.
• a narrow, power- ful solder wave which can also penetrate into the space bet ⁇ ween the surfaces of the components for soldering and the printed circuit board.
• the object of the present invention is to provide a soldering machine wherein the above stated problems are avoid ⁇ ed. This object is achieved by a scraping member arranged in the slot movably in the lengthwise direction of the slot.
• the slot is kept clean so that the outflow- ing solder wave remains regular and reliable soldered connec ⁇ tions are obtained.
• fig. 1 shows a perspective view of a soldering machine in which the present invention is applied
• fig. 2 shows a perspective, partially broken away view of a solder vessel provided with a solder tower with an out ⁇ flow slot, in which the present invention is applied
• fig. 3 shows a view corresponding with fig. 2 of another embodiment of the present invention
• fig. 4 is a sectional view of the device according to the present invention
• fig. 5 shows a detail view of the device according to the present invention
• fig. 6 is a perspective detail view of a scraping member applicable in the device according to the present invention
• the soldering machine 1 depicted in fig. 1 is substan ⁇ tially formed by a housing 2 through which extends a conveyor belt 3.
• a solder vessel 4, which is further shown in fig. 2, is arranged in the soldering machine under the conveyor belt 3.
• the solder vessel 4 is provided with a heating device (not shown in the drawing) in order to keep the solder situ ⁇ ated in the vessel 4 in the liquid state.
• a first outlet tower 5 which is provi ⁇ ded with an outflow slot 6 for molten solder.
• a second outlet tower 7 is further arranged.
• the conveyor belt 3 is arranged such that the printed circuit boards 8 for soldering are carried along above both outlet towers 5 and 7 such that the solder waves 9, 10 genera ⁇ ted by these towers solder the components arranged on the underside of the printed circuit board 8 onto the board.
• the conveyor belt further forms no part of the present invention, so it will not be discussed further.
• Each of the outlet towers 5, 7 is further provided with a pump (not shown) to raise the molten solder.
• the first outlet tower is provided with a narrow outflow slot 6 for forming of a first narrow, powerful solder wave 9.
• the wave generated by the second outlet tower 7 has a gently flowing surface, since it is then no longer necessary to penetrate into the space between the solder surfaces; the soldered connection has already been brought about using the first solder wave.
• This outflow slot becomes blocked as a result of oxides from the outflowing molten solder and as a result of the flux present in the solder bath which is deposited in the fairly narrow outflow slot 6.
• this contamination can be regularly removed by causing a scraping member 11 to move regularly back and forth in the outflow slot 6, which member removes deposits of dirt during the reciprocating movement.
• This scraping member 11 is fixed to a block 13 by means of a holder 12.
• This block 13 is movable in the length ⁇ wise direction of the slot 6 since this block 13 is guided on a guide rod 14.
• the block 13 is provided with an opening 15, through which the guide rod 14 extends.
• a screw spindle 16 is arranged which extends parallel to the guide rod 14.
• the screw spindle 16 extends through an opening 17 provided with screw thread and arranged in the block 13.
• the screw spindle 16 is drivable by means of an electromotor 18. Just as the guide rod 14 and the screw spindle 16 the electromotor 18 is fitted onto a bracket 19 which is fixed against the vessel 4. Once a certain number of soldering operations have been carried out, and therefore after the passage of a certain number of printed circuit boards 8, energy is supplied to the electromotor 18 so that the screw spindle 16 is driven, the block 13 moves along the guide rod 14 and the scraping member 11 performs a linear reciprocating movement through the out ⁇ flow slot 6. The soldering process is subsequently resumed. After a number of soldering operations have once again been carried out this scraping action is repeated.
• Fig. 3 shows another embodiment of the scraping member which otherwise wholly corresponds with the embodiment shown in fig.
• a second guide rod 20 is arranged for this pur ⁇ pose a second guide opening 21 is arranged in the block 13.
• a linear drive member 22 which for instance can be formed by a pneuma ⁇ tically or hydraulically driven cylinder or by a linear elec ⁇ tromotor.
• Fig. 4 shows a sectional view of the first solder tower 5 on which the scraping member 11 according to the present invention is used. This shows a number of construction de ⁇ tails.
• Shown in fig. 5 is a perspective detail view which shows the construction of the scraping member in more detail. Also shown here is that the slot 6 is provided on both sides with a broadening 23 in which the scraped off dirt can collect. The solder oxides and flux collected in the broadening are removed by the solder wave flowing out of the slot. If neces ⁇ sary, this broadening could also be cleaned by hand at regular intervals, for instance daily.
• the broadening is shown as being rectangular, it is possible to embody the broadening with another shape, for instance a round shape.
• fig. 6 and 7 show two alternative embodiments of the scraping member.
• two parallel extending blades 24 are used which are both fixed on the holder 12 by means of a rivet or pop rivet 25.

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Molten Solder (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=19855258

Family Applications (1)

Country Status (4)

Citations (2)

Family Cites Families (2)

• 1989
  • 1989-09-04 NL NL8902220A patent/NL8902220A/nl not_active Application Discontinuation
• 1990
  • 1990-09-04 WO PCT/NL1990/000126 patent/WO1991003350A1/en active Application Filing
  • 1990-09-04 DE DE4091519A patent/DE4091519C2/de not_active Expired - Fee Related
  • 1990-09-04 JP JP51293690A patent/JPH04501828A/ja active Pending
  • 1990-09-04 DE DE19904091519 patent/DE4091519T/de active Pending

Patent Citations (2)

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