USD888903S1 - Deposition ring for physical vapor deposition chamber - Google Patents

Deposition ring for physical vapor deposition chamber Download PDF

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Publication number
USD888903S1
USD888903S1 US29/673,685 US201829673685F USD888903S US D888903 S1 USD888903 S1 US D888903S1 US 201829673685 F US201829673685 F US 201829673685F US D888903 S USD888903 S US D888903S
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United States
Prior art keywords
physical vapor
ring
deposition
vapor deposition
chamber
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US29/673,685
Inventor
David Gunther
Cheng-Hsiung Tsai
Kirankumar Neelasandra Savandaiah
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Priority to US29/673,685 priority Critical patent/USD888903S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: GUNTHER, David, TSAI, CHENG-HSIUNG, SAVANDAIAH, KIRANKUMAR NEELASANDRA
Priority to TW108303547F priority patent/TWD207532S/en
Priority to JPD2020-4209F priority patent/JP1669283S/ja
Priority to JPD2019-13254F priority patent/JP1669226S/ja
Priority to TW108303547D01F priority patent/TWD209650S/en
Application granted granted Critical
Publication of USD888903S1 publication Critical patent/USD888903S1/en
Active legal-status Critical Current
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FIG. 1 is a perspective view of a deposition ring for a physical vapor deposition chamber, according to the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a left side elevation view thereof.
FIG. 7 is a right side elevation view thereof.
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2.
FIG. 9 is a perspective view of a deposition ring for a physical vapor deposition chamber, according to the novel design.
FIG. 10 is a top plan view thereof.
FIG. 11 is a bottom plan view thereof.
FIG. 12 is a front elevation view thereof.
FIG. 13 is a back elevation view thereof.
FIG. 14 is a left side elevation view thereof.
FIG. 15 is a right side elevation view thereof; and,
FIG. 16 is a cross-sectional view taken along line 16-16 in FIG. 10.
The dashed lines in FIGS. 9-16 represent unclaimed environment forming no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a deposition ring for a physical vapor deposition chamber, as shown and described.
US29/673,685 2018-12-17 2018-12-17 Deposition ring for physical vapor deposition chamber Active USD888903S1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US29/673,685 USD888903S1 (en) 2018-12-17 2018-12-17 Deposition ring for physical vapor deposition chamber
TW108303547F TWD207532S (en) 2018-12-17 2019-06-17 Deposition ring for pvd chamber
JPD2020-4209F JP1669283S (en) 2018-12-17 2019-06-17
JPD2019-13254F JP1669226S (en) 2018-12-17 2019-06-17
TW108303547D01F TWD209650S (en) 2018-12-17 2019-06-17 Deposition ring for pvd chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/673,685 USD888903S1 (en) 2018-12-17 2018-12-17 Deposition ring for physical vapor deposition chamber

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USD888903S1 true USD888903S1 (en) 2020-06-30

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US29/673,685 Active USD888903S1 (en) 2018-12-17 2018-12-17 Deposition ring for physical vapor deposition chamber

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US (1) USD888903S1 (en)
JP (2) JP1669226S (en)
TW (2) TWD209650S (en)

Cited By (55)

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USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
TWD214021S (en) 2020-07-27 2021-09-11 美商應用材料股份有限公司 Edge ring
USD932721S1 (en) * 2020-02-26 2021-10-05 Bway Corporation Container ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD936190S1 (en) * 2020-02-27 2021-11-16 Caterpillar Inc. Ripple seal
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD939695S1 (en) * 2020-12-18 2021-12-28 North Shore Medical, Llc Disposable commode receptacle
USD939694S1 (en) * 2019-11-06 2021-12-28 North Shore Medical, Llc Disposable commode receptacle
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD972101S1 (en) * 2020-05-08 2022-12-06 Bloomy Lotus Ltd Air purifier
US20220406573A1 (en) * 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD985741S1 (en) * 2020-11-06 2023-05-09 Kubota Corporation Gland for pipe joints
TWD227909S (en) 2023-04-21 2023-10-01 錩崎勝企業有限公司 Sealing materials for wall faucet covers
US11832770B2 (en) 2019-11-06 2023-12-05 North Shore Medical, Llc Disposable commode receptacle
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1011671S1 (en) 1991-07-02 2024-01-16 Bway Corporation Container
USD1015669S1 (en) 2020-02-26 2024-02-20 Bway Corporation Container ring
US11961723B2 (en) * 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1032795S1 (en) * 2022-03-03 2024-06-25 Advanced Drainage Systems, Inc. Reducing plate
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1059312S1 (en) * 2022-08-04 2025-01-28 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1064818S1 (en) * 2022-08-29 2025-03-04 Bway Corporation Container ring
USD1064817S1 (en) * 2022-08-29 2025-03-04 Bway Corporation Container ring
USD1069054S1 (en) * 2022-08-08 2025-04-01 As America, Inc. Gasket
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD1079661S1 (en) * 2023-08-31 2025-06-17 Kokusai Electric Corporation Susceptor of semiconductor manufacturing apparatus
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1093328S1 (en) * 2023-01-11 2025-09-16 Nuflare Technology, Inc. Susceptor
USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
USD1094320S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1098057S1 (en) * 2022-10-20 2025-10-14 Nuflare Technology, Inc. Susceptor cover

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD244533S (en) * 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
USD338621S (en) * 1991-03-14 1993-08-24 Balson John E Rim seal for a can
USD379588S (en) * 1995-03-22 1997-06-03 Greene, Tweed Of Delaware, Inc. Seal
US5803977A (en) * 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
US5863340A (en) 1996-05-08 1999-01-26 Flanigan; Allen Deposition ring anti-rotation apparatus
USD497977S1 (en) * 2003-01-22 2004-11-02 Tour & Andersson Ab Sealing ring membrane
US20070102286A1 (en) 2005-10-31 2007-05-10 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7282123B2 (en) 2002-12-16 2007-10-16 Ifire Technology Corp. Composite sputter target and phosphor deposition method
US20080141942A1 (en) * 2006-12-19 2008-06-19 Applied Materials, Inc. Non-contact process kit
US7520969B2 (en) * 2006-03-07 2009-04-21 Applied Materials, Inc. Notched deposition ring
US20120042825A1 (en) * 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120103257A1 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
TWM431893U (en) 2012-02-10 2012-06-21 Well Thin Technology Ltd Deposition ring
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
US8596870B2 (en) * 2008-04-14 2013-12-03 Hitachi Construction Machinery Co., Ltd. Bearing device
TW201413868A (en) 2012-08-30 2014-04-01 應用材料股份有限公司 Reflective deposition rings and substrate processing chambers incorporating same
US20150047563A1 (en) 2013-08-16 2015-02-19 Taiwan Semiconductor Manufacturing Company Limited Patterned processing kits for material processing
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
TWD180764S (en) 2015-06-18 2017-01-11 應用材料股份有限公司 Portion of a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
TWD188898S (en) 2016-09-30 2018-03-01 應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
CN207176067U (en) 2017-06-08 2018-04-03 北京北方华创微电子装备有限公司 Deposition ring and chuck assembly
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads

Patent Citations (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD244533S (en) * 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
USD338621S (en) * 1991-03-14 1993-08-24 Balson John E Rim seal for a can
US5803977A (en) * 1992-09-30 1998-09-08 Applied Materials, Inc. Apparatus for full wafer deposition
USD379588S (en) * 1995-03-22 1997-06-03 Greene, Tweed Of Delaware, Inc. Seal
US5863340A (en) 1996-05-08 1999-01-26 Flanigan; Allen Deposition ring anti-rotation apparatus
US7282123B2 (en) 2002-12-16 2007-10-16 Ifire Technology Corp. Composite sputter target and phosphor deposition method
USD497977S1 (en) * 2003-01-22 2004-11-02 Tour & Andersson Ab Sealing ring membrane
US20070102286A1 (en) 2005-10-31 2007-05-10 Applied Materials, Inc. Process kit and target for substrate processing chamber
US7520969B2 (en) * 2006-03-07 2009-04-21 Applied Materials, Inc. Notched deposition ring
US20080141942A1 (en) * 2006-12-19 2008-06-19 Applied Materials, Inc. Non-contact process kit
US8596870B2 (en) * 2008-04-14 2013-12-03 Hitachi Construction Machinery Co., Ltd. Bearing device
US20120042825A1 (en) * 2010-08-20 2012-02-23 Applied Materials, Inc. Extended life deposition ring
US20120103257A1 (en) * 2010-10-29 2012-05-03 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
US9689070B2 (en) 2010-10-29 2017-06-27 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
US8911601B2 (en) * 2010-10-29 2014-12-16 Applied Materials, Inc. Deposition ring and electrostatic chuck for physical vapor deposition chamber
USD665491S1 (en) * 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
US20130206070A1 (en) * 2012-02-10 2013-08-15 Well Thin Technology, Ltd. Deposition ring
TWM431893U (en) 2012-02-10 2012-06-21 Well Thin Technology Ltd Deposition ring
TW201413868A (en) 2012-08-30 2014-04-01 應用材料股份有限公司 Reflective deposition rings and substrate processing chambers incorporating same
TWI600108B (en) 2012-08-30 2017-09-21 應用材料股份有限公司 Reflective deposition rings and substrate processing chambers incorporating same
US9534286B2 (en) 2013-03-15 2017-01-03 Applied Materials, Inc. PVD target for self-centering process shield
US20150047563A1 (en) 2013-08-16 2015-02-19 Taiwan Semiconductor Manufacturing Company Limited Patterned processing kits for material processing
US9960021B2 (en) 2013-12-18 2018-05-01 Applied Materials, Inc. Physical vapor deposition (PVD) target having low friction pads
TWD180764S (en) 2015-06-18 2017-01-11 應用材料股份有限公司 Portion of a physical vapor deposition chamber target
TWD181803S (en) 2015-06-18 2017-03-11 應用材料股份有限公司 Portion of a physical vapor deposition chamber target
US20170002461A1 (en) 2015-07-03 2017-01-05 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
US9909206B2 (en) 2015-07-03 2018-03-06 Applied Materials, Inc. Process kit having tall deposition ring and deposition ring clamp
TWD188898S (en) 2016-09-30 2018-03-01 應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
TWD191626S (en) 2016-09-30 2018-07-11 應用材料股份有限公司 Target profile for a physical vapor deposition chamber target
CN206573738U (en) 2017-03-16 2017-10-20 江苏亨通光导新材料有限公司 Low loss fiber
CN207176067U (en) 2017-06-08 2018-04-03 北京北方华创微电子装备有限公司 Deposition ring and chuck assembly

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2019/065900 dated Apr. 10, 2020.
Search Report for Taiwan Design Application No. 108303547, dated Dec. 10, 2019.

Cited By (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1011671S1 (en) 1991-07-02 2024-01-16 Bway Corporation Container
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US12293902B2 (en) 2018-01-19 2025-05-06 Applied Materials, Inc. Process kit for a substrate support
USD1040304S1 (en) * 2018-12-17 2024-08-27 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber
US11961723B2 (en) * 2018-12-17 2024-04-16 Applied Materials, Inc. Process kit having tall deposition ring for PVD chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) * 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
US11832770B2 (en) 2019-11-06 2023-12-05 North Shore Medical, Llc Disposable commode receptacle
USD939694S1 (en) * 2019-11-06 2021-12-28 North Shore Medical, Llc Disposable commode receptacle
US11551960B2 (en) 2020-01-30 2023-01-10 Applied Materials, Inc. Helical plug for reduction or prevention of arcing in a substrate support
USD1015669S1 (en) 2020-02-26 2024-02-20 Bway Corporation Container ring
USD932721S1 (en) * 2020-02-26 2021-10-05 Bway Corporation Container ring
USD936190S1 (en) * 2020-02-27 2021-11-16 Caterpillar Inc. Ripple seal
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD934315S1 (en) * 2020-03-20 2021-10-26 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD972101S1 (en) * 2020-05-08 2022-12-06 Bloomy Lotus Ltd Air purifier
TWD214021S (en) 2020-07-27 2021-09-11 美商應用材料股份有限公司 Edge ring
USD1034491S1 (en) * 2020-07-27 2024-07-09 Applied Materials, Inc. Edge ring
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber
US11581166B2 (en) 2020-07-31 2023-02-14 Applied Materials, Inc. Low profile deposition ring for enhanced life
USD985741S1 (en) * 2020-11-06 2023-05-09 Kubota Corporation Gland for pipe joints
US11996315B2 (en) 2020-11-18 2024-05-28 Applied Materials, Inc. Thin substrate handling via edge clamping
USD1038049S1 (en) * 2020-11-18 2024-08-06 Applied Materials, Inc. Cover ring for use in semiconductor processing chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1052546S1 (en) * 2020-12-10 2024-11-26 Nuflare Technology, Inc. Cover ring of top plate for semiconductor manufacturing apparatus
USD939695S1 (en) * 2020-12-18 2021-12-28 North Shore Medical, Llc Disposable commode receptacle
USD1072774S1 (en) 2021-02-06 2025-04-29 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11581167B2 (en) * 2021-06-18 2023-02-14 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (ESC) for PVD chamber
US20220406573A1 (en) * 2021-06-18 2022-12-22 Applied Materials, Inc. Process kit having tall deposition ring and smaller diameter electrostatic chuck (esc) for pvd chamber
USD1032795S1 (en) * 2022-03-03 2024-06-25 Advanced Drainage Systems, Inc. Reducing plate
USD1042374S1 (en) * 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1055006S1 (en) 2022-03-18 2024-12-24 Applied Materials, Inc. Support ring for an interlocking process kit for a substrate processing chamber
USD1053230S1 (en) 2022-05-19 2024-12-03 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD1069863S1 (en) 2022-08-04 2025-04-08 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1064005S1 (en) 2022-08-04 2025-02-25 Applied Materials, Inc. Grounding ring of a process kit for semiconductor substrate processing
USD1059312S1 (en) * 2022-08-04 2025-01-28 Applied Materials, Inc. Deposition ring of a process kit for semiconductor substrate processing
USD1069054S1 (en) * 2022-08-08 2025-04-01 As America, Inc. Gasket
USD1064818S1 (en) * 2022-08-29 2025-03-04 Bway Corporation Container ring
USD1064817S1 (en) * 2022-08-29 2025-03-04 Bway Corporation Container ring
USD1094322S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1098057S1 (en) * 2022-10-20 2025-10-14 Nuflare Technology, Inc. Susceptor cover
USD1096676S1 (en) * 2022-10-20 2025-10-07 Nuflare Technology, Inc. Cover base for susceptors
USD1094320S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor
USD1094321S1 (en) * 2022-10-20 2025-09-23 Nuflare Technology, Inc. Susceptor cover
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1093328S1 (en) * 2023-01-11 2025-09-16 Nuflare Technology, Inc. Susceptor
USD1094323S1 (en) * 2023-01-11 2025-09-23 Nuflare Technology, Inc. Susceptor unit
USD1082731S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
USD1082729S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor cover
USD1082728S1 (en) * 2023-01-11 2025-07-08 Nuflare Technology, Inc. Susceptor
TWD227909S (en) 2023-04-21 2023-10-01 錩崎勝企業有限公司 Sealing materials for wall faucet covers
USD1079661S1 (en) * 2023-08-31 2025-06-17 Kokusai Electric Corporation Susceptor of semiconductor manufacturing apparatus

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Publication number Publication date
JP1669283S (en) 2020-09-28
TWD209650S (en) 2021-02-01
TWD207532S (en) 2020-10-01
JP1669226S (en) 2020-09-28

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