JP1633578S - - Google Patents

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Publication number
JP1633578S
JP1633578S JPD2018-24475F JP2018024475F JP1633578S JP 1633578 S JP1633578 S JP 1633578S JP 2018024475 F JP2018024475 F JP 2018024475F JP 1633578 S JP1633578 S JP 1633578S
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JPD2018-24475F
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JPD2018-24475F priority Critical patent/JP1633578S/ja
Priority to US29/689,360 priority patent/USD906273S1/en
Application granted granted Critical
Publication of JP1633578S publication Critical patent/JP1633578S/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JPD2018-24475F 2018-11-07 2018-11-07 Active JP1633578S (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JPD2018-24475F JP1633578S (ja) 2018-11-07 2018-11-07
US29/689,360 USD906273S1 (en) 2018-11-07 2019-04-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JPD2018-24475F JP1633578S (ja) 2018-11-07 2018-11-07

Publications (1)

Publication Number Publication Date
JP1633578S true JP1633578S (ja) 2019-06-10

Family

ID=66695484

Family Applications (1)

Application Number Title Priority Date Filing Date
JPD2018-24475F Active JP1633578S (ja) 2018-11-07 2018-11-07

Country Status (2)

Country Link
US (1) USD906273S1 (ja)
JP (1) JP1633578S (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1640260S (ja) * 2018-11-19 2019-09-02
USD940090S1 (en) * 2019-05-29 2022-01-04 Diodes Incorporated Leadframe
USD939458S1 (en) * 2019-05-29 2021-12-28 Diodes Incorporated Leadframe
JP1664527S (ja) 2019-10-28 2020-07-27
JP1664528S (ja) * 2019-10-28 2020-07-27

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD523403S1 (en) * 2004-09-09 2006-06-20 Kabushiki Kaisha Toshiba Substrate for a semiconductor device
KR101184375B1 (ko) * 2010-05-10 2012-09-20 매그나칩 반도체 유한회사 패드 영역의 크랙 발생을 방지하는 반도체 장치 및 그 제조 방법
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD717254S1 (en) * 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD769832S1 (en) * 2013-02-19 2016-10-25 Sony Corporation Semiconductor device
USD729250S1 (en) * 2013-07-30 2015-05-12 Samsung Electronics Co., Ltd. Semiconductor memory device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
US9553022B1 (en) * 2015-07-06 2017-01-24 Infineon Technologies Ag Method for use in manufacturing a semiconductor device die
CN107851639B (zh) * 2015-10-28 2020-08-25 三菱电机株式会社 电力用半导体装置
JP1561023S (ja) * 2016-03-24 2016-10-17
JP1563812S (ja) 2016-04-11 2016-11-21
JP6827776B2 (ja) * 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
KR20180070973A (ko) * 2016-12-19 2018-06-27 삼성전자주식회사 미세 패턴 형성 방법, 커패시터 및 그의 형성 방법, 반도체 소자 및 그의 제조 방법, 반도체 소자를 포함하는 전자 시스템
CN113737128A (zh) * 2017-01-31 2021-12-03 堺显示器制品株式会社 蒸镀掩模、蒸镀掩模及有机半导体元件的制造方法
US10605828B2 (en) * 2017-03-30 2020-03-31 Advanced Semiconductor Engineering, Inc. Device for attaching a semiconductor device to a circuit board
JP1592769S (ja) * 2017-05-02 2017-12-11
US10199336B2 (en) * 2017-05-24 2019-02-05 Advanced Semiconductor Engineering, Inc. Antenna package device
USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
US10418255B2 (en) * 2017-12-01 2019-09-17 Micron Technology, Inc. Semiconductor device packages and related methods
JP7113221B2 (ja) * 2018-02-08 2022-08-05 パナソニックＩｐマネジメント株式会社 炭化珪素半導体装置
JP2019151922A (ja) * 2018-02-28 2019-09-12 株式会社Flosfia 積層体および半導体装置

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