USD719926S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD719926S1
USD719926S1 US29/450,511 US201329450511F USD719926S US D719926 S1 USD719926 S1 US D719926S1 US 201329450511 F US201329450511 F US 201329450511F US D719926 S USD719926 S US D719926S
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US
United States
Prior art keywords
semiconductor device
view
ornamental design
semiconductor
perspective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/450,511
Inventor
Young Ho Sohn
Si Joong Yang
Young Ki Lee
Jin Su Kim
Dong Hwan Kim
Jong Man KIM
Kee Ju UM
Hyo Jin Lee
Young Hoon Kwak
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD. reassignment SAMSUNG ELECTRO-MECHANICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KIM, DONG HWAN, KIM, JIN SU, KIM, JONG MAN, LEE, HYO JIN, LEE, YOUNG KI, SOHN, YOUNG HO, UM, KEE JU, YANG, SI JOONG
Application granted granted Critical
Publication of USD719926S1 publication Critical patent/USD719926S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is a perspective view of a semiconductor device showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof, the right side view thereof being a mirror image;
FIG. 5 is a top plan view thereof; and,
FIG. 6 is a bottom plan view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for semiconductor device, as shown and described.
US29/450,511 2012-09-20 2013-03-18 Semiconductor device Active USD719926S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20120045472 2012-09-20
KR30-2012-0045472 2012-09-20

Publications (1)

Publication Number Publication Date
USD719926S1 true USD719926S1 (en) 2014-12-23

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ID=52102156

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/450,511 Active USD719926S1 (en) 2012-09-20 2013-03-18 Semiconductor device

Country Status (1)

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US (1) USD719926S1 (en)

Cited By (28)

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USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD743399S1 (en) * 2014-05-30 2015-11-17 Emc Corporation Flash module
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD836073S1 (en) * 2017-01-25 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1112116S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112118S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

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USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device

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* Cited by examiner, † Cited by third party
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US3602846A (en) * 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3825876A (en) * 1971-08-12 1974-07-23 Augat Inc Electrical component mounting
US3762039A (en) * 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
US3846734A (en) * 1973-02-06 1974-11-05 Amp Inc Frames for adapting a multi-contact electrical connector to electrically connect with various styles of substrates
US4951124A (en) * 1986-10-24 1990-08-21 Kabushiki Kaisha Toshiba Semiconductor device
USD357462S (en) * 1993-09-16 1995-04-18 Fuji Electric Co., Ltd. Hybrid integrated circuit for electric power control
USD394244S (en) * 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD401912S (en) * 1995-11-27 1998-12-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD418485S (en) * 1998-09-29 2000-01-04 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD421969S (en) * 1998-09-29 2000-03-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD432097S (en) * 1999-11-20 2000-10-17 Samsung Electronics Co., Ltd. Semiconductor package
USD448739S1 (en) 2000-09-12 2001-10-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD441727S1 (en) * 2000-10-04 2001-05-08 Sony Corporation Semiconductor element
USD459705S1 (en) * 2001-03-06 2002-07-02 Shindengen Electric Manufacturing Co., Ltd. Semiconductor package
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
US20030042584A1 (en) * 2001-09-05 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and method of manufacturing the same
USD470463S1 (en) * 2001-11-30 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470824S1 (en) * 2001-11-30 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD472530S1 (en) * 2001-11-30 2003-04-01 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD470825S1 (en) * 2001-12-28 2003-02-25 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505399S1 (en) * 2003-03-14 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD505400S1 (en) * 2004-03-26 2005-05-24 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
USD548202S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD548203S1 (en) * 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
USD539761S1 (en) * 2006-08-22 2007-04-03 Kabushiki Kaisha Toshiba Semiconductor
US20100149774A1 (en) * 2008-12-17 2010-06-17 Mitsubishi Electric Corporation Semiconductor device
USD653634S1 (en) * 2010-10-28 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD653633S1 (en) * 2010-12-14 2012-02-07 Fuji Electric Co., Ltd. Semiconductor
USD674760S1 (en) * 2011-04-01 2013-01-22 Fuji Electric Co., Ltd. Semiconductor device
USD686174S1 (en) * 2011-08-12 2013-07-16 Fuji Electric Co., Ltd Semiconductor device
USD703625S1 (en) * 2012-12-06 2014-04-29 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module
USD706232S1 (en) * 2012-12-21 2014-06-03 Fuji Electric Co., Ltd. Semiconductor device
USD705184S1 (en) * 2013-07-11 2014-05-20 Fuji Electric Co., Ltd. Semiconductor module

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD874411S1 (en) * 2008-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD742842S1 (en) * 2014-03-24 2015-11-10 Lem Intellectual Property Sa Electrical current transducer
USD770994S1 (en) * 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD772182S1 (en) * 2014-04-02 2016-11-22 Mitsubishi Electric Corporation Power semiconductor device
USD777124S1 (en) * 2014-04-02 2017-01-24 Mitsubishi Electric Corporation Power semiconductor device
USD783550S1 (en) * 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD743399S1 (en) * 2014-05-30 2015-11-17 Emc Corporation Flash module
USD836073S1 (en) * 2017-01-25 2018-12-18 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD836565S1 (en) * 2017-01-25 2018-12-25 Shindengen Electric Manufacturing Co., Ltd. Solid state relay
USD864135S1 (en) * 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD877102S1 (en) * 2017-12-28 2020-03-03 Shindengen Electric Manufacturing Co., Ltd. Semiconductor module
USD873226S1 (en) * 2018-04-13 2020-01-21 Rohm Co., Ltd. Semiconductor module
USD874412S1 (en) * 2018-04-13 2020-02-04 Rohm Co., Ltd. Semiconductor module
USD906271S1 (en) 2018-04-13 2020-12-29 Rohm Co., Ltd. Semiconductor module
USD978809S1 (en) 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD914621S1 (en) * 2019-05-14 2021-03-30 Rohm Co., Ltd. Packaged semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD1034494S1 (en) * 2020-07-31 2024-07-09 Rohm Co., Ltd. Semiconductor device
USD999747S1 (en) * 2020-07-31 2023-09-26 Rohm Co., Ltd. Semiconductor device
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1021829S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1021830S1 (en) * 2021-03-16 2024-04-09 Rohm Co., Ltd. Semiconductor module
USD1022932S1 (en) * 2021-03-16 2024-04-16 Rohm Co., Ltd. Semiconductor module
USD1017533S1 (en) * 2022-01-28 2024-03-12 Mitsubishi Electric Corporation Semiconductor device
USD1046801S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1046800S1 (en) * 2022-01-28 2024-10-15 Mitsubishi Electric Corporation Semiconductor device
USD1112116S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112118S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device
USD1112117S1 (en) * 2023-09-11 2026-02-10 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device

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