TWD214021S - Edge ring - Google Patents

Edge ring Download PDF

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Publication number
TWD214021S
TWD214021S TW110300464F TW110300464F TWD214021S TW D214021 S TWD214021 S TW D214021S TW 110300464 F TW110300464 F TW 110300464F TW 110300464 F TW110300464 F TW 110300464F TW D214021 S TWD214021 S TW D214021S
Authority
TW
Taiwan
Prior art keywords
view
edge ring
mirror symmetrical
design
manufacturing process
Prior art date
Application number
TW110300464F
Other languages
Chinese (zh)
Inventor
建邦 勞
弗拉迪米爾 納戈尼
煒 劉
泰瑞莎克拉莫 瓜立尼
明綠 黃
麥爾肯Ｊ 畢凡
雅各 阿布拉罕
斯瓦葉胡佩拉塞德 貝荷拉
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD214021S publication Critical patent/TWD214021S/en

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Abstract

【物品用途】;本設計所請求邊緣環係應用於半導體製程。;【設計說明】;後視圖與前視圖呈鏡射對稱因而省略。;右側視圖與左側視圖呈鏡射對稱因而省略。;狀態參考圖中虛線表示另安裝元件。【Item Usage】;The edge ring system requested by this design is used in the semiconductor manufacturing process. ;[Design Description];The rear view and the front view are mirror symmetrical and are omitted. ;The right side view is mirror symmetrical to the left side view and is therefore omitted. ;The dotted lines in the status reference diagram indicate additional components to be installed.

Description

邊緣環 Edge ring

本設計所請求邊緣環係應用於半導體製程。 The edge ring system requested by this design is applied to semiconductor manufacturing process.

後視圖與前視圖呈鏡射對稱因而省略。 The rear view and the front view are mirror-symmetrical and are therefore omitted.

右側視圖與左側視圖呈鏡射對稱因而省略。 The right side view and the left side view are mirror-symmetrical and are therefore omitted.

狀態參考圖中虛線表示另安裝元件。 The dotted line in the state reference figure indicates another component is installed.

TW110300464F 2020-07-27 2021-01-27 Edge ring TWD214021S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/744,119 USD1034491S1 (en) 2020-07-27 2020-07-27 Edge ring
US29/744,119 2020-07-27

Publications (1)

Publication Number Publication Date
TWD214021S true TWD214021S (en) 2021-09-11

Family

ID=80216999

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110300464F TWD214021S (en) 2020-07-27 2021-01-27 Edge ring

Country Status (3)

Country Link
US (1) USD1034491S1 (en)
JP (2) JP1704603S (en)
TW (1) TWD214021S (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD828524S1 (en) 2016-09-26 2018-09-11 Noritz Corporation Packing for pipe adapter for water heater
USD834156S1 (en) 2017-10-17 2018-11-20 Flsmidth A/S Valve sleeve
TWD194249S (en) 2018-03-06 2018-11-21 大晟科技股份有限公司 Wafer clamp ring
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1542903A (en) * 1976-09-02 1979-03-28 Wellworthy Ltd Sealing ring assemblies for pistons
US5891348A (en) 1996-01-26 1999-04-06 Applied Materials, Inc. Process gas focusing apparatus and method
US5810931A (en) 1996-07-30 1998-09-22 Applied Materials, Inc. High aspect ratio clamp ring
US6277198B1 (en) 1999-06-04 2001-08-21 Applied Materials, Inc. Use of tapered shadow clamp ring to provide improved physical vapor deposition system
US6344105B1 (en) 1999-06-30 2002-02-05 Lam Research Corporation Techniques for improving etch rate uniformity
US6589352B1 (en) 1999-12-10 2003-07-08 Applied Materials, Inc. Self aligning non contact shadow ring process kit
TW517262B (en) 2000-03-16 2003-01-11 Applied Materials Inc Shadow ring with common guide member
US6896765B2 (en) 2002-09-18 2005-05-24 Lam Research Corporation Method and apparatus for the compensation of edge ring wear in a plasma processing chamber
US7147749B2 (en) 2002-09-30 2006-12-12 Tokyo Electron Limited Method and apparatus for an improved upper electrode plate with deposition shield in a plasma processing system
US20040259485A1 (en) * 2002-10-02 2004-12-23 Ensinger Kunstsofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
DE10247180A1 (en) * 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing device
US20040149226A1 (en) * 2003-01-30 2004-08-05 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate clamp ring with removable contract pads
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20150283668A1 (en) * 2014-04-04 2015-10-08 SPM Technology, Inc. Retaining ring assembly with inserts
US10658222B2 (en) 2015-01-16 2020-05-19 Lam Research Corporation Moveable edge coupling ring for edge process control during semiconductor wafer processing
JP1546800S (en) * 2015-06-12 2016-03-28
KR102709082B1 (en) 2015-07-03 2024-09-23 어플라이드 머티어리얼스, 인코포레이티드 Process kit with high deposition ring and deposition ring clamp
JP1584241S (en) * 2017-01-31 2017-08-21
US10553404B2 (en) 2017-02-01 2020-02-04 Applied Materials, Inc. Adjustable extended electrode for edge uniformity control
USD933725S1 (en) * 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
KR102124766B1 (en) 2019-12-31 2020-06-19 (주)삼양컴텍 Plasma processing apparatus and manufacturing method of the same
USD933726S1 (en) * 2020-07-31 2021-10-19 Applied Materials, Inc. Deposition ring for a semiconductor processing chamber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
TWD187824S (en) 2016-04-14 2018-01-11 應用材料股份有限公司 A composite edge ring
USD828524S1 (en) 2016-09-26 2018-09-11 Noritz Corporation Packing for pipe adapter for water heater
USD834156S1 (en) 2017-10-17 2018-11-20 Flsmidth A/S Valve sleeve
TWD194249S (en) 2018-03-06 2018-11-21 大晟科技股份有限公司 Wafer clamp ring
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber

Also Published As

Publication number Publication date
JP1704603S (en) 2022-01-13
USD1034491S1 (en) 2024-07-09
JP1708662S (en) 2022-03-01

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