USD864882S1 - Part for semiconductor device - Google Patents

Part for semiconductor device Download PDF

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Publication number
USD864882S1
USD864882S1 US29/641,834 US201829641834F USD864882S US D864882 S1 USD864882 S1 US D864882S1 US 201829641834 F US201829641834 F US 201829641834F US D864882 S USD864882 S US D864882S
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United States
Prior art keywords
semiconductor device
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US29/641,834
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English (en)
Inventor
Takeshi Sakamoto
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Assigned to HAMAMATSU PHOTONICS K.K. reassignment HAMAMATSU PHOTONICS K.K. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SAKAMOTO, TAKESHI
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US29/641,834 2017-09-27 2018-03-26 Part for semiconductor device Active USD864882S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2017-21146F JP1603911S (cs) 2017-09-27 2017-09-27
JP2017-021146 2017-09-27

Publications (1)

Publication Number Publication Date
USD864882S1 true USD864882S1 (en) 2019-10-29

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ID=62104959

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US29/641,834 Active USD864882S1 (en) 2017-09-27 2018-03-26 Part for semiconductor device

Country Status (3)

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US (1) USD864882S1 (cs)
JP (1) JP1603911S (cs)
TW (1) TWD195586S (cs)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device

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TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
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TWM478909U (zh) 2012-11-20 2014-05-21 Kun-Chieh Chang 發光二極體晶片之複合陣列微透鏡
TWM482158U (zh) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd 黏著半導體晶片之裝置
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Patent Citations (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
USD395638S (en) * 1997-01-30 1998-06-30 Sony Corporation Semiconductor package
USD395423S (en) * 1997-03-13 1998-06-23 Sony Corporation Semiconductor package
USD432095S (en) * 1998-10-09 2000-10-17 Vishay Semiconductor Gmbh Light-emitting semi-conductor component
TW452191U (en) 1999-05-06 2001-08-21 Advanced Semiconductor Eng Semiconductor adhesive-film adhering platen with a positioning structure
TW404562U (en) 1999-05-06 2000-09-01 Advanced Semiconductor Eng Semiconductor glue film application platform with positioning structure
USD427977S (en) * 1999-06-18 2000-07-11 Fujikura Ltd. Piezoelectric conversion type semiconductor device
TW510503U (en) 1999-11-25 2002-11-11 Chipmos Technolgies Inc Distributing structure of wafer's testing pad and burning pad
TW446183U (en) 1999-11-25 2001-07-11 Chipmos Technologies Inc Wafer surface structure
TW491359U (en) 1999-11-25 2002-06-11 Chipmos Technologies Inc Connection distribution structure for etching pad mesh set of wafer
TW495035U (en) 1999-11-25 2002-07-11 Chipmos Technologies Inc Distribution structure of test pad network connection of wafer
TW443580U (en) 1999-11-25 2001-06-23 Chipmos Technologies Inc Distribution structure of net-shaped connecting wire for the scorching pad of wafer
TW461582U (en) 2000-11-07 2001-10-21 Chipmos Technologies Inc Laser repair and real-time detection device
TW529771U (en) 2001-11-28 2003-04-21 Advanced Semiconductor Eng Flip chip semiconductor device with solder balls
USD476959S1 (en) * 2002-07-31 2003-07-08 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
TW556957U (en) 2002-08-13 2003-10-01 Advanced Semiconductor Eng Semiconductor wafer and semiconductor device
TWM293525U (en) 2004-06-29 2006-07-01 Sino American Silicon Products Silicon wafer structure for power electronic device
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD589012S1 (en) * 2008-03-17 2009-03-24 Fuji Electric Device Technology Co., Ltd. Semiconductor device
TWM352128U (en) 2008-10-08 2009-03-01 Int Semiconductor Tech Ltd Semiconductor structure having silver bump
TWM379066U (en) 2009-12-18 2010-04-21 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe card
TWM386593U (en) 2010-03-29 2010-08-11 Quality Pro Technology Co Ltd Improved structure of semiconductor wafer probe
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
TWM478909U (zh) 2012-11-20 2014-05-21 Kun-Chieh Chang 發光二極體晶片之複合陣列微透鏡
USD704671S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD704670S1 (en) * 2013-01-24 2014-05-13 Fuji Electric Co., Ltd. Semiconductor device
USD710318S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710319S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Ltd. Semiconductor device
USD710317S1 (en) * 2013-01-24 2014-08-05 Fuji Electric Co., Inc. Semiconductor device
USD769834S1 (en) * 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD785577S1 (en) * 2013-08-21 2017-05-02 Mitsubishi Electric Corporation Semiconductor device
USD754084S1 (en) * 2013-08-21 2016-04-19 Mitsubishi Electric Corporation Semiconductor device
USD727861S1 (en) * 2013-08-24 2015-04-28 Apex Microelectronics Co., Ltd. Ink cartridge chip
TWM482158U (zh) 2013-08-29 2014-07-11 Gallant Micro Machining Co Ltd 黏著半導體晶片之裝置
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD776071S1 (en) * 2014-08-19 2017-01-10 Infineon Technologies Ag Power semiconductor module
USD775593S1 (en) * 2014-08-19 2017-01-03 Infineon Technologies Ag Power semiconductor module
USD775091S1 (en) * 2014-08-19 2016-12-27 Infineon Technologies Ag Power semiconductor module
USD762185S1 (en) * 2014-08-21 2016-07-26 Infineon Technologies Ag Power semiconductor module
USD774479S1 (en) * 2014-11-28 2016-12-20 Fuji Electric Co., Ltd. Semiconductor module
USD772184S1 (en) * 2014-12-24 2016-11-22 Fuji Electric Co., Ltd. Semiconductor module
USD773413S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD773412S1 (en) * 2015-02-04 2016-12-06 Mitsubishi Electric Corporation Semiconductor device
USD767516S1 (en) * 2015-02-04 2016-09-27 Mitsubishi Electric Corporation Semiconductor device
USD766851S1 (en) * 2015-02-04 2016-09-20 Mitsubishi Electric Corporation Semiconductor device
USD768115S1 (en) * 2015-02-05 2016-10-04 Armen E. Kazanchian Module
USD759604S1 (en) * 2015-06-17 2016-06-21 Mitsubishi Electric Corporation Semiconductor device
USD813182S1 (en) * 2016-08-02 2018-03-20 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD934821S1 (en) * 2019-07-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD934820S1 (en) * 2019-10-24 2021-11-02 Nuvoton Technology Corporation Japan Semiconductor device
USD937233S1 (en) 2019-10-24 2021-11-30 Nuvoton Technology Corporation Japan Semiconductor device

Also Published As

Publication number Publication date
JP1603911S (cs) 2018-05-14
TWD195586S (zh) 2019-01-21

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