USD796978S1 - Socket for electronic device testing apparatus - Google Patents

Socket for electronic device testing apparatus Download PDF

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Publication number
USD796978S1
USD796978S1 US29/560,253 US201629560253F USD796978S US D796978 S1 USD796978 S1 US D796978S1 US 201629560253 F US201629560253 F US 201629560253F US D796978 S USD796978 S US D796978S
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United States
Prior art keywords
socket
electronic device
view
testing apparatus
device testing
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US29/560,253
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English (en)
Inventor
Takashi Kawashima
Shintaro Takaki
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Advantest Corp
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Advantest Corp
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Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KAWASHIMA, TAKASHI, TAKAKI, SHINTARO
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Publication of USD796978S1 publication Critical patent/USD796978S1/en
Assigned to ADVANTEST CORPORATION reassignment ADVANTEST CORPORATION CHANGE OF ADDRESS Assignors: ADVANTEST CORPORATION
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US29/560,253 2016-03-24 2016-04-05 Socket for electronic device testing apparatus Active USD796978S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-6402F JP1561023S (enrdf_load_stackoverflow) 2016-03-24 2016-03-24
JP2016-006402 2016-03-24

Publications (1)

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USD796978S1 true USD796978S1 (en) 2017-09-12

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JP (1) JP1561023S (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836088S1 (en) * 2016-08-16 2018-12-18 Mitek Corp., Inc. Sleek ceiling speaker
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD967036S1 (en) * 2019-09-26 2022-10-18 Infineon Technologies Ag Electrical contact
USD978116S1 (en) * 2020-06-30 2023-02-14 Audio-Technica Corporation Microphone
USD1010620S1 (en) * 2019-09-09 2024-01-09 Murata Manufacturing Co., Ltd. Module for RFID

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8911266B2 (en) * 2010-06-01 2014-12-16 3M Innovative Properties Company Contact holder
US9039425B2 (en) * 2013-01-21 2015-05-26 Tyco Electronics Corporation Electrical interconnect device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8911266B2 (en) * 2010-06-01 2014-12-16 3M Innovative Properties Company Contact holder
US9039425B2 (en) * 2013-01-21 2015-05-26 Tyco Electronics Corporation Electrical interconnect device

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Office Action issued in China Appl. No. 201630224369.0, dated Dec. 9, 2016 , along with an English translation thereof.
Office Action issued in China Appl. No. 201630224369.0, dated Nov. 1, 2016 , along with an English translation thereof.
Office Action issued in Korea Counterpart Patent Appl. No. 30-2016-0017017, dated Oct. 4, 2016 , along with an English translation thereof.
Taiwanese Official Action in TW Appl. No. 103306664, Jul. 20, 2015.
Taiwanese Official Action in TW Appl. No. 103306665, Jul. 20, 2015.

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD836088S1 (en) * 2016-08-16 2018-12-18 Mitek Corp., Inc. Sleek ceiling speaker
USD893439S1 (en) * 2018-05-07 2020-08-18 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
USD933618S1 (en) * 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
USD1046799S1 (en) 2018-10-31 2024-10-15 Asahi Kasei Microdevices Corporation Semiconductor module
USD900759S1 (en) * 2018-11-07 2020-11-03 Rohm Co., Ltd. Semiconductor device
USD906273S1 (en) * 2018-11-07 2020-12-29 Rohm Co., Ltd. Semiconductor device
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD1010620S1 (en) * 2019-09-09 2024-01-09 Murata Manufacturing Co., Ltd. Module for RFID
USD967036S1 (en) * 2019-09-26 2022-10-18 Infineon Technologies Ag Electrical contact
USD978116S1 (en) * 2020-06-30 2023-02-14 Audio-Technica Corporation Microphone

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Publication number Publication date
JP1561023S (enrdf_load_stackoverflow) 2016-10-17

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