USD985518S1 - Leadframe - Google Patents
Leadframe Download PDFInfo
- Publication number
- USD985518S1 USD985518S1 US29/813,452 US202129813452F USD985518S US D985518 S1 USD985518 S1 US D985518S1 US 202129813452 F US202129813452 F US 202129813452F US D985518 S USD985518 S US D985518S
- Authority
- US
- United States
- Prior art keywords
- leadframe
- elevational view
- view
- side elevational
- new design
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Description
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.
The shade lines in the figures show contours and not surface ornamentation.
Claims (1)
- The ornamental design for a leadframe, as shown and described.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/813,452 USD985518S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
US17/803,180 US20230317567A1 (en) | 2019-05-29 | 2022-08-31 | Leadframe |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/692,906 USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
US29/813,452 USD985518S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,906 Division USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,906 Continuation-In-Part USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
Publications (1)
Publication Number | Publication Date |
---|---|
USD985518S1 true USD985518S1 (en) | 2023-05-09 |
Family
ID=79030162
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,906 Active USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
US29/813,450 Active USD969763S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
US29/813,451 Active USD969764S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
US29/813,452 Active USD985518S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/692,906 Active USD939458S1 (en) | 2019-05-29 | 2019-05-29 | Leadframe |
US29/813,450 Active USD969763S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
US29/813,451 Active USD969764S1 (en) | 2019-05-29 | 2021-10-28 | Leadframe |
Country Status (1)
Country | Link |
---|---|
US (4) | USD939458S1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258520A1 (en) * | 2004-05-18 | 2005-11-24 | Dolan Douglas E | Packaged integrated circuit with MLP leadframe and method of making same |
US20090278241A1 (en) * | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
US20150084172A1 (en) * | 2013-09-26 | 2015-03-26 | Byung Tai Do | Integrated circuit packaging system with side solderable leads and method of manufacture thereof |
US20150200156A1 (en) * | 2014-01-13 | 2015-07-16 | Altera Corporation | Module having mirror-symmetric terminals and methods of forming the same |
US20150221584A1 (en) * | 2014-02-05 | 2015-08-06 | Texas Instruments Incorporated | Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe |
US20180130723A1 (en) * | 2014-03-07 | 2018-05-10 | Bridge Semiconductor Corporation | Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same |
US20180182642A1 (en) * | 2016-12-23 | 2018-06-28 | Texas Instruments Incorporated | Qfn pin routing thru lead frame etching |
US20190198352A1 (en) * | 2017-12-22 | 2019-06-27 | Texas Instruments Incorporated | Semiconductor package with filler particles in a mold compound |
US10347571B1 (en) * | 2018-01-09 | 2019-07-09 | Macom Technology Solutions Holdings, Inc. | Intra-package interference isolation |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20190355651A1 (en) * | 2018-05-21 | 2019-11-21 | Texas Instruments Incorporated | Two sided bondable lead frame |
US20200035586A1 (en) * | 2018-07-25 | 2020-01-30 | Semiconductor Components Industries, Llc | Chip-on-lead semiconductor device packages with electrically isolated signal leads |
US20200194351A1 (en) * | 2018-12-12 | 2020-06-18 | Stmicroelectronics, Inc. | Compact leadframe package |
US20200194357A1 (en) * | 2018-12-14 | 2020-06-18 | Texas Instruments Incorporated | Package with dies mounted on opposing surfaces of a leadframe |
US20200211933A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Leadframe die pad with partially-etched groove between through-hole slots |
US20200258825A1 (en) * | 2019-02-12 | 2020-08-13 | Texas Instruments Incorporated | High current packages with reduced solder layer count |
US20200303609A1 (en) * | 2019-03-22 | 2020-09-24 | Samsung Electronics Co., Ltd. | Light-emitting device packages |
US20200312754A1 (en) * | 2019-04-01 | 2020-10-01 | Fuji Electric Co., Ltd. | Semiconductor device |
US20200312958A1 (en) * | 2019-03-27 | 2020-10-01 | Intel Corporation | Source or drain structures with phosphorous and arsenic co-dopants |
US20200343168A1 (en) * | 2019-04-25 | 2020-10-29 | Stmicroelectronics, Inc. | Lead stabilization in semiconductor packages |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
US20200411421A1 (en) * | 2019-06-28 | 2020-12-31 | Semiconductor Components Industries, Llc | Semiconductor device assemblies |
US20210020553A1 (en) * | 2016-03-21 | 2021-01-21 | Infineon Technologies Ag | Leadframe leads having fully plated end faces |
US20210090980A1 (en) * | 2019-09-25 | 2021-03-25 | Texas Instruments Incorporated | Semiconductor package with solder standoff |
US20210225742A1 (en) * | 2020-01-22 | 2021-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
US20220020680A1 (en) * | 2020-07-14 | 2022-01-20 | Advanced Semiconductor Engineering, Inc. | Lead frame, package structure comprising the same and method for manufacturing the package structure |
US20220028767A1 (en) * | 2020-07-27 | 2022-01-27 | Texas Instruments Incorporated | Surface mount package for a semiconductor device |
US20220102248A1 (en) * | 2020-09-30 | 2022-03-31 | Semiconductor Components Industries, Llc | Concealed gate terminal semiconductor packages and related methods |
US20220139812A1 (en) * | 2020-11-03 | 2022-05-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10128171B1 (en) * | 2016-03-25 | 2018-11-13 | Marvell International Ltd. | Leadframe with improved half-etch layout to reduce defects caused during singulation |
US10763195B2 (en) * | 2018-03-23 | 2020-09-01 | Stmicroelectronics S.R.L. | Leadframe package using selectively pre-plated leadframe |
-
2019
- 2019-05-29 US US29/692,906 patent/USD939458S1/en active Active
-
2021
- 2021-10-28 US US29/813,450 patent/USD969763S1/en active Active
- 2021-10-28 US US29/813,451 patent/USD969764S1/en active Active
- 2021-10-28 US US29/813,452 patent/USD985518S1/en active Active
Patent Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050258520A1 (en) * | 2004-05-18 | 2005-11-24 | Dolan Douglas E | Packaged integrated circuit with MLP leadframe and method of making same |
US20090278241A1 (en) * | 2008-05-08 | 2009-11-12 | Yong Liu | Semiconductor die package including die stacked on premolded substrate including die |
US20150084172A1 (en) * | 2013-09-26 | 2015-03-26 | Byung Tai Do | Integrated circuit packaging system with side solderable leads and method of manufacture thereof |
US20150200156A1 (en) * | 2014-01-13 | 2015-07-16 | Altera Corporation | Module having mirror-symmetric terminals and methods of forming the same |
US20150221584A1 (en) * | 2014-02-05 | 2015-08-06 | Texas Instruments Incorporated | Stacked Synchronous Buck Converter Having Chip Embedded in Outside Recess of Leadframe |
US20180130723A1 (en) * | 2014-03-07 | 2018-05-10 | Bridge Semiconductor Corporation | Leadframe substrate with electronic component incorporated therein and semiconductor assembly using the same |
US20210020553A1 (en) * | 2016-03-21 | 2021-01-21 | Infineon Technologies Ag | Leadframe leads having fully plated end faces |
US20180182642A1 (en) * | 2016-12-23 | 2018-06-28 | Texas Instruments Incorporated | Qfn pin routing thru lead frame etching |
USD864884S1 (en) * | 2017-10-23 | 2019-10-29 | Mitsubishi Electric Corporation | Semiconductor device |
US20190198352A1 (en) * | 2017-12-22 | 2019-06-27 | Texas Instruments Incorporated | Semiconductor package with filler particles in a mold compound |
US10347571B1 (en) * | 2018-01-09 | 2019-07-09 | Macom Technology Solutions Holdings, Inc. | Intra-package interference isolation |
US20190355651A1 (en) * | 2018-05-21 | 2019-11-21 | Texas Instruments Incorporated | Two sided bondable lead frame |
US20200035586A1 (en) * | 2018-07-25 | 2020-01-30 | Semiconductor Components Industries, Llc | Chip-on-lead semiconductor device packages with electrically isolated signal leads |
USD900759S1 (en) * | 2018-11-07 | 2020-11-03 | Rohm Co., Ltd. | Semiconductor device |
USD906273S1 (en) * | 2018-11-07 | 2020-12-29 | Rohm Co., Ltd. | Semiconductor device |
US20200194351A1 (en) * | 2018-12-12 | 2020-06-18 | Stmicroelectronics, Inc. | Compact leadframe package |
US20200194357A1 (en) * | 2018-12-14 | 2020-06-18 | Texas Instruments Incorporated | Package with dies mounted on opposing surfaces of a leadframe |
US20200211933A1 (en) * | 2018-12-31 | 2020-07-02 | Texas Instruments Incorporated | Leadframe die pad with partially-etched groove between through-hole slots |
US20200258825A1 (en) * | 2019-02-12 | 2020-08-13 | Texas Instruments Incorporated | High current packages with reduced solder layer count |
US20200303609A1 (en) * | 2019-03-22 | 2020-09-24 | Samsung Electronics Co., Ltd. | Light-emitting device packages |
US20200312958A1 (en) * | 2019-03-27 | 2020-10-01 | Intel Corporation | Source or drain structures with phosphorous and arsenic co-dopants |
US20200312754A1 (en) * | 2019-04-01 | 2020-10-01 | Fuji Electric Co., Ltd. | Semiconductor device |
US20200343168A1 (en) * | 2019-04-25 | 2020-10-29 | Stmicroelectronics, Inc. | Lead stabilization in semiconductor packages |
USD939458S1 (en) * | 2019-05-29 | 2021-12-28 | Diodes Incorporated | Leadframe |
USD940090S1 (en) * | 2019-05-29 | 2022-01-04 | Diodes Incorporated | Leadframe |
US20200411421A1 (en) * | 2019-06-28 | 2020-12-31 | Semiconductor Components Industries, Llc | Semiconductor device assemblies |
US20210090980A1 (en) * | 2019-09-25 | 2021-03-25 | Texas Instruments Incorporated | Semiconductor package with solder standoff |
US20210225742A1 (en) * | 2020-01-22 | 2021-07-22 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure |
US20220020680A1 (en) * | 2020-07-14 | 2022-01-20 | Advanced Semiconductor Engineering, Inc. | Lead frame, package structure comprising the same and method for manufacturing the package structure |
US20220028767A1 (en) * | 2020-07-27 | 2022-01-27 | Texas Instruments Incorporated | Surface mount package for a semiconductor device |
US20220102248A1 (en) * | 2020-09-30 | 2022-03-31 | Semiconductor Components Industries, Llc | Concealed gate terminal semiconductor packages and related methods |
US20220139812A1 (en) * | 2020-11-03 | 2022-05-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
USD969764S1 (en) | 2022-11-15 |
USD939458S1 (en) | 2021-12-28 |
USD969763S1 (en) | 2022-11-15 |
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Legal Events
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---|---|---|---|
FEPP | Fee payment procedure |
Free format text: ENTITY STATUS SET TO UNDISCOUNTED (ORIGINAL EVENT CODE: BIG.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |