USD937232S1 - Semiconductor device - Google Patents
Semiconductor device Download PDFInfo
- Publication number
- USD937232S1 USD937232S1 US29/801,764 US202129801764F USD937232S US D937232 S1 USD937232 S1 US D937232S1 US 202129801764 F US202129801764 F US 202129801764F US D937232 S USD937232 S US D937232S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- view
- ornamental design
- semiconductor
- perspective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
Claims (1)
- The ornamental design for a semiconductor device, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/801,764 USD937232S1 (en) | 2019-10-24 | 2021-07-30 | Semiconductor device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/710,616 USD938925S1 (en) | 2019-10-24 | 2019-10-24 | Semiconductor device |
US29/801,764 USD937232S1 (en) | 2019-10-24 | 2021-07-30 | Semiconductor device |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/710,616 Division USD938925S1 (en) | 2019-10-24 | 2019-10-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
USD937232S1 true USD937232S1 (en) | 2021-11-30 |
Family
ID=78704014
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/710,616 Active USD938925S1 (en) | 2019-10-24 | 2019-10-24 | Semiconductor device |
US29/801,764 Active USD937232S1 (en) | 2019-10-24 | 2021-07-30 | Semiconductor device |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/710,616 Active USD938925S1 (en) | 2019-10-24 | 2019-10-24 | Semiconductor device |
Country Status (1)
Country | Link |
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US (2) | USD938925S1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD986840S1 (en) * | 2020-05-13 | 2023-05-23 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
USD988299S1 (en) * | 2021-06-18 | 2023-06-06 | Telit Cinterion Deutschland Gmbh | Cellular module |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP1661378S (en) * | 2020-02-27 | 2020-06-08 | ||
USD972933S1 (en) * | 2020-11-24 | 2022-12-20 | Panasonic Intellectual Property Management Co., Ltd. | Package cushioning |
Citations (48)
Publication number | Priority date | Publication date | Assignee | Title |
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US273559A (en) | 1883-03-06 | Chaeles s | ||
US729489A (en) | 1902-10-04 | 1903-05-26 | Mattson Rubber Company | Game-piece. |
US1998526A (en) | 1932-09-23 | 1935-04-23 | Schubert Philipp | Domino |
USD318461S (en) | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
USD319045S (en) | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD319814S (en) | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
US5370398A (en) | 1993-06-30 | 1994-12-06 | Nguyen; Thang V. | Close and open game |
US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5858815A (en) * | 1996-06-21 | 1999-01-12 | Anam Semiconductor Inc. | Semiconductor package and method for fabricating the same |
US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
US6589817B1 (en) * | 1996-12-03 | 2003-07-08 | Oki Electric Industry Co., Ltd. | Semiconductor device, method for manufacturing the same, and method for mounting the same |
USD487430S1 (en) | 2002-07-10 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor memory element |
US6836002B2 (en) | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
USD598380S1 (en) | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
US20100326710A1 (en) * | 2009-06-29 | 2010-12-30 | Guigen Zhang | Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same |
USD633672S1 (en) * | 2010-02-10 | 2011-03-01 | The Libman Company | Pad |
US8177993B2 (en) * | 2006-11-05 | 2012-05-15 | Globalfoundries Singapore Pte Ltd | Apparatus and methods for cleaning and drying of wafers |
US8294250B2 (en) * | 2009-10-12 | 2012-10-23 | Samsung Electronics Co., Ltd. | Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate |
USD687898S1 (en) | 2012-06-11 | 2013-08-13 | Raymond Lupkas | Set of pai-gow tiles |
USD704155S1 (en) | 2010-08-19 | 2014-05-06 | Epistar Corporation | Wafer carrier |
USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
USD757693S1 (en) | 2013-09-26 | 2016-05-31 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
USD764424S1 (en) | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD789456S1 (en) | 2015-02-12 | 2017-06-13 | Wenlan H. Frost | Set of square domino tiles |
JP1581768S (en) | 2016-08-02 | 2017-07-24 | ||
USD797066S1 (en) | 2015-08-17 | 2017-09-12 | Cooper Technologies Company | Integrated light emitting diode (LED) light engine |
JP1588125S (en) | 2017-04-26 | 2017-10-16 | ||
JP1588481S (en) | 2017-04-26 | 2017-10-16 | ||
USD821338S1 (en) * | 2015-01-20 | 2018-06-26 | Modus Test Automation, Llc. | Contact fields for a printed circuit board |
USD821337S1 (en) * | 2015-01-20 | 2018-06-26 | Modus Test Automation, Llc. | Contact field for a printed circuit board |
USD831009S1 (en) * | 2015-12-11 | 2018-10-16 | Gemalto M2M Gmbh | Radio module |
USD837171S1 (en) | 2018-05-07 | 2019-01-01 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
JP1632160S (en) | 2018-09-28 | 2019-05-27 | ||
JP1632597S (en) | 2018-09-28 | 2019-05-27 | ||
USD850309S1 (en) | 2017-07-27 | 2019-06-04 | Aehr Test Systems | Layout of contacts |
USD856948S1 (en) | 2018-05-07 | 2019-08-20 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
JP1641048S (en) | 2018-06-19 | 2019-09-09 | ||
JP1640664S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641049S (en) | 2018-06-19 | 2019-09-09 | ||
US10510626B2 (en) | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
USD872033S1 (en) | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD872032S1 (en) | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
USD902164S1 (en) | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
USD904325S1 (en) | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
USD927429S1 (en) * | 2019-03-15 | 2021-08-10 | Modus Test, Llc | Plurality of contact fields for a printed circuit board |
-
2019
- 2019-10-24 US US29/710,616 patent/USD938925S1/en active Active
-
2021
- 2021-07-30 US US29/801,764 patent/USD937232S1/en active Active
Patent Citations (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US273559A (en) | 1883-03-06 | Chaeles s | ||
US729489A (en) | 1902-10-04 | 1903-05-26 | Mattson Rubber Company | Game-piece. |
US1998526A (en) | 1932-09-23 | 1935-04-23 | Schubert Philipp | Domino |
USD319814S (en) | 1988-04-13 | 1991-09-10 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319045S (en) | 1988-04-13 | 1991-08-13 | Ibiden Co., Ltd. | Semi-conductor substrate with conducting pattern |
USD319629S (en) | 1988-04-13 | 1991-09-03 | Ibiden Co., Ltd. | Semiconductor substrate with conducting pattern |
USD318461S (en) | 1988-04-13 | 1991-07-23 | Ibiden Co., Ltd. | Semi-conductor mounting substrate |
US5370398A (en) | 1993-06-30 | 1994-12-06 | Nguyen; Thang V. | Close and open game |
US5757082A (en) | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5858815A (en) * | 1996-06-21 | 1999-01-12 | Anam Semiconductor Inc. | Semiconductor package and method for fabricating the same |
US6589817B1 (en) * | 1996-12-03 | 2003-07-08 | Oki Electric Industry Co., Ltd. | Semiconductor device, method for manufacturing the same, and method for mounting the same |
US6307269B1 (en) | 1997-07-11 | 2001-10-23 | Hitachi, Ltd. | Semiconductor device with chip size package |
US6836002B2 (en) | 2000-03-09 | 2004-12-28 | Sharp Kabushiki Kaisha | Semiconductor device |
USD487430S1 (en) | 2002-07-10 | 2004-03-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor memory element |
US8177993B2 (en) * | 2006-11-05 | 2012-05-15 | Globalfoundries Singapore Pte Ltd | Apparatus and methods for cleaning and drying of wafers |
USD598380S1 (en) | 2008-05-09 | 2009-08-18 | Fujifilm Corporation | Conductive sheet |
US20100326710A1 (en) * | 2009-06-29 | 2010-12-30 | Guigen Zhang | Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same |
US8294250B2 (en) * | 2009-10-12 | 2012-10-23 | Samsung Electronics Co., Ltd. | Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate |
USD633672S1 (en) * | 2010-02-10 | 2011-03-01 | The Libman Company | Pad |
USD704155S1 (en) | 2010-08-19 | 2014-05-06 | Epistar Corporation | Wafer carrier |
USD687898S1 (en) | 2012-06-11 | 2013-08-13 | Raymond Lupkas | Set of pai-gow tiles |
USD757693S1 (en) | 2013-09-26 | 2016-05-31 | Murata Manufacturing Co., Ltd. | Wireless transmission/reception module |
USD775093S1 (en) | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
USD754083S1 (en) | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
USD778850S1 (en) | 2014-05-15 | 2017-02-14 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD730304S1 (en) | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD764424S1 (en) | 2014-05-15 | 2016-08-23 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD821337S1 (en) * | 2015-01-20 | 2018-06-26 | Modus Test Automation, Llc. | Contact field for a printed circuit board |
USD821338S1 (en) * | 2015-01-20 | 2018-06-26 | Modus Test Automation, Llc. | Contact fields for a printed circuit board |
USD789456S1 (en) | 2015-02-12 | 2017-06-13 | Wenlan H. Frost | Set of square domino tiles |
US10510626B2 (en) | 2015-07-06 | 2019-12-17 | Infineon Technologies Ag | Method for use in manufacturing a semiconductor device die |
USD797066S1 (en) | 2015-08-17 | 2017-09-12 | Cooper Technologies Company | Integrated light emitting diode (LED) light engine |
USD904355S1 (en) | 2015-12-11 | 2020-12-08 | Gemalto M2M Gmbh | Radio module |
USD831009S1 (en) * | 2015-12-11 | 2018-10-16 | Gemalto M2M Gmbh | Radio module |
JP1581768S (en) | 2016-08-02 | 2017-07-24 | ||
USD813182S1 (en) | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
JP1588481S (en) | 2017-04-26 | 2017-10-16 | ||
JP1588125S (en) | 2017-04-26 | 2017-10-16 | ||
USD850309S1 (en) | 2017-07-27 | 2019-06-04 | Aehr Test Systems | Layout of contacts |
USD893439S1 (en) | 2018-05-07 | 2020-08-18 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
USD856948S1 (en) | 2018-05-07 | 2019-08-20 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
USD837171S1 (en) | 2018-05-07 | 2019-01-01 | Adura Led Solutions Llc | Circuit board having arrangements of light-emitting diodes |
JP1640664S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641049S (en) | 2018-06-19 | 2019-09-09 | ||
JP1641048S (en) | 2018-06-19 | 2019-09-09 | ||
USD872033S1 (en) | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
USD872032S1 (en) | 2018-09-14 | 2020-01-07 | Telit Communications S.P.A. | Connection module |
JP1632160S (en) | 2018-09-28 | 2019-05-27 | ||
JP1632597S (en) | 2018-09-28 | 2019-05-27 | ||
USD887999S1 (en) * | 2018-10-17 | 2020-06-23 | Oupiin Electronic (Kunshan) Co., Ltd | Circuit board with zigzag routes |
USD902164S1 (en) | 2019-01-24 | 2020-11-17 | Toshiba Memory Corporation | Integrated circuit card |
USD927429S1 (en) * | 2019-03-15 | 2021-08-10 | Modus Test, Llc | Plurality of contact fields for a printed circuit board |
USD904325S1 (en) | 2019-03-20 | 2020-12-08 | Sansha Electric Manufacturing Company, Limited | Semiconductor module |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD986840S1 (en) * | 2020-05-13 | 2023-05-23 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
USD988299S1 (en) * | 2021-06-18 | 2023-06-06 | Telit Cinterion Deutschland Gmbh | Cellular module |
Also Published As
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USD938925S1 (en) | 2021-12-21 |
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Legal Events
Date | Code | Title | Description |
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FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |