USD906273S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD906273S1
USD906273S1 US29/689,360 US201929689360F USD906273S US D906273 S1 USD906273 S1 US D906273S1 US 201929689360 F US201929689360 F US 201929689360F US D906273 S USD906273 S US D906273S
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semiconductor device
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design
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Ryota Majima
Koshun SAITO
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAITO, KOSHUN, MAJIMA, RYOTA
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US29/689,360 2018-11-07 2019-04-29 Semiconductor device Active USD906273S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2018-24475F JP1633578S (enrdf_load_stackoverflow) 2018-11-07 2018-11-07
JP2018-024475 2018-11-07

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USD906273S1 true USD906273S1 (en) 2020-12-29

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JP (1) JP1633578S (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus

Citations (23)

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USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
JP1563812S (enrdf_load_stackoverflow) 2016-04-11 2016-11-21
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD796978S1 (en) * 2016-03-24 2017-09-12 Advantest Corporation Socket for electronic device testing apparatus
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
US10546825B2 (en) * 2017-05-24 2020-01-28 Advanced Semiconductor Engineering, Inc. Semiconductor package device
US10553559B2 (en) * 2015-10-28 2020-02-04 Mitsubishi Electric Corporation Power semiconductor device
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10600789B2 (en) * 2016-12-19 2020-03-24 Samsung Electronics Co., Ltd. Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
US10636703B2 (en) * 2010-05-10 2020-04-28 Magnachip Semiconductor, Ltd. Semiconductor device for preventing crack in pad region and fabricating method thereof
US10644115B2 (en) * 2018-02-28 2020-05-05 Flosfia Inc. Layered structure and semiconductor device including layered structure
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device

Patent Citations (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
US10636703B2 (en) * 2010-05-10 2020-04-28 Magnachip Semiconductor, Ltd. Semiconductor device for preventing crack in pad region and fabricating method thereof
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD839220S1 (en) * 2013-02-19 2019-01-29 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
US10510626B2 (en) * 2015-07-06 2019-12-17 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
US10553559B2 (en) * 2015-10-28 2020-02-04 Mitsubishi Electric Corporation Power semiconductor device
USD796978S1 (en) * 2016-03-24 2017-09-12 Advantest Corporation Socket for electronic device testing apparatus
JP1563812S (enrdf_load_stackoverflow) 2016-04-11 2016-11-21
US10600744B2 (en) * 2016-11-15 2020-03-24 Rohm Co., Ltd. Semiconductor device
US10600789B2 (en) * 2016-12-19 2020-03-24 Samsung Electronics Co., Ltd. Micro-pattern forming method, capacitor and method of manufacturing the same, semiconductor device and method of manufacturing the same, and electronic system including semiconductor device
US10557191B2 (en) * 2017-01-31 2020-02-11 Sakai Display Products Corporation Method for producing deposition mask, deposition mask, and method for producing organic semiconductor device
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
US10546825B2 (en) * 2017-05-24 2020-01-28 Advanced Semiconductor Engineering, Inc. Semiconductor package device
USD873227S1 (en) * 2017-10-23 2020-01-21 Mitsubishi Electric Corporation Semiconductor device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
US10651050B2 (en) * 2017-12-01 2020-05-12 Micron Technology, Inc. Semiconductor device packages and structures
US10672878B2 (en) * 2018-02-08 2020-06-02 Panasonic Intellectual Property Management Co., Ltd. Silicon carbide semiconductor device
US10644115B2 (en) * 2018-02-28 2020-05-05 Flosfia Inc. Layered structure and semiconductor device including layered structure

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
"Integrated circuit device," Toshiba Semiconductor Company, Japan, JPO Publicly Known Design No. HC2000747100 date of making available to the public: Jun. 11, 2008, 5 pages including English translation of bibliographic data.
Office Action issued for Japanese Patent Application No. 2018-024474, dated Mar. 1, 2019, 3 pages including abridged English translation.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD940669S1 (en) * 2018-11-19 2022-01-11 Kokusai Electric Corporation Boat for substrate processing apparatus
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
USD969093S1 (en) * 2019-05-29 2022-11-08 Diodes Incorported Leadframe
USD969763S1 (en) * 2019-05-29 2022-11-15 Diodes Incorporated Leadframe
USD969764S1 (en) * 2019-05-29 2022-11-15 Diodes Incorported Leadframe
USD980811S1 (en) * 2019-05-29 2023-03-14 Diodes Incorporated Leadframe
USD985518S1 (en) * 2019-05-29 2023-05-09 Diodes Incorporated Leadframe
USD922970S1 (en) 2019-10-28 2021-06-22 Rohm Co., Ltd. Semiconductor device
USD928105S1 (en) * 2019-10-28 2021-08-17 Rohm Co., Ltd. Semiconductor device

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