USD716240S1 - Lower chamber liner - Google Patents

Lower chamber liner Download PDF

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Publication number
USD716240S1
USD716240S1 US29/472,055 US201329472055F USD716240S US D716240 S1 USD716240 S1 US D716240S1 US 201329472055 F US201329472055 F US 201329472055F US D716240 S USD716240 S US D716240S
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US
United States
Prior art keywords
lower chamber
chamber liner
view
liner
taken along
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/472,055
Inventor
Shu-Kwan Lau
Mehmet Tugrul Samir
Anzhong Chang
Paul Brillhart
Richard O. Collins
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/472,055 priority Critical patent/USD716240S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: COLLINS, RICHARD O., CHANG, ANZHONG, LAU, Shu-Kwan, SAMIR, MEHMET TUGRUL, BRILLHART, PAUL
Application granted granted Critical
Publication of USD716240S1 publication Critical patent/USD716240S1/en
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Description

FIG. 1 is a top perspective view of a lower chamber liner showing our new design;
FIG. 2 is another top perspective view thereof;
FIG. 3 is a bottom perspective view thereof;
FIG. 4 is another bottom perspective view thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a side view thereof;
FIG. 8 is another side view thereof;
FIG. 9 is another side view thereof;
FIG. 10 is a cross sectional view taken along line 10-10 in FIG. 5;
FIG. 11 is an enlarged portion view taken along lines 11-11 in FIG. 10; and,
FIG. 12 is an enlarged portion view taken along lines 12-12 in FIG. 10.
The broken lines in the figures form no part of the claimed design.
The upper chamber liner is shown broken away in FIGS. 11 and 12 to indicate that no particular length is claimed.
All surfaces not shown, form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lower chamber liner, as shown and described.
US29/472,055 2013-11-07 2013-11-07 Lower chamber liner Active USD716240S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/472,055 USD716240S1 (en) 2013-11-07 2013-11-07 Lower chamber liner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/472,055 USD716240S1 (en) 2013-11-07 2013-11-07 Lower chamber liner

Publications (1)

Publication Number Publication Date
USD716240S1 true USD716240S1 (en) 2014-10-28

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US29/472,055 Active USD716240S1 (en) 2013-11-07 2013-11-07 Lower chamber liner

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1066440S1 (en) * 2022-10-28 2025-03-11 Applied Materials, Inc. Process chamber pumping liner

Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US6884297B2 (en) * 2003-03-31 2005-04-26 Ips Ltd. Thin film deposition reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
US8313578B2 (en) * 2008-01-28 2012-11-20 Applied Materials, Inc. Etching chamber having flow equalizer and lower liner
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4340462A (en) * 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6170429B1 (en) * 1998-09-30 2001-01-09 Lam Research Corporation Chamber liner for semiconductor process chambers
US6277237B1 (en) * 1998-09-30 2001-08-21 Lam Research Corporation Chamber liner for semiconductor process chambers
US20020069970A1 (en) * 2000-03-07 2002-06-13 Applied Materials, Inc. Temperature controlled semiconductor processing chamber liner
US7011039B1 (en) * 2000-07-07 2006-03-14 Applied Materials, Inc. Multi-purpose processing chamber with removable chamber liner
US7234412B2 (en) * 2002-04-11 2007-06-26 Micron Technology, Inc. Semiconductor substrate deposition processor chamber liner apparatus
US20080041820A1 (en) * 2002-09-20 2008-02-21 Lam Research Corporation Apparatus for reducing polymer deposition on a substrate and substrate support
US6884297B2 (en) * 2003-03-31 2005-04-26 Ips Ltd. Thin film deposition reactor
US20050229849A1 (en) * 2004-02-13 2005-10-20 Applied Materials, Inc. High productivity plasma processing chamber
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD593969S1 (en) * 2006-10-10 2009-06-09 Tokyo Electron Limited Processing chamber for manufacturing semiconductors
US20080121620A1 (en) * 2006-11-24 2008-05-29 Guo G X Processing chamber
US7942969B2 (en) * 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
US8313578B2 (en) * 2008-01-28 2012-11-20 Applied Materials, Inc. Etching chamber having flow equalizer and lower liner
USD600222S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
USD600221S1 (en) * 2008-03-28 2009-09-15 Tokyo Electron Limited Wafer boat
US7987814B2 (en) * 2008-04-07 2011-08-02 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8282736B2 (en) * 2008-04-07 2012-10-09 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
US8118938B2 (en) * 2008-04-07 2012-02-21 Applied Materials, Inc. Lower liner with integrated flow equalizer and improved conductance
USD658691S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658692S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD658693S1 (en) * 2011-03-30 2012-05-01 Tokyo Electron Limited Liner for plasma processing apparatus
USD678228S1 (en) * 2011-03-30 2013-03-19 Tokyo Electron Limited Chamber block
USD699692S1 (en) * 2012-01-19 2014-02-18 Applied Materials, Inc. Upper liner

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD802790S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804436S1 (en) * 2015-06-12 2017-12-05 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD786201S1 (en) * 2015-10-19 2017-05-09 Tymphany Hk Limited Heat sink for woofer
USD812578S1 (en) * 2016-02-26 2018-03-13 Hitachi High-Technologies Corporation Upper chamber for a plasma processing apparatus
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD838681S1 (en) * 2017-04-28 2019-01-22 Applied Materials, Inc. Plasma chamber liner
USD842259S1 (en) * 2017-04-28 2019-03-05 Applied Materials, Inc. Plasma chamber liner
USD837754S1 (en) * 2017-04-28 2019-01-08 Applied Materials, Inc. Plasma chamber liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD925481S1 (en) * 2018-12-06 2021-07-20 Kokusai Electric Corporation Inlet liner for substrate processing apparatus
USD1051867S1 (en) * 2020-03-19 2024-11-19 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD1008967S1 (en) * 2022-05-16 2023-12-26 Japan Aviation Electronics Industry, Limited Collar for connector
USD1066440S1 (en) * 2022-10-28 2025-03-11 Applied Materials, Inc. Process chamber pumping liner
USD1034493S1 (en) * 2022-11-25 2024-07-09 Ap Systems Inc. Chamber wall liner for a semiconductor manufacturing apparatus

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