USD937232S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD937232S1
USD937232S1 US29/801,764 US202129801764F USD937232S US D937232 S1 USD937232 S1 US D937232S1 US 202129801764 F US202129801764 F US 202129801764F US D937232 S USD937232 S US D937232S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/801,764
Inventor
Ryosuke Okawa
Toshikazu Imai
Kazuma Yoshida
Tsubasa INOUE
Takeshi Imamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nuvoton Technology Corp Japan
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Nuvoton Technology Corp Japan
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Publication date
Application filed by Nuvoton Technology Corp Japan filed Critical Nuvoton Technology Corp Japan
Priority to US29/801,764 priority Critical patent/USD937232S1/en
Application granted granted Critical
Publication of USD937232S1 publication Critical patent/USD937232S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/801,764 2019-10-24 2021-07-30 Semiconductor device Active USD937232S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/801,764 USD937232S1 (en) 2019-10-24 2021-07-30 Semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/710,616 USD938925S1 (en) 2019-10-24 2019-10-24 Semiconductor device
US29/801,764 USD937232S1 (en) 2019-10-24 2021-07-30 Semiconductor device

Related Parent Applications (1)

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US29/710,616 Division USD938925S1 (en) 2019-10-24 2019-10-24 Semiconductor device

Publications (1)

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USD937232S1 true USD937232S1 (en) 2021-11-30

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US29/710,616 Active USD938925S1 (en) 2019-10-24 2019-10-24 Semiconductor device
US29/801,764 Active USD937232S1 (en) 2019-10-24 2021-07-30 Semiconductor device

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US29/710,616 Active USD938925S1 (en) 2019-10-24 2019-10-24 Semiconductor device

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1054404S1 (en) * 2018-11-20 2024-12-17 Kontron Europe Gmbh Cellular module
USD1087928S1 (en) * 2022-08-16 2025-08-12 Modus Test, Llc Contact field for a printed circuit board

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1661378S (en) * 2020-02-27 2020-06-08
USD972933S1 (en) * 2020-11-24 2022-12-20 Panasonic Intellectual Property Management Co., Ltd. Package cushioning
JP1725479S (en) * 2022-01-05 2022-09-22
JP1725480S (en) * 2022-01-05 2022-09-22

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USD821338S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact fields for a printed circuit board
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
USD837171S1 (en) 2018-05-07 2019-01-01 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
JP1632597S (en) 2018-09-28 2019-05-27
JP1632160S (en) 2018-09-28 2019-05-27
USD850309S1 (en) 2017-07-27 2019-06-04 Aehr Test Systems Layout of contacts
USD856948S1 (en) 2018-05-07 2019-08-20 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
JP1640664S (en) 2018-06-19 2019-09-09
JP1641049S (en) 2018-06-19 2019-09-09
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US10510626B2 (en) 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
USD872033S1 (en) 2018-09-14 2020-01-07 Telit Communications S.P.A. Connection module
USD872032S1 (en) 2018-09-14 2020-01-07 Telit Communications S.P.A. Connection module
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD902164S1 (en) 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD904325S1 (en) 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD927429S1 (en) * 2019-03-15 2021-08-10 Modus Test, Llc Plurality of contact fields for a printed circuit board

Patent Citations (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US273559A (en) 1883-03-06 Chaeles s
US729489A (en) 1902-10-04 1903-05-26 Mattson Rubber Company Game-piece.
US1998526A (en) 1932-09-23 1935-04-23 Schubert Philipp Domino
USD319814S (en) 1988-04-13 1991-09-10 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319045S (en) 1988-04-13 1991-08-13 Ibiden Co., Ltd. Semi-conductor substrate with conducting pattern
USD319629S (en) 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD318461S (en) 1988-04-13 1991-07-23 Ibiden Co., Ltd. Semi-conductor mounting substrate
US5370398A (en) 1993-06-30 1994-12-06 Nguyen; Thang V. Close and open game
US5757082A (en) 1995-07-31 1998-05-26 Rohm Co., Ltd. Semiconductor chips, devices incorporating same and method of making same
US5858815A (en) * 1996-06-21 1999-01-12 Anam Semiconductor Inc. Semiconductor package and method for fabricating the same
US6589817B1 (en) * 1996-12-03 2003-07-08 Oki Electric Industry Co., Ltd. Semiconductor device, method for manufacturing the same, and method for mounting the same
US6307269B1 (en) 1997-07-11 2001-10-23 Hitachi, Ltd. Semiconductor device with chip size package
US6836002B2 (en) 2000-03-09 2004-12-28 Sharp Kabushiki Kaisha Semiconductor device
USD487430S1 (en) 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
US8177993B2 (en) * 2006-11-05 2012-05-15 Globalfoundries Singapore Pte Ltd Apparatus and methods for cleaning and drying of wafers
USD598380S1 (en) 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
US20100326710A1 (en) * 2009-06-29 2010-12-30 Guigen Zhang Mono-Domain Hexagonal Arrays of Nanopillars and Processes For Preparing the Same
US8294250B2 (en) * 2009-10-12 2012-10-23 Samsung Electronics Co., Ltd. Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate
USD633672S1 (en) * 2010-02-10 2011-03-01 The Libman Company Pad
USD704155S1 (en) 2010-08-19 2014-05-06 Epistar Corporation Wafer carrier
USD687898S1 (en) 2012-06-11 2013-08-13 Raymond Lupkas Set of pai-gow tiles
USD757693S1 (en) 2013-09-26 2016-05-31 Murata Manufacturing Co., Ltd. Wireless transmission/reception module
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD754083S1 (en) 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD778850S1 (en) 2014-05-15 2017-02-14 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD730304S1 (en) 2014-05-15 2015-05-26 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD764424S1 (en) 2014-05-15 2016-08-23 Kabushiki Kaisha Toshiba Substrate for an electronic circuit
USD821338S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact fields for a printed circuit board
USD821337S1 (en) * 2015-01-20 2018-06-26 Modus Test Automation, Llc. Contact field for a printed circuit board
USD789456S1 (en) 2015-02-12 2017-06-13 Wenlan H. Frost Set of square domino tiles
US10510626B2 (en) 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
USD797066S1 (en) 2015-08-17 2017-09-12 Cooper Technologies Company Integrated light emitting diode (LED) light engine
USD904355S1 (en) 2015-12-11 2020-12-08 Gemalto M2M Gmbh Radio module
USD831009S1 (en) * 2015-12-11 2018-10-16 Gemalto M2M Gmbh Radio module
JP1581768S (en) 2016-08-02 2017-07-24
USD813182S1 (en) 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
JP1588125S (en) 2017-04-26 2017-10-16
JP1588481S (en) 2017-04-26 2017-10-16
USD850309S1 (en) 2017-07-27 2019-06-04 Aehr Test Systems Layout of contacts
USD893439S1 (en) 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD856948S1 (en) 2018-05-07 2019-08-20 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD837171S1 (en) 2018-05-07 2019-01-01 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
JP1641049S (en) 2018-06-19 2019-09-09
JP1641048S (en) 2018-06-19 2019-09-09
JP1640664S (en) 2018-06-19 2019-09-09
USD872033S1 (en) 2018-09-14 2020-01-07 Telit Communications S.P.A. Connection module
USD872032S1 (en) 2018-09-14 2020-01-07 Telit Communications S.P.A. Connection module
JP1632597S (en) 2018-09-28 2019-05-27
JP1632160S (en) 2018-09-28 2019-05-27
USD887999S1 (en) * 2018-10-17 2020-06-23 Oupiin Electronic (Kunshan) Co., Ltd Circuit board with zigzag routes
USD902164S1 (en) 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD927429S1 (en) * 2019-03-15 2021-08-10 Modus Test, Llc Plurality of contact fields for a printed circuit board
USD904325S1 (en) 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1054404S1 (en) * 2018-11-20 2024-12-17 Kontron Europe Gmbh Cellular module
USD986840S1 (en) * 2020-05-13 2023-05-23 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD988300S1 (en) * 2021-03-09 2023-06-06 Thales Dis Ais Deutschland Gmbh IoT module
USD988299S1 (en) * 2021-06-18 2023-06-06 Telit Cinterion Deutschland Gmbh Cellular module
USD1087928S1 (en) * 2022-08-16 2025-08-12 Modus Test, Llc Contact field for a printed circuit board

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