TWD214021S - Edge ring - Google Patents

Edge ring Download PDF

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Publication number
TWD214021S
TWD214021S TW110300464F TW110300464F TWD214021S TW D214021 S TWD214021 S TW D214021S TW 110300464 F TW110300464 F TW 110300464F TW 110300464 F TW110300464 F TW 110300464F TW D214021 S TWD214021 S TW D214021S
Authority
TW
Taiwan
Prior art keywords
view
edge ring
mirror symmetrical
design
manufacturing process
Prior art date
Application number
TW110300464F
Other languages
Chinese (zh)
Inventor
建邦 勞
弗拉迪米爾 納戈尼
煒 劉
泰瑞莎克拉莫 瓜立尼
明綠 黃
麥爾肯Ｊ 畢凡
雅各 阿布拉罕
斯瓦葉胡佩拉塞德 貝荷拉
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TWD214021S publication Critical patent/TWD214021S/en

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Abstract

【物品用途】;本設計所請求邊緣環係應用於半導體製程。;【設計說明】;後視圖與前視圖呈鏡射對稱因而省略。;右側視圖與左側視圖呈鏡射對稱因而省略。;狀態參考圖中虛線表示另安裝元件。【Item Usage】;The edge ring system requested by this design is used in the semiconductor manufacturing process. ;[Design Description];The rear view and the front view are mirror symmetrical and are omitted. ;The right side view is mirror symmetrical to the left side view and is therefore omitted. ;The dotted lines in the status reference diagram indicate additional components to be installed.

Description

邊緣環 Edge ring

本設計所請求邊緣環係應用於半導體製程。 The edge ring system requested by this design is applied to semiconductor manufacturing process.

後視圖與前視圖呈鏡射對稱因而省略。 The rear view and the front view are mirror-symmetrical and are therefore omitted.

右側視圖與左側視圖呈鏡射對稱因而省略。 The right side view and the left side view are mirror-symmetrical and are therefore omitted.

狀態參考圖中虛線表示另安裝元件。 The dotted line in the state reference figure indicates another component is installed.

TW110300464F 2020-07-27 2021-01-27 Edge ring TWD214021S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202029744119 2020-07-27
US29/744,119 2020-07-27

Publications (1)

Publication Number Publication Date
TWD214021S true TWD214021S (en) 2021-09-11

Family

ID=80216999

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110300464F TWD214021S (en) 2020-07-27 2021-01-27 Edge ring

Country Status (2)

Country Link
JP (2) JP1704603S (en)
TW (1) TWD214021S (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD828524S1 (en) 2016-09-26 2018-09-11 Noritz Corporation Packing for pipe adapter for water heater
USD834156S1 (en) 2017-10-17 2018-11-20 Flsmidth A/S Valve sleeve
TWD194249S (en) 2018-03-06 2018-11-21 大晟科技股份有限公司 Wafer clamp ring
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD665491S1 (en) 2012-01-25 2012-08-14 Applied Materials, Inc. Deposition chamber cover ring
USD797691S1 (en) 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
TWD187824S (en) 2016-04-14 2018-01-11 應用材料股份有限公司 A composite edge ring
USD828524S1 (en) 2016-09-26 2018-09-11 Noritz Corporation Packing for pipe adapter for water heater
USD834156S1 (en) 2017-10-17 2018-11-20 Flsmidth A/S Valve sleeve
TWD194249S (en) 2018-03-06 2018-11-21 大晟科技股份有限公司 Wafer clamp ring
USD888903S1 (en) 2018-12-17 2020-06-30 Applied Materials, Inc. Deposition ring for physical vapor deposition chamber

Also Published As

Publication number Publication date
JP1704603S (en) 2022-01-13
JP1708662S (en) 2022-03-01

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