USD521464S1 - Process tube for semiconductor device manufacturing apparatus - Google Patents
Process tube for semiconductor device manufacturing apparatus Download PDFInfo
- Publication number
- USD521464S1 USD521464S1 US29/204,406 US20440604F USD521464S US D521464 S1 USD521464 S1 US D521464S1 US 20440604 F US20440604 F US 20440604F US D521464 S USD521464 S US D521464S
- Authority
- US
- United States
- Prior art keywords
- semiconductor device
- manufacturing apparatus
- device manufacturing
- process tube
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 3
- 238000000034 method Methods 0.000 title claims description 3
- 239000004065 semiconductor Substances 0.000 title claims description 3
Images
Description
FIG. 1 is an isometric view of a process tube for semiconductor device manufacturing apparatus of the present invention;
FIG. 2 is a front view thereof;
FIG. 3 is a left side view thereof;
FIG. 4 is a right side view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a sectional view along line 7—7 shown in FIG. 5;
FIG. 8 is a sectional view along line 8—8 shown in FIG. 7;
FIG. 9 is a sectional view along line 9—9 shown in FIG. 5;
FIG. 10 is a sectional view along line 10—10 shown in FIG. 5; and,
FIG. 11 is a sectional view along line 11—11 shown in FIG. 5.
A rear view is not shown as the rear view is a mirror image of the front view shown in FIG. 2.
Claims (1)
- The ornamental design for a process tube for semiconductor device manufacturing apparatus, as shown and described.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003-032503 | 2003-11-04 | ||
| JP2003032503 | 2003-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD521464S1 true USD521464S1 (en) | 2006-05-23 |
Family
ID=36424296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US29/204,406 Expired - Lifetime USD521464S1 (en) | 2003-11-04 | 2004-04-29 | Process tube for semiconductor device manufacturing apparatus |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | USD521464S1 (en) |
| TW (1) | TWD104755S1 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD590359S1 (en) * | 2006-02-20 | 2009-04-14 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers or the like |
| USD594488S1 (en) * | 2007-04-20 | 2009-06-16 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD720308S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD724551S1 (en) * | 2011-11-18 | 2015-03-17 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD725053S1 (en) * | 2011-11-18 | 2015-03-24 | Tokyo Electron Limited | Outer tube for process tube for manufacturing semiconductor wafers |
| USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD842824S1 (en) * | 2017-08-09 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
| USD842823S1 (en) * | 2017-08-10 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
| USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
| USD901406S1 (en) * | 2019-03-20 | 2020-11-10 | Kokusai Electric Corporation | Inner tube of reactor for semiconductor fabrication |
| USD931823S1 (en) * | 2020-01-29 | 2021-09-28 | Kokusai Electric Corporation | Reaction tube |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037502A (en) * | 1983-12-29 | 1991-08-06 | Sharp Kabushiki Kaisha | Process for producing a single-crystal substrate of silicon carbide |
| US5279986A (en) * | 1989-02-03 | 1994-01-18 | Applied Materials, Inc. | Method for epitaxial deposition |
| US5352293A (en) * | 1992-01-06 | 1994-10-04 | Samsung Electronics Co., Ltd. | Tube apparatus for manufacturing semiconductor device |
| US5752819A (en) * | 1993-01-22 | 1998-05-19 | International Business Machines Corporation | Exhaust system for high temperature furnace |
| USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
| US6240875B1 (en) * | 1999-07-07 | 2001-06-05 | Asm International N.V. | Vertical oven with a boat for the uniform treatment of wafers |
| US6402849B2 (en) * | 2000-03-17 | 2002-06-11 | Samsung Electronics Co., Ltd. | Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device |
| JP2002280378A (en) | 2001-01-11 | 2002-09-27 | Hitachi Kokusai Electric Inc | Batch type remote plasma processing equipment |
-
2004
- 2004-04-28 TW TW093302440F patent/TWD104755S1/en unknown
- 2004-04-29 US US29/204,406 patent/USD521464S1/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5037502A (en) * | 1983-12-29 | 1991-08-06 | Sharp Kabushiki Kaisha | Process for producing a single-crystal substrate of silicon carbide |
| US5279986A (en) * | 1989-02-03 | 1994-01-18 | Applied Materials, Inc. | Method for epitaxial deposition |
| US5352293A (en) * | 1992-01-06 | 1994-10-04 | Samsung Electronics Co., Ltd. | Tube apparatus for manufacturing semiconductor device |
| US5752819A (en) * | 1993-01-22 | 1998-05-19 | International Business Machines Corporation | Exhaust system for high temperature furnace |
| USD405062S (en) * | 1997-08-20 | 1999-02-02 | Tokyo Electron Ltd. | Processing tube for use in a semiconductor wafer heat processing apparatus |
| US6240875B1 (en) * | 1999-07-07 | 2001-06-05 | Asm International N.V. | Vertical oven with a boat for the uniform treatment of wafers |
| US6402849B2 (en) * | 2000-03-17 | 2002-06-11 | Samsung Electronics Co., Ltd. | Process tube having slit type process gas injection portion and hole type waste gas exhaust portion, and apparatus for fabricating semiconductor device |
| JP2002280378A (en) | 2001-01-11 | 2002-09-27 | Hitachi Kokusai Electric Inc | Batch type remote plasma processing equipment |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD590359S1 (en) * | 2006-02-20 | 2009-04-14 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers or the like |
| USD600659S1 (en) * | 2006-09-12 | 2009-09-22 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD586768S1 (en) * | 2006-10-12 | 2009-02-17 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD594488S1 (en) * | 2007-04-20 | 2009-06-16 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD619630S1 (en) * | 2007-05-08 | 2010-07-13 | Tokyo Electron Limited | Process tube for manufacturing semiconductor wafers |
| USD610559S1 (en) * | 2008-05-30 | 2010-02-23 | Hitachi Kokusai Electric, Inc. | Reaction tube |
| USD720308S1 (en) * | 2011-11-18 | 2014-12-30 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD724551S1 (en) * | 2011-11-18 | 2015-03-17 | Tokyo Electron Limited | Inner tube for process tube for manufacturing semiconductor wafers |
| USD725053S1 (en) * | 2011-11-18 | 2015-03-24 | Tokyo Electron Limited | Outer tube for process tube for manufacturing semiconductor wafers |
| USD772824S1 (en) * | 2015-02-25 | 2016-11-29 | Hitachi Kokusai Electric Inc. | Reaction tube |
| USD842824S1 (en) * | 2017-08-09 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
| USD842823S1 (en) * | 2017-08-10 | 2019-03-12 | Kokusai Electric Corporation | Reaction tube |
| USD853979S1 (en) * | 2017-12-27 | 2019-07-16 | Kokusai Electric Corporation | Reaction tube |
| USD901406S1 (en) * | 2019-03-20 | 2020-11-10 | Kokusai Electric Corporation | Inner tube of reactor for semiconductor fabrication |
| USD931823S1 (en) * | 2020-01-29 | 2021-09-28 | Kokusai Electric Corporation | Reaction tube |
Also Published As
| Publication number | Publication date |
|---|---|
| TWD104755S1 (en) | 2005-05-21 |
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