USD476962S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD476962S1
USD476962S1 US29/168,143 US16814302F USD476962S US D476962 S1 USD476962 S1 US D476962S1 US 16814302 F US16814302 F US 16814302F US D476962 S USD476962 S US D476962S
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US
United States
Prior art keywords
semiconductor device
view
elevational view
mirror image
side elevational
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/168,143
Inventor
Takayuki Yoshihira
Gentaro Ookura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Assigned to KABUSHIKI KAISHA TOSHIBA reassignment KABUSHIKI KAISHA TOSHIBA ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OOKURA, GENTARO, YOSHIHIRA, TAKAYUKI
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Publication of USD476962S1 publication Critical patent/USD476962S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 is a front perspective view of a semiconductor device, showing our new design;
FIG. 2 is a rear perspective view thereof;
FIG. 3 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 4 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 5 is a front elevational view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a front perspective view of a second embodiment of a semiconductor device, showing our new design;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is a top plan view thereof; a bottom plan view being a mirror image thereof;
FIG. 10 is a right side elevational view thereof; a left side elevational view being a mirror image thereof;
FIG. 11 is a front elevational view thereof; and,
FIG. 12 is a rear elevational view thereof.

Claims (1)

  1. The ornamental design for a semiconductor device, as shown and described.
US29/168,143 2002-03-29 2002-09-27 Semiconductor device Expired - Lifetime USD476962S1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2002008487 2002-03-29
JP2002-008487 2002-03-29
JP2002008488 2002-03-29
JP2002-008488 2002-03-29

Publications (1)

Publication Number Publication Date
USD476962S1 true USD476962S1 (en) 2003-07-08

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Family Applications (1)

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US29/168,143 Expired - Lifetime USD476962S1 (en) 2002-03-29 2002-09-27 Semiconductor device

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US (1) USD476962S1 (en)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Catalog showing a Power MOSFET (PowerFLAT).
Website showing a Power MOSFET (P series).

Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD668659S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD668658S1 (en) * 2011-11-15 2012-10-09 Connectblue Ab Module
USD680119S1 (en) * 2011-11-15 2013-04-16 Connectblue Ab Module
USD680545S1 (en) * 2011-11-15 2013-04-23 Connectblue Ab Module
USD689053S1 (en) * 2011-11-15 2013-09-03 Connectblue Ab Module
USD692896S1 (en) * 2011-11-15 2013-11-05 Connectblue Ab Module
US8975694B1 (en) 2013-03-07 2015-03-10 Vlt, Inc. Low resistance power switching device
US9269661B1 (en) 2013-03-07 2016-02-23 Vlt, Inc. Low resistance power switching device
USD752000S1 (en) 2013-03-07 2016-03-22 Vlt, Inc. Semiconductor device
USD732487S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD732488S1 (en) * 2013-08-06 2015-06-23 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
USD758329S1 (en) * 2013-08-06 2016-06-07 Formosa Epitaxy Incorporation Partial semiconductor light emitting component
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD832228S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD832227S1 (en) * 2016-11-15 2018-10-30 Rohm Co., Ltd. Semiconductor module
USD822629S1 (en) * 2017-01-26 2018-07-10 Kyocera Corporation Semiconductor package
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD859334S1 (en) * 2017-10-26 2019-09-10 Mitsubishi Electric Corporation Semiconductor device
USD864135S1 (en) 2017-10-26 2019-10-22 Mitsubishi Electric Corporation Semiconductor device
USD904325S1 (en) * 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD1042376S1 (en) * 2022-02-25 2024-09-17 Rohm Co., Ltd. Semiconductor module

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